JPH05326791A - Press work device, lead forming method, and resin sealing method - Google Patents

Abstract

PURPOSE:To provide a method of forming leads of high quality, where the leads of a semiconductor device can be accurately formed high in productivity by adequately controlling a lead forming die in clamping force. CONSTITUTION:A primary motor 18 is provided to move an upper platen 8 vertically, furthermore an auxiliary power motor 25 is mounted on the upside of an upper platen 8, a punch 13 is built in freely retractable manner in the main body 10 of a lead forming die 110 fixed to the upper platen 8, and the punch 13 is pressed by a punch pressing ball screw 26 rotated by the auxiliary power motor 25 against a die 14 of a lead forming lower die 112.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressing device, a lead molding method and a resin sealing method, and more particularly to a device for switching the clamping force of a die for manufacturing a semiconductor device.

[0002]

2. Description of the Related Art FIG. 3 is a front view showing an example of a conventional lead forming apparatus of this type. In the figure, reference numeral 200 denotes a lead forming apparatus for forming leads of a semiconductor element, in which a fixed surface plate 11 to which a lower lead forming die 212 is attached and an upper lead forming die 210 are opposed to the lower die 11. The upper platen (movable platen) 8 is supported so as to be able to approach and separate from the upper platen, and a power source 3 for moving the upper platen 8 and the like.

More specifically, the lead forming upper die 210 is a movable die body 1 fixed to the upper platen 8.
0 and the punch 13 attached to the die 10, the lead forming lower die 212 is a fixed die body 12 fixed to the fixed surface plate 11, and a die 14 attached to the die 12. It consists of and. Here, each die body 1
Pressing rods 10b and 12b sandwiching the lead frame 201 are urged in the projecting direction and mounted on both sides of the punch 13 and the die 14, respectively. , Die 14
Pin 10 to protect the machine from excessive tightening force
a and 12a are attached.

The fixed surface plate 11 is fixed on a frame member 11a assembled on the pedestal 1, and a press surface plate 2 is horizontally attached to the middle part of the side surface of the frame member 11a. A hydraulic device 3 is installed on the press surface plate 2.
Is mounted on the frame member 11a, and the frame member 11a has a crankshaft 4 rotatably driven by the hydraulic device 3.
Are rotatably supported by bearings 4a. A plurality of connecting shafts 7 are slidably supported on the fixed platen 11. The upper platen 8 is fixed to the tip of the connecting shaft 7 by a fixing nut 9, and the lower end of the connecting shaft 7 is fixed. Has a lower platen 6 attached thereto.

At the center of the lower platen 6, the lower end of the connecting rod 5 is swingably supported by a supporting member 5a, and the tip of the connecting rod 5 is connected to the crankshaft 4. By driving the hydraulic device 3, the connecting shaft 7 is moved up and down via the crankshaft 4 and the connecting rod 5.

Next, the operation will be described. Figure 4 (a)-
(d) is an upper die 210 and a lower die 212 for lead molding.
FIG. 4A is a view for explaining the movement of the upper die 210 mounted on the lower surface of the upper platen 8 on the fixed surface plate 11 in a standby state as shown in FIG. 4A. It is held at a certain interval with the lower mold 212.

In this state, the lead frame 201, in which the semiconductor element portion is molded with resin, is placed on the lower die 212, and the hydraulic device 3 is driven so that the upper platen 8 is lowered. Shaft 4
Rotates, and the movement is transmitted to the lower platen 6 as vertical movement via the connecting rod 5. At this time, since the connecting shaft 7 connected to the lower platen 6 and the upper platen 8 are integrated with each other by the fixing nut 9, the vertical movement of the lower platen 6 is directly performed via the connecting shaft 7 as the vertical movement of the upper platen 8. Become. As a result, the upper die 210 and the lower die 212 come close to each other, and the pressing rods 10b and 12 protruding from the die bodies 10 and 12 are brought close to each other.
The lead frame 201 is pressed and clamped by b (FIG. 4).
(See (b)).

