JP2011005739A - Resin sealing device of compression type - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin sealing device of a compression type which enables upgrading of press molding precision at low cost by passive control and also shortening of a resin sealing cycle time.SOLUTION: This resin sealing device J1 of the compression type operates to seal a product to be sealed 158 with a resin, using a first mold 100 and a second mold 102. In addition, the device J1 includes frame-like molds 100B and 102B, a transfer mechanism 121 which is transferred by a linkage mechanism 122 and a regulating mechanism 151 which has ramming members 150A1 to 150D1, 150A2 to 150D2 outside the frame-like molds 100B and 102B and makes it possible to regulate the parallelism of the first mold 100 and the second mold 102. A dynamic load is applied to the first mold 100 side and the second mold 102 side by the movement of the second mold 102 side by the linkage mechanism 122 through the ramming members 150A1 to 150D1, 150A2 to 150D2. Thus the parallelism of the first mold 100 and the second mold 102 can be regulated.

Description

  The present invention relates to a compression type resin sealing device.

  In Patent Document 1, in a press molding apparatus provided with an upper die and a lower die that is arranged opposite to the upper die and can be brought into contact with and separated from the upper die, the parallelism between the upper and lower dies is set. A technique for correcting the parallelism between the upper and lower molds by active control that is detected by a sensor, and this information is fed back to an actuator as needed and electrically controlled is disclosed. In order to realize this object, Patent Document 1 includes a hydraulic cylinder (preload generation mechanism) that generates a preload in a direction in which both molds are separated from each other. The parallelism of the mold and the lower mold is actively controlled.

  In patent document 2, the technique provided with a space | interval adjustment member between upper and lower metal mold | die is disclosed in the clamping device. This interval adjusting member has a temperature adjusting mechanism, and actively controls the parallelism and the interval between the upper die and the lower die by utilizing the dimensional change caused by the temperature change of the interval adjusting member.

JP 2008-87408 A (Claim 1, paragraph [0041], FIG. 1) JP-A-2005-231960 (Claim 1, paragraph [0003], FIG. 2, FIG. 4)

  By the way, as a resin sealing device that seals only a part of a sealed product such as a semiconductor substrate with a resin, a transfer type that pushes and injects molten resin into a cavity formed by upper and lower molds, and A compression mold for compressing and molding a resin placed in a cavity is known. Among these, especially in the case of a compression type resin sealing device, the upper and lower molds form a part of the cavity, and the frame shape is movable up and down to hold the end of the sealed product. Since the structure is complicated due to the provision of molds, the current situation is that a technique for improving the parallelism of each mold has not yet been disclosed.

  However, the compression-type resin sealing device has a frame-shaped mold, and therefore has an aspect that management of parallelism is more important.

  Thus, it is conceivable to divert the parallelism control technology in the press molding apparatus and the mold clamping apparatus to a compression type resin sealing apparatus. However, the configuration of the press molding apparatus according to Patent Document 1 is between upper and lower molds. In order to control the degree of parallelism, a method of actively controlling with a high-capacity adjustment mechanism using a sensor was adopted, so when this was simply diverted to a compression type resin sealing device, The problem is how to incorporate a "complex and high-capacity correction mechanism" that corrects the posture of the upper and lower molds including the frame-shaped mold under the load environment, and the manufacturing cost of the entire device must be greatly increased. It is thought that it does not get.

  An object of the present invention is to improve the accuracy of parallelism of upper and lower molds including a frame-shaped mold at a low cost and to reduce the cycle time of resin sealing together.

  The present invention provides a resin to be encapsulated by a first mold and a second mold that is disposed opposite to the first mold and can be brought into contact with and separated from the first mold. In a compression-type resin sealing device for sealing, a frame-shaped mold that is provided on one or both of the first mold and the second mold and can hold the end of the sealed product A moving mechanism for moving the second mold side by a link mechanism with respect to the first mold side, and either the first mold or the second mold outside the frame-shaped mold. An abutment member disposed on one or both sides, and an adjustment mechanism that allows adjustment of the parallelism of the first mold and the second mold, and a second of the moving mechanism by the link mechanism A mechanical load is applied to the first mold and the second mold through the abutting member of the adjustment mechanism by movement of the mold side, and the first mold and With adjustable and with the structure of the parallelism of the second mold, the above-mentioned problems are eliminated.

