JP2010287421A - Organic el device, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an organic EL device capable of maintaining an adhesive agent with a prescribed gap and moreover eliminating mixture of bubbles and pores, in a solid sealing of the organic EL device, and to provide a manufacturing method of the same. <P>SOLUTION: In the organic EL device, an organic EL element substrate, having a first electrode layer formed on a first base material, barrier ribs formed on the first base material to divide the first electrode layer, an organic light emitting medium layer formed on the first electrode layer, and a second electrode layer formed on the organic light emitting medium layer, is pasted on a sealing base material with an adhesive agent layer in-between. The sealing base material includes a second base material and a protruded layer formed on the second base material, and the protruded layer is so formed as to be positioned at openings between the barrier ribs. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an organic EL device expected to be widely used as a flat panel display used in a portable terminal such as a television, a personal computer monitor, a mobile phone, a surface emitting light source, an illumination, a light emitting advertising body, and the like. Regarding the method.

  The organic EL device is expected as a flat panel display that replaces a surface emitting light source, a cathode ray tube, or a liquid crystal display because of advantages such as a wide viewing angle, a high response speed, and low power consumption.

  An organic EL element has a structure in which an organic light-emitting medium layer is sandwiched between two electrode layers (anode layer and cathode layer), at least one of which has translucency, and a voltage is applied between both electrodes. It is a self-luminous display element in which light is emitted from the organic light emitting medium layer when an electric current is passed. However, since the organic EL element has a problem that it deteriorates due to the influence of moisture and oxygen in the atmosphere, a method of covering with a metal can or glass cap containing a desiccant and blocking from the atmosphere is generally used. .

  In recent years, in order to improve the light extraction efficiency of an active matrix organic EL display, an upper surface light emitting element that extracts light from the sealing member side has been proposed, and it has been replaced with a cap sealing that includes a desiccant that has been used conventionally. Solid sealing in which a sealing substrate having a barrier property (sealing layer), an adhesive, a color filter function and the like are laminated without providing a space has been proposed (Patent Documents 1 and 2). .

  In solid sealing, in order to maintain the sealing performance, it is necessary to maintain a uniform thickness gap of several microns, and mixing of bubbles and spaces not only prevents light emission but also organic Since it becomes a deterioration factor of the EL display, it is necessary to perform bonding without bubbles. As an example of the bonding method, an ODF (one drop fill) method that is generally used for liquid crystal injection has recently been tried. However, in the case of an organic EL display, the viscosity of an adhesive is high unlike a liquid crystal material. As the size of the substrate increases, it is susceptible to the influence of unevenness on the surface of the substrate, and it is difficult to uniformly apply and apply the adhesive to the surface of the substrate.

  FIG. 9 is a schematic cross-sectional view of a conventional sealing method in which a sealing base material 35 on which a color filter layer is formed and a base material 36 on which an organic EL element 16 is formed are bonded using an ODF method. . When the organic EL device is bonded by the ODF method, generally, a UV curable adhesive containing a spacer is applied around the substrate 36 as the first adhesive layer 31, and then UV cured as the second adhesive layer 32. Alternatively, a region surrounded by the first adhesive layer 31 is filled with a thermosetting adhesive. At this time, both the first and second adhesive layers are coated and filled with an adhesive amount corresponding to the gap after bonding and curing, but the viscosity of the second adhesive layer 32 is about 100 to 1000 mPa · s, which is a liquid crystal material. Therefore, wetting and spreading at the time of bonding is not possible due to the unevenness of the surface formed by the partition pattern formed on the substrate 36 or the color filter layer formed on the sealing substrate 35. There was a problem that sufficient locations were generated and bubbles 33 and spaces 34 were easily generated.

JP 2002-231443 A JP 2004-164890 A

  In view of the above problems, an object of the present invention is to provide an organic EL device that maintains an adhesive in a predetermined gap and does not contain bubbles or spaces in a solid sealing of an organic EL device, and a method for manufacturing the same. .

The invention according to claim 1 of the present invention is formed on the first base material so as to partition the first electrode layer formed on the first base material and the first electrode layer. A partition; an organic light emitting medium layer formed on the first electrode layer; a second electrode layer formed on the organic light emitting medium layer;
An organic EL device in which an organic EL element substrate having an adhesive layer is bonded to a sealing substrate through an adhesive layer,
The sealing substrate has a second substrate and a protruding layer formed on the second substrate,
In the organic EL device, the protruding layer is formed to be positioned in an opening between the partition walls.

  In the invention according to claim 2 of the present invention, the thickness of the adhesive layer between the protruding layer and the organic EL element is smaller than the thickness of the adhesive layer between the partition wall and the second substrate. The organic EL device according to claim 1.

  The invention according to claim 3 of the present invention is the organic EL device according to claim 2, wherein a spacer layer is formed on the adhesive surface of the sealing substrate.

  The invention according to claim 4 of the present invention is the organic EL device according to claim 3, wherein the second base material and the protruding layer are made of a transparent material.

  The invention according to claim 5 of the present invention is characterized in that a plurality of color filter layers are formed on the second base material, and the protruding layers are formed on the plurality of color filter layers. An organic EL device according to claim 4.

  According to a sixth aspect of the present invention, a plurality of color filter layers are formed on the second base material, and a plurality of lights that output light having a wavelength different from the absorption wavelength are formed on the plurality of color filter layers. The organic EL device according to claim 4, wherein the color conversion layer is formed, and the protrusion layer is formed on the plurality of color conversion layers and the plurality of color filter layers.

  The invention according to claim 7 of the present invention is the organic EL device according to claim 5 or 6, wherein a light shielding layer is formed on a region between the plurality of color filter layers. .

The invention according to claim 8 of the present invention is such that the shape of the cross-section of the protruding layer is a prism or a sinusoidal waveform in which the cross-sectional shape is a quadrangle, trapezoid, isosceles triangle, inequilateral triangle, large triangle, or the like. Or a lenticular lens with a half-circular shape with a large number of cross sections, a lens array triangle with a pyramid or hemispherical unit, a semicircular shape, a hemispherical shape, or a combination of these shapes Yes,
The organic EL device according to claim 7, wherein a refractive index of the protruding layer is higher than a refractive index of the adhesive layer.

  The invention according to claim 9 of the present invention is characterized in that the entire surface of the organic EL element substrate is covered with an inorganic film of an inorganic oxide film, an inorganic nitride film, or an inorganic oxynitride film. Item 9. The organic EL device according to Item 1 to 8.

  The invention according to claim 10 of the present invention is characterized in that the entire surface of the sealing substrate is covered with an inorganic film of an inorganic oxide film, an inorganic nitride film, or an inorganic oxynitride film. The organic EL device according to 1 to 9.

  According to an eleventh aspect of the present invention, a liquid adhesive is applied to the surface of the organic EL element substrate on which the partition walls are formed, and the liquid adhesive is cured after being attached to the sealing substrate. 11. The method of manufacturing an organic EL device according to claim 1, wherein the organic EL device is a manufacturing method.

