JP2010530018A5 - - Google Patents
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- Publication number
- JP2010530018A5 JP2010530018A5 JP2010511602A JP2010511602A JP2010530018A5 JP 2010530018 A5 JP2010530018 A5 JP 2010530018A5 JP 2010511602 A JP2010511602 A JP 2010511602A JP 2010511602 A JP2010511602 A JP 2010511602A JP 2010530018 A5 JP2010530018 A5 JP 2010530018A5
- Authority
- JP
- Japan
- Prior art keywords
- curable composition
- group
- epoxy compound
- use according
- independently
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims 14
- 239000004593 Epoxy Substances 0.000 claims 8
- 150000001875 compounds Chemical class 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- 125000000962 organic group Chemical group 0.000 claims 4
- 239000003054 catalyst Substances 0.000 claims 3
- 239000002131 composite material Substances 0.000 claims 3
- 150000004693 imidazolium salts Chemical class 0.000 claims 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 2
- 125000001931 aliphatic group Chemical group 0.000 claims 2
- 125000003118 aryl group Chemical group 0.000 claims 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 2
- 239000003795 chemical substances by application Substances 0.000 claims 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims 2
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 238000000034 method Methods 0.000 claims 2
- 239000003960 organic solvent Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 claims 1
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 claims 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 150000001412 amines Chemical class 0.000 claims 1
- 150000008064 anhydrides Chemical class 0.000 claims 1
- 238000005266 casting Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003431 cross linking reagent Substances 0.000 claims 1
- 238000001125 extrusion Methods 0.000 claims 1
- 239000004744 fabric Substances 0.000 claims 1
- 239000000835 fiber Substances 0.000 claims 1
- 239000008240 homogeneous mixture Substances 0.000 claims 1
- 238000001802 infusion Methods 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 claims 1
- 229920003986 novolac Polymers 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 238000001721 transfer moulding Methods 0.000 claims 1
- 238000004804 winding Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP07110171.1 | 2007-06-13 | ||
| EP07110171 | 2007-06-13 | ||
| PCT/EP2008/057140 WO2008152011A1 (de) | 2007-06-13 | 2008-06-09 | Katalysator für die härtung von epoxiden |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010530018A JP2010530018A (ja) | 2010-09-02 |
| JP2010530018A5 true JP2010530018A5 (OSRAM) | 2011-07-28 |
| JP5409612B2 JP5409612B2 (ja) | 2014-02-05 |
Family
ID=39722654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010511602A Expired - Fee Related JP5409612B2 (ja) | 2007-06-13 | 2008-06-09 | エポキシドの硬化のための触媒 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US8247517B2 (OSRAM) |
| EP (1) | EP2158249B1 (OSRAM) |
| JP (1) | JP5409612B2 (OSRAM) |
| KR (1) | KR101438866B1 (OSRAM) |
| CN (1) | CN101679599B (OSRAM) |
| AT (1) | ATE484537T1 (OSRAM) |
| DE (1) | DE502008001542D1 (OSRAM) |
| ES (1) | ES2354399T3 (OSRAM) |
| TW (1) | TWI439486B (OSRAM) |
| WO (1) | WO2008152011A1 (OSRAM) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101438865B1 (ko) | 2007-06-12 | 2014-09-11 | 바스프 에스이 | 에폭사이드 경화용 촉매 |
| US20120296012A1 (en) * | 2010-02-04 | 2012-11-22 | Drexel University | Room temperature ionic liquid-epoxy systems as dispersants and matrix materials for nanocomposites |
