JP2010533986A - 垂直配向のSiワイヤアレイを形成するための構造及び方法 - Google Patents
垂直配向のSiワイヤアレイを形成するための構造及び方法 Download PDFInfo
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- 238000000034 method Methods 0.000 title claims description 62
- 238000003491 array Methods 0.000 title description 23
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- 239000010931 gold Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 16
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- 229920002120 photoresistant polymer Polymers 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 11
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 238000000151 deposition Methods 0.000 claims description 10
- 229910003902 SiCl 4 Inorganic materials 0.000 claims description 9
- 229910021419 crystalline silicon Inorganic materials 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 238000005530 etching Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 3
- 238000001459 lithography Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
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- 238000000206 photolithography Methods 0.000 description 3
- 229910052697 platinum Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
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- 230000015556 catabolic process Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000002019 doping agent Substances 0.000 description 2
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- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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- 229910052782 aluminium Inorganic materials 0.000 description 1
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- 150000002739 metals Chemical class 0.000 description 1
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- 230000001105 regulatory effect Effects 0.000 description 1
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- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000002174 soft lithography Methods 0.000 description 1
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Abstract
【選択図】図1G
Description
本出願は、同一出願人による同時係属出願である2007年7月19日に出願された「Fabrication of Wire Array Samples and Controls」と題される全体的な内容が参照することにより本書に盛り込まれた米国特許出願第60/961,170号に関し、その利益を主張するものであり、同一出願人による同時係属出願である2007年7月19日に出願された「Growth of Vertically Aligned Si Wire Arrays Over Large Areas(>1cm2)with Au and Cu Catalysts」と題される全体的な内容が参照することにより本書に盛り込まれた米国特許出願第60/961,169に関し、その利益を主張するものである。
米国政府は、米国エネルギー省によって付与された付与番号DE−FG02−03ER15483に従って本発明の特定の権利を有する。
本開示はSiワイヤアレイに関する。特に、本開示は、垂直に配向したSiワイヤアレイの構造及びこのようなアレイを形成するための方法を説明する。
リソグラフィーでパターン形成し、それに続く異方性エッチングを用いて明確なワイヤアレイが作製されているが、このような方法は、一般に広範囲の高品質の基板材料を要する。例えば、Z.Huang、H.Feng及びJ.ZhuによるAdv.Mater.(Weinheim,Ger.)19,744(2007)を参照されたい。
Claims (20)
- 結晶Siワイヤの規則アレイを具える構造であって、
複数の結晶SiワイヤのSiワイヤが、長さ寸法に対して略直交する直径寸法を有しており、
前記複数のSiワイヤの直径寸法の半径が、前記Siワイヤを具える材料の少数キャリヤの拡散長さと略同一であることを特徴とする構造。 - 前記複数のSiワイヤが、光エネルギを受けるための向きと同じ方向に概して向いていることを特徴とする請求項1に記載の構造。
- さらに、基板を具えており、
前記複数のSiワイヤが、前記Siワイヤの第1の端部で前記基板に接しており、
前記Siワイヤの第2の端部が、前記基板に対する前記Siワイヤの垂直又は略垂直な向きを与えるよう配置されていることを特徴とする請求項2に記載の構造。 - 前記結晶Siワイヤの規則アレイが、前記基板上の1cm2よりも広い領域にわたって分布していることを特徴とする請求項3に記載の構造。
- 前記複数のSiワイヤが、1μmよりも大きい直径を有し、30μmよりも大きい長さを有することを特徴とする請求項2又は3に記載の構造。
- 前記複数のSiワイヤが、受光した光のエネルギへの最適な変換のために選択される間隔で配置されることを特徴とする請求項2乃至5のいずれか1項に記載の構造。
- 垂直に整列したSiワイヤアレイを製造するための方法であって:
Si基板上にテンプレート層を形成するステップと;
前記Si基板に延びる複数の穴で前記テンプレート層にパターンを形成するステップと;
前記テンプレート層の1又はそれ以上の前記穴の中に触媒を蒸着するステップと;
950℃乃至1100℃の間の温度で前記基板上にワイヤを成長させ、SiCl4を含む成長ガスを適用するステップと;
を具えることを特徴とする方法。 - 前記ワイヤが成長する間の前記温度が、約1000℃乃至約1050℃の間であることを特徴とする請求項7に記載の方法。
- 前記テンプレート層が、約285nm乃至約300nmの間の厚さを有することを特徴とする請求項7又は8に記載の方法。
- 前記テンプレート層が酸化物層を具えており、
前記複数の穴で前記テンプレート層にパターンを形成するステップが:
前記酸化物層にフォトレジスト層を設けるステップと;
所望のパターンの穴で前記フォトレジスト層にパターンを形成するステップと;