  To correct the parallelism of the mold, a very high capacity adjustment mechanism is required. In the present invention, the movable mold (second mold) is moved to the fixed mold (first mold) side instead of separately incorporating a high-capacity adjustment mechanism to adjust the parallelism. The main moving mechanism that can provide the thrust to be used is effectively used as it is. That is, by providing a link mechanism on the second mold side that enables high-speed and high-thrust movement, the second mold can be operated at high speed in a high load environment, and then the outside of the frame-shaped mold The position of the first and second molds including the frame-shaped mold is mechanically restrained by the abutting member disposed in the position, and the attitude of the second mold on the movable side is forced to the first mold on the fixed side. Imitate. As a result, mechanical backlash and irregular vertical movement of the second mold can be reduced, and an accurate parallelism can be realized. In the present invention, a complicated sensor mechanism and a high-capacity separate adjustment mechanism that are required when the above-described active control is employed can be eliminated, and the system can be simplified. In addition, combined with the effect of adopting the link mechanism, the resin sealing cycle time can be shortened and the manufacturing cost can be reduced.

  According to the present invention, the parallelism of the first mold and the second mold at the time of resin sealing can be corrected and secured at a low cost including the frame mold, and the resin sealing The cycle time can be shortened.

FIG. 1 is a front sectional view and a longitudinal sectional view of a compression molding sealing device according to an example of an embodiment of the present invention. II-II sectional view in FIG. Enlarged view of arrow III in Fig. 1 Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Process of molding operation of resin sealing device according to an example of embodiment Schematic front sectional view of a compression molding sealing device according to another example of the present invention The schematic longitudinal cross-sectional view of the compression molding sealing device concerning an example of further another embodiment of this invention. The longitudinal cross-sectional view of the compression molding sealing device concerning an example of another embodiment of this invention The longitudinal cross-sectional view of the compression molding sealing device concerning an example of further another embodiment of this invention

  Hereinafter, a compression-type resin sealing device J1 according to an example of an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1A is a front sectional view and FIG. 1B is a longitudinal sectional view of a resin sealing device J1 according to an example of an embodiment of the present invention. 2 is a cross-sectional view taken along the line II-II in FIG. 1, and FIG. 3 is an enlarged view of an arrow III part in FIG.

  The compression-type resin sealing device J1 includes an upper mold (first mold) 100 and a lower mold (second mold) that is disposed so as to face the upper mold 100 and can be brought into contact with and separated from the upper mold 100. ) 102, for example, a sealed product 158 such as a package substrate is sealed with a resin 160 such as a thermosetting resin.

  Four tie bars (supports) 108 (108A to 108D) are erected on the base 104 of the resin sealing device J1. The upper mold 100 is disposed on the fixed platen 110 side fixed to the upper end portion of the tie bar 108. On the other hand, the lower mold 102 is disposed on the first movable platen 112 side that faces the fixed platen 110 side and can move forward and backward toward the upper mold 100 side. A second movable platen 114 is fitted inside the first movable platen 112.

  The upper mold 100 includes an upper mold main body 100A and an upper frame (upper mold frame mold) 100B, and the lower mold 102 includes a lower mold main body 102A and a lower frame (lower mold frame mold) 102B. Prepare. The upper mold 100 and the lower mold 102 form a resin sealed space (cavity) 162 that is hermetically sealed by an action described later.

  The upper frame 100B and the lower frame 102B are provided on the upper mold 100 and the lower mold 102 side, respectively, and can hold the end of the article to be sealed 158. The upper frame 100B and the lower frame 102B have a first spring (first elastic body) 120 that urges the upper frame 100B and the lower frame 102B toward the upper mold 100 and the lower mold 102 facing each other on the non-contact surface side. 120A and 120B) are attached respectively.

  In the present embodiment, there is a moving mechanism 121 that moves the first movable platen 112 to the upper mold 100 side so that the lower mold 102 side can be relatively close to and separated from the upper mold 100 side. The moving mechanism 121 includes a first motor 126, a first ball screw 128 coupled to the first motor 126, and a toggle link mechanism 122.

