JP2020061377A - Electro-optical device, method of manufacturing the same, and electronic apparatus - Google Patents

Abstract

To provide an electro-optical device in which bubbles are hardly mixed when bonding an element substrate having a light emitting element and a color filter and a counter substrate using an adhesive and a method for manufacturing the same.SOLUTION: An electro-optical device 100 includes an element substrate 10 as a first substrate having an organic EL element 30 as a plurality of light emitting elements and a color filter 36 provided corresponding to the plurality of organic EL elements 30; and a counter substrate 40 as a translucent second substrate disposed opposite to the element substrate 10 through an adhesive 41. A plurality of grooves 50a as striped irregularities is provided on an adhesion surface of the color filter 36 on the element substrate 10.SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electro-optical device, a method of manufacturing an electro-optical device, and electronic equipment.

  As an electro-optical device, an organic EL device including an organic electroluminescence (Electro-Luminescence) element in a pixel is known. Since organic EL devices can be made smaller and thinner than LEDs (Light Emitting Diodes), their application to microdisplays such as head-mounted displays (HMD) and electronic viewfinders (EVF) has received attention. There is.

  As means for realizing color display in such a micro display, for example, Patent Document 1 proposes an organic EL device in which an organic EL element capable of producing white light emission and a color filter are combined. In the organic EL device of Patent Document 1, a sealing layer is formed so as to cover a plurality of organic EL elements arranged on a substrate, and blue (B), green (G), and red (R) are formed on the sealing layer. A color filter including a colored layer is formed. The colored layer that constitutes the color filter is divided by the convex portion whose height on the sealing layer is lower than that of the colored layer. According to the organic EL device of Patent Document 1, as compared with the case where there is no convex portion, the ratio of the light emitted from the organic EL element at the boundary of the colored layer is transmitted through the colored layer of a color other than the originally intended colored layer. Is reduced. Therefore, it is said that excellent symmetry in view angle characteristics can be realized.

JP, 2014-89804, A

  In the organic EL device described in Patent Document 1, in order to protect the color filter, the counter substrate is arranged via the transparent resin layer with respect to the element substrate on which the organic EL element and the color filter are formed. . In other words, the organic EL device is configured by bonding the element substrate and the counter substrate via the transparent resin layer.

  However, in order to obtain desired optical characteristics, for example, when the thickness of the colored layer is adjusted to be different for each color, a step is generated between the colored layers. Then, in bonding the element substrate and the counter substrate, application unevenness of the resin material may occur when forming the transparent resin layer covering the color filter of the element substrate, or bubbles may be mixed in the step portion between the colored layers. there were. In particular, air bubbles affect the display, so improvement was necessary.

  An electro-optical device according to the present application includes a first substrate having a plurality of light emitting elements and a color filter provided corresponding to the plurality of light emitting elements, and a translucent surface that is arranged to face the first substrate via an adhesive. And a second substrate, and stripe-shaped unevenness is provided on the adhesive surface of the first substrate on the color filter.

  Further, in the above electro-optical device, it is preferable that a translucent overcoat layer is provided on the color filter, and the overcoat layer is provided with stripe-shaped irregularities.

  In the electro-optical device described above, it is preferable that the color filter includes at least three colored layers, and the overcoat layer covers at least three colored layers arranged in the first direction.

  In the electro-optical device described above, the colored layers arranged in the first direction may include colored layers having different film thicknesses.

  In the electro-optical device described above, the colored layers arranged in the second direction intersecting the first direction may have different film thicknesses with respect to the colored layers arranged in the first direction.

  In the electro-optical device described above, the overcoat layer includes a first overcoat layer that covers the color filter and a second overcoat layer that extends in the first direction on the first overcoat layer. In addition, it is preferable that the first overcoat layer and the second overcoat layer form stripe unevenness.

  In the electro-optical device described above, the color filter includes colored layers of at least three colors, and two colored layers having different colors among the colored layers of at least three colors are made different in thickness to form a stripe shape. It may be uneven.

