JP2010531542A - 高出力対重量比用途のためのバックコンタクト太陽電池 - Google Patents
高出力対重量比用途のためのバックコンタクト太陽電池 Download PDFInfo
- Publication number
- JP2010531542A JP2010531542A JP2010513268A JP2010513268A JP2010531542A JP 2010531542 A JP2010531542 A JP 2010531542A JP 2010513268 A JP2010513268 A JP 2010513268A JP 2010513268 A JP2010513268 A JP 2010513268A JP 2010531542 A JP2010531542 A JP 2010531542A
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- JP
- Japan
- Prior art keywords
- region
- solar cell
- substrate
- front surface
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000758 substrate Substances 0.000 claims abstract description 65
- 238000000034 method Methods 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 22
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 238000001039 wet etching Methods 0.000 claims description 5
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 3
- 230000008569 process Effects 0.000 description 15
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 238000000059 patterning Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 3
- 239000006117 anti-reflective coating Substances 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 238000005137 deposition process Methods 0.000 description 3
- 239000012212 insulator Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 201000003373 familial cold autoinflammatory syndrome 3 Diseases 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 but not limited to Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F10/00—Individual photovoltaic cells, e.g. solar cells
- H10F10/10—Individual photovoltaic cells, e.g. solar cells having potential barriers
- H10F10/14—Photovoltaic cells having only PN homojunction potential barriers
- H10F10/146—Back-junction photovoltaic cells, e.g. having interdigitated base-emitter regions on the back side
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
- H10F71/121—The active layers comprising only Group IV materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/10—Semiconductor bodies
- H10F77/14—Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
- H10F77/147—Shapes of bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/20—Electrodes
- H10F77/206—Electrodes for devices having potential barriers
- H10F77/211—Electrodes for devices having potential barriers for photovoltaic cells
- H10F77/219—Arrangements for electrodes of back-contact photovoltaic cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US93695407P | 2007-06-23 | 2007-06-23 | |
| US12/143,556 US20080314443A1 (en) | 2007-06-23 | 2008-06-20 | Back-contact solar cell for high power-over-weight applications |
| PCT/US2008/007779 WO2009002463A2 (en) | 2007-06-23 | 2008-06-23 | Back-contact solar cell for high power-over-weight applications |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010531542A true JP2010531542A (ja) | 2010-09-24 |
| JP2010531542A5 JP2010531542A5 (enExample) | 2011-07-07 |
Family
ID=40135234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010513268A Abandoned JP2010531542A (ja) | 2007-06-23 | 2008-06-23 | 高出力対重量比用途のためのバックコンタクト太陽電池 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20080314443A1 (enExample) |
| EP (1) | EP2168168A2 (enExample) |
| JP (1) | JP2010531542A (enExample) |
| KR (1) | KR20100036336A (enExample) |
| CN (1) | CN201681950U (enExample) |
| WO (1) | WO2009002463A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197733A (ja) * | 2009-09-17 | 2016-11-24 | サイオニクス、エルエルシー | 感光撮像素子および関連方法 |
| JP2017519354A (ja) * | 2014-04-30 | 2017-07-13 | 1366 テクノロジーズ インク. | 他の領域よりも厚い局所制御領域を有する薄肉半導体ウェハの作製方法および装置、ならびに該ウェハ |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100071765A1 (en) * | 2008-09-19 | 2010-03-25 | Peter Cousins | Method for fabricating a solar cell using a direct-pattern pin-hole-free masking layer |
| EP2261976A1 (en) * | 2009-06-12 | 2010-12-15 | Applied Materials, Inc. | Semiconductor device module, method of manufacturing a semiconductor device module, semiconductor device module manufacturing device |