  More specifically, the first motor 126 is installed on the pedestal 104. A first pulley 132 fixed to the tip of the motor shaft 126J of the first motor 126 and a second pulley 134 fixed to the lower end of the first ball screw 128 are connected by a first timing belt 136. The first ball screw 128 is supported by the pedestal 104 via the bearing 130 and is engaged with the nut portion 175. The toggle link mechanism 122 includes a first link member 124A connected to the nut portion 175, a second link member 124B connected to both the base 104 and the first link member 124A, a second link member 124B, and a first link member 124A. The third link member 124C is connected to both the movable platen 112 and the third link member 124C. By this moving mechanism 121, the first movable platen 112 on the lower mold side can be moved, and as a result, the lower mold 102 can be moved to the upper mold 100 side.

  In the present embodiment, similarly, the second movement for moving the second movable platen 114 to the upper mold 100 side so that the lower mold 102 side can be relatively close to and separated from the upper mold 100 side. A mechanism 138 is included. The second moving mechanism 138 is a so-called linear movement mechanism having a second motor (drive source) 140 and a second ball screw (ball screw) 142 rotated by the second motor 140.

  The motor shaft (not shown) of the second motor 140 that moves the second movable platen 114 is connected to the input shaft (not shown) of the speed reducer 144, and the casing 144 K of the speed reducer 144 is connected to the first movable platen 112. It is fixed to an L-shaped sheet metal 146 attached to the side surface. A third pulley 148 fixed to the tip of the output shaft 144J of the second speed reducer 144 and a fourth pulley 153 fixed to the lower end of the second ball screw 142 are connected by a second timing belt 152.

  The second movable platen 114 is supported by a nut portion (not shown) of the second ball screw 142 and a linear bush 154 disposed between the second movable platen 114 itself and the first movable platen 112. By this second moving mechanism 138, the second movable platen 114 on the lower mold 102 side can be moved, and as a result, the lower mold 102 can be moved to the upper mold 100 side.

  The adjustment mechanism 151 is arranged on the outer side of the upper mold 100 via fixing members 150A1 to 150D1 and adjustment members 150A2 to 150D2 arranged on the respective sides of the upper mold 100 and the lower mold 102 on the outside of the frame molds 100B and 102B. By applying a mechanical load on the lower mold 102 side, the parallelism between the upper mold 100 and the lower mold 102 can be adjusted. In the adjustment mechanism 151, fixing members 150 </ b> A <b> 1 to 150 </ b> D <b> 1 (only 150 </ b> D <b> 1 are not shown) are disposed on the upper mold 100 side, and adjustment members 150 </ b> A <b> 2 to 150 </ b> D <b> 2 are disposed on the lower mold 102 side. Yes. The parallelism of the lower mold 102 with respect to the upper mold 100 can be adjusted by the fixing members 150A1 to 150D1 and the adjusting members 150A2 to 150D2.

  When the second movable platen 114 is at the lowest point, the height H1 of the adjustment members 150A2 to 150D2 is higher than the height h1 from the surface of the first movable platen 112 to the surface of the lower frame 102B on the upper frame 100B side. (H1> h1), the height H2 of the other fixing members 150A1 to 150D1 is higher than the height h2 from the surface of the fixed platen 110 to the surface of the upper frame 100B on the lower frame 102B side (H2> h2).

  As shown in FIG. 3, four adjustment screws 182A to 182D are used as a mechanism for adjusting the parallelism between the abutment surface 150f1 of the fixing members 150A1 to 150D1 and the abutment surface 150f2 of the adjustment members 150A2 to 150D2. A pillar adjusting mechanism 180 is provided.

  Next, the operation of this embodiment will be described.

  The process of the sealing operation of the resin sealing device J1 is shown in FIGS.

  First, as shown in FIG. 4, a ceramic substrate 158 (molded product) on which a semiconductor chip is mounted is adsorbed and held on the upper mold 100, and a sealing resin 160 is put into the lower mold 102.

  Next, when the first motor 126 is rotated, this rotation is transmitted to the first pulley 132, the first timing belt 136, and the second pulley 134, and the first ball screw 128 to which the second pulley 134 is fixed is moved. Rotate. The rotation of the first ball screw 128 raises the nut portion 175. Along with this, the first link member 124A constituting a part of the toggle link mechanism 122 connected to the nut portion 175 is raised. Accordingly, the second link member 124B and the third link member 124C are also rotated around the fulcrum on the side of the pedestal 104 and the first movable platen 112 to which the first link platen 112 is fixed. , Can rise along the tie bar 108.