  Further, in the electro-optical device described above, the color filter includes a colored layer of at least three colors, and a light-shielding portion formed by stacking colored layers of at least three colors in a position surrounding a light emitting region in which a plurality of light emitting elements are arranged. Is preferably provided.

  A method of manufacturing an electro-optical device according to the present application is a method of manufacturing an electro-optical device including a plurality of light emitting elements and a color filter, wherein a plurality of light emitting areas of a first substrate are arranged over a light emitting region. A sealing layer forming step of forming a sealing layer for sealing the light emitting element, and a color filter forming step of forming a colored layer of at least three colors on the sealing layer so as to correspond to the plurality of light emitting elements. An overcoat layer forming step of forming a translucent overcoat layer to cover the colored layers arranged in the first direction among the three colored layers; a first substrate on which the overcoat layer is formed; And a bonding step of bonding the flexible second substrate with an adhesive.

  Another method of manufacturing an electro-optical device according to the present application is a method of manufacturing an electro-optical device including a plurality of light emitting elements and a color filter, the method covering a light emitting region of the first substrate in which the plurality of light emitting elements are arranged. A sealing layer forming step of forming a sealing layer for sealing a plurality of light emitting elements, and a color filter forming step of forming at least three colored layers corresponding to the plurality of light emitting elements on the sealing layer. An overcoat forming a light-transmitting first overcoat layer covering the color filter, and forming a light-transmitting second overcoat layer extending in the first direction on the first overcoat layer A layer forming step; and an adhering step of adhering the first substrate on which the first overcoat layer and the second overcoat layer are formed, and the translucent second substrate with an adhesive. It is characterized by

  Another method of manufacturing an electro-optical device according to the present application is a method of manufacturing an electro-optical device including a plurality of light emitting elements and a color filter, the method covering a light emitting region of the first substrate in which the plurality of light emitting elements are arranged. A sealing layer forming step of forming a sealing layer for sealing a plurality of light emitting elements, and a color filter forming step of forming at least three colored layers corresponding to the plurality of light emitting elements on the sealing layer. And a bonding step of bonding a first substrate having a color filter formed thereon and a translucent second substrate with an adhesive, wherein in the color filter forming step, at least three colored layers of The first colored layer and the second colored layer are formed so as to be arranged in the first direction, and are adjacent to the first colored layer and the second colored layer in the second direction intersecting the first direction. Are aligned, and the film thickness is different from that of the first colored layer and the second colored layer. And forming a third colored layer formed.

  In the above-described method for manufacturing an electro-optical device, it is preferable that in the color filter forming step, the light shielding portion be formed by stacking colored layers of at least three colors at a position surrounding the light emitting region.

  In the method of manufacturing the electro-optical device described above, in the color filter forming step, the light shielding portion is formed by laminating colored layers of at least three colors in a position surrounding the light emitting region, and in the overcoat layer forming step, the light shielding portion is formed. It is preferable to form an overcoat layer on the inside.

  An electronic device of the present application is characterized by including the electro-optical device described above.