When the upper platen 8 is continuously lowered, the upper and lower holding rods 10b and 12b are sunk into the die bodies 10 and 12 with the lead frame 201 being held therebetween, and the upper die punches. 13 comes into contact with the lead frame 201 on the die 14 of the lower mold (see FIG. 4 (c)). When the upper platen 8 is further lowered by a predetermined distance and stopped, the lead frame 201 is pressed by the punch 13 and the die 14, that is, the semiconductor element (not shown) is separated from the lead frame 201 and the leads of the semiconductor element are separated. Molding is performed simultaneously (see Fig. 4 (d)).

[0009]

However, in the conventional lead forming apparatus, the upper and lower molds 21 are driven by the hydraulic device 3.
Since a so-called hydraulic drive system for tightening 0 and 212 is used, maintenance such as inspection and prevention of oil leaks and replacement of seal members of the hydraulic device is very complicated, and the mold clamping force is controlled with high accuracy. There was a problem that it was not possible and the responsiveness was poor.

That is, since the platen 8 is moved up and down by the rotation of the crankshaft 4, the stop position of the platen 8 at the time of mold clamping varies and an error occurs in the mold clamping force. Also, if the stroke of the platen 8 has a margin when the mold is clamped, the upper platen 8 can be used even if the lead is not completely formed.
Although the lead can be corrected by further lowering it, in the above-mentioned conventional apparatus, since the lifting stroke of the platen 8 is restricted by the shape of the crankshaft 4, there is no margin and a high quality product can be manufactured with high productivity. In addition, the time required to move the mold to a predetermined height position becomes a problem in mass production, and the mold clamping responsiveness is not good.

Further, when the number of leads of the semiconductor device to be molded is different, the mold clamping load of the molding die is also different, but the power source for generating the mold clamping force is 1 as in the conventional device.
However, since the mold clamping force is constant, it is necessary to adjust the hydraulic pressure of the hydraulic system to change the mold clamping force, and it is not possible to re-tighten the lead according to the molding condition of the lead. There was a point.

By the way, Japanese Unexamined Patent Publication (Kokai) No. 62-28220 and Japanese Unexamined Patent Publication (Kokai) No. 2-45111 disclose mold clamping devices which perform mold clamping using two drive sources. The mold is opened and closed by the drive source, and the mold is clamped by the other drive source, and the hydraulic drive type is also used as the drive source. is there.

The present invention has been made in view of the above problems, and the maintenance is easy, and the mold clamping force can be controlled according to the press working condition without adjusting the press drive source, and high quality is achieved. It is an object of the present invention to obtain a press device capable of performing press processing with high accuracy.

Further, according to the present invention, the leads of the semiconductor device can be formed with high accuracy and high productivity by appropriately controlling the mold clamping force of the lead forming die, and leads of high quality can be formed. An object is to provide a molding method.

It is another object of the present invention to provide a resin encapsulation method capable of encapsulating a semiconductor device with a resin with high productivity by appropriately controlling the mold clamping force of a resin encapsulating mold. ..

[0016]

A press working apparatus according to the present invention is capable of moving a fixed die plate which supports a fixed die member and a movable die member so as to face the fixed die member and move toward and away from the fixed die member. A movable platen supported by the movable platen, and a main power source for moving the movable platen, and an auxiliary power source attached to the movable platen and the auxiliary power in an apparatus for pressing a work between the mold members. Source and a connecting rod that connects the movable mold member to each other, and an auxiliary press mechanism for displacing the movable mold member with respect to the movable platen by the auxiliary power source to press the fixed mold member, The pressing force of the above can be switched by the main power source and the auxiliary power source as needed.

The present invention provides the press working apparatus as described above,
A second auxiliary power source is arranged on the fixed surface plate, the fixed mold member is supported so as to be retractable from the support surface plate, and the fixed mold member is connected to the second auxiliary power source by a connecting rod. Thus, the second auxiliary pressing mechanism for pressing the fixed mold member against the movable mold member is provided.

