JP2010528480A - 成形によって光学素子を作製する方法、この方法により作製した光学素子、集光器および照明系 - Google Patents
成形によって光学素子を作製する方法、この方法により作製した光学素子、集光器および照明系 Download PDFInfo
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- JP2010528480A JP2010528480A JP2010509734A JP2010509734A JP2010528480A JP 2010528480 A JP2010528480 A JP 2010528480A JP 2010509734 A JP2010509734 A JP 2010509734A JP 2010509734 A JP2010509734 A JP 2010509734A JP 2010528480 A JP2010528480 A JP 2010528480A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/06—Wholly-metallic mirrors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/0005—Separation of the coating from the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
- C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
- C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/08—Mirrors; Reflectors
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/02—Catoptric systems, e.g. image erecting and reversing system
- G02B17/06—Catoptric systems, e.g. image erecting and reversing system using mirrors only, i.e. having only one curved mirror
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0816—Multilayer mirrors, i.e. having two or more reflecting layers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/0891—Ultraviolet [UV] mirrors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70166—Capillary or channel elements, e.g. nested extreme ultraviolet [EUV] mirrors or shells, optical fibers or light guides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/7095—Materials, e.g. materials for housing, stage or other support having particular properties, e.g. weight, strength, conductivity, thermal expansion coefficient
- G03F7/70958—Optical materials or coatings, e.g. with particular transmittance, reflectance or anti-reflection properties
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- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K1/00—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating
- G21K1/06—Arrangements for handling particles or ionising radiation, e.g. focusing or moderating using diffraction, refraction or reflection, e.g. monochromators
- G21K1/062—Devices having a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/061—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements characterised by a multilayer structure
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/064—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements having a curved surface
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K2201/00—Arrangements for handling radiation or particles
- G21K2201/06—Arrangements for handling radiation or particles using diffractive, refractive or reflecting elements
- G21K2201/067—Construction details
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4981—Utilizing transitory attached element or associated separate material
- Y10T29/49812—Temporary protective coating, impregnation, or cast layer
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Nanotechnology (AREA)
- Mathematical Physics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Theoretical Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Engineering & Computer Science (AREA)
- High Energy & Nuclear Physics (AREA)
- Optical Elements Other Than Lenses (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Electroluminescent Light Sources (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US93251707P | 2007-05-31 | 2007-05-31 | |
| DE102007025278 | 2007-05-31 | ||
| PCT/EP2008/004273 WO2008145364A2 (de) | 2007-05-31 | 2008-05-29 | Verfahren zur herstellung eines optischen elementes mit hilfe von abformung, optisches element hergestellt nach diesem verfahren, kollektor und beleuchtungssystem |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010528480A true JP2010528480A (ja) | 2010-08-19 |