  In the invention according to claim 12 of the present invention, a sheet-like adhesive is laminated on the surface of the sealing substrate on which the protruding layer is formed, and after being attached to the organic EL element substrate, the sheet-like adhesive is added. The organic EL device manufacturing method according to claim 1, wherein the organic EL device is cured.

  The invention according to claim 13 of the present invention is characterized in that the step of attaching the first base material and the second base material through the adhesive layer is performed in a vacuum. Or a method for producing an organic EL device according to 12.

  According to the present invention, it is possible to maintain the adhesive in a predetermined gap, provide a solid seal without bubbles and spaces, and further prevent light emission, particularly light emission from the upper surface of the device derived from the bubbles of the adhesive layer, for a long time. An organic EL device capable of suppressing deterioration over a wide range and a method for manufacturing the same can be provided.

Cross section of color filter type organic EL device Cross-sectional view of a three-color organic EL device Cross section of color conversion organic EL device Cross-sectional view of organic EL device showing angle θ and angle φ Sectional view showing how light is refracted and reflected in an organic EL device Cross section of adhesive layer thickness and gas intrusion path in sealed state Stepwise cross-sectional view of ODF sealing method Sectional cross-sectional view of sealing method with sheet adhesive Staged cross-sectional view of conventional sealing method

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. The present invention is not limited to this.

  FIG. 1 shows a partition wall 12 formed on a first substrate 10, an organic layer composed of a first electrode 11, an organic light emitting medium layer 13, and a second electrode 14 formed in an opening surrounded by the partition wall. An organic EL element substrate 17 composed of the EL element 16 and the first passivation layer 15 formed on the organic EL element 16, a protrusion layer 21 formed on the second base material 20, a spacer layer 22, and a light shielding layer 23. FIG. 3 is a schematic cross-sectional view of a top emission organic EL device in which a color filter system in which a color filter layer 24 and a sealing substrate 27 composed of a second passivation layer 25 are attached via an adhesive layer 30 is applied to the present invention. .

  FIG. 2 is a schematic cross-sectional view of a top emission organic EL device in which a three-color organic EL element 16 in which elements that emit red, blue, and green are arranged by applying an electric field is applied to the present invention. It is. In the case of the three-color light emission method, since the organic light emitting medium layers 13 (a) and 13 (b) of a plurality of colors are formed on the organic EL element 16, only the protrusion layer 21 and the spacer layer 22 are formed on the sealing substrate 27. Is formed.

  Further, FIG. 3 shows a color conversion type organic material that absorbs near-ultraviolet light, blue light, blue-green light, or white light and performs wavelength distribution conversion to emit light in the visible light region and a color filter layer. It is the cross-sectional schematic of the top emission type organic electroluminescent apparatus at the time of applying the EL element 16 to this invention. In the case of the color conversion method, in addition to the layers 21 to 24, color conversion layers 26 (a) and 26 (b) containing a color conversion dye for converting light from the organic EL element 16 are formed. In addition, when using as it is, without converting the light emission from an organic EL element, there may not be two or more color conversion layers and color filter layers.

  The organic EL device shown in FIGS. 1 to 3 has a light shielding layer 23, a color filter layer 24, and a color conversion layer 26 depending on the light emitting method of the organic EL element 16, whether the light emitting surface is an upper surface or a lower surface, or a difference in element configuration. May be formed on the organic EL element substrate 17 or may not be formed on either the organic EL element substrate 17 or the sealing substrate 27.

  Next, details of the organic EL device of the present invention will be described in order from the organic EL element substrate 17.

  As the first substrate 10, a substrate in which a thin film transistor (TFT) is formed on a plastic film such as glass, quartz, polyethersulfone, or polycarbonate is used when the driving method of the organic EL device is an active matrix method. . Note that the thin film transistor is not particularly illustrated.

  As the thin film transistor formed on the first substrate 10, a known thin film transistor can be used. Specifically, a thin film transistor mainly including an active layer in which a source / drain region and a channel region are formed, a gate insulating film, and a gate electrode can be given. The structure of the thin film transistor is not particularly limited, and examples thereof include a staggered type, an inverted staggered type, a top gate type, and a coplanar type.

  The organic EL element 16 of the present invention is not limited to the active matrix method in which a thin film transistor (TFT) is formed for each pixel and the light is emitted independently for each pixel, and the stripe-shaped anode and cathode are orthogonal to each other. It is also possible to adopt a passive matrix configuration, which is a scheme in which light is emitted at the intersections.

The active layer used in the thin film transistor is not particularly limited, and examples thereof include inorganic semiconductor materials such as amorphous silicon, polycrystalline silicon, microcrystalline silicon, and cadmium selenide, thiophene oligomers, and poly (p-ferri). It can be formed of an organic semiconductor material such as (lenvinylene). These active layers are formed by, for example, laminating amorphous silicon by plasma CVD, ion doping, forming amorphous silicon by LPCVD using SiH ₄ gas, and crystallizing amorphous silicon by solid phase growth. After obtaining silicon, ion doping is performed by ion implantation, LPCVD using Si ₂ H ₆ gas, and amorphous silicon is formed by PECVD using SiH ₄ gas, and laser such as excimer laser is used. After annealing and crystallizing amorphous silicon to obtain polysilicon, polysilicon is laminated by ion doping (low temperature process), low pressure CVD or LPCVD, and thermally oxidized at 1000 ° C. or higher. Gate break Film is formed, a gate electrode of the n + polysilicon is formed thereon, then, a method of ion doping (high temperature process), and the like by an ion implantation method.

As the gate insulating film, typically, it can be used that is used as a gate insulating film, for example, PECVD method, SiO formed by the LPCVD method or the like _2; SiO obtained polysilicon film was thermally oxidized ₂ Etc. can be used.

  As a gate electrode, what is normally used as a gate electrode can be used, for example, metals, such as aluminum and copper, refractory metals, such as titanium, tantalum, and tungsten, polysilicon, silicide of a refractory metal, Polycide etc. are mentioned. The thin film transistor may have a single gate structure, a double gate structure, or a multi-gate structure having three or more gate electrodes. Moreover, you may have a LDD structure and an offset structure. Further, two or more thin film transistors may be arranged in one pixel.

  The organic EL device of the present invention is connected so that the thin film transistor functions as a switching element of the organic EL device, and the drain electrode of the transistor and the first electrode layer 11 of the organic EL device are electrically connected. The thin film transistor, the drain electrode, and the first electrode layer 11 of the organic EL device are connected through a connection wiring formed in a contact hole that penetrates the planarization film.

