JP2010533364A - 板状部材から残留はんだを除去する方法及び装置 - Google Patents
板状部材から残留はんだを除去する方法及び装置 Download PDFInfo
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- JP2010533364A JP2010533364A JP2010515342A JP2010515342A JP2010533364A JP 2010533364 A JP2010533364 A JP 2010533364A JP 2010515342 A JP2010515342 A JP 2010515342A JP 2010515342 A JP2010515342 A JP 2010515342A JP 2010533364 A JP2010533364 A JP 2010533364A
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- Prior art keywords
- sleeve
- solder
- plate
- residual solder
- opening
- Prior art date
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 84
- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000011159 matrix material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 230000001133 acceleration Effects 0.000 claims 2
- 238000012546 transfer Methods 0.000 description 35
- 239000000758 substrate Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/02—Soldering irons; Bits
- B23K3/029—Solder or residue removing devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims (13)
- 板状部材(10)から残留はんだ(12)を除去する方法であって、
残留はんだの入口となる開口(22)を備えたスリーブ(19)を、前記開口の外縁部(21)が前記板状部材に気密又はほぼ気密に接触するように、前記板状部材の残留はんだと位置を合わせて配置し、
前記残留はんだに熱エネルギーを照射して、
前記スリーブで規定されるスリーブ内腔部(23)には、スリーブの長手方向軸(30)を横断するように排出部材(29)に向けて空気流(28)が流されることを特徴とする残留はんだの除去方法。 - 前記残留はんだ(12)への熱エネルギーの照射は、レーザーエネルギーで行われることを特徴とする請求項1記載の方法。
- 前記残留はんだ(12)に照射されるレーザーエネルギーは、レーザー光線であることを特徴とする請求項2記載の方法。
- 前記レーザー光線は、前記スリーブ(19)の内腔部(23)を規定するレンズ系(25)によって集束させることを特徴とする請求項3記載の方法。
- 板状部材(19)から残留はんだ(12)を除去する装置であって、
前記板状部材との接触端(20)に残留はんだの入口となる開口(22)を備えたスリーブ(19)と、
前記スリーブの内腔部(23)を規定する規定部材の近傍に配置される排出部材(29)と、
前記スリーブ内腔部(23)に圧縮空気を流すために前記排出部材(29)と対面して設けられる圧縮空気連結部(27)と、
前記はんだに熱エネルギーを照射する加熱器具を備えたことを特徴とする残留はんだ除去装置。 - 前記加熱器具はレーザーエネルギー発振器であることを特徴とする請求項5記載の装置。
- 前記レーザーエネルギー発振器は、レーザービーム(32)を開口外縁部(21)で規定される前記開口(22)の開口断面(24)に集束させるためのレンズ系を備えることを特徴とする請求項6記載の装置。
- 前記レンズ系(25)は、前記スリーブ内腔部(23)を軸方向に規定する規定部材として設けられることを特徴とする請求項7記載の装置。
- 前記排出部材(29)は、前記圧縮空気流を加速させる加速手段として設計されることを特徴とする請求項5乃至8のいずれか1項に記載の装置。
- 前記加速手段は、ベンチュリノズルであることを特徴とする請求項9記載の装置。
- 前記スリーブ(19)には、前記板状部材(10)との相対位置を変更する位置決め手段が設けられることを特徴とする請求項5乃至10のいずれか1項に記載の装置。
- 前記スリーブ(19)は、複数のスリーブより成るスリーブアッセンブリの一部であることを特徴とする請求項5乃至11のいずれか1項に記載の装置。
- 前記複数のスリーブは、前記スリーブアッセンブリにマトリクス状に配置されることを特徴とする請求項12記載の装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007033074A DE102007033074A1 (de) | 2007-07-13 | 2007-07-13 | Verfahren und Vorrichtung zur Entfernung von Lotmaterialdepots von einem Substrat |
DE102007033074.1 | 2007-07-13 | ||
PCT/DE2008/000971 WO2009010029A1 (de) | 2007-07-13 | 2008-06-10 | Verfahren und vorrichtung zur entfernung von lotmaterialdepots von einem substrat |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010533364A true JP2010533364A (ja) | 2010-10-21 |
JP5189648B2 JP5189648B2 (ja) | 2013-04-24 |
Family
ID=39967967
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010515342A Active JP5189648B2 (ja) | 2007-07-13 | 2008-06-10 | 板状部材から残留はんだを除去する方法及び装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8330076B2 (ja) |