| WO2011142855A2 (en) * | 2010-02-04 | 2011-11-17 | Drexel University | Room temperature ionic liquids and ionic liquid epoxy adducts as initiators for epoxy systems |
| WO2012136273A1 (de) | 2011-04-08 | 2012-10-11 | Basf Se | Hyperverzweigte polymere zur modifikation der zähigkeit von anionisch gehärteten epoxidharz-systemen |
| DE102013008723A1 (de) | 2013-05-23 | 2014-11-27 | Deutsche Institute Für Textil- Und Faserforschung Denkendorf | Polymerisierbare Reaktionsmischung zur Herstellung von Epoxidharzen und deren Verwendung |
| EP2933019A1 (en) | 2014-04-15 | 2015-10-21 | Henkel AG&Co. KGAA | Storage stable heat activated quaternary ammonium catalysts for epoxy cure |
| JP6985040B2 (ja) * | 2017-07-04 | 2021-12-22 | 積水化学工業株式会社 | 熱硬化性樹脂組成物 |
| CA3111761A1 (en) * | 2018-09-07 | 2020-03-12 | Pipefusion Cipp Corporation | Curable composition for cured in place pipes |
| US10696839B2 (en) | 2018-09-07 | 2020-06-30 | Pipefusion Cipp Corporation | Curable composition for cured in place pipes |
| WO2025047123A1 (ja) * | 2023-08-30 | 2025-03-06 | パナソニックＩｐマネジメント株式会社 | 放熱樹脂組成物 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3635894A (en) | 1969-11-06 | 1972-01-18 | Ppg Industries Inc | Curable epoxy resin compositions containing organoimidazolium salt |
| DE2416408C3 (de) * | 1974-04-04 | 1978-08-17 | Hitachi Chemical Co., Ltd. | Wärmehärtbare Gemische auf der Basis eines Epoxyharzes und einer komplexen Imidazoliumsalzverbindung und ihr Herstellungsverfahren |
| EP0458502B1 (en) | 1990-05-21 | 2003-06-18 | Dow Global Technologies Inc. | Latent catalysts, cure-inhibited epoxy resin compositions and laminates prepared therefrom |
| DE4110219A1 (de) | 1991-03-28 | 1992-10-01 | Huels Troisdorf | Verfahren zur herstellung von prepregs mit loesungsmittelfreiem epoxidharz |
| US5879794A (en) * | 1994-08-25 | 1999-03-09 | W. L. Gore & Associates, Inc. | Adhesive-filler film composite |
| US5538756A (en) * | 1994-09-23 | 1996-07-23 | W. L. Gore & Associates | High capacitance sheet adhesives and process for making the same |
| JPH08259764A (ja) * | 1995-03-03 | 1996-10-08 | W L Gore & Assoc Inc | 接着剤、充填材含有ポリマーフィルム複合材料 |
| US6180696B1 (en) * | 1997-02-19 | 2001-01-30 | Georgia Tech Research Corporation | No-flow underfill of epoxy resin, anhydride, fluxing agent and surfactant |
| JP2001316629A (ja) * | 2000-05-02 | 2001-11-16 | Nippon Steel Corp | 防食塗料組成物および防食被覆鋼材 |
| JP2004217859A (ja) | 2003-01-17 | 2004-08-05 | Hitachi Chem Co Ltd | 接着シートの製造方法、半導体装置およびその製造方法 |
| JP2004238555A (ja) * | 2003-02-07 | 2004-08-26 | Asahi Denka Kogyo Kk | 熱硬化型エポキシ樹脂組成物 |
| JP4844130B2 (ja) * | 2005-02-03 | 2011-12-28 | 住友化学株式会社 | β−ヒドロキシエーテル類の製造方法 |
| JP2006232882A (ja) * | 2005-02-22 | 2006-09-07 | Nitto Denko Corp | 粘着剤組成物、粘着シート類および両面粘着テープ |
-
2008
- 2008-06-09 KR KR1020107000660A patent/KR101438866B1/ko not_active Expired - Fee Related
- 2008-06-09 JP JP2010511602A patent/JP5409612B2/ja not_active Expired - Fee Related
- 2008-06-09 US US12/664,231 patent/US8247517B2/en active Active
- 2008-06-09 DE DE502008001542T patent/DE502008001542D1/de active Active
- 2008-06-09 WO PCT/EP2008/057140 patent/WO2008152011A1/de not_active Ceased
- 2008-06-09 CN CN200880019866.XA patent/CN101679599B/zh active Active
- 2008-06-09 ES ES08760709T patent/ES2354399T3/es active Active
- 2008-06-09 AT AT08760709T patent/ATE484537T1/de active
- 2008-06-09 EP EP08760709A patent/EP2158249B1/de active Active
- 2008-06-13 TW TW097122340A patent/TWI439486B/zh not_active IP Right Cessation
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