JP2010531542A - 高出力対重量比用途のためのバックコンタクト太陽電池 - Google Patents

高出力対重量比用途のためのバックコンタクト太陽電池 Download PDF

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Publication number
JP2010531542A
JP2010531542A JP2010513268A JP2010513268A JP2010531542A JP 2010531542 A JP2010531542 A JP 2010531542A JP 2010513268 A JP2010513268 A JP 2010513268A JP 2010513268 A JP2010513268 A JP 2010513268A JP 2010531542 A JP2010531542 A JP 2010531542A
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region
solar cell
substrate
front surface
forming
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JP2010513268A
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English (en)
Japanese (ja)
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JP2010531542A5 (enExample
Inventor
クリストファー マイケル ボナー
ピーター カズンズ
デニ ドゥスーステル
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サンパワー コーポレイション
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Publication of JP2010531542A publication Critical patent/JP2010531542A/ja
Publication of JP2010531542A5 publication Critical patent/JP2010531542A5/ja
Abandoned legal-status Critical Current

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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F10/00Individual photovoltaic cells, e.g. solar cells
    • H10F10/10Individual photovoltaic cells, e.g. solar cells having potential barriers
    • H10F10/14Photovoltaic cells having only PN homojunction potential barriers
    • H10F10/146Back-junction photovoltaic cells, e.g. having interdigitated base-emitter regions on the back side
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass
    • H10F71/121The active layers comprising only Group IV materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/10Semiconductor bodies
    • H10F77/14Shape of semiconductor bodies; Shapes, relative sizes or dispositions of semiconductor regions within semiconductor bodies
    • H10F77/147Shapes of bodies
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00Constructional details of devices covered by this subclass
    • H10F77/20Electrodes
    • H10F77/206Electrodes for devices having potential barriers
    • H10F77/211Electrodes for devices having potential barriers for photovoltaic cells
    • H10F77/219Arrangements for electrodes of back-contact photovoltaic cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/547Monocrystalline silicon PV cells
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Photovoltaic Devices (AREA)
JP2010513268A 2007-06-23 2008-06-23 高出力対重量比用途のためのバックコンタクト太陽電池 Abandoned JP2010531542A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US93695407P 2007-06-23 2007-06-23
US12/143,556 US20080314443A1 (en) 2007-06-23 2008-06-20 Back-contact solar cell for high power-over-weight applications
PCT/US2008/007779 WO2009002463A2 (en) 2007-06-23 2008-06-23 Back-contact solar cell for high power-over-weight applications

Publications (2)

Publication Number Publication Date
JP2010531542A true JP2010531542A (ja) 2010-09-24
JP2010531542A5 JP2010531542A5 (enExample) 2011-07-07

Family

ID=40135234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010513268A Abandoned JP2010531542A (ja) 2007-06-23 2008-06-23 高出力対重量比用途のためのバックコンタクト太陽電池

Country Status (6)

Country Link
US (1) US20080314443A1 (enExample)
EP (1) EP2168168A2 (enExample)
JP (1) JP2010531542A (enExample)
KR (1) KR20100036336A (enExample)
CN (1) CN201681950U (enExample)
WO (1) WO2009002463A2 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016197733A (ja) * 2009-09-17 2016-11-24 サイオニクス、エルエルシー 感光撮像素子および関連方法
JP2017519354A (ja) * 2014-04-30 2017-07-13 1366 テクノロジーズ インク. 他の領域よりも厚い局所制御領域を有する薄肉半導体ウェハの作製方法および装置、ならびに該ウェハ

Families Citing this family (12)

