JP2010512022A - 太陽電池 - Google Patents
太陽電池 Download PDFInfo
- Publication number
- JP2010512022A JP2010512022A JP2009540188A JP2009540188A JP2010512022A JP 2010512022 A JP2010512022 A JP 2010512022A JP 2009540188 A JP2009540188 A JP 2009540188A JP 2009540188 A JP2009540188 A JP 2009540188A JP 2010512022 A JP2010512022 A JP 2010512022A
- Authority
- JP
- Japan
- Prior art keywords
- phosphorus
- ppma
- polycrystalline
- silicon wafer
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 73
- 239000011574 phosphorus Substances 0.000 claims abstract description 73
- 238000009792 diffusion process Methods 0.000 claims abstract description 40
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 38
- 239000010703 silicon Substances 0.000 claims abstract description 38
- 238000005247 gettering Methods 0.000 claims abstract description 37
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052796 boron Inorganic materials 0.000 claims abstract description 25
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims abstract description 19
- 229910052785 arsenic Inorganic materials 0.000 claims abstract description 11
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 claims abstract description 11
- 235000012431 wafers Nutrition 0.000 claims description 109
- 238000000034 method Methods 0.000 claims description 17
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 20
- 239000002184 metal Substances 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 7
- 239000012535 impurity Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 5
- 229910005329 FeSi 2 Inorganic materials 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- 239000000969 carrier Substances 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002019 doping agent Substances 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 229910005347 FeSi Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052914 metal silicate Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000007523 nucleic acids Chemical class 0.000 description 1
- 102000039446 nucleic acids Human genes 0.000 description 1
- 108020004707 nucleic acids Proteins 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000009991 scouring Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/322—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections
- H01L21/3221—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to modify their internal properties, e.g. to produce internal imperfections of silicon bodies, e.g. for gettering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/186—Particular post-treatment for the devices, e.g. annealing, impurity gettering, short-circuit elimination, recrystallisation
- H01L31/1864—Annealing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Photovoltaic Devices (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Silicon Compounds (AREA)
Abstract
Description
1cm3当り1〜5×1014Fe原子を含有する慣用の市販p−型ホウ素ドープ剤入りの多結晶質シリコンウェファの高温加工
リンはPOCl3−拡散により、市販のp−型ウェファの表面にチー(chee)まで押送する。抵抗は100オームcm2である。反射防止被覆層を窒化シリコンCVD沈着によりウェファの前面に施用する。埋設接触部用の溝をウェファの表面に形成し、リンをPOCl3−拡散により数分間950℃の温度で溝に押送した。拡散過程後にはシートの抵抗は10オームcm2である。Alの裏接触部をウェファの裏面に合金化する。MIRHPにより水素不動態化(passivation)を行ない、金属の前面接触部はNi/Cuメッキの使用によりウェファの前面上の溝に印加した。ウェファの寿命時間は前記処理工程の各々後に測定する。未処理のウェファと比較すると、寿命時間は最初の拡散工程及び窒化シリコンの沈着工程後に増大した。然しながら、950℃での拡散工程後には寿命時間は測定し得ないような低い程度にまで低下した。これは慣用の多結晶質ウェファについて予期される通りである。950℃での拡散処理に続いての処理工程によって寿命時間の小さな増大が得られるが、低温又は中位温度での熱処理工程を含有するに過ぎない慣用のスクリーンプリント法により加工した慣用の多結晶質太陽電池に典型的な寿命時間は得られなかった。