| JP2010528480A5 JP2010528480A5 (OSRAM) | 2011-07-07 |
Family
ID=39865722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010509734A Pending JP2010528480A (ja) | 2007-05-31 | 2008-05-29 | 成形によって光学素子を作製する方法、この方法により作製した光学素子、集光器および照明系 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20100182710A1 (OSRAM) |
| EP (1) | EP2155932A2 (OSRAM) |
| JP (1) | JP2010528480A (OSRAM) |
| KR (1) | KR20100017443A (OSRAM) |
| WO (1) | WO2008145364A2 (OSRAM) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011139043A (ja) * | 2009-12-02 | 2011-07-14 | Media Lario Srl | 斜入射euvリソグラフィ集光器用の冷却システム及び冷却方法 |
| JP2017219841A (ja) * | 2016-06-03 | 2017-12-14 | カール ツアイス メディテック アクチエンゲゼルシャフト | 光学要素を製造する方法 |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101903518B1 (ko) * | 2011-02-24 | 2018-10-04 | 에이에스엠엘 네델란즈 비.브이. | 스침 입사 반사기, 리소그래피 장치, 스침 입사 반사기 제조 방법, 및 디바이스 제조 방법 |
| DE102011087323A1 (de) | 2011-11-29 | 2012-12-13 | Carl Zeiss Smt Gmbh | Zwangsgeformtes optisches Element und Verfahren zu seiner Herstellung |
| DE102012200454A1 (de) * | 2012-01-13 | 2013-01-03 | Carl Zeiss Smt Gmbh | Verfahren zur Herstellung eines reflektiven optischen Elements und reflektives optisches Element |
| DE102012201497A1 (de) | 2012-02-02 | 2013-01-17 | Carl Zeiss Smt Gmbh | Kollektor mit einem Beugungsgitter |
| US20140134351A1 (en) * | 2012-11-09 | 2014-05-15 | Applied Materials, Inc. | Method to deposit cvd ruthenium |
| DE102015100918A1 (de) | 2015-01-22 | 2016-07-28 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines reflektiven optischen Elements, reflektives optisches Element und Verwendung eines reflektiven optischen Elements |
| DE102015104262A1 (de) | 2015-03-20 | 2016-09-22 | Carl Zeiss Smt Gmbh | Verfahren zum Herstellen eines reflektiven optischen Elements und reflektives optisches Element |
| DE102015213253A1 (de) * | 2015-07-15 | 2017-01-19 | Carl Zeiss Smt Gmbh | Spiegel, insbesondere für eine mikrolithographische Projektionsbelichtungsanlage |
| DE102018212224A1 (de) | 2018-07-23 | 2020-01-23 | Carl Zeiss Smt Gmbh | Vorrichtung zur Rückkopplung von emittierter Strahlung in eine Laserquelle |
| US12388230B2 (en) * | 2020-05-26 | 2025-08-12 | The Regents Of The University Of Colorado, A Body Corporate | Monolithic photonic resonator and associated laser frequency stabilization method |
| DE102020214466A1 (de) | 2020-11-18 | 2022-05-19 | Carl Zeiss Smt Gmbh | Verfahren zur Herstellung eines Grundkörpers eines optischen Elementes für die Halbleiterlithographie und Grundkörper eines optischen Elementes für die Halbleiterlithographie |
| DE102022132407A1 (de) * | 2022-12-06 | 2024-06-06 | FLABEG France S.A.S. | Spiegelelement und entsprechendes Herstellungsverfahren |
| CN116043284A (zh) * | 2023-01-10 | 2023-05-02 | 同济大学 | 一种基于多层薄膜基底精密电铸的射线反射聚焦镜制造方法 |
| DE102023121686B4 (de) * | 2023-08-14 | 2025-03-13 | Carl Zeiss Smt Gmbh | Optisches System mit einem EUV-Spiegel und Verfahren zum Betreiben eines optischen Systems |
| DE102023211114A1 (de) * | 2023-11-10 | 2025-05-15 | Carl Zeiss Smt Gmbh | Verfahren zur Herstellung einer EUV-Strahlung reflektierenden Oberflächenbeschichtung |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125376B1 (OSRAM) * | 1967-10-09 | 1976-07-30 | ||
| JPS62116793A (ja) * | 1985-11-15 | 1987-05-28 | Ricoh Co Ltd | 電鋳スタンパの製造方法 |
| JPH01103801U (OSRAM) * | 1987-12-28 | 1989-07-13 | ||
| EP1152555A1 (en) * | 2000-05-03 | 2001-11-07 | Media Lario S.r.L. | Telescope mirror for high bandwidth free space optical data transmission |
| JP2004501491A (ja) * | 2000-06-09 | 2004-01-15 | サイマー, インコーポレイテッド | 活性ガス及びバッファガス制御を有するプラズマ集束光源 |