The present invention provides the press working apparatus as described above,
As the main power source, there is provided a main power unit including a motor for rotating the screw shaft to generate the mold clamping force of the mold members, and a motor control unit for controlling the torque of the motor. As a power source, an auxiliary power unit including an auxiliary motor that rotates a shaft with a screw to generate a mold clamping force for the two mold members and an auxiliary motor control unit that controls the torque of the motor is provided. ..

A lead forming method according to the present invention is a method of forming leads of a semiconductor element using the press working apparatus, wherein a die is used as the fixed die member in a fixed die body and the movable die is used. The movable platen is used as a main power source by using a pair of upper and lower lead forming dies for forming a lead of the semiconductor element at the same time when the semiconductor element is separated from the lead frame by incorporating a punch as a die member in the main body of the movable die. The upper and lower lead forming molds so that a predetermined tightening force is generated between them, and in this state, the punch is moved by an auxiliary driving source to separate the semiconductor element and lead. It is for molding.

A resin sealing method according to the present invention is a method of resin-sealing a semiconductor element using the above-mentioned press working apparatus, wherein a lead frame is sandwiched between the fixed and movable mold members. In this state, using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion of the lead frame, the movable platen is moved by the main power source, and both molds are moved. Mold clamping so that a predetermined clamping force is generated between them, and in this state, the movable side resin sealing mold is moved by an auxiliary drive source so that additional clamping force is generated between the two molds. Is to do.

[0021]

According to the present invention, the auxiliary power source is attached to the movable platen, and the movable die member of the lead forming die attached to the movable platen is connected to the auxiliary power source by the connecting rod. Since an auxiliary pressing mechanism for displacing the movable mold member with respect to the movable platen and pressing it against the fixed mold member is provided, the movable platen is moved by the main power source to clamp the pair of lead forming molds. After that, the movable mold member can be pressed against the fixed mold member by the auxiliary power source, and the mold can be retightened without adjusting the press drive source according to the processing situation. It is possible to perform press processing with high quality and high accuracy.

In the present invention, a second auxiliary power source is provided on the fixed platen, the fixed mold member is supported so as to be retractable from the fixed platen, and the fixed mold member is connected. Since the second auxiliary pressing mechanism, which is connected to the second auxiliary power source by the rod and presses the fixed mold member against the movable mold member, is provided, it is possible to perform the retightening of the mold in multiple stages. it can.

Further, in the present invention, as the main power source, a main power unit comprising a main motor for generating a mold clamping force for the both lead molding dies and a main motor control means for controlling the torque of the motor. As an auxiliary power source, an auxiliary power unit including an auxiliary motor that generates a mold clamping force between the fixed and movable mold members and an auxiliary motor control unit that controls the torque of the motor is used. The tightening force can be finely controlled, the quality can be further improved, and maintenance is easy because no hydraulic mechanism is used in the drive system.

Further, according to the present invention, the above-mentioned press working apparatus is used for molding the leads of the semiconductor element, and the die and the punch are incorporated in a pair of lead molding dies, respectively.
Since the movable platen is moved by the main power source, the lead forming die is clamped so that a predetermined clamping force is generated between them, and in this state, the punch is moved by the auxiliary drive source. The leads of the semiconductor device can be formed with high accuracy and high productivity by appropriately controlling the mold clamping force of the lead forming die, and high-quality leads can be formed.

Further, in the present invention, the press working apparatus is used for resin sealing of the semiconductor element, and the lead frame is sandwiched between the fixed mold and the movable mold member with the lead frame sandwiched therebetween. Using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion, the movable platen is moved by the main power source, and the two molds are clamped with a predetermined clamping force between them. In this state, the movable side resin sealing mold is moved by an auxiliary drive source so that the additional mold clamping force is generated between the two molds.
The resin sealing of the semiconductor device can be performed with good productivity by appropriately controlling the mold clamping force of the resin sealing mold.