  When the first movable platen 112 rises, the height relationship between the fixing members 150A1 to 150D1 and the adjusting members 150A2 to 150D2 and the frame molds 100B and 102B ((H1> h1), (H2> h2)) 5, the fixing members 150A1 to 150D1 and the adjustment members 150A2 to 150D2 are in contact with each other before the lower frame 102B and the upper frame 100B are in contact with each other.

  Even after contact, the first motor 126 continues to rotate until the toggle link mechanism 122 reaches top dead center, and the first movable platen 112 continues to move, and the fixing members 150A1 to 150D1 of the adjustment mechanism 151 and the adjustment member A mechanical load is applied to the upper mold 100 and the lower mold 102 via 150A2 to 150D2. The toggle link mechanism 122 can increase the moving speed of the first movable platen 112 more than a linear motion press mechanism composed of a motor and a ball screw, and can secure a larger thrust than the linear motion mechanism at a low cost. Therefore, a sufficiently large mechanical load can be applied even in this abutment.

  Accordingly, the posture of the first movable platen 112 side (lower mold side: second mold side) is set to four points (4) so as to follow the fixed platen 110 side (upper mold side: first mold side) in the fixed state. Forcibly corrected at the location). By this correction, for example, mechanical backlash of a member such as mechanical backlash by the toggle link mechanism 122, irregular up and down movement of the first movable platen 112 connected to the toggle link mechanism 122, or the tie bar 108 and the first movable The backlash and the like with the platen 112 are eliminated, and the parallelism between the upper mold 100 installed on the fixed platen 110 and the lower mold 102 installed on the first movable platen 112 is also ensured accurately.

  Here, the parallelism adjustment by the adjustment mechanism 151 is performed by changing the posture of the first movable platen 112 on the movable side to “4” by the strong thrust of the toggle link mechanism 122 with respect to the fixed platen 110 fixed to the tie bar 108 without backlash. In addition, since the adjustment mechanism 151 is arranged outside the upper frame 100B and the lower frame 102B, the upper frame 100B and the lower frame 102B are included. Parallelism between the upper mold 100 and the lower mold 102 can be ensured with very high accuracy. In particular, its reproducibility is extremely high.

  In this embodiment, since the adjustment mechanism 151 further includes a pillar adjustment mechanism 180 in order to take advantage of the feature of “good reproducibility”, the pressing mechanism is pressed against the upper and lower platens in advance before molding. The degree of application of the mechanical load and the parallelism of the upper mold 100 and the lower mold 102 can be measured to finely adjust the actual parallelism of the upper mold 100 and the lower mold 102 when the mold is closed. As a result, the degree of parallelism in many subsequent seals can always be kept good with extremely high reproducibility by performing fine adjustment once. Further, even when the parallelism slightly shifts with time, it can be dealt with by adjustment by the pillar adjustment mechanism 180.

  In addition to the pillar adjustment mechanism 180 or instead of the pillar adjustment mechanism 180, for example, a shim adjustment mechanism may be provided between the first movable platen 112 and the lower mold body 102A.

  After that, as shown in FIG. 6, the ceramic substrate 158 is clamped by the upper mold 100 and the lower frame 102B by moving the lower frame 102B to the upper mold 100 side by the driving unit. Accordingly, the upper mold body 100A and the lower mold body 102A cover the side surfaces in the vertical direction (vertical direction in FIG. 4), and the upper frame 100B and the lower frame 102B cover the side surfaces in the horizontal direction (horizontal direction in FIG. 4). A sealed resin sealing space 162 is formed.

  In this state, as shown in FIG. 7, the fixed position by the abutment of the first movable platen 112 is used as a reference point, and the linear movement mechanism 139 is installed on the second movable platen 114 from the position toward the upper mold 100. Lower mold body 102A is moved to upper mold 100 side. As a result, clamping by the lower mold 102 proceeds, the resin 160 is heated and compression molded, and the semiconductor chip portion is sealed with resin. Since the linear motion mechanism 139 can realize position controllability with higher accuracy than the press operation by the toggle link mechanism 122, it is possible to accurately control the second movable platen 114 that requires delicate position control. Can do.