比較的高いリン含量を有するシリコンウェファの高温加工(埋設した接触部)
リンはPOCl3拡散により、1ppmaのBと0.8ppmaのPと1〜5×1014Fe原子/cm3とを含有するp−型ウェファにシートの抵抗が100オームcm2となるまで押送した。反射防止被覆層を窒化シリコンCVD沈着によりウェファの前面に施用した。接触部用の溝をウェファ表面に形成し、リンをPOCl3拡散により950℃の温度で数分間溝中に拡散した。拡散処理後にはシートの抵抗は10オームcm3である。Alの裏接触部をウェファの裏面に合金化した。MIRHPにより水素の不動態化を行ない、金属の前面接触部をNi/Cuメッキによりウェファの前面上の溝中に印加した。ウェファの寿命時間を上記処理工程の各々後に測定する。未処理のウェファと比較すると、寿命時間は第1の拡散工程後に及び窒化シリコン層の施用後に増大した。950℃での拡散後には寿命時間は未処理ウェファの寿命時間よりもずっと良い程度にまで増大した。これは実施例2における慣用の多結晶質ウェファについて見られるものとは正反対である。高温拡散に続いての処理工程によって寿命時間の小さな増大が得られ、最後には、低温又は中位温度での熱処理を含有するに過ぎない標準のスクリーンプリント過程後に加工した慣用の多結晶質太陽電池についての寿命時間よりも3倍以上良好であるマイクロ秒での寿命時間が得られた。
Claims (10)
- 高い寿命時間を有する多結晶質のp−型シリコンウェファであって、該シリコンウェファが0.2〜2.8ppmaのホウ素と0.06〜2.8ppmaのリン及び/又は0.06〜2.8ppmaのヒ素とを含有し、925℃より高い温度でリンの拡散及びリンのゲッタリングを受けていたことを特徴とする多結晶質のp−型シリコンウェファ。
- シリコンウェファは少なくとも950℃の温度でリンの拡散及びリンのゲッタリングを受けていることを特徴とする請求項1記載の多結晶質のp−型シリコンウェファ。
- 多結晶質のシリコンウェファは0.3〜0.75ppmaのホウ素と0.1〜0.75ppmaのリンとを含有することを特徴とする請求項1又は2記載の多結晶質p−型シリコンウェファ。
- リンppmaとホウ素ppmaとの割合は0.2と1との間であることを特徴とする請求項1〜3の何れかに記載の多結晶質p−型シリコンウェファ。
- 高温でのp−型多結晶質ウェファのリン拡散及びリンのゲッタリング方法において、0.2〜2.8ppmaのホウ素と0.06〜2.8ppmaのリン及び/又は0.06〜2.8ppmaのヒ素とを含有するp−型多結晶質シリコンウェファは925℃より高い温度でリンの拡散及びリンのゲッタリングを受けていることを特徴とするp−型多結晶質ウェファのリン拡散及びリンのゲッタリング方法。
- シリコンウェファは少なくとも950℃の温度でリンの拡散及びリンのゲッタリングを受けていることを特徴とする、請求項5記載の方法。
- 多結晶質ウェファは0.3〜0.75ppmaのホウ素と0.1〜0.75ppmaのリンとを含有することを特徴とする請求項5又は6記載の方法。
- リンppmaとホウ素ppmaとの間の割合は0.2と1との間で生起することを特徴とする請求項5〜7の何れかに記載の方法。
- 高い寿命年数を有するp−型多結晶質シリコンウェファを含有してなる太陽電池パネルにおいて該シリコンウェファが0.2〜2.8ppmaのホウ素と0.06〜2.8ppmaのリン及び/又はヒ素とを含有し、925℃より高い温度でリンの拡散及びリンのゲッタリングを受けていることを特徴とする太陽電池パネル。
- パネルは、少なくとも950℃の温度でリンの拡散及びリンのゲッタリングを受けていたシリコンウェファから形成されることを特徴とする請求項9記載の太陽電池パネル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
NO20065586 | 2006-12-04 | ||
NO20065586A NO333757B1 (no) | 2006-12-04 | 2006-12-04 | Solceller |
PCT/NO2007/000422 WO2008069675A2 (en) | 2006-12-04 | 2007-11-28 | Multicrystalline silicon solar cells |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010512022A true JP2010512022A (ja) | 2010-04-15 |
JP5401322B2 JP5401322B2 (ja) | 2014-01-29 |
Family
ID=39492751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009540188A Expired - Fee Related JP5401322B2 (ja) | 2006-12-04 | 2007-11-28 | 太陽電池 |
Country Status (10)
Country | Link |
---|---|
US (1) | US8735203B2 (ja) |
EP (1) | EP2095405B1 (ja) |
JP (1) | JP5401322B2 (ja) |
CN (1) | CN101636823B (ja) |
BR (1) | BRPI0719420A2 (ja) |
CA (1) | CA2670527C (ja) |
EA (1) | EA015668B1 (ja) |
ES (1) | ES2882152T3 (ja) |
NO (1) | NO333757B1 (ja) |
WO (1) | WO2008069675A2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130036258A (ko) * | 2010-06-03 | 2013-04-11 | 수니바 인코포레이티드 | 혼성 확산 및 이온 주입 공정에 의해서 제조된 선택적 이미터 태양전지 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009055685A1 (de) * | 2009-11-25 | 2011-05-26 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zur Qualitätsverbesserung von Wafern sowie Verwendung des Verfahrens |
RU2485632C1 (ru) * | 2012-01-19 | 2013-06-20 | Учреждение Российской академии наук Институт автоматики и процессов управления Дальневосточного отделения РАН (ИАПУ ДВО РАН) | Способ создания светоизлучающего элемента |
RU2485631C1 (ru) * | 2012-01-19 | 2013-06-20 | Учреждение Российской академии наук Институт автоматики и процессов управления Дальневосточного отделения РАН (ИАПУ ДВО РАН) | Способ создания светоизлучающего элемента |
US8709859B2 (en) * | 2012-02-03 | 2014-04-29 | Gamc Biotech Development Co., Ltd. | Method for fabricating solar cell |