In the embodiment of the present invention, the first electrode layer 11 is partitioned by the partition walls 12 and becomes the first electrode layer corresponding to each pixel. As the material of the first electrode layer 11, a material having a high work function such as ITO is preferably selected, and metal composite oxidation such as ITO (indium tin composite oxide), indium zinc composite oxide, and zinc aluminum composite oxide. Can be used as a single layer or a laminate of fine particles, metal materials such as gold and platinum, and fine particle dispersion films in which fine particles of these metal oxides or metal materials are dispersed in epoxy resin or acrylic resin. . Further, when the organic EL element 16 is a top emission type and hole injection property and reflectivity are required as the first electrode layer, an ITO film may be laminated on a metal material such as Ag or Al. Good. On the other hand, when the organic EL element 16 is a bottom emission type and it is necessary to ensure hole injecting property and transparency as the first electrode layer, it is laminated with a metal oxide having excellent light transmittance such as ITO or IZO. A film may be used.
The optimum value of the thickness of the first electrode layer 11 varies depending on the element configuration of the organic EL element 16, but is 0.01 μm or more and 1 μm or less, more preferably 0.01 μm or more, regardless of single layer or stacked layers. 0.3 μm or less.

  As a method for forming the first electrode layer 11, depending on the material, a dry film forming method such as a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a sputtering method, or a gravure printing method is used. Further, a wet film forming method such as a screen printing method can be used.

The partition wall 12 is formed so as to partition the light emitting region corresponding to the pixel. In general, in an active matrix drive type display device, a first electrode layer 11 is formed for each pixel, and each pixel tries to occupy as large an area as possible. The most preferable shape of the partition wall 12 formed so as to cover is basically a lattice shape that divides each first electrode layer 11 by the shortest distance.
As a method of forming the partition wall 12, as in the conventional method, an inorganic film is uniformly formed on a substrate, masked with a resist, and then dry-etched, or a photosensitive resin is laminated on the substrate, and a photolithography method is used. The method of setting to a predetermined pattern is mentioned. If necessary, a water repellent can be added, or plasma or UV can be irradiated to impart liquid repellency to the ink after formation.
A preferable height of the partition wall 12 is not less than 0.1 μm and not more than 10 μm, and more preferably not less than 0.5 μm and not more than 2 μm. If the height of the partition wall 12 exceeds 10 μm, the formation and sealing of the counter electrode is hindered, and if it is less than 0.1 μm, the end of the first electrode layer 11 cannot be covered, or the light emitting medium layer is formed. This is because they are short-circuited or mixed with adjacent pixels.

  The organic light emitting medium layer 13 in the present invention can be formed of a single layer film or a multilayer film containing a light emitting substance. Examples of the configuration of the organic light emitting medium layer 13 in the case of forming a multilayer film include a hole transport layer, an electron transporting light emitting layer or a hole transporting light emitting layer, a two-layer structure comprising an electron transport layer, a hole transport layer, A three-layer structure consisting of a light emitting layer and an electron transport layer, and further, if necessary, a hole (electron) injection function and a hole (electron) transport function, or a layer that blocks the transport of holes and electrons By inserting, a multilayer can be formed.

Examples of hole transport materials used for the organic light emitting medium layer 13 include metal phthalocyanines and metal-free phthalocyanines such as copper phthalocyanine and tetra (t-butyl) copper phthalocyanine, quinacridone compounds, 1,1-bis (4-di -P-tolylaminophenyl) cyclohexane, N, N'-diphenyl-N, N'-bis (3-methylphenyl) -1,1'-biphenyl-4,4'-diamine, N, N'-di ( 1-naphthyl) -N, N′-diphenyl-1,1′-biphenyl-4,4′-diamine and other aromatic amine-based low-molecular hole injection / transport materials, polyaniline, polythiophene, polyvinylcarbazole, poly (3 , 4-ethylenedioxythiophene) and a mixture of polystyrene sulfonic acid and other polymer hole transport materials, polythiophene oligomer materials, Cu ₂ O, Cr ₂ O ₃ , Mn ₂ O ₃ , FeOx (x˜0.1), NiO, CoO, Pr ₂ O ₃ , Ag ₂ O, MoO ₂ , Bi ₂ O ₃ , ZnO, TiO ₂ , SnO ₂ , ThO ₂ , V ₂ O ₅ , Nb ₂ O ₅ , Ta ₂ O ₅ , MoO ₃ , WO ₃ , MnO ₂ and other inorganic materials, and other existing hole transport materials.

  When the light emitting material of the organic light emitting medium layer 13 is a polymer material, the hole transport property is increased between the light emitting layer and the hole transport layer or between the hole transport layer and the electron transport layer, It is preferable to form an interlayer layer having a function of blocking electrons. Examples of materials used for the interlayer layer include polymers containing aromatic amines such as polyvinyl carbazole or derivatives thereof, polyarylene derivatives having aromatic amines in the side chain or main chain, arylamine derivatives, and triphenyldiamine derivatives. . These materials can be dissolved or dispersed in a solvent and formed using various coating methods such as spin coating or letterpress printing.

  Examples of the light emitting material used for the organic light emitting medium layer 13 include 9,10-diarylanthracene derivatives, pyrene, coronene, perylene, rubrene, 1,1,4,4-tetraphenylbutadiene, tris (8-quinolinolato) aluminum complex, tris. (4-methyl-8-quinolinolato) aluminum complex, bis (8-quinolinolato) zinc complex, tris (4-methyl-5-trifluoromethyl-8-quinolinolato) aluminum complex, tris (4-methyl-5-cyano-) 8-quinolinolato) aluminum complex, bis (2-methyl-5-trifluoromethyl-8-quinolinolato) [4- (4-cyanophenyl) phenolate] aluminum complex, bis (2-methyl-5-cyano-8-quinolinolato) ) [4- (4-Cyanophenyl) phenoler ] Aluminum complex, tris (8-quinolinolato) scandium complex, bis [8- (para-tosyl) aminoquinoline] zinc complex and cadmium complex, 1,2,3,4-tetraphenylcyclopentadiene, pentaphenylcyclopentadiene, poly -2,5-diheptyloxy-para-phenylene vinylene, coumarin phosphor, perylene phosphor, pyran phosphor, anthrone phosphor, porphyrin phosphor, quinacridone phosphor, N, N'-dialkyl Low molecular weight light emitting materials such as substituted quinacridone phosphors, naphthalimide phosphors, N, N'-diaryl substituted pyrrolopyrrole phosphors, phosphorescent phosphors such as Ir complexes, polyfluorenes, polyparaphenylene vinylenes , Polythiophene, polyspiro and other polymer materials The materials and dispersed or copolymerization of low molecular weight material in the material, it is possible to use other conventional fluorescent light emitting material or phosphorescent material.

Examples of the electron transport material used for the organic light emitting medium layer 13 include 2- (4-biphenylyl) -5- (4-tert-butylphenyl) -1,3,4-oxadiazole, 2,5-bis. (1-naphthyl) -1,3,4-oxadiazole, an oxadiazole derivative, a bis (10-hydroxybenzo [h] quinolinolato) beryllium complex, a triazole compound, or the like can be used.
These electron transport materials may be doped with an alkali metal or alkaline earth metal having a low work function such as sodium, barium, or lithium to form an electron injection layer.