* Cited by examiner, † Cited by third party
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US20100071765A1 (en) * 2008-09-19 2010-03-25 Peter Cousins Method for fabricating a solar cell using a direct-pattern pin-hole-free masking layer
EP2261976A1 (en) * 2009-06-12 2010-12-15 Applied Materials, Inc. Semiconductor device module, method of manufacturing a semiconductor device module, semiconductor device module manufacturing device
CN102222722B (zh) * 2010-04-14 2014-06-18 圆益Ips股份有限公司 太阳能电池元件的制备方法及利用该方法制备的太阳能电池元件
TWI420700B (zh) * 2010-12-29 2013-12-21 Au Optronics Corp 太陽能電池
US9559228B2 (en) * 2011-09-30 2017-01-31 Sunpower Corporation Solar cell with doped groove regions separated by ridges
WO2013058707A1 (en) * 2011-10-21 2013-04-25 Trina Solar Energy Development Pte Ltd All-back-contact solar cell and method of fabricating the same
TW201320364A (zh) * 2011-11-07 2013-05-16 Motech Ind Inc 矽基板、太陽能電池基板的製造方法及太陽能電池
CN103137721B (zh) * 2011-11-28 2016-01-20 茂迪股份有限公司 硅基板、太阳能电池基板的制造方法及太阳能电池
US10020410B1 (en) * 2012-11-01 2018-07-10 University Of South Florida Solar tiles and arrays
US20140166094A1 (en) * 2012-12-18 2014-06-19 Paul Loscutoff Solar cell emitter region fabrication using etch resistant film
US20140166093A1 (en) * 2012-12-18 2014-06-19 Paul Loscutoff Solar cell emitter region fabrication using n-type doped silicon nano-particles
US20150155398A1 (en) * 2013-08-30 2015-06-04 Mehrdad M. Moslehi Photovoltaic monolithic solar module connection and fabrication methods

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US4322571A (en) * 1980-07-17 1982-03-30 The Boeing Company Solar cells and methods for manufacture thereof
US5228924A (en) * 1991-11-04 1993-07-20 Mobil Solar Energy Corporation Photovoltaic panel support assembly
KR100370410B1 (ko) * 1996-01-09 2003-03-28 삼성전자 주식회사 후면 함몰전극형 태양전지의 제조방법
JPH10117004A (ja) * 1996-10-09 1998-05-06 Toyota Motor Corp 集光型太陽電池素子
JP3070489B2 (ja) * 1996-10-09 2000-07-31 トヨタ自動車株式会社 集光型太陽電池素子
US6034319A (en) * 1998-07-30 2000-03-07 Falbel; Gerald Immersed photovoltaic solar power system
JP3764843B2 (ja) * 2000-06-06 2006-04-12 シャープ株式会社 太陽電池セル
WO2003014686A1 (de) * 2001-08-11 2003-02-20 FAG Kugelfischer Georg Schäfer AG Berührungsloses messen von beanspruchungen rotierender teile
US7298314B2 (en) * 2002-08-19 2007-11-20 Q-Track Corporation Near field electromagnetic positioning system and method
US7388147B2 (en) * 2003-04-10 2008-06-17 Sunpower Corporation Metal contact structure for solar cell and method of manufacture
US7593740B2 (en) * 2004-05-12 2009-09-22 Google, Inc. Location-based social software for mobile devices
JP2007049079A (ja) * 2005-08-12 2007-02-22 Sharp Corp マスキングペースト、その製造方法およびマスキングペーストを用いた太陽電池の製造方法
DE102006032833B4 (de) * 2005-08-26 2016-11-03 Honda Motor Co., Ltd. Transponder-Auswertungssystem und Verfahren
US7809805B2 (en) * 2007-02-28 2010-10-05 Facebook, Inc. Systems and methods for automatically locating web-based social network members

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016197733A (ja) * 2009-09-17 2016-11-24 サイオニクス、エルエルシー 感光撮像素子および関連方法
JP2017519354A (ja) * 2014-04-30 2017-07-13 1366 テクノロジーズ インク. 他の領域よりも厚い局所制御領域を有する薄肉半導体ウェハの作製方法および装置、ならびに該ウェハ

Also Published As

Publication number Publication date
CN201681950U (zh) 2010-12-22
US20080314443A1 (en) 2008-12-25
KR20100036336A (ko) 2010-04-07
WO2009002463A2 (en) 2008-12-31
WO2009002463A3 (en) 2009-03-19
EP2168168A2 (en) 2010-03-31

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