CN104120494A (zh) * | 2014-06-25 | 2014-10-29 | 上饶光电高科技有限公司 | 一种适用于提升晶体硅太阳能电池转换效率的扩散工艺 |
RU2680606C1 (ru) * | 2018-01-23 | 2019-02-25 | Федеральное государственное бюджетное образовательное учреждение высшего образования "Кабардино-Балкарский государственный университет им. Х.М. Бербекова" (КБГУ) | Способ изготовления полупроводниковых структур |
CA3004436C (en) | 2018-05-09 | 2021-06-01 | Paige Whitehead | Biodegradable light wand |
CN113013296B (zh) * | 2021-03-05 | 2023-07-28 | 赛维Ldk太阳能高科技(新余)有限公司 | 铸造单晶硅片黑丝的去除方法、hit异质结太阳能电池及其制备方法 |
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JPH05218464A (ja) * | 1992-01-31 | 1993-08-27 | Canon Inc | 半導体基体と太陽電池の製造方法及びこれらの方法により得られた半導体基体と太陽電池 |
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JP2005129714A (ja) * | 2003-10-23 | 2005-05-19 | Sharp Corp | 太陽電池セルの製造方法 |
JP2005191315A (ja) * | 2003-12-25 | 2005-07-14 | Kyocera Corp | 光電変換装置およびその製造方法 |
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-
2006
- 2006-12-04 NO NO20065586A patent/NO333757B1/no unknown
-
2007
- 2007-11-28 EP EP07851981.6A patent/EP2095405B1/en active Active
- 2007-11-28 BR BRPI0719420-0A2A patent/BRPI0719420A2/pt not_active Application Discontinuation
- 2007-11-28 CN CN2007800447831A patent/CN101636823B/zh active Active
- 2007-11-28 US US12/517,502 patent/US8735203B2/en active Active
- 2007-11-28 WO PCT/NO2007/000422 patent/WO2008069675A2/en active Application Filing
- 2007-11-28 CA CA2670527A patent/CA2670527C/en active Active
- 2007-11-28 JP JP2009540188A patent/JP5401322B2/ja not_active Expired - Fee Related
- 2007-11-28 ES ES07851981T patent/ES2882152T3/es active Active
- 2007-11-28 EA EA200970541A patent/EA015668B1/ru not_active IP Right Cessation
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JPH05218464A (ja) * | 1992-01-31 | 1993-08-27 | Canon Inc | 半導体基体と太陽電池の製造方法及びこれらの方法により得られた半導体基体と太陽電池 |
JPH10251010A (ja) * | 1997-03-14 | 1998-09-22 | Kawasaki Steel Corp | 太陽電池用シリコン |
JP2005129714A (ja) * | 2003-10-23 | 2005-05-19 | Sharp Corp | 太陽電池セルの製造方法 |
JP2005191315A (ja) * | 2003-12-25 | 2005-07-14 | Kyocera Corp | 光電変換装置およびその製造方法 |
WO2005063621A1 (en) * | 2003-12-29 | 2005-07-14 | Elkem Asa | Silicon feedstock for solar cells |
JP2007516928A (ja) * | 2003-12-29 | 2007-06-28 | エルケム アクシエセルスカプ | 太陽電池用のシリコン供給原料 |
JP2006111519A (ja) * | 2004-09-16 | 2006-04-27 | Sanritsuku:Kk | 太陽光発電用多結晶シリコン原料および太陽光発電用シリコンウェーハ |
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KR20130036258A (ko) * | 2010-06-03 | 2013-04-11 | 수니바 인코포레이티드 | 혼성 확산 및 이온 주입 공정에 의해서 제조된 선택적 이미터 태양전지 |
JP2013531371A (ja) * | 2010-06-03 | 2013-08-01 | サニーバ,インコーポレイテッド | 拡散とイオン注入とのハイブリッドプロセスによって形成される選択エミッタ太陽電池 |
KR101648440B1 (ko) * | 2010-06-03 | 2016-08-16 | 수니바 인코포레이티드 | 혼성 확산 및 이온 주입 공정에 의해서 제조된 선택적 이미터 태양전지 |
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CA2670527C (en) | 2014-02-04 |
BRPI0719420A2 (pt) | 2014-02-11 |
NO20065586L (no) | 2008-06-05 |
EP2095405A2 (en) | 2009-09-02 |
US8735203B2 (en) | 2014-05-27 |
WO2008069675A3 (en) | 2008-11-20 |
EP2095405A4 (en) | 2016-05-25 |
WO2008069675A2 (en) | 2008-06-12 |
EP2095405B1 (en) | 2021-07-07 |
CA2670527A1 (en) | 2008-06-12 |
CN101636823B (zh) | 2012-09-05 |
AU2007328538A1 (en) | 2008-06-12 |
ES2882152T3 (es) | 2021-12-01 |
JP5401322B2 (ja) | 2014-01-29 |
CN101636823A (zh) | 2010-01-27 |
EA015668B1 (ru) | 2011-10-31 |
EA200970541A1 (ru) | 2009-10-30 |
US20100212738A1 (en) | 2010-08-26 |
NO333757B1 (no) | 2013-09-09 |
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