The thickness of the organic light emitting medium layer 13 is 1 μm or less, preferably about 0.05 to 0.2 μm, even when formed by a single layer or a stacked layer.
Depending on the material, the organic luminescent medium layer can be formed by vacuum deposition, coating, printing such as slit coating, spin coating, spray coating, nozzle coating, flexo, gravure, micro gravure, intaglio offset, inkjet, etc. The method etc. can be used.

  In the case where the organic EL element 16 is a top emission organic EL element, the second electrode layer 14 needs to serve both as an electron-injecting cathode and a transparent electrode. As the electron-injecting cathode, an alkali metal or alkaline earth metal such as Li, Ba, Mg, or Ca having a low work function, or a compound such as an oxide or fluoride of these metals can be used. Although these materials are excellent in electron injecting property, they are poor in stability. Therefore, it is more preferable to use a laminated film or an alloy film with a metal having excellent stability such as Al or Ag. As the upper electrode of the top emission type organic EL element, it is more preferable to use a laminated film with a metal oxide excellent in light transmissivity such as ITO or IZO. When the organic EL element 16 is a bottom emission type, since the second electrode layer needs to be reflective, it is preferable to use a laminated film of a metal material having excellent reflectivity such as Ag or Al.

  As a method for forming the second electrode layer 14, a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, or a sputtering method may be selected depending on the material. Moreover, there is no restriction | limiting in particular in the thickness of the 2nd electrode layer 14, However, About 0.01 micrometer or more and 1 micrometer or less can be used. In the case of a top emission type EL element, an electrode is used in which an alkali metal such as Ba is about 5 nm, a stable metal such as Al is about 10 nm, and a metal oxide such as ITO is laminated about 100 nm.

  Examples of the first passivation layer 15 include metal oxides such as silicon oxide and aluminum oxide, metal fluorides such as aluminum fluoride and magnesium fluoride, metal nitrides such as silicon nitride, aluminum nitride, and carbon nitride, and silicon oxynitride. A laminated film of a metal oxynitride such as silicon carbide, a metal carbide such as silicon carbide, and a polymer resin film such as an acrylic resin, an epoxy resin, a silicone resin, or a polyester resin may be used as necessary. In particular, it is preferable to use silicon oxide, silicon nitride, or silicon oxynitride from the viewpoint of barrier properties and transparency. Furthermore, a laminated film or a gradient film with a variable film density may be used depending on the film forming conditions. .

As a method for forming the first passivation layer 15, a resistance heating vapor deposition method, an electron beam vapor deposition method, a reactive vapor deposition method, an ion plating method, a sputtering method, and a CVD method can be used depending on the material. It is preferable to use the CVD method in terms of barrier properties and translucency. As the CVD method, a thermal CVD method, a plasma CVD method, a catalytic CVD method, a VUV-CVD method, or the like can be used. In addition, as a reaction gas in the CVD method, a gas such as N ₂ , O ₂ , NH ₃ , H ₂ , N ₂ O is added to an organic silicon compound such as monosilane, hexamethyldisilazane (HMDS), or tetraethoxysilane. It may be added as necessary. For example, the density of the film may be changed by changing the flow rate of silane, and hydrogen or carbon may be contained in the film by the reactive gas used. The thickness of the first passivation layer 15 varies depending on the electrode level difference of the organic EL element 16, the partition wall height of the first base material, the required barrier characteristics, etc., but is generally about 0.01 μm to 10 μm. It is used for.

  Next, the sealing substrate 27 will be described.

  Examples of the second substrate 20 include inorganic glass such as quartz glass, borosilicate glass, and soda glass, plastic substrates such as PET, PES, and PC, or silicon oxide or oxide on these glass substrates and plastic substrates. A film on which an inorganic thin film such as aluminum, silicon nitride, or silicon oxynitride is formed can be used. In the case of a top emission organic EL device, a light-transmitting one is preferable.

The shape of the protruding layer 21 is the same as or smaller than the concave shape of the opening in which the organic EL element surrounded by the partition wall 12 is formed, and by forming a convex shape such as a trapezoid or a dome shape, the adhesive Is stuck to the outside of the opening so that the thickness of the adhesive layer at the opening can be reduced, and even if there are bubbles or spaces, it does not remain in the opening.
When the protruding layer 21 is trapezoidal, the angle formed between the side surface of the protruding layer 21 and the plane of the second substrate 20 is larger than the angle formed between the side surface of the partition wall 12 and the plane of the first substrate 10. It is preferable.
Here, the angle formed by the side surface of the projection layer 21 and the plane of the second substrate 20 is a projection at the point where the side surface of the projection layer 21 and the second substrate 20 are in contact with each other, as shown in FIG. The angle θ formed by the tangent of the layer 21 and the plane of the second substrate 20 is referred to. The angle formed by the side surface of the partition wall 12 and the plane of the first substrate 10 is the side surface of the partition wall 12 and the first surface. The angle φ formed by the tangent line of the partition wall 12 at the point where the substrate 10 is in contact with the plane of the first substrate 10 is assumed.

  By adopting such a shape, the possibility that the side surface of the protruding layer 21 and the partition wall 12 come into contact with each other at the time of bonding is reduced, and the protruding layer 21 can be smoothly aligned and bonded to the opening surrounded by the partition wall 12. In addition, the thickness of the adhesive layer 30 between the protruding layer 21 and the organic EL element 16 can be reduced. Further, since the space surrounded by the side surface of the protruding layer 21 and the side surface of the partition wall 12 becomes thicker in the direction outside the opening, the adhesive is opened when the first base material 10 and the second base material 20 are bonded together. It becomes easy to extrude from the inside of the part to the outside, and bubbles and spaces can be eliminated over the entire adhesive layer 30 from the inside of the opening where the organic EL element 16 is formed to the partition 12.

  Further, in the case of a top emission type organic EL device, the cross-sectional shape of the projection layer 21 using a translucent material is a continuous shape such as a quadrangle, a trapezoid, an isosceles triangle, an unequal triangle, a large triangle, or the like. Prisms, sinusoidal waveforms, or lenticular lenses with a hemispherical shape with multiple cross sections, lens array triangles with pyramid or hemispherical units, semicircular, hemispherical, or By combining these shapes, the light extraction efficiency from the organic EL element 16 can be improved.

  FIG. 5 shows the state of light refraction and reflection in an organic EL device using a resin having a refractive index higher than that of the adhesive layer 30 as the resin composition constituting the protruding layer 21 in the case of a top emission organic EL device. FIG. Note that the first electrode 11, the partition 12, the second electrode 14, the first passivation layer 15, the light shielding layer 23, and the color filter layer 24 are omitted.