[0026]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front view showing the overall structure of a lead forming apparatus according to an embodiment of the present invention. In the drawing, 100 is the lead forming apparatus of the present embodiment, in which the lower platen 6 rotates a ball screw 20. And the punch 13 is moved up and down by using the upper die main body 10 for lead molding.
The punch 13 is attached to and retracted from the inside, and the punch 13 is independently moved up and down by an auxiliary motor (auxiliary power source) 25 arranged on the upper surface of the upper platen 8.

That is, the ball screw 20 is provided so as to penetrate the lower platen 6 by being screwed into a nut member 21 attached to the central portion of the lower platen 6.
Its lower end is supported by a bearing 22 attached to the gantry 1, and its upper end serves as the main power source for the fixed surface plate 11
Is connected to a rotary shaft 19 of a motor 18 attached to the lower surface of the.

The punch 13 is supported in an upper mold body 10 attached to the lower surface of the upper platen 8 so as to be retractable, and together with the upper mold body 10, the lead molding upper mold 11 is formed.
0, and the punch 13 is connected to the motor 25.
It is connected to a punch pressing ball screw 26 that rotates and moves forward and backward by the rotation of. Further, a lower mold body 12 is attached to the fixed surface plate 11, and inside the lower mold body 12,
A die 14 is embedded so as to face the punch 13 to form a pair, and the die 14 constitutes a lead forming lower die 112 together with the lower die body 12. Further, the upper and lower molds 110, 112 for forming the leads are provided with the pressing rods 10b, 12 biased in the projecting direction as in the conventional apparatus.
b, a stopper pin 1 for protecting the punch 13 and the die 14
0a and 12a are attached. Also, at the four corners of the lower surface of the gantry 1, adjust members 1a for adjusting the height position of the work according to the height of the worker are attached.

Next, the operation will be described. Figure 2 (a)
(d) is a diagram for explaining the operation of the lead forming apparatus 100. When the lead forming apparatus 100 is in a standby state, as shown in FIG. The molds 110 and 112 are held at regular intervals.

When molding the leads, the lead frame 201, in which the semiconductor element portion is resin-molded, is placed on the lower die 112, and the main power motor 18 is first driven in the die clamping direction to rotate the ball screw 20. As a result, the lower platen 6 is pushed down, whereby the upper die 110 for lead molding is lowered onto the lower die 12 for lead molding.

When the upper die 110 descends by a predetermined distance,
The pressing rod 10b of the upper die 110 is connected to the lead frame 20.
It comes into contact with 1 and sandwiches this together with the pressing rod 12b of the lower die (see FIG. 2 (b)). When the upper die 110 is further lowered by a certain distance, the punch 13 of the upper die 110 comes into contact with the lead frame 201 on the die 14 of the lower die 12 to generate a die clamping force between the punch 13 and the die 14. However, when the mold clamping force reaches a value corresponding to the maximum torque of the main power motor 18, the rotation of the ball screw 20 is stopped (see FIG. 2 (c)).

In the state where the first-stage mold clamping by the main power motor 18 is completed in this way, the auxiliary power motor 25 rotates the ball screw 26 as necessary to rotate the punch 1
3 is pressed toward the die 14 to perform the additional tightening, and the second stage mold clamping is performed. As a result, it is possible to deal with the case where the lead is not sufficiently formed in the first stage of the mold clamping state, and a mold for lead molding in which the mold clamping load is larger than that of the standard type.

As described above, in this embodiment, the auxiliary power motor 25 is attached to the upper platen 8 and the punch 1 is freely retractable in the upper die 110 fixed to the upper platen 8.
3, the punch 13 is attached to the auxiliary power motor 25.
Since it is pressed by the ball screw 26 for punch pressing which is rotated by the auxiliary power as needed, the main power motor 18 clamps the upper and lower molds 110, 112 for lead molding. Punch 1 by motor 25
3 can be pressed to the die 14 side to perform additional mold clamping, and even if a mold having a different mold clamping load is mounted, by controlling the second stage mold clamping force without adjusting the power source for mold clamping. High quality and high precision products can be manufactured. Further, in the device of the present embodiment, since the motor is used as the power source, there is an effect that maintenance is easier as compared with the hydraulic drive system.