  Next, after the resin 160 is cured to such an extent that it can be taken out from the upper mold 100 and the lower mold 102, the lower frame 102B is pulled down by the linear motion mechanism 139 as shown in FIG.

  Finally, as shown in FIG. 9, the toggle link mechanism 122 is folded, and the mold of the press is opened.

  This embodiment is a low-cost, high-speed and high-thrust, toggle link mechanism 122 that can shorten the cycle time of resin sealing, and high-precision of the upper and lower molds 100 and 102 during forward and backward movement. The linear motion mechanism 139 capable of realizing the position control is configured in two stages, and is selectively used in an appropriate movement section, so that the upper frame 100B and the lower frame 102B are included by passive control (mechanically) at low cost. In addition, the accuracy of the parallelism in the resin sealing including the parallelism of the upper mold 100 and the lower mold 102 can be improved at a low cost, and the cycle time of the resin sealing can be shortened.

  Next, another embodiment will be described.

  FIG. 10 shows a schematic front sectional view of a resin sealing device J2 according to another embodiment. FIG. 11 is a schematic longitudinal sectional view.

  Also in this embodiment, the upper mold 200 and the lower mold 202 are moved to the upper mold 200 and the lower mold 202 via the fixing members 250A1 to 250D1 and the adjusting members 250A2 to 250D2 of the adjusting mechanism 251 by the movement of the moving mechanism 221 on the lower mold 202 side by the toggle link mechanism 222. By applying a mechanical load, the parallelism of the upper mold 200 and the lower mold 202 can be adjusted. However, unlike the previous embodiment, instead of configuring the linear motion mechanism (139) that is the second moving mechanism (121), the first spring 220 is positioned on the side of the abutting surface 250u of the adjustment members 250A2 to 250D2. A second spring 262 (second elastic body) having a large spring constant is additionally provided.

  More specifically, in this embodiment, the adjustment members 250A2 to 250D2 are abutted against the fixing members 250A1 to 250D1, the postures of the upper mold 200 side and the lower mold 202 side are controlled, and then the toggle link mechanism 222 By continuously pushing in the movable platen 212, the lower mold 202 is further raised toward the upper mold 200, and the upper frame 200B and the lower frame 202B are first brought into contact with the substrate to clamp the substrate. The lower mold body 202A is raised while the first movable platen 212 is raised to contract both the first spring 220 and the second spring 262, thereby compressing the resin in the cavity and sealing the resin. Do.

  In the present embodiment, the second spring 262 disposed on the counter-abutting surface 250u of the adjustment member has a spring constant that can control the posture of the movable platen 212 and can be directly put into the compression for sealing. After the fixing members 250 </ b> A <b> 1 to 250 </ b> D <b> 1 and the adjustment members 250 </ b> A <b> 2 to 250 </ b> D <b> 2 come into contact to adjust the parallelism of the upper die 200 and the lower die 202, sealing can be completed by the thrust of the same toggle link mechanism 222. Accordingly, compression is realized by pushing in the adjustment members 250A2 to 250D2, and the linear motion mechanism (139) required for driving and compressing the lower mold 202 in the above embodiment can be eliminated. .

  In other words, in the present embodiment, the same effects as those of the above-described embodiment can be obtained, the mechanical configuration can be further simplified, and the cost can be further reduced.

  Further, since the adjusting members 250A2 to 250D2 are configured to move up and down through the guide post 274, the reproducibility of the abutting position in the horizontal direction and the positions of the molds 200 and 202 can be improved.

  The adjustment mechanism 251 for adjusting the parallelism further includes a shim adjustment mechanism 264 between the first movable platen 212 and the lower mold 202 main body.

  A plurality of insertion holes 268 are formed below the fixed platen 210 in a horizontal direction with respect to the fixed platen 210. A pillar (not shown) can be fitted into each of the insertion holes 268, thereby constituting a pillar adjusting mechanism 266 on the upper die 200 side.

  Note that a shim having a predetermined thickness can be inserted without inserting the pillar into the insertion hole 268.