FIG. 3 is a schematic plan view showing the configuration of the electro-optical device according to the first embodiment. FIG. 3 is an equivalent circuit diagram showing an electrical configuration of the electro-optical device according to the first embodiment. FIG. 3 is a schematic plan view showing the arrangement of sub-pixels and color filters in a pixel. FIG. 4 is a schematic cross-sectional view showing the structure of the sub-pixel taken along the line A-A ′ in FIG. 3. FIG. 3 is a schematic plan view showing the arrangement of light shielding portions on the element substrate. FIG. 6 is a schematic cross-sectional view showing the structure of the electro-optical device taken along the line C-C ′ of FIG. 5. 6 is a flowchart showing a method of manufacturing the electro-optical device according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing the method of manufacturing the electro-optical device according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing the method of manufacturing the electro-optical device according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing the method of manufacturing the electro-optical device according to the first embodiment. FIG. 4 is a schematic cross-sectional view showing the method of manufacturing the electro-optical device according to the first embodiment. FIG. 6 is a schematic cross-sectional view showing the structure of the electro-optical device according to the second embodiment. FIG. 6 is an enlarged cross-sectional view showing the structures of a color filter and an overcoat layer in the electro-optical device according to the second embodiment. FIG. 9 is a schematic cross-sectional view showing the structure of the electro-optical device according to the third embodiment. FIG. 6 is an enlarged cross-sectional view showing the structure of a color filter in the electro-optical device according to the third embodiment. The schematic diagram which shows the structure of the head mounted display as an electronic device of 4th Embodiment. FIG. 9 is a schematic plan view showing the arrangement of sub-pixels and color filters of Modification 1. FIG. 18 is a schematic cross-sectional view showing a structure of a color filter and an overcoat layer taken along the line D-D ′ of FIG. 17. FIG. 9 is a schematic plan view showing the arrangement of sub-pixels and color filters of Modification 2. FIG. 20 is a schematic cross-sectional view showing a structure of a color filter and an overcoat layer taken along line F-F ′ of FIG. 19.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In each of the following drawings, the portions to be described are appropriately enlarged or reduced so that they can be recognized.

(First embodiment)
<Electro-optical device>
The electro-optical device according to this embodiment will be described with reference to FIGS. 1 to 4. 1 is a schematic plan view showing the configuration of the electro-optical device according to the first embodiment, FIG. 2 is an equivalent circuit diagram showing the electrical configuration of the electro-optical device according to the first embodiment, and FIG. 3 is a sub-pixel in a pixel. FIG. 4 is a schematic plan view showing the arrangement of the color filters, and FIG. 4 is a schematic sectional view showing the structure of the sub-pixel taken along the line AA ′ of FIG. The electro-optical device according to the present embodiment is a self-emission type micro display suitable for a display unit of a head mounted display (HMD) described later.

  As shown in FIG. 1, the electro-optical device 100 according to this embodiment includes an element substrate 10 and a counter substrate 40. Both substrates are arranged and bonded to each other via an adhesive 41 (see FIG. 4).

  The element substrate 10 has a display area E1 in which a plurality of pixels P are arranged in a matrix, and a non-display area E2 which is a peripheral area outside the display area E1. The pixel P includes a sub pixel 18B that emits blue (B) light, a sub pixel 18G that emits green (G) light, and a sub pixel 18R that emits red (R) light. In the electro-optical device 100, a pixel P including the three sub-pixels 18B, 18G, and 18R serves as a display unit to provide full-color display.

  In the following description, the sub-pixels 18B, 18G, 18R may be collectively referred to as the sub-pixel 18. The sub-pixel 18 of this embodiment includes an organic EL element 30 (see FIG. 2 or 4) as a light emitting element. Therefore, the display area E1 is an example of the light emitting area in the present invention. The display area E1 may include an area in which dummy pixels that do not contribute to display are arranged outside the area in which the plurality of pixels P that contribute to display are arranged.

  The element substrate 10 is an example of the first substrate in the present invention, and is larger than the counter substrate 40, and a plurality of external connection terminals 102 are arranged along the first side of the element substrate 10 protruding from the counter substrate 40. Has been done. A data line driving circuit 15 is provided between the plurality of external connection terminals 102 and the display area E1. The scanning line driving circuit 16 is provided between the other second and third sides orthogonal to the first side and facing each other and the display area E1. A flexible wiring board (FPC) 103 is mounted on the external connection terminal 102 for connection with an external drive circuit that supplies a control signal related to display, a power source, and the like.

  The counter substrate 40 is an example of the second substrate of the present invention, and is one size smaller than the element substrate 10 as the first substrate, and is arranged so that the external connection terminals 102 are exposed. The counter substrate 40 is a light transmissive substrate, and for example, a quartz substrate or a glass substrate can be used. The counter substrate 40 has a role of protecting the organic EL element 30 described later arranged in the sub-pixel 18 from being damaged, and is arranged so as to face at least the display region E1. The electro-optical device 100 according to the present embodiment employs a top emission method in which light emitted from the sub-pixel 18 is extracted from the counter substrate 40 side.