  In order for light emitted from the organic EL element to be emitted into the atmosphere, it is necessary to pass through the interfaces of several media having different refractive indexes, such as transparent electrodes and sealing substrates. According to Snell's law, when light enters from the medium A to the medium B when the refractive index is medium A> medium B, the light is totally reflected at the interface of the medium AB when the angle of the incident light is greater than the critical angle. On the contrary, since light is not totally reflected when light enters the medium A from the medium B, the light is refracted at the interface and travels straight through the medium A. In the organic EL element, the light totally reflected at the interface of each medium is guided through the layer and disappears or is emitted from the side surface of the layer, and the light emission from the light extraction surface is reduced accordingly.

The light 51 incident on the projection layer 21 from the light emitting point 50 where the organic light emitting medium layer 13 is incident, through the adhesive layer, has a higher refractive index than that of the adhesive layer 30. The light is refracted into the protrusion layer 21 without being totally reflected at the interface with the light and enters the second base material 20.
On the other hand, the light 52 incident on the adhesive layer 30 from the inside of the projection layer 21 has a refractive index of the projection layer 21 higher than the refractive index of the adhesive layer 30. Since light can be totally reflected at the interface between the layer 21 and the adhesive layer 30 and guided to the second substrate, the light extraction efficiency can be increased.
Further, since the light extraction efficiency is improved, the same luminance as the conventional luminance can be obtained by driving at a lower voltage, so that the deterioration of the organic EL element 16 due to energization can be delayed.

The material of the projecting layer 21 is desirably a resin for facilitating the formation of the shape as described above. In particular, in the case of a top emission organic EL device, it is required to be a transparent resin having excellent translucency. .
The protrusion layer 21 preferably has a transmittance of 80% or more in the wavelength region of 400 to 700 nm in the visible light region, and more preferably has a transmittance of 95% or more, and it is necessary to select such a transparent resin. The transparent resin includes a thermoplastic resin, a thermosetting resin, and a photosensitive resin. As the photosensitive resin, a polymerizable monomer or oligomer that is cured by irradiation with radiation, which is a precursor thereof, can be used alone or in combination of two or more.

  Examples of the thermoplastic resin include butyral resin, styrene-maleic acid copolymer, chlorinated polyethylene, chlorinated polypropylene, polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, polyurethane resin, and polyester resin. , Acrylic resins, alkyd resins, polystyrene, polyamide resins, rubber resins, cyclized rubber resins, celluloses, polyethylene, polybutadiene, polyimide resins, and the like.

  Examples of the thermosetting resin include an epoxy resin, a benzoguanamine resin, a rosin-modified maleic acid resin, a rosin-modified fumaric acid resin, a melamine resin, a urea resin, and a phenol resin.

  Examples of the photosensitive resin include (meth) acrylic compounds having a reactive substituent such as an isocyanate group, an aldehyde group, and an epoxy group on a chain polymer having a reactive substituent such as a hydroxyl group, a carboxyl group, and an amino group. A resin obtained by reacting an acid and introducing a photocrosslinkable group such as a (meth) acryloyl group or a styryl group into the linear polymer is used. Further, a linear polymer containing an acid anhydride such as a styrene-maleic anhydride copolymer or an α-olefin-maleic anhydride copolymer is converted into a (meth) acrylic compound having a hydroxyl group such as hydroxyalkyl (meth) acrylate. Half-esterified products are also used.

  As the polymerizable monomer and oligomer constituting the photosensitive resin, methyl (meth) acrylate, ethyl (meth) acrylate, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, cyclohexyl (meth) acrylate, β-carboxyethyl (meth) acrylate, diethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, triethylene glycol di (meth) acrylate, tripropylene glycol di (meth) acrylate, trimethylolpropane tri (Meth) acrylate, pentaerythritol tri (meth) acrylate, 1,6-hexanediol diglycidyl ether di (meth) acrylate, bisphenol A diglycidyl ether di (Meth) acrylate, neopentyl glycol diglycidyl ether di (meth) acrylate, dipentaerythritol hexa (meth) acrylate, tricyclodecanyl (meth) acrylate, ester acrylate, (meth) acrylic acid ester of methylolated melamine, epoxy ( Various acrylic and methacrylic esters such as (meth) acrylate and urethane acrylate, (meth) acrylic acid, styrene, vinyl acetate, hydroxyethyl vinyl ether, ethylene glycol divinyl ether, pentaerythritol trivinyl ether, (meth) acrylamide, N-hydroxy Examples include methyl (meth) acrylamide, N-vinylformamide, acrylonitrile and the like. These can be used alone or in admixture of two or more.

  When curing by ultraviolet irradiation, a photopolymerization initiator or the like is added to the photosensitive resin. Examples of the photopolymerization initiator include 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, diethoxyacetophenone, 1- (4-isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- Acetophenone compounds such as hydroxycyclohexyl phenyl ketone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzyl Benzoin compounds such as dimethyl ketal, benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4-benzoyl-4 ' Benzophenone-based compounds such as methyldiphenyl sulfide, 3,3 ′, 4,4′-tetra (t-butylperoxycarbonyl) benzophenone, thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4- Thioxanthone compounds such as diisopropylthioxanthone and 2,4-diethylthioxanthone, 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2- (p- Methoxyphenyl) -4,6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4,6-bis (trichloromethyl) -s-triazine, 2-piperonyl-4,6-bis ( Trichloromethyl) -s-triazine, 2,4-bis (trichloro) Methyl) -6-styryl-s-triazine, 2- (naphth-1-yl) -4,6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy-naphth-1-yl) -4 , 6-Bis (trichloromethyl) -s-triazine, 2,4-trichloromethyl- (piperonyl) -6-triazine, 2,4-trichloromethyl (4′-methoxystyryl) -6-triazine 1,2-octanedione, 1- [4- (phenylthio)-, 2- (O-benzoyloxime)], O- (acetyl) -N- (1-phenyl-2-oxo-2- (4 ′ -Methoxy-naphthyl) ethylidene) oxime ester compounds such as hydroxylamine, bis (2,4,6-trimethylbenzoyl) phenylphosphine oxide, 2,4,6-to Phosphine compounds such as methylbenzoyldiphenylphosphine oxide, quinone compounds such as 9,10-phenanthrenequinone, camphorquinone, and ethylanthraquinone, borate compounds, carbazole compounds, imidazole compounds, titanocene compounds, and the like are used. . These photopolymerization initiators can be used alone or in combination. The amount of the photopolymerization initiator used is preferably 0.5 to 50% by weight, more preferably 3 to 30% by weight, based on the total solid content of the colored composition.

