JP2010537442A - プレート状物体のウェット処理用装置 - Google Patents
プレート状物体のウェット処理用装置 Download PDFInfo
- Publication number
- JP2010537442A JP2010537442A JP2010522290A JP2010522290A JP2010537442A JP 2010537442 A JP2010537442 A JP 2010537442A JP 2010522290 A JP2010522290 A JP 2010522290A JP 2010522290 A JP2010522290 A JP 2010522290A JP 2010537442 A JP2010537442 A JP 2010537442A
- Authority
- JP
- Japan
- Prior art keywords
- plate
- gas
- spin chuck
- rotating
- nozzle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims description 28
- 239000007789 gas Substances 0.000 description 81
- 238000000034 method Methods 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Abstract
【選択図】 図1
Description
該スピンチャックは、該プレート状物体を該プレート状物体のエッジで保持する手段と、該プレート状物体の該スピンチャックに面する側の方へガスを導くガス供給手段と、を備える、該プレート状物体の保持、回転用スピンチャックであって、該ガス供給手段が該プレート状物体と該スピンチャックとの間にガスクッションを設けるために該スピンチャックと共に回転するガスノズルを有しており、
該流体供給手段は、該プレート状物体の該スピンチャックと面する側に、非回転流体ノズルを通して流体を導く手段である。
利点を有する。従って、ガスクッションを提供するガスが処理流体(例えば、液体)に干渉しないことが可能である。
くしてガス分配室34への接続部を有しない。
持する。
Claims (12)
- 単一のプレート状物体のエッジで該プレート状物体を保持する手段と、スピンチャックに面するプレート状物体の側方に向かってガスを導き、該プレート状物体とスピンチャックの間にガスクッションを設けるために該スピンチャックと共に回転するガスノズルを有するガス供給手段とを備える、プレート状物体を保持して回転するスピンチャックと、
該プレート状物体の該スピンチャックに面する側に、非回転流体ノズルを介して流体を導く流体供給手段と、を具備する単一のプレート状物体のウェット処理用装置。 - 該ガス供給手段が複数のガスノズルを有する請求項1記載の装置。
- 該複数のガスノズルが回転の軸線に対して環状に配置されている請求項2記載の装置。
- 該ガス供給手段が環状のガスノズルを有する請求項1記載の装置。
- 該ガスノズルが、該スピンチャックの一部分である回転ガス分配室を通して供給を受ける請求項1記載の装置。
- 該ガス分配室が非回転ガス給気部を通して給気される請求項5記載の装置。
- 該非回転ガス給気部がガス分配室と、該回転ガス分配室に給気するために、複数の環状配置されたノズル又はスリット形環状ノズルと、を有する請求項6記載の装置。
- 該非回転流体ノズルと該非回転ガス給気部とが、該スピンチャックの中央を軸方向に通過するノズル組立体の要素である請求項7記載の装置。
- 該スピンチャックが該プレート状物体に平行なプレートを備え、該プレートは該非回転流体ノズルが通過する中央孔を有する請求項1記載の装置。
- 該スピンチャックが、該プレート状物体を該プレート状物体のエッジで把持する移動可能な把持用要素を備える請求項1記載の装置。
- 少なくとも2つの非回転流体ノズルを有する請求項1記載の装置。
- 非回転流体ノズルが液体源に接続される請求項1記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AT13602007 | 2007-08-30 | ||
ATA1360/2007 | 2007-08-30 | ||
PCT/EP2008/060375 WO2009027194A1 (en) | 2007-08-30 | 2008-08-07 | Apparatus for wet treatment of plate-like articles |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010537442A true JP2010537442A (ja) | 2010-12-02 |
JP5261491B2 JP5261491B2 (ja) | 2013-08-14 |
Family
ID=39811573
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010522290A Active JP5261491B2 (ja) | 2007-08-30 | 2008-08-07 | プレート状物体のウェット処理用装置 |
Country Status (7)
Country | Link |
---|---|
US (1) | US8888952B2 (ja) |
EP (1) | EP2201597B1 (ja) |
JP (1) | JP5261491B2 (ja) |
KR (1) | KR20100044912A (ja) |
CN (1) | CN101796611B (ja) |
TW (1) | TWI348934B (ja) |
WO (1) | WO2009027194A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016203680A1 (ja) * | 2015-06-19 | 2016-12-22 | 信越半導体株式会社 | 枚葉式ウェーハ洗浄処理装置及びウェーハ洗浄方法 |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI348934B (en) * | 2007-08-30 | 2011-09-21 | Lam Res Ag | Apparatus for wet treatment of plate-like articles |
JP2012064800A (ja) * | 2010-09-16 | 2012-03-29 | Sumco Corp | ウェーハ洗浄装置 |
US8945341B2 (en) | 2011-08-22 | 2015-02-03 | Lam Research Ag | Method and device for wet treatment of plate-like articles |
CN103094166B (zh) * | 2011-10-31 | 2015-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶圆承载装置及具有它的半导体处理设备 |
CN105088186B (zh) * | 2011-11-23 | 2018-05-15 | 中微半导体设备(上海)有限公司 | 化学气相沉积反应器或外延层生长反应器及其支撑装置 |
US8974632B2 (en) * | 2011-11-30 | 2015-03-10 | Lam Research Ag | Device and method for treating wafer-shaped articles |
US20130309874A1 (en) * | 2012-05-15 | 2013-11-21 | Lam Research Ag | Method and apparatus for liquid treatment of wafer-shaped articles |
US9418883B2 (en) * | 2013-07-03 | 2016-08-16 | Lam Research Ag | Device for holding wafer shaped articles |
US10707099B2 (en) | 2013-08-12 | 2020-07-07 | Veeco Instruments Inc. | Collection chamber apparatus to separate multiple fluids during the semiconductor wafer processing cycle |
DE102013220252A1 (de) * | 2013-10-08 | 2015-04-09 | Rudolph Technologies Germany Gmbh | Halte- und Drehvorrichtung für flache Objekte |
WO2015081072A1 (en) | 2013-11-26 | 2015-06-04 | Applied Materials Israel, Ltd. | System and method for forming a sealed chamber |