In the above embodiment, the punch 13 of the upper mold 110 is driven by the auxiliary power motor 25 independently of the upper platen 8 to generate an additional tightening force. Platen 8 is also used for dies.
It may be configured to generate a mold clamping force independent of the clamping force by.

A lead forming apparatus having such a structure will be described below with reference to FIG. 1 as a second embodiment. A second auxiliary motor (not shown) is provided as an auxiliary power source on the fixed surface plate 11. In addition, the die 14 is supported by the lower die body 12 so that it can be retracted from the lower die 112, and the die 14 is connected to a second auxiliary motor by a connecting rod (not shown). Is pressed to the punch 13 side. In this case, there is an effect that the retightening of the upper and lower lead forming dies can be switched in multiple stages.

In each of the above embodiments, the power source is
Although a motor that simply generates a rotational force is used, this is a main power source that controls the torque of the motor in addition to the motor that rotates the ball screw 20 to generate the mold clamping force of the two dies. A motor control means is provided, and the ball screw 26 is rotated as each auxiliary power source to rotate the punch 1 as described above.
3 for generating a mold clamping force between the die 3 and the die 14
In addition to 5, auxiliary motor control means for controlling the torque of the motor may be provided. In this case, the mold clamping force can be finely controlled, and the quality can be further improved.

Furthermore, in the above description, a lead molding apparatus for a semiconductor device has been described, but the press mechanism employed in the lead molding apparatus may be used for a device for sealing a semiconductor element with resin.

A resin sealing device as a third embodiment of the present invention will be briefly described below with reference to FIG. 1. Instead of the die 14 and punch 13 of the device 100 shown in FIG. Using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion of the lead frame with the frame sandwiched, the movable platen is moved by the main power source, The mold is clamped so that a predetermined clamping force is generated between them, and in this state, the movable side resin sealing mold is moved by an auxiliary drive source, and an additional clamping force is generated between the two molds. The mold clamping may be performed. In this case, there is an effect that the resin sealing of the semiconductor device can be performed with good productivity by appropriately controlling the mold clamping force of the resin sealing mold.

Further, in the above description, the power transmission system in the press mechanism is shown as a ball screw direct-acting system, but the power transmission system is not limited to this. For example, a system using a crankshaft in a conventional device may be used. Can be adopted.

[0040]

As described above, according to the press working apparatus of the present invention, an auxiliary power source is attached to the movable platen, and the movable die member of the lead forming die attached to the movable platen is connected by the connecting rod. Since it is connected to a power source and has an auxiliary pressing mechanism that displaces the movable mold member with respect to the movable platen by the auxiliary power source and presses it against the fixed mold member, the movable platen is moved by the main power source. Even after the pair of lead forming dies are clamped by the above, the movable mold member can be pressed against the fixed mold member by the auxiliary power source, and the press drive source of the press drive source can be changed according to the processing situation. There is an effect that the mold can be retightened without adjustment, and high-quality and highly accurate press working can be performed.

According to the invention, in the press working apparatus, the second auxiliary power source is arranged on the fixed platen, and the fixed mold member is supported so as to be retractable from the fixed platen. Since the fixed mold member is connected to the second auxiliary power source by the connecting rod and the second auxiliary press mechanism for pressing the fixed mold member against the movable mold member is provided, the tightening of the mold is frequently performed. There is an effect that it can be performed by switching to stages.

Further, according to the invention, in the press working apparatus, as each of the power sources, a power comprising a motor for generating a mold clamping force of the both molds and a motor control means for controlling the torque of the motor. Since the device is used, the mold clamping force can be finely controlled, the quality can be further improved, and maintenance is easy because the drive system is a motor rather than a hydraulic mechanism.