  Further, as sensitizers, triethanolamine, methyldiethanolamine, triisopropanolamine, methyl 4-dimethylaminobenzoate, ethyl 4-dimethylaminobenzoate, isoamyl 4-dimethylaminobenzoate, 2-dimethylaminoethyl benzoate, 2-Ethylhexyl 4-dimethylaminobenzoate, N, N-dimethylparatoluidine, 4,4′-bis (dimethylamino) benzophenone, 4,4′-bis (diethylamino) benzophenone, 4,4′-bis (ethylmethyl) Amine-based compounds such as amino) benzophenone can also be used in combination. These sensitizers can be used alone or in combination. The amount of the sensitizer used is preferably 0.5 to 60% by weight, more preferably 3 to 40% by weight based on the total amount of the photopolymerization initiator and the sensitizer.

  Furthermore, a polyfunctional thiol that functions as a chain transfer agent can be contained. The polyfunctional thiol may be a compound having two or more thiol groups. For example, hexanedithiol, decanedithiol, 1,4-butanediol bisthiopropionate, 1,4-butanediol bisthioglycolate, ethylene Glycol bisthioglycolate, ethylene glycol bisthiopropionate, trimethylolpropane tristhioglycolate, trimethylolpropane tristhiopropionate, trimethylolpropane tris (3-mercaptobutyrate), pentaerythritol tetrakisthioglycolate, Pentaerythritol tetrakisthiopropionate, trimercaptopropionic acid tris (2-hydroxyethyl) isocyanurate, 1,4-dimethylmercaptobenzene, 2,4,6-trimercap -s- triazine, 2- (N, N- dibutylamino) -4,6-dimercapto -s- triazine. These polyfunctional thiols can be used alone or in combination. The amount of the polyfunctional thiol used is preferably 0.1 to 30% by weight, more preferably 1 to 20% by weight, based on the total solid content of the colored composition. If the amount is less than 0.1% by mass, the effect of adding a polyfunctional thiol is insufficient.

  Moreover, an organic solvent can be contained as needed. Examples of the organic solvent include cyclohexanone, ethyl cellosolve acetate, butyl cellosolve acetate, 1-methoxy-2-propyl acetate, diethylene glycol dimethyl ether, ethylbenzene, ethylene glycol diethyl ether, xylene, ethyl cellosolve, methyl-n amyl ketone, propylene glycol monomethyl ether toluene, Examples thereof include methyl ethyl ketone, ethyl acetate, methanol, ethanol, isopropyl alcohol, butanol, isobutyl ketone, and petroleum solvents, and these can be used alone or in combination.

In addition, in the case of a top emission type organic EL device, it is desirable to appropriately select a resin having a refractive index higher than that of the adhesive layer 30 in addition to the above-described resins having a high refractive index. As described above, the light extraction efficiency can be improved by using the resin having the same.
Further, in the case of a top emission organic EL device, the protruding layer 21 may be colored in the same manner as the color filter layer 24, or a color conversion material that outputs light having a wavelength different from the absorbed light may be mixed to form a color conversion layer. It may contain light scattering particles.
In the case of a bottom emission organic EL device, the protruding layer 21 does not need to be transparent, and can be arbitrarily selected from the above materials, and a gas barrier property or hygroscopic material may be dispersed in the resin.

  As a method for forming the protrusion layer 21, a resin film selected from the above is formed by a coating method such as a slit coat method, a spin coat method, or a roll coat method, and then patterned by a photolithography method, an inkjet method, Patterns can be formed by various printing methods such as gravure printing method and flexographic printing method, and lamination method.

  As the shape of the spacer layer 22, it is desirable that the width is narrower than that of the light shielding layer 23 or the partition pattern 12, and as shown in FIG. 6, the thickness of the adhesive layer on the partition pattern is larger than the thickness B of the adhesive layer on the partition pattern. It is preferable to design the height of the spacer layer 22 so that the thickness A becomes small. By doing so, the flow direction of the adhesive can be changed from the opening to the partition, and bubbles in the opening are pushed out of the opening. In addition, since gas components such as moisture and oxygen, which are one of the causes of deterioration of the organic EL device, enter through the adhesive layer, the thickness of the adhesive layer in the opening is made as small as possible, and the adhesive layer is bonded by bonding the projection layer 21 and the opening. By making the shape of the zigzag shape, the gas component intrusion path C is extended as compared with the intrusion path D in the case where there is no protrusion layer 21, so that the intrusion of the gas component can be suppressed and the adhesion area is increased. As a result, the adhesive strength increases, and deterioration of the organic EL device can be suppressed over a long period of time.

  The spacer layer 22 only needs to satisfy the above-described shape requirements, and may be formed so as not to have a gap. Alternatively, the spacer layer 22 has a circular, oval, square, triangular, or other polygonal columnar shape. If the spacer layer 22 is arranged at an arbitrary interval, the adhesive can be easily pushed out from the opening through the gap when bonding, and air bubbles and spaces can be eliminated. preferable. Moreover, when the space | interval of the protrusion layer 21 and the organic EL element 16 is maintained appropriately only by the spacer layer 22 arrange | positioned on the circumference | surroundings of the sealing substrate 27, it is not arrange | positioned in the center part of the sealing substrate 27. Also good.

  The material of the spacer layer 22 is preferably a resin from the viewpoint of ease of formation, and can be arbitrarily selected from the materials used for the projection layer 21 described above. Can be selected arbitrarily.

  As a resin composition used for each layer of the light shielding layer 23, the color filter layer 24, and the color conversion layer 26, the same transparent resin used for the above-described protrusion layer 21 can be used. It can be used by dispersing a pigment serving as a colorant, a light shielding material, a color conversion dye, a photoinitiator, a polymerizable monomer, or the like with an appropriate solvent according to the application. There are various methods such as mill base, three rolls, jet mill and the like, and there are no particular limitations. Below, an example of the raw material of the resin composition which can be used for this invention is demonstrated.

  As a material used for the light shielding layer 23, metal oxides and pigments, such as carbon black, titanium oxide, titanium oxynitride, and iron tetroxide, and other known light shielding materials can be used. Further, in order to adjust the color tone of the light shielding layer, the following complementary color pigments may be mixed as necessary.

  Examples of the red colored composition for forming the red colored layer or red pixel of the color filter layer 24 include C.I. I. Pigment Red 7, 9, 14, 41, 48: 1, 48: 2, 48: 3, 48: 4, 81: 1, 81: 2, 81: 3, 97, 122, 123, 146, 149, 168, 177, 178, 179, 180, 184, 185, 187, 192, 200, 202, 208, 210, 215, 216, 217, 220, 223, 224, 226, 227, 228, 240, 246, 254, 255, Red pigments such as H.264, 272, and 279 can be used.