| JP2005522839A (ja) * | 2002-04-10 | 2005-07-28 | サイマー インコーポレイテッド | 極紫外線光源 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5160668A (en) * | 1989-12-05 | 1992-11-03 | Optical Coating Laboratory, Inc. | Method for forming optical elements having an optical coating by replication of a mold |
| US5763930A (en) * | 1997-05-12 | 1998-06-09 | Cymer, Inc. | Plasma focus high energy photon source |
| US7006595B2 (en) * | 1998-05-05 | 2006-02-28 | Carl Zeiss Semiconductor Manufacturing Technologies Ag | Illumination system particularly for microlithography |
| DE10053587A1 (de) * | 2000-10-27 | 2002-05-02 | Zeiss Carl | Beleuchtungssystem mit variabler Einstellung der Ausleuchtung |
| EP0955641B1 (de) * | 1998-05-05 | 2004-04-28 | Carl Zeiss | Beleuchtungssystem insbesondere für die EUV-Lithographie |
| DE10138313A1 (de) * | 2001-01-23 | 2002-07-25 | Zeiss Carl | Kollektor für Beleuchtugnssysteme mit einer Wellenlänge < 193 nm |
| US6600552B2 (en) * | 1999-02-15 | 2003-07-29 | Carl-Zeiss Smt Ag | Microlithography reduction objective and projection exposure apparatus |
| JP3751778B2 (ja) * | 1999-04-26 | 2006-03-01 | 日本板硝子株式会社 | ゾルゲル成形物の製造方法 |
| US6285737B1 (en) * | 2000-01-21 | 2001-09-04 | Euv Llc | Condenser for extreme-UV lithography with discharge source |
| WO2003014833A2 (de) * | 2001-08-10 | 2003-02-20 | Carl Zeiss Smt Ag | Kollektor mit befestigungseinrichtungen zum befestigen von spiegelschalen |
| DE10317667A1 (de) * | 2003-04-17 | 2004-11-18 | Carl Zeiss Smt Ag | Optisches Element für ein Beleuchtungssystem |
| US6825089B1 (en) * | 2003-06-04 | 2004-11-30 | Agere Systems Inc. | Increased quality factor of a varactor in an integrated circuit via a high conductive region in a well |
| EP1649324B1 (en) * | 2003-07-30 | 2011-03-16 | Carl Zeiss SMT GmbH | An illumination system for microlithography |
| US7081992B2 (en) * | 2004-01-16 | 2006-07-25 | Euv Llc | Condenser optic with sacrificial reflective surface |
| US7164144B2 (en) * | 2004-03-10 | 2007-01-16 | Cymer Inc. | EUV light source |
| WO2006050891A2 (en) * | 2004-11-09 | 2006-05-18 | Carl Zeiss Smt Ag | A high-precision optical surface prepared by sagging from a masterpiece |
-
2008
- 2008-05-29 EP EP08801441A patent/EP2155932A2/de not_active Withdrawn
- 2008-05-29 WO PCT/EP2008/004273 patent/WO2008145364A2/de not_active Ceased
- 2008-05-29 KR KR1020097024793A patent/KR20100017443A/ko not_active Withdrawn
- 2008-05-29 JP JP2010509734A patent/JP2010528480A/ja active Pending
-
2009
- 2009-11-25 US US12/626,437 patent/US20100182710A1/en not_active Abandoned
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5125376B1 (OSRAM) * | 1967-10-09 | 1976-07-30 | ||
| JPS62116793A (ja) * | 1985-11-15 | 1987-05-28 | Ricoh Co Ltd | 電鋳スタンパの製造方法 |
| JPH01103801U (OSRAM) * | 1987-12-28 | 1989-07-13 | ||
| EP1152555A1 (en) * | 2000-05-03 | 2001-11-07 | Media Lario S.r.L. | Telescope mirror for high bandwidth free space optical data transmission |
| JP2004501491A (ja) * | 2000-06-09 | 2004-01-15 | サイマー, インコーポレイテッド | 活性ガス及びバッファガス制御を有するプラズマ集束光源 |
| JP2005522839A (ja) * | 2002-04-10 | 2005-07-28 | サイマー インコーポレイテッド | 極紫外線光源 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011139043A (ja) * | 2009-12-02 | 2011-07-14 | Media Lario Srl | 斜入射euvリソグラフィ集光器用の冷却システム及び冷却方法 |
| JP2017219841A (ja) * | 2016-06-03 | 2017-12-14 | カール ツアイス メディテック アクチエンゲゼルシャフト | 光学要素を製造する方法 |
| US11474281B2 (en) | 2016-06-03 | 2022-10-18 | Carl Zeiss Meditec Ag | Optical element and method of making an optical element |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100182710A1 (en) | 2010-07-22 |
| WO2008145364A3 (de) | 2009-01-29 |
| KR20100017443A (ko) | 2010-02-16 |
| EP2155932A2 (de) | 2010-02-24 |
| WO2008145364A2 (de) | 2008-12-04 |
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