Further, according to the lead forming method of the present invention, the press working apparatus is used for forming the leads of the semiconductor element, the die and the punch are incorporated in the pair of lead forming dies, respectively, and the movable platen is mainly used. Since the lead forming die is clamped by a power source so that a predetermined clamping force is generated between them, in this state, the punch is moved by an auxiliary drive source. Can be formed with high accuracy and high productivity by appropriately controlling the mold clamping force of the lead forming die, and high quality lead forming can be achieved.

Further, according to the resin sealing device of the present invention, the press working device is used for resin sealing the semiconductor element, and the lead frame is sandwiched between the fixed mold and the movable mold member. In this state, using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion of the lead frame, the movable platen is moved by the main power source, and both molds are moved. Mold clamping so that a predetermined clamping force is generated between them, and in this state, the movable side resin sealing mold is moved by an auxiliary drive source so that additional clamping force is generated between the two molds. Therefore, there is an effect that the resin sealing of the semiconductor device can be performed with good productivity by appropriately controlling the mold clamping force of the resin sealing mold.

[Brief description of drawings]

FIG. 1 is a front view showing the overall configuration of a lead forming apparatus according to an embodiment of the present invention.

FIG. 2 is a diagram for explaining the operation of the lead forming apparatus.

FIG. 3 is an overall front view showing an example of a conventional lead forming apparatus of this type.

FIG. 4 is a diagram for explaining the operation of the conventional device.

[Explanation of symbols]

 1 Stand 6 Lower Platen 7 Connecting Shaft 8 Upper Platen 9 Fixing Nut 10 Upper Mold Body 10a, 12a Stopper Pins 10b, 12b Holding Rod 11 Fixed Surface Plate 12 Lower Mold Body 13 Punch (Movable Mold Member) 14 Die (Fixed) Mold member) 18 Main power motor (main power source) 19 Drive shaft 20 Ball screw 21 Nut 22 Bearing 25 Auxiliary power motor (auxiliary power source) 26 Punch pressing ball screw 100 Lead forming device 110 Lead forming upper die 112 Lead Lower mold for molding

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[Procedure amendment]

[Submission date] August 3, 1992

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 5

[Correction method] Change

[Correction content]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] 0002

[Correction method] Change

[Correction content]

[0002]

2. Description of the Related Art FIG. 3 is a front view showing an example of a conventional lead forming apparatus of this type. In the figure, reference numeral 200 denotes a lead forming apparatus for forming leads of a semiconductor element, in which a fixed platen 11 to which a lead forming lower die 212 is attached and a lead forming upper die 210 are opposed to the lower die 212. The upper platen (movable platen) 8 is supported so as to be able to approach and separate from the upper platen, and a power source 3 for moving the upper platen 8 and the like.

[Procedure 3]

[Document name to be amended] Statement

[Correction target item name] 0020

[Correction method] Change

[Correction content]

A resin sealing method according to the present invention is a method of resin-sealing a semiconductor element using the above-mentioned press working apparatus, wherein a lead frame is sandwiched between the fixed and movable mold members. In this state, using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion of the lead frame, the movable platen is moved by the main power source, and both molds are moved. predetermined tightening force is tightened type as those generated during, in this state, the movable-side resin sealing mold to move by an auxiliary driving source, type as the clamping force is generated added between the dies It is to tighten.

[Procedure amendment 4]

[Document name to be amended] Statement

[Name of item to be corrected] 0025

[Correction method] Change

[Correction content]

Further, in the present invention, the press working apparatus is used for resin sealing of the semiconductor element, and the lead frame is sandwiched between the fixed mold and the movable mold member with the lead frame sandwiched therebetween. Using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion, the movable platen is moved by the main power source, and the two molds are clamped with a predetermined clamping force between them. There tighten type to occur, in this state, the movable-side resin sealing <br/> mold by moving the auxiliary driving source, performing mold clamping as the clamping force is generated added between the dies Thus, the semiconductor device can be resin-sealed with good productivity by appropriately controlling the mold clamping force of the resin-sealing die.