  A yellow pigment and an orange pigment can be used in combination with the red coloring composition. Examples of yellow pigments include C.I. I. Pigment Yellow 1, 2, 3, 4, 5, 6, 10, 12, 13, 14, 15, 16, 17, 18, 20, 24, 31, 32, 34, 35, 35: 1, 36, 36: 1, 37, 37: 1, 40, 42, 43, 53, 55, 60, 61, 62, 63, 65, 73, 74, 77, 81, 83, 86, 93, 94, 95, 97, 98, 100, 101, 104, 106, 108, 109, 110, 113, 114, 115, 116, 117, 118, 119, 120, 123, 125, 126, 127, 128, 129, 137, 138, 139, 144, 146, 147, 148, 150, 151, 152, 153, 154, 155, 156, 161, 162, 164, 166, 167, 168, 169, 170, 171, 172, 1 73, 174, 175, 176, 177, 179, 180, 181, 182, 185, 187, 188, 193, 194, 199, 213, 214 and the like. Examples of orange pigments include C.I. I. Pigment Orange 36, 43, 51, 55, 59, 61, 71, 73 and the like.

  Examples of the green coloring composition include C.I. I. Green pigments such as Pigment Green 7, 1036, and 37 can be used. The green coloring composition can be used in combination with the same yellow pigment as the red coloring composition.

  Examples of the blue coloring composition include C.I. I. Pigment Blue 15, 15: 1, 15: 2, 15: 3, 15: 4, 15: 6, 16, 22, 60, 64, 80, etc., preferably C.I. I. Pigment Blue 15: 6 can be used. In addition, C.I. I. Pigment Violet 1, 19, 23, 27, 29, 30, 32, 37, 40, 42, 50 and the like, preferably C.I. I. Pigment Violet 23 can be used in combination.

  In combination with the above-described coloring composition or organic pigment, an inorganic pigment can also be used in combination in order to ensure good coatability, sensitivity, developability and the like while balancing saturation and lightness. Inorganic pigments include yellow lead, zinc yellow, red bean (red iron oxide (III)), cadmium red, ultramarine, bitumen, chromium oxide green, cobalt green and other metal oxide powders, metal sulfide powders, metal powders, etc. Can be mentioned. Furthermore, for color matching, a dye can be contained in a range that does not lower the heat resistance.

  The color conversion layer 26 is a color conversion dye that emits light in a wavelength range different from the absorbed light, such as rhodamine dye, cyanine dye, pyridine dye, or oxazine dye that emits red light. Any of those known in the art can be used, such as a coumarin dye that emits blue light, a coumarin dye that emits blue light, and the like.

  As a method for forming the light shielding layer 23, the color filter layer 24, and the color conversion layer 26, after forming a resin film made of a resin composition constituting each layer by a coating method such as a slit coating method, a spin coating method, or a roll coating method. Patterning can be performed by a photolithography method, or a pattern can be formed by an inkjet method, various printing methods such as a gravure printing method and a flexographic printing method, and a lamination method.

  Prevents outgas such as solvent and moisture contained in the color filter layer 24 and the color conversion layer 26 described above and gas that enters through the protruding layer 21 from the adhesive layer 30 at the sealing end as shown in FIG. In order to prevent the deterioration of the organic EL element 16, it is desirable to form the second passivation layer 25 on the surface of the sealing substrate composed of the layers described above. In particular, if a passivation layer is formed on the protruding layer 21, the gas entering from the sealing end as described above does not pass through the protruding layer 21, and the gas intrusion from the adhesive layer 30 is suppressed. It is desirable to form it on the entire surface of the sealing substrate including the protruding layer 21. The material and the formation method of the second passivation layer 25 can be the same as those of the first passivation layer 15 described above.

  Next, the bonding through the organic EL element substrate 17, the sealing substrate 27, and the adhesive layer 30 will be described.

  Examples of the material for the adhesive layer 30 include a photo-curing adhesive resin made of an epoxy resin, an acrylic resin, a silicone resin, a thermosetting adhesive resin, and a thermoplastic adhesive resin made of an acid-modified product such as polyethylene or polypropylene. Can be used. If necessary, the adhesive layer may contain a spherical or rod-like spacer made of glass or resin for gap control, or may contain a desiccant or an oxygen absorbent.

  Further, in the case of a top emission type organic EL device, the material of the adhesive layer 30 prevents the total reflection of incident light from the adhesive layer 30 to the protruding layer 21 in order to improve the light extraction efficiency as described above. It is more preferable to use a material having a lower refractive index than the material used for the protruding layer 21 in order to totally reflect the light incident on the adhesive layer 30 from the inside. Furthermore, in the case of a top emission type organic EL device, light enters the adhesive layer 30 from the first passivation layer 15, so that total reflection at the interface between the first passivation layer 15 and the adhesive layer 30 is prevented. The refractive index of the adhesive layer 30 is more preferably higher than the refractive index of the first passivation layer 15.

  As the method for forming the adhesive layer 30 for bonding the first base material 10 and the second base material 20 described above, depending on the material and pattern, spin coating, spray coating, flexo, gravure, micro gravure, intaglio Coating methods such as offset, printing methods, ink jet methods, dispenser application, nozzle ejection, transfer methods, laminating methods, and the like can be used.

  Since the step of bonding the first base material and the second base material through the adhesive layer 30 is performed in a vacuum, the adhesive layer contains oxygen and moisture that cause deterioration of the organic EL element. There is no. Further, when bonded together in a vacuum, a vacuum space may be generated in the adhesive layer, but at the time of bonding, the protruding layer 21 can crush the vacuum space and fill it with an adhesive. Further, when the bonding step is performed in an atmosphere of nitrogen or other inert gas, bubbles of inert gas that cause light scattering may be generated in the adhesive layer. Since it is extruded from the opening, the present invention may be performed in an atmosphere of nitrogen or other inert gas.

  7 and 8 are schematic cross-sectional views illustrating step by step the sealing method of FIG. 1 including the organic EL element substrate 17 and the sealing substrate 27 formed by the above method.

  FIG. 7 shows a case where the liquid adhesive 40 is used, and the liquid adhesive 40 is filled in each opening of the first base material 10 and then the second base material 20 is bonded. ing. Since the protruding layer 21 is opposed to the opening, the liquid adhesive 40 filled in the opening is formed so as to be pushed out of the opening. Therefore, as shown in FIG. Does not remain. On the other hand, by designing the spacer layer 22 formed on the second substrate 20 so as to hit the partition pattern 12, the gap control of the adhesive layer can be performed with high accuracy.

  FIG. 8 shows a case where the sheet-like adhesive 41 is used. After the sheet-like adhesive 41 is bonded to the second base material 20 with a roller 42 or the like, the first adhesive is used using a diaphragm laminating apparatus or the like. When the base material 10 and the second base material 20 are bonded together, as in the case of the liquid adhesive 40, when the sheet-like adhesive 41 in the opening is heated and pressurized at the time of bonding, the protruding layer 21. Since the pressure is applied, it can be bonded without bubbles or spaces.

  7 and 8, the case where the top emission organic EL element is used has been described. However, even with the structure of the bottom emission organic EL element, the same effect can be obtained by the protruding layer. The present invention can also be applied to organic EL devices of different systems as shown in FIGS.

  EXAMPLES Hereinafter, although an Example and a comparative example further demonstrate this invention, this invention is not restrict | limited to the following example.