  In the following description, the direction along the first side on which the external connection terminals 102 are arranged is the X direction, and the other two sides (second side and third side) orthogonal to the first side and facing each other. The direction along is the Y direction. The direction from the element substrate 10 to the counter substrate 40 is the Z direction. Also, viewing from the counter substrate 40 side along the Z direction is referred to as “plan view”.

[Electrical configuration of organic EL device]
As shown in FIG. 2, the electro-optical device 100 has a scanning line 12 and a data line 13 that intersect with each other, and a power supply line 14. The scanning line 12 is electrically connected to the scanning line driving circuit 16, and the data line 13 is electrically connected to the data line driving circuit 15. Further, the sub-pixel 18 is provided in a region partitioned by the scanning line 12 and the data line 13.

  The sub-pixel 18 includes an organic EL element 30 and a pixel circuit 20 that controls driving of the organic EL element 30.

  The organic EL element 30 includes a pixel electrode 31, a light emitting functional layer 32, and a counter electrode 33. The pixel electrode 31 functions as an anode that injects holes into the light emitting functional layer 32. The counter electrode 33 functions as a cathode that injects electrons into the light emitting functional layer 32. In the light emitting functional layer 32, excitons (exciton; a state in which holes and electrons are bound to each other by Coulomb force) are formed by the injected holes and electrons, and when the excitons (excitons) disappear. Part of the energy is emitted as fluorescence or phosphorescence (when the holes and electrons recombine). In the present embodiment, the light emitting functional layer 32 is configured so that white light emission can be obtained from the light emitting functional layer 32.

  The pixel circuit 20 includes a switching transistor 21, a storage capacitor 22, and a driving transistor 23. The two transistors 21 and 23 can be configured using, for example, n-channel type or p-channel type transistors.

  The gate of the switching transistor 21 is electrically connected to the scanning line 12. The source of the switching transistor 21 is electrically connected to the data line 13. The drain of the switching transistor 21 is electrically connected to the gate of the driving transistor 23.

  The drain of the driving transistor 23 is electrically connected to the pixel electrode 31 of the organic EL element 30. The source of the driving transistor 23 is electrically connected to the power supply line 14. The storage capacitor 22 is electrically connected between the gate of the driving transistor 23 and the power supply line 14.

  When the scanning line 12 is driven by the control signal supplied from the scanning line driving circuit 16 and the switching transistor 21 is turned on (ON), the potential based on the image signal supplied from the data line 13 causes the switching transistor 21 to operate. It is held in the storage capacitor 22 via the. The ON / OFF state of the driving transistor 23 is determined according to the potential of the storage capacitor 22, that is, the gate potential of the driving transistor 23. Then, when the driving transistor 23 is turned on, an amount of current corresponding to the gate potential flows from the power supply line 14 to the organic EL element 30 via the driving transistor 23. The organic EL element 30 emits light with brightness according to the amount of current flowing through the light emitting functional layer 32.

  The configuration of the pixel circuit 20 is not limited to having the two transistors 21 and 23. For example, the pixel circuit 20 may further include a transistor for controlling the current flowing through the organic EL element 30.

[Arrangement of sub-pixels and color filters]
Next, the arrangement of the sub-pixels 18B, 18G, 18R and the color filter 36 in the pixel P will be described with reference to FIG. As described above, since the sub-pixel 18 is provided with the organic EL element 30 and the pixel circuit 20, the organic EL element 30 arranged in the sub-pixel 18B is hereinafter referred to as an organic EL element 30B, and is referred to as the sub-pixel 18G. The arranged organic EL element 30 is referred to as an organic EL element 30G, and the organic EL element 30 arranged in the sub-pixel 18R is referred to as an organic EL element 30R. The pixel electrode 31 of the organic EL element 30B is called a pixel electrode 31B, the pixel electrode 31 of the organic EL element 30G is called a pixel electrode 31G, and the pixel electrode 31 of the organic EL element 30R is called a pixel electrode 31R.