EP (1) | EP2178669B1 (ja) |
JP (1) | JP5189648B2 (ja) |
KR (1) | KR101484803B1 (ja) |
DE (1) | DE102007033074A1 (ja) |
WO (1) | WO2009010029A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CZ305039B6 (cs) | 2009-11-27 | 2015-04-08 | Technická univerzita v Liberci | Lineární vlákenný útvar obsahující nanovlákna a způsob a zařízení pro jeho výrobu |
AU2011252915B2 (en) * | 2010-05-12 | 2016-05-19 | Prokidney | Bioactive renal cells |
CN103544967B (zh) * | 2012-07-09 | 2017-11-10 | 新科实业有限公司 | 用于分离焊接面之间的焊点的装置 |
US10362720B2 (en) | 2014-08-06 | 2019-07-23 | Greene Lyon Group, Inc. | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media |
KR102174928B1 (ko) * | 2019-02-01 | 2020-11-05 | 레이저쎌 주식회사 | 멀티 빔 레이저 디본딩 장치 및 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01133672A (ja) * | 1987-11-20 | 1989-05-25 | Hitachi Ltd | はんだの吸取治具 |
US20040026383A1 (en) * | 2000-10-06 | 2004-02-12 | Elke Zakel | Device for removing solder material from a soldered joint |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4187973A (en) | 1978-02-06 | 1980-02-12 | Fortune William S | Desoldering system for use with a soldering instrument |
DE19533171A1 (de) | 1994-09-13 | 1996-03-14 | Fraunhofer Ges Forschung | Verfahren und Vorrichtung zur Applikation von Verbindungsmaterial auf einer Substratanschlußfläche |
JP3532925B2 (ja) * | 1997-06-13 | 2004-05-31 | ピーエーシー ティーイーシーエイチ−パッケージング テクノロジーズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 欠陥のあるはんだ接合部を直す装置 |
JP2004141907A (ja) * | 2002-10-23 | 2004-05-20 | Toyota Motor Corp | 溶融はんだ表面の溶融酸化物の除去冶具と電子装置製造装置及び電子装置製造方法 |
US7353983B2 (en) | 2003-10-28 | 2008-04-08 | Temic Automotive Of North America, Inc. | Vertical removal of excess solder from a circuit substrate |
-
2007
- 2007-07-13 DE DE102007033074A patent/DE102007033074A1/de not_active Withdrawn
-
2008
- 2008-06-10 EP EP08784195.3A patent/EP2178669B1/de active Active
- 2008-06-10 KR KR1020107001355A patent/KR101484803B1/ko active IP Right Grant
- 2008-06-10 JP JP2010515342A patent/JP5189648B2/ja active Active
- 2008-06-10 US US12/668,508 patent/US8330076B2/en active Active
- 2008-06-10 WO PCT/DE2008/000971 patent/WO2009010029A1/de active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01133672A (ja) * | 1987-11-20 | 1989-05-25 | Hitachi Ltd | はんだの吸取治具 |
US20040026383A1 (en) * | 2000-10-06 | 2004-02-12 | Elke Zakel | Device for removing solder material from a soldered joint |
Also Published As
Publication number | Publication date |
---|---|
EP2178669B1 (de) | 2014-07-16 |
EP2178669A1 (de) | 2010-04-28 |
KR20100047847A (ko) | 2010-05-10 |
US20100181295A1 (en) | 2010-07-22 |
US8330076B2 (en) | 2012-12-11 |
KR101484803B1 (ko) | 2015-01-21 |
DE102007033074A1 (de) | 2009-01-15 |
JP5189648B2 (ja) | 2013-04-24 |
WO2009010029A1 (de) | 2009-01-22 |
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