[Procedure Amendment 5]

[Document name to be amended] Statement

[Name of item to be corrected] 0030

[Correction method] Change

[Correction content]

When molding the leads, the lead frame 201, in which the semiconductor element portion is resin-molded, is placed on the lower die 112, and the main power motor 18 is first driven in the die clamping direction to rotate the ball screw 20. As a result, the lower platen 6 is pushed down, whereby the upper die 110 for lead forming comes down onto the lower die 112 for lead forming.

[Procedure Amendment 6]

[Document name to be amended] Statement

[Correction target item name] 0031

[Correction method] Change

[Correction content]

When the upper die 110 descends by a predetermined distance,
The pressing rod 10b of the upper die 110 is connected to the lead frame 20.
It comes into contact with 1 and sandwiches this together with the pressing rod 12b of the lower die (see FIG. 2 (b)). When the upper die 110 is further lowered by a certain distance, the punch 13 of the upper die 110 comes into contact with the lead frame 201 on the die 14 of the lower die 112 , and a die clamping force is generated between the punch 13 and the die 14. However, when the mold clamping force reaches a value corresponding to the maximum torque of the main power motor 18, the rotation of the ball screw 20 is stopped (see FIG. 2 (c)).

[Procedure Amendment 7]

[Document name to be amended] Statement

[Name of item to be corrected] 0033

[Correction method] Change

[Correction content]

As described above, in this embodiment, the auxiliary power motor 25 is attached to the upper platen 8 and the punch 1 is freely retractable in the upper die 110 fixed to the upper platen 8.
3, the punch 13 is attached to the auxiliary power motor 25.
Since to press the punch pressing the ball screw 26 is rotated, the lead formed by the main power motor 18, in a state where the lower mold 110, 112 is Me clamping, optionally assisted by The punch 13 can be pressed to the die 14 side by the power motor 25 to perform additional mold clamping, and even when a mold having a different mold clamping load is mounted, the second stage mold without adjusting the power source for the mold clamping. By controlling the tightening force, it is possible to manufacture high quality and highly accurate products. Further, in the device of the present embodiment, since the motor is used as the power source, there is an effect that maintenance is easier as compared with the hydraulic drive system.

[Procedure Amendment 8]

[Document name to be amended] Statement

[Correction target item name] 0038

[Correction method] Change

[Correction content]

A resin sealing device as a third embodiment of the present invention will be briefly described below with reference to FIG. 1. Instead of the die 14 and punch 13 of the device 100 shown in FIG. Using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion of the lead frame with the frame sandwiched, the movable platen is moved by the main power source, mold was clamped type as predetermined clamping force between them occurs, in this state, the movable-side resin sealing mold to move by an auxiliary driving source, additional clamping force between the molds occurs The mold may be clamped so as to do so. In this case, there is an effect that the resin sealing of the semiconductor device can be performed with good productivity by appropriately controlling the mold clamping force of the resin sealing mold.

[Procedure Amendment 9]

[Document name to be amended] Statement

[Correction target item name] 0039

[Correction method] Change

[Correction content]

Further, in the above description, the power transmission system in the press mechanism is shown as a ball screw direct-acting system, but the power transmission system is not limited to this, and for example, a system using a crankshaft in a conventional device is used. Can also be adopted.

[Procedure Amendment 10]

[Document name to be amended] Statement

[Correction target item name] 0044

[Correction method] Change

[Correction content]

Further, according to the resin sealing device of the present invention, the press working device is used for resin sealing the semiconductor element, and the lead frame is sandwiched between the fixed mold and the movable mold member. In this state, using a pair of upper and lower resin sealing molds in which a resin filling space is formed so as to surround the element mounting portion of the lead frame, the movable platen is moved by the main power source, and both molds are moved. predetermined tightening force is tightened type as those generated during, in this state, by moving the auxiliary driving source the movable side resin sealing mold,
Since the mold is clamped so that an additional clamping force is generated between the two molds, the semiconductor device should be resin-molded with high productivity by appropriately controlling the mold-molding force of the resin mold. There is an effect that can be.