<Example 1>
First, the organic EL element substrate 17 is produced. Glass was used as the first substrate 10, and an ITO film (150 nm) was patterned on the first substrate 10 as the first electrode layer 11 by sputtering. Next, as the partition pattern 12, a positive photosensitive polyimide resin (2 μm) was formed into a pattern film by using a photolithography method.
Next, as the organic light-emitting medium layer 13, a mixture (20 nm) of poly (3,4-ethylenedioxythiophene) and polystyrenesulfonic acid is used for the hole transport layer, and poly [2-methoxy-5- (2 '-Ethyl-hexyloxy) -1,4-phenylenevinylene] (MEHPPV) (100 nm) was patterned using a relief printing method. Next, a Ca film (5 nm) and an Al film (20 nm) were stacked as the second electrode layer 14 by vapor deposition. Next, an organic EL element substrate 17 was produced by forming a 5 μm SiNx film as the first passivation layer 15.
Next, the sealing substrate 27 is produced. Glass is used as the second substrate 20, and two types of color filter layer-forming photosensitive resins containing a carbon-containing light-shielding layer-forming photosensitive resin and two types of color pigments on the second substrate 20 are used. The resin was sequentially patterned by spin coating and photolithography to form the light shielding layer 23 and the color filter layers 24 (a) and 24 (b). The thicknesses of the light shielding layer 23 were 1 μm and the color filter layers 24 (a) and 24 (b) were 1.5 μm.
Next, as the protruding layer 21, a photosensitive acrylic resin was spin-coated, and the protruding layer 21 having a trapezoidal cross section was formed using a photolithography method.
At this time, the thickness of the protrusion layer 21 was 2.5 μm, and the thickness from the glass together with the color filter layer 24 was 4 μm.
Next, a photosensitive acrylic resin was spin-coated as the spacer layer 22, and a pattern was formed using a photolithography method. At this time, since the color filter layer 24 overlaps the light shielding layer 23 on which the spacer layer 22 is disposed, the thickness of the spacer layer 22 is measured with reference to the color filter layer (1.5 μm) in the opening. And was prepared to be 2.0 μm.
Next, a 0.1 μm SiNx film was formed as the second passivation layer 25 to produce a sealing substrate 27.
Finally, as the adhesive layer 30, two types of adhesives 31 and 40 were used as shown in FIG.
The produced organic EL device (number of pixels: 960 × 540) was free from bubbles and pixel defects even when stored for 3000 hours at 85 ° C. and 90 RH%.

<Example 2>
In the organic EL device described in Example 1, a laminate-type bonding was performed using a sheet-like epoxy adhesive 41 as the adhesive layer 30.
The produced organic EL device (number of pixels: 960 × 540) was free from bubbles and pixel defects even when stored for 3000 hours at 85 ° C. and 90 RH%.

<Comparative Example 1>
In the organic EL element 16 described in Example 1, the second substrate 20 was bonded by the ODF method without forming the protruding layer 21 and the spacer layer 22. In the produced organic EL device (number of pixels: 960 × 540), bubbles were observed in the initial state of production, and light emission failure occurred in about 1% of all pixels. When this apparatus was stored at 85 ° C. and 90 RH for 3000 hours and gas entered from bubbles and edges, pixel defects progressed, and about 20% of all pixels became non-luminous.

DESCRIPTION OF SYMBOLS 10 1st base material 11 1st electrode layer 12 Partition 13 Organic luminescent medium layer 14 2nd electrode layer 15 1st passivation layer 16 Organic EL element 17 Organic EL element board | substrate 20 2nd base material 21 Protrusion layer 22 Spacer layer 23 Light-shielding layer 24 Color filter layer 25 Second passivation layer 26 Color conversion layer 27 Sealing substrate 30 Adhesive layer 31 First adhesive layer 32 Second adhesive layer 33 Air bubbles 34 Space 40 Liquid adhesive 41 Sheet-like adhesive Agent 42 Roller 50 Light emitting point 51 Light guided through the adhesive layer 30 Light guided through the protruding layer 21

Claims (13)

On the first electrode layer, a first electrode layer formed on the first base material, a partition formed on the first base material so as to partition the first electrode layer, and the first electrode layer An organic light emitting medium layer formed; and a second electrode layer formed on the organic light emitting medium layer;
An organic EL device in which an organic EL element substrate having an adhesive layer is bonded to a sealing substrate through an adhesive layer,
The sealing substrate has a second substrate and a protruding layer formed on the second substrate,
The organic EL device according to claim 1, wherein the protruding layer is formed so as to be positioned in an opening between the partition walls.   The thickness of the adhesive layer between the protrusion layer and the organic EL element is smaller than the thickness of the adhesive layer between the partition and the second base material. Organic EL device.   The organic EL device according to claim 2, wherein a spacer layer is formed on the adhesive surface of the sealing substrate.   The organic EL device according to claim 3, wherein the second base material and the protruding layer are made of a transparent material.   The organic EL device according to claim 4, wherein a plurality of color filter layers are formed on the second base material, and the protruding layers are formed on the plurality of color filter layers.   A plurality of color filter layers are formed on the second substrate, and a plurality of color conversion layers for outputting light including a wavelength different from an absorption wavelength are formed on the plurality of color filter layers, and the protrusion layer The organic EL device according to claim 4, wherein the organic EL device is formed on the plurality of color conversion layers and the plurality of color filter layers.   The organic EL device according to claim 5, wherein a light shielding layer is formed on a region between the plurality of color filter layers. The shape of the cross-section of the protrusion layer is a prism, a sinusoidal waveform, or a semicircular shape with a large number of cross-sections, such as quadrilateral, trapezoid, isosceles triangle, unequal triangle, large and small triangles. Lenticular lenses with a face down, lens array triangles with pyramid and hemispherical units, semicircular, hemispherical, or a combination of these shapes,
The organic EL device according to claim 7, wherein a refractive index of the protruding layer is higher than a refractive index of the adhesive layer.   9. The organic EL device according to claim 1, wherein the entire surface of the organic EL element substrate is covered with any one of an inorganic oxide film, an inorganic nitride film, and an inorganic oxynitride film.   10. The organic EL device according to claim 1, wherein the entire surface of the sealing substrate is covered with any one of an inorganic oxide film, an inorganic nitride film, and an inorganic oxynitride film.   The liquid adhesive is hardened after applying a liquid adhesive to the surface of the organic EL element substrate on which the partition walls are formed and pasting the liquid adhesive. A method for manufacturing an organic EL device.   The sheet adhesive is cured after laminating a sheet adhesive on the surface of the sealing substrate on which the projecting layer is formed and attaching the sheet adhesive to the organic EL element substrate. 10. A method for producing an organic EL device according to 10.   The method for manufacturing an organic EL device according to claim 11 or 12, wherein the step of attaching the first base material and the second base material via the adhesive layer is performed in a vacuum. .