前記フォトレジスト層の前記所望のパターンの穴に基いて前記酸化物層をエッチングして、前記酸化物層に前記複数の穴を形成するステップと;
を具えることを特徴とする請求項7乃至9のいずれか1項に記載の方法。 - 前記酸化物層の前記穴の中に触媒を蒸着するステップが:
前記フォトレジスト層の上及び前記酸化物層の穴の中に前記触媒を熱蒸着するステップと;
前記フォトレジスト層をリフトオフするステップと;
を具えることを特徴とする請求項10に記載の方法。 - 前記触媒を蒸着するステップが、光電変換のために選択される長さ及び直径を具えるワイヤを成長させるための厚さの触媒層を蒸着するステップを具えることを特徴とする請求項7乃至11のいずれか1項に記載の方法。
- 前記テンプレート層が、約3μmの直径で中心間が約7μmの間隔を空けた穴の正方配列でパターン形成されることを特徴とする請求項7乃至12のいずれか1項に記載の方法。
- 前記テンプレート層を形成するステップが、前記Si基板上に酸化物層を熱成長させるステップを具えることを特徴とする請求項7乃至13のいずれか1項に記載の方法。
- 前記触媒が、金、銅、又はニッケルを含むことを特徴とする請求項7乃至14のいずれか1項に記載の方法。
- 半導体構造を製造するための方法であって:
Si基板上にテンプレート層を形成するステップと;
前記Si基板に延びる穴の配列で前記テンプレート層にパターンを形成するステップと;
前記穴の配列の1又はそれ以上の穴の中に触媒島部(catalyst island)を形成するステップと;
約950℃乃至約1050℃の間の温度で前記Si基板上に半導体構造を成長させて、SiCl4を含む成長ガスを適用するステップと;
を具えることを特徴とする方法。 - 前記テンプレート層が酸化物層を具えており、
前記酸化物層が、約285nm乃至300nm間の厚さを有することを特徴とする請求項16に記載の方法。 - 前記触媒島部が、金、銅、又はニッケルを含むことを特徴とする請求項16又は17に記載の方法。
- 前記テンプレート層が、ワイヤアレイを形成するよう穴でパターン形成され、
前記ワイヤアレイのワイヤが、約1.5μmの直径を有しており、
前記触媒島部が、約500nmの高さを有する触媒を具えることを特徴とする請求項16乃至18のいずれか1項に記載の方法。 - さらに、前記半導体構造が成長した後にテンプレート層を除去するステップと、
1又はそれ以上の前記半導体構造の上部に残っている残留触媒を除去するステップと、
を具えることを特徴とする請求項16乃至19のいずれか1項に記載の方法。
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US96116907P | 2007-07-19 | 2007-07-19 | |
PCT/US2008/070509 WO2009012469A2 (en) | 2007-07-19 | 2008-07-18 | Structures of and methods for forming vertically aligned si wire arrays |
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US (1) | US8530338B2 (ja) |
EP (1) | EP2171745A4 (ja) |
JP (1) | JP2010533986A (ja) |
KR (1) | KR20100064360A (ja) |
CN (1) | CN101779271B (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257601B2 (en) | 2011-05-17 | 2016-02-09 | Mcmaster University | Light emitting diodes and substrates |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010533985A (ja) * | 2007-07-19 | 2010-10-28 | カリフォルニア インスティテュート オブ テクノロジー | 半導体の規則配列構造 |
KR100955109B1 (ko) * | 2007-07-25 | 2010-04-28 | 김경환 | 휴대용 숯불구이기 |
JP2010541194A (ja) * | 2007-08-28 | 2010-12-24 | カリフォルニア インスティテュート オブ テクノロジー | 垂直配列ワイヤアレイ成長用ウェハの再利用方法 |
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US20110277833A1 (en) * | 2010-05-11 | 2011-11-17 | Molecular Imprints, Inc. | Backside contact solar cell |
US8563351B2 (en) * | 2010-06-25 | 2013-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for manufacturing photovoltaic device |
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WO2013126432A1 (en) | 2012-02-21 | 2013-08-29 | California Institute Of Technology | Axially-integrated epitaxially-grown tandem wire arrays |
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WO2013152132A1 (en) | 2012-04-03 | 2013-10-10 | The California Institute Of Technology | Semiconductor structures for fuel generation |
US9425254B1 (en) | 2012-04-04 | 2016-08-23 | Ball Aerospace & Technologies Corp. | Hybrid integrated nanotube and nanostructure substrate systems and methods |
US9553223B2 (en) | 2013-01-24 | 2017-01-24 | California Institute Of Technology | Method for alignment of microwires |
KR101485341B1 (ko) * | 2013-09-16 | 2015-01-28 | 한국전기연구원 | 반도체 공정 기술 기반 미세패턴 2극 전극 구조 |
CN103771335B (zh) * | 2014-01-15 | 2016-01-20 | 华中科技大学 | 一种仿壁虎脚微纳分级结构及其制造工艺 |
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CN107799387A (zh) * | 2016-09-06 | 2018-03-13 | 中国科学院上海微系统与信息技术研究所 | 一种在掺杂的多晶硅层上制备硅纳米线的方法及结构 |
TW201906599A (zh) * | 2017-05-11 | 2019-02-16 | 美商珍費爾醫療公司 | 吉卡賓組成物及其使用方法 |
KR101954864B1 (ko) * | 2017-10-24 | 2019-03-06 | 울산과학기술원 | 결정질 실리콘계 유연태양전지 및 이의 제조방법 |
CN108445567B (zh) * | 2018-03-30 | 2020-09-18 | 苏州沛斯仁光电科技有限公司 | 一种高损伤阈值的高反膜及制备方法 |
US11251042B2 (en) * | 2019-10-31 | 2022-02-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Formation of single crystal semiconductors using planar vapor liquid solid epitaxy |