  As shown in FIG. 3, in the present embodiment, the pixels P are arranged in a matrix in the X direction and the Y direction. The outer shape of the pixel P including the sub-pixels 18B, 18G, and 18R is substantially square, and the arrangement pitch of the pixels P in the X direction and the Y direction is 7.5 μm, for example. In each pixel P, the sub pixel 18B and the sub pixel 18R are arranged adjacent to each other in the Y direction, and the sub pixel 18G is arranged adjacent to the sub pixel 18B and the sub pixel 18R in the X direction. The sub-pixel 18B and the sub-pixel 18R are repeatedly arranged in units of the pixel P along the Y direction. The sub-pixel G is also repeatedly arranged in the Y direction with the pixel P as a unit. The range in which light emission is obtained in each of the sub-pixels 18B, 18G, and 18R defines the range in which the pixel electrode 31 of the organic EL element 30 in each of the sub-pixels 18B, 18G, and 18R contacts the light-emitting functional layer 32 (see FIG. 4). See)). In FIG. 3, the opening is indicated by a solid line, the sub-pixel 18B is provided with the opening 28KB, the sub-pixel 18G is provided with the opening 28KG, and the sub-pixel 18R is provided with the opening 28KR. There is.

  The shape of each of the openings 28KB, 28KG, 28KR is a quadrangle, and the area ratio thereof is, for example, when the size of the opening 28KR is "1", the size of the opening 28KB is "2". The size of the portion 28KG is "3". The area ratio of the openings 28KB, 28KG, 28KR is not limited to this.

  A color filter 36 is arranged in each of the sub-pixels 18B, 18G and 18R. The color filter 36 includes a blue (B) colored layer 36B, a green (G) colored layer 36G, and a red (R) colored layer 36R. Specifically, since the sub-pixel 18B and the sub-pixel 18R are arranged adjacent to each other in the Y direction, the coloring layer 36B is arranged independently for each of the plurality of sub-pixels 18B, and the plurality of sub-pixels are arranged. Similarly, the coloring layer 36R is independently arranged for each of the pixels 18R. The colored layer 36G is disposed in the sub-pixel 18G. Since the sub-pixels 18G are arranged adjacent to each other in the Y direction, the colored layer 36G is arranged in a stripe pattern for the plurality of sub-pixels 18G arranged in the Y direction.

  In other words, the colored layer 36B is independently arranged so as to overlap the opening 28KB. Similarly, the coloring layer 36R is independently arranged so as to overlap the opening 28KR. The coloring layer 36G extends in the Y direction so as to overlap the plurality of openings 28KG arranged in the Y direction, and is arranged in a stripe shape.

  Although the arrangement of the colored layers 36B, 36G, and 36R on the element substrate 10 will be described in detail later, in the present embodiment, at the boundary between the sub-pixel 18B and the sub-pixel 18R that are adjacent to each other in the Y direction, the colored layers 36B and 36R are separated from each other. Are overlapped with each other. At the boundary between the sub-pixel 18B and the sub-pixel 18G that are adjacent to each other in the X direction, the coloring layer 36B and the coloring layer 36G are arranged so as to overlap each other. Similarly, at the boundary between the sub-pixel 18R and the sub-pixel 18G adjacent to each other in the X direction, the coloring layer 36R and the coloring layer 36G are arranged so as to overlap each other.

  In the present embodiment, the Y direction in which the colored layers 36B and 36R are adjacent to each other is an example of the first direction in the present invention, and the X direction orthogonal to the Y direction intersects with the first direction in the present invention. It is an example of a second direction to do. The colored layer 36B is an example of the first colored layer of the present invention, the colored layer 36R is an example of the second colored layer of the present invention, and the colored layer 36G is an example of the third colored layer of the present invention. Is.