US9536770B2 (en) | 2014-01-14 | 2017-01-03 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
US10167552B2 (en) * | 2015-02-05 | 2019-01-01 | Lam Research Ag | Spin chuck with rotating gas showerhead |
US9887120B2 (en) * | 2015-11-03 | 2018-02-06 | Lam Research Ag | Apparatus for treating surfaces of wafer-shaped articles |
US9968970B2 (en) * | 2015-12-04 | 2018-05-15 | Lam Research Ag | Spin chuck with in situ cleaning capability |
US10068792B2 (en) * | 2016-05-31 | 2018-09-04 | Lam Research Ag | Method and apparatus for liquid treatment of wafer shaped articles |
TWI797121B (zh) | 2017-04-25 | 2023-04-01 | 美商維克儀器公司 | 半導體晶圓製程腔體 |
EP3594748B1 (en) * | 2018-07-09 | 2021-04-14 | C&D Semiconductor Services. Inc | Optimal exposure of a bottom surface of a substrate material and/or edges thereof for cleaning in a spin coating device |
JP7213648B2 (ja) * | 2018-09-27 | 2023-01-27 | 東京エレクトロン株式会社 | 基板処理装置 |
GB202401389D0 (en) | 2024-02-02 | 2024-03-20 | Lam Res Ag | Apparatus for processing a wafer-shaped article and gripping pin |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003059896A (ja) * | 2001-08-14 | 2003-02-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2003324090A (ja) * | 2002-04-26 | 2003-11-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2004134431A (ja) * | 2002-10-08 | 2004-04-30 | Sprout Co Ltd | 基板処理装置およびその製造方法 |
JP2006157008A (ja) * | 2004-11-26 | 2006-06-15 | Kaijo Corp | 基板支持用チャック |
Family Cites Families (8)
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TW434052B (en) * | 1996-02-20 | 2001-05-16 | Pre Tech Co Ltd | Washing device of disk to be washed |
JP3563605B2 (ja) * | 1998-03-16 | 2004-09-08 | 東京エレクトロン株式会社 | 処理装置 |
JP2001319910A (ja) * | 2000-05-08 | 2001-11-16 | Tokyo Electron Ltd | 液処理装置 |
DE50004935D1 (de) * | 2000-10-31 | 2004-02-05 | Sez Ag Villach | Vorrichtung zur Flüssigkeitsbehandlung von scheibenförmigen Gegenständen |
US6669808B2 (en) * | 2001-03-22 | 2003-12-30 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus and substrate processing method |
DE50212020D1 (de) * | 2001-05-29 | 2008-05-15 | Aixtron Ag | Aus einem tragkörper und darauf gasgelagerten und drehangetriebenen substrathalter bestehende anordnung |
US6786996B2 (en) * | 2001-10-16 | 2004-09-07 | Applied Materials Inc. | Apparatus and method for edge bead removal |
TWI348934B (en) * | 2007-08-30 | 2011-09-21 | Lam Res Ag | Apparatus for wet treatment of plate-like articles |
-
2008
- 2008-07-31 TW TW097128990A patent/TWI348934B/zh active
- 2008-08-07 JP JP2010522290A patent/JP5261491B2/ja active Active
- 2008-08-07 EP EP08786977.2A patent/EP2201597B1/en active Active
- 2008-08-07 KR KR1020107006238A patent/KR20100044912A/ko active Search and Examination
- 2008-08-07 US US12/675,845 patent/US8888952B2/en active Active
- 2008-08-07 CN CN200880104571.2A patent/CN101796611B/zh active Active
- 2008-08-07 WO PCT/EP2008/060375 patent/WO2009027194A1/en active Application Filing
Patent Citations (4)
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JP2003059896A (ja) * | 2001-08-14 | 2003-02-28 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2003324090A (ja) * | 2002-04-26 | 2003-11-14 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2004134431A (ja) * | 2002-10-08 | 2004-04-30 | Sprout Co Ltd | 基板処理装置およびその製造方法 |
JP2006157008A (ja) * | 2004-11-26 | 2006-06-15 | Kaijo Corp | 基板支持用チャック |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016203680A1 (ja) * | 2015-06-19 | 2016-12-22 | 信越半導体株式会社 | 枚葉式ウェーハ洗浄処理装置及びウェーハ洗浄方法 |
JP2017011062A (ja) * | 2015-06-19 | 2017-01-12 | 信越半導体株式会社 | 枚葉式ウェーハ洗浄処理装置及びウェーハ洗浄方法 |
Also Published As
Publication number | Publication date |
---|---|
CN101796611A (zh) | 2010-08-04 |
CN101796611B (zh) | 2015-09-02 |
TW200914138A (en) | 2009-04-01 |
EP2201597B1 (en) | 2018-10-10 |
TWI348934B (en) | 2011-09-21 |
EP2201597A1 (en) | 2010-06-30 |
US8888952B2 (en) | 2014-11-18 |
JP5261491B2 (ja) | 2013-08-14 |
WO2009027194A1 (en) | 2009-03-05 |
KR20100044912A (ko) | 2010-04-30 |
US20100206481A1 (en) | 2010-08-19 |
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