[Procedure Amendment 11]

[Document name to be amended] Statement

[Correction target item name] Explanation of code

[Correction method] Change

[Correction content]

[Explanation of symbols] 1 cradle 6 lower platen 7 connecting shaft 8 upper platen 9 fixing nut 10 upper mold body 10a, 12a stopper pins 10b, 12b presser rod 11 fixed surface plate 12 lower mold body 13 punch (movable mold member) ) 14 die (fixed mold member) 18 main power motor (main power source) 19 drive shaft 20 ball screw 21 nut 22 bearing 25 auxiliary power motor (auxiliary power source) 26 punch pressing ball screw 100 lead forming device 110 lead forming Upper mold 112 Lower mold for lead molding

[Procedure Amendment 13]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 1

[Correction method] Change

[Correction content]

[Figure 1]

[Procedure Amendment 14]

[Document name to be corrected] Drawing

[Name of item to be corrected] Figure 2

[Correction method] Change

[Correction content]

[Fig. 2]

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁵ Identification code Internal reference number FI Technical display location B30B 15/14 K 7819-4E H01L 21/56 T 8617-4M // B29L 31:34 4F

Claims (5)

[Claims] 1. A fixed platen for holding a fixed mold member, a movable platen that supports the movable mold member so as to face the fixed mold member so that the movable mold member can approach and separate from the fixed mold member, and a main body that moves the movable platen. A press working apparatus, comprising: a power source, for pressing a work between the two molds, wherein an auxiliary power source attached to the movable platen, and a connection for connecting the auxiliary power source and the movable mold member. An auxiliary pressing mechanism configured to displace the movable mold member with respect to the movable platen by the auxiliary power source and press the fixed mold member by the auxiliary power source, and the main power source as needed to press the work. And a press working apparatus characterized by being switchable by an auxiliary power source. 2. The press working apparatus according to claim 1, wherein a second auxiliary power source is arranged on the fixed surface plate, and the fixed mold member is supported so as to be retractable from the fixed surface plate. A press working apparatus comprising a second auxiliary pressing mechanism configured to connect a fixed mold member to a second auxiliary power source by a connecting rod and press the fixed mold member toward a movable mold member. 3. The press working apparatus according to claim 1, wherein a motor that rotates a shaft with a screw to generate a mold clamping force for both the mold members and a torque of the motor are used as the main power source. A main power unit comprising a motor control means for controlling, an auxiliary motor that rotates a shaft with a screw to generate a mold clamping force for both mold members as each auxiliary power source, and a torque of the motor is controlled. A press working apparatus comprising an auxiliary power unit including auxiliary motor control means for 4. A method of forming leads of a semiconductor element by using the press working apparatus according to claim 1, wherein a die is used as the fixed mold member in a fixed mold body, and the die is used as the movable mold member. The movable platen is moved by the main power source by using a pair of upper and lower lead molding dies that are formed by incorporating a punch into the movable mold body and separate the semiconductor element from the lead frame and simultaneously mold the leads of the semiconductor element. Then, the upper and lower lead forming dies are clamped so that a predetermined clamping force is generated between them, and in this state, the punch is moved by an auxiliary drive source to separate the semiconductor element and form the leads. A lead forming method characterized by the above. 5. A method of resin-sealing a semiconductor element using the press working apparatus according to claim 1, wherein a lead frame is sandwiched between the fixed and movable mold members, Using a pair of upper and lower resin sealing dies in which a resin filling space is formed so as to surround the element mounting portion of the lead frame, the movable platen is moved by a main power source, and the two dies are placed between them in a predetermined manner. Clamping is performed so that the above clamping force is generated, and in this state, the movable side resin sealing mold is moved by an auxiliary drive source to perform clamping so that an additional clamping force is generated between the two molds. A characteristic resin sealing method.