  The luminance (brightness) of the light emission of each color obtained from each of the sub-pixels 18B, 18G, 18R is the size of the openings 28KB, 28KG, 28KR and the coloring layers 36B, 36G, which are overlapped with the openings 28KB, 28KG, 28KR. It depends on the optical characteristics (transmittance) of 36R.

[Structure of sub-pixel]
Next, the structure of the sub-pixel 18 in the electro-optical device 100 will be described with reference to FIG. Note that FIG. 4 shows a cross section taken along the line AA ′ shown in FIG. 3, and the line AA ′ is the subpixel 18B, the subpixel 18R, and the subpixel 18G in this order. A line segment that crosses 18 in the Y direction.

  As shown in FIG. 4, the electro-optical device 100 includes an element substrate 10 and a counter substrate 40 that are opposed to each other with an adhesive 41 in between. The adhesive 41 has a role of adhering the element substrate 10 and the counter substrate 40, and is made of, for example, an epoxy resin or an acrylic resin having a light transmitting property. As these resins, a thermosetting type, an ultraviolet curable type, or a resin curable by both heat and ultraviolet rays can be used.

  The element substrate 10 includes a base material 11, a reflective layer 25 sequentially stacked in the Z direction on the base material 11, a translucent layer 26, an organic EL element 30, a sealing layer 34, and a color filter 36. Is equipped with.

  The base material 11 is a semiconductor substrate such as silicon. On the base material 11, the scanning lines 12, the data lines 13, the power supply lines 14, the data line driving circuits 15, the scanning line driving circuits 16, the pixel circuits 20 (the switching transistors 21, the storage capacitors 22, the driving circuits) in the equivalent circuit described above are provided. Transistor 23) and the like are formed by using a known technique. In FIG. 4, illustration of these wirings and circuit configurations is omitted.

  The base material 11 is not limited to a semiconductor substrate such as silicon, but may be a substrate such as quartz or glass. In other words, the transistors forming the pixel circuit 20 may be MOS type transistors having an active layer on a semiconductor substrate, or may be thin film transistors or field effect transistors formed on a substrate such as quartz or glass. May be.

  The reflective layer 25 is arranged across the sub-pixels 18B, 18R, 18G, and reflects the light emitted from the organic EL elements 30B, 30R, 30G of the sub-pixels 18B, 18R, 18G to the counter substrate 40 side. . As a material for forming the reflective layer 25, for example, aluminum, silver, or an alloy of these metals that can realize high reflectance is used.

  A translucent layer 26 is provided on the reflective layer 25. The translucent layer 26 includes a first insulating film 26a, a second insulating film 26b, and a third insulating film 26c. The first insulating film 26a is arranged on the reflective layer 25 so as to extend over the sub-pixels 18B, 18R, and 18G. The second insulating film 26b is stacked on the first insulating film 26a and is arranged so as to extend over the sub-pixel 18R and the sub-pixel 18G. The third insulating film 26c is stacked on the second insulating film 26b and arranged in the sub-pixel 18R. These insulating films are made of, for example, silicon oxide.

  That is, the transparent layer 26 of the sub-pixel 18B is composed of the first insulating film 26a, the transparent layer 26 of the sub-pixel 18G is composed of the first insulating film 26a and the second insulating film 26b, and the transparent layer 26 of the sub-pixel 18R. The optical layer 26 is composed of a first insulating film 26a, a second insulating film 26b, and a third insulating film 26c. Therefore, the film thickness of the translucent layer 26 increases in the order of the sub-pixel 18B, the sub-pixel 18G, and the sub-pixel 18R.

  An organic EL element 30 is provided on the translucent layer 26. The organic EL element 30 includes a pixel electrode 31, a light emitting functional layer 32, and a counter electrode 33, which are sequentially stacked in the Z direction. The pixel electrode 31 is made of