US11814740B2 (en) | 2020-08-27 | 2023-11-14 | H2U Technologies, Inc. | System for managing fuel generation |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0597598A (ja) * | 1990-02-23 | 1993-04-20 | Thomson Csf | 結晶ホイスカの制御成長方法と、該方法の尖頭超小型カソード製造への応用 |
WO2006138671A2 (en) * | 2005-06-17 | 2006-12-28 | Illuminex Corporation | Photovoltaic wire |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5352651A (en) | 1992-12-23 | 1994-10-04 | Minnesota Mining And Manufacturing Company | Nanostructured imaging transfer element |
RU2099808C1 (ru) * | 1996-04-01 | 1997-12-20 | Евгений Инвиевич Гиваргизов | Способ выращивания ориентированных систем нитевидных кристаллов и устройство для его осуществления (варианты) |
US5976957A (en) | 1996-10-28 | 1999-11-02 | Sony Corporation | Method of making silicon quantum wires on a substrate |
JPH11214720A (ja) | 1998-01-28 | 1999-08-06 | Canon Inc | 薄膜結晶太陽電池の製造方法 |
US6649824B1 (en) | 1999-09-22 | 2003-11-18 | Canon Kabushiki Kaisha | Photoelectric conversion device and method of production thereof |
EP2273552A3 (en) | 2001-03-30 | 2013-04-10 | The Regents of the University of California | Methods of fabricating nanstructures and nanowires and devices fabricated therefrom |
US7309620B2 (en) | 2002-01-11 | 2007-12-18 | The Penn State Research Foundation | Use of sacrificial layers in the manufacture of high performance systems on tailored substrates |
WO2004010552A1 (en) * | 2002-07-19 | 2004-01-29 | President And Fellows Of Harvard College | Nanoscale coherent optical components |
JP2005194609A (ja) | 2004-01-09 | 2005-07-21 | Sony Corp | 水素ガス発生装置、電気分解装置、太陽電池モジュールおよびエネルギーシステム |
TWI299358B (en) | 2004-03-12 | 2008-08-01 | Hon Hai Prec Ind Co Ltd | Thermal interface material and method for making same |
CN100383213C (zh) | 2004-04-02 | 2008-04-23 | 清华大学 | 一种热界面材料及其制造方法 |
JP2005310388A (ja) | 2004-04-16 | 2005-11-04 | Ebara Corp | 光電変換素子 |
WO2005119753A2 (en) | 2004-04-30 | 2005-12-15 | Nanosys, Inc. | Systems and methods for nanowire growth and harvesting |
KR100767184B1 (ko) | 2005-08-10 | 2007-10-15 | 재단법인서울대학교산학협력재단 | 전자부품 냉각장치 및 그 제조방법 |
US20070122313A1 (en) | 2005-11-30 | 2007-05-31 | Zhiyong Li | Nanochannel apparatus and method of fabricating |
KR101530379B1 (ko) * | 2006-03-29 | 2015-06-22 | 삼성전자주식회사 | 다공성 글래스 템플릿을 이용한 실리콘 나노 와이어의제조방법 및 이에 의해 형성된 실리콘 나노 와이어를포함하는 소자 |
US8337979B2 (en) | 2006-05-19 | 2012-12-25 | Massachusetts Institute Of Technology | Nanostructure-reinforced composite articles and methods |
US20080315430A1 (en) | 2007-06-22 | 2008-12-25 | Qimonda Ag | Nanowire vias |
-
2008
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- 2008-07-18 WO PCT/US2008/070509 patent/WO2009012469A2/en active Application Filing
- 2008-07-18 KR KR1020107003483A patent/KR20100064360A/ko not_active Application Discontinuation
- 2008-07-18 US US12/176,099 patent/US8530338B2/en active Active
- 2008-07-18 EP EP08796305.4A patent/EP2171745A4/en not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0597598A (ja) * | 1990-02-23 | 1993-04-20 | Thomson Csf | 結晶ホイスカの制御成長方法と、該方法の尖頭超小型カソード製造への応用 |
WO2006138671A2 (en) * | 2005-06-17 | 2006-12-28 | Illuminex Corporation | Photovoltaic wire |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9257601B2 (en) | 2011-05-17 | 2016-02-09 | Mcmaster University | Light emitting diodes and substrates |
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EP2171745A2 (en) | 2010-04-07 |
US20090020853A1 (en) | 2009-01-22 |
WO2009012469A3 (en) | 2009-04-16 |
CN101779271B (zh) | 2013-05-22 |
KR20100064360A (ko) | 2010-06-14 |
WO2009012469A2 (en) | 2009-01-22 |
AU2008275878A1 (en) | 2009-01-22 |
CN101779271A (zh) | 2010-07-14 |
US8530338B2 (en) | 2013-09-10 |
EP2171745A4 (en) | 2014-10-15 |
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