  The parallelism between the upper mold 200 and the lower mold 202 can be adjusted by the shim adjusting mechanism 264 or the pillar adjusting mechanism 266.

  Since the other parts have the same functions as those in the above embodiment, members having the same or similar functions are given the same reference numerals as the resin sealing device J1 in the above embodiment. The duplicated explanation is omitted. The same applies to the following embodiments.

  Various variations of the present invention are possible.

  For example, in the above embodiment, the lower mold is movable and the upper mold is fixed, but the lower mold may be fixed and the upper mold may be movable, or both the lower mold and the upper mold may be movable. Further, as shown in FIG. 12, the second movable platen 314 may be disposed not only on the lower mold side but also on the upper mold 300 side. Further, the second movable platen need not be a so-called nested structure inside the first movable platen, and may be disposed on the side surface of the first movable platen on the fixed platen side.

  The abutting member is not limited to the cylindrical shape, and other shapes such as a rectangular parallelepiped may be used. Also, the arrangement position of the abutting member may be arranged at the end of the fixed platen and the second movable platen as long as it is between the upper and lower molds. As a result, the number of abutting members having a highly accurate surface shape can be reduced, and the manufacturing cost can be further reduced by simplifying the shape. Further, since the abutting member is not in close contact with the tie bar as in the above embodiment, assembly can be performed more easily.

  The arrangement position of the pillar is not limited to the above embodiment. For example, many smaller pillars may be arranged. Further, the shape of the pillar itself can be changed to an optimal shape as appropriate as well as the quadrangular prism as illustrated.

  Further, as shown in FIG. 13, a structure having a guide post 574 for supporting the abutting member 550 may be used, and the radial support of the abutting member may be stabilized. Thereby, the reproducibility of the abutting position in the horizontal direction can be improved, and as a result, the reproducibility of the parallelism of the upper mold and the lower mold can be further improved.

    The guide mechanism disposed between the second movable platen and the first movable platen may support a linear motion such as an oil-free bush or an LM guide in addition to the linear bush.

  Note that, among the components and elements described in the embodiment, even if not particularly described, the dimensions, materials, shapes, and other relative arrangements of the components are not particularly specified, unless otherwise specified. The scope of the present invention is not intended to be limited to that.

100 ... Upper mold (first mold)
102 ... Lower mold (second mold)
100B, 102B ... Upper frame, lower frame (frame-shaped mold)
121 ... Moving mechanism 122 ... Link mechanism 150A1 to 150D1 ... Fixed member (abutting member)
150A2 to 150D2 ... Adjustment member (butting member)
J1 ... Resin sealing device

Claims (5)

A product to be sealed is sealed with a resin by a first mold and a second mold that is arranged to face the first mold and can be brought into contact with and separated from the first mold. In the compression type resin sealing device,
A frame-shaped mold that is provided on one or both of the first mold and the second mold side and can hold an end of the sealed product;
A moving mechanism for moving the second mold side by a link mechanism with respect to the first mold side;
An abutting member disposed on one or both sides of the first mold and the second mold on the outside of the frame-shaped mold, and the parallelism of the first mold and the second mold An adjustment mechanism that makes adjustment possible,
With
Due to the movement of the moving mechanism on the second mold side by the link mechanism, a mechanical load is applied to the first mold side and the second mold side via the abutting member of the adjusting mechanism, A compression type resin sealing device characterized in that the parallelism between the first mold and the second mold can be adjusted. In claim 1,
In addition to the movement mechanism by the link mechanism,
A compression molding characterized in that it has a second moving mechanism that allows either one of the first mold or the second mold to be relatively close to or separated from the other side. Sealing device. In claim 2,
The compression molding sealing apparatus, wherein the second moving mechanism is a linear moving mechanism having a driving source and a ball screw rotated by the driving source. In any one of Claims 1-3, Furthermore,
The compression mechanism is further provided with a shim adjustment mechanism or a pillar adjustment mechanism. In any one of Claims 1-4,
A first elastic body for urging the frame-shaped mold toward the first mold or the second mold is attached to the frame-shaped mold,
A compression molding sealing device, wherein a second elastic body having a spring constant larger than that of the first elastic body is attached to the abutting surface side of the abutting member.