| CN102222722B (zh) * | 2010-04-14 | 2014-06-18 | 圆益Ips股份有限公司 | 太阳能电池元件的制备方法及利用该方法制备的太阳能电池元件 |
| TWI420700B (zh) * | 2010-12-29 | 2013-12-21 | Au Optronics Corp | 太陽能電池 |
| US9559228B2 (en) * | 2011-09-30 | 2017-01-31 | Sunpower Corporation | Solar cell with doped groove regions separated by ridges |
| WO2013058707A1 (en) * | 2011-10-21 | 2013-04-25 | Trina Solar Energy Development Pte Ltd | All-back-contact solar cell and method of fabricating the same |
| TW201320364A (zh) * | 2011-11-07 | 2013-05-16 | Motech Ind Inc | 矽基板、太陽能電池基板的製造方法及太陽能電池 |
| CN103137721B (zh) * | 2011-11-28 | 2016-01-20 | 茂迪股份有限公司 | 硅基板、太阳能电池基板的制造方法及太阳能电池 |
| US10020410B1 (en) * | 2012-11-01 | 2018-07-10 | University Of South Florida | Solar tiles and arrays |
| US20140166094A1 (en) * | 2012-12-18 | 2014-06-19 | Paul Loscutoff | Solar cell emitter region fabrication using etch resistant film |
| US20140166093A1 (en) * | 2012-12-18 | 2014-06-19 | Paul Loscutoff | Solar cell emitter region fabrication using n-type doped silicon nano-particles |
| US20150155398A1 (en) * | 2013-08-30 | 2015-06-04 | Mehrdad M. Moslehi | Photovoltaic monolithic solar module connection and fabrication methods |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4322571A (en) * | 1980-07-17 | 1982-03-30 | The Boeing Company | Solar cells and methods for manufacture thereof |
| US5228924A (en) * | 1991-11-04 | 1993-07-20 | Mobil Solar Energy Corporation | Photovoltaic panel support assembly |
| KR100370410B1 (ko) * | 1996-01-09 | 2003-03-28 | 삼성전자 주식회사 | 후면 함몰전극형 태양전지의 제조방법 |
| JPH10117004A (ja) * | 1996-10-09 | 1998-05-06 | Toyota Motor Corp | 集光型太陽電池素子 |
| JP3070489B2 (ja) * | 1996-10-09 | 2000-07-31 | トヨタ自動車株式会社 | 集光型太陽電池素子 |
| US6034319A (en) * | 1998-07-30 | 2000-03-07 | Falbel; Gerald | Immersed photovoltaic solar power system |
| JP3764843B2 (ja) * | 2000-06-06 | 2006-04-12 | シャープ株式会社 | 太陽電池セル |
| WO2003014686A1 (de) * | 2001-08-11 | 2003-02-20 | FAG Kugelfischer Georg Schäfer AG | Berührungsloses messen von beanspruchungen rotierender teile |
| US7298314B2 (en) * | 2002-08-19 | 2007-11-20 | Q-Track Corporation | Near field electromagnetic positioning system and method |
| US7388147B2 (en) * | 2003-04-10 | 2008-06-17 | Sunpower Corporation | Metal contact structure for solar cell and method of manufacture |
| US7593740B2 (en) * | 2004-05-12 | 2009-09-22 | Google, Inc. | Location-based social software for mobile devices |
| JP2007049079A (ja) * | 2005-08-12 | 2007-02-22 | Sharp Corp | マスキングペースト、その製造方法およびマスキングペーストを用いた太陽電池の製造方法 |
| DE102006032833B4 (de) * | 2005-08-26 | 2016-11-03 | Honda Motor Co., Ltd. | Transponder-Auswertungssystem und Verfahren |
| US7809805B2 (en) * | 2007-02-28 | 2010-10-05 | Facebook, Inc. | Systems and methods for automatically locating web-based social network members |
-
2008
- 2008-06-20 US US12/143,556 patent/US20080314443A1/en not_active Abandoned
- 2008-06-23 WO PCT/US2008/007779 patent/WO2009002463A2/en not_active Ceased
- 2008-06-23 CN CN2008900000692U patent/CN201681950U/zh not_active Expired - Fee Related
- 2008-06-23 JP JP2010513268A patent/JP2010531542A/ja not_active Abandoned
- 2008-06-23 EP EP08768703A patent/EP2168168A2/en not_active Withdrawn
- 2008-06-23 KR KR1020107001577A patent/KR20100036336A/ko not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016197733A (ja) * | 2009-09-17 | 2016-11-24 | サイオニクス、エルエルシー | 感光撮像素子および関連方法 |
| JP2017519354A (ja) * | 2014-04-30 | 2017-07-13 | 1366 テクノロジーズ インク. | 他の領域よりも厚い局所制御領域を有する薄肉半導体ウェハの作製方法および装置、ならびに該ウェハ |
Also Published As
| Publication number | Publication date |
|---|---|
| CN201681950U (zh) | 2010-12-22 |
| US20080314443A1 (en) | 2008-12-25 |
| KR20100036336A (ko) | 2010-04-07 |
| WO2009002463A2 (en) | 2008-12-31 |
| WO2009002463A3 (en) | 2009-03-19 |
| EP2168168A2 (en) | 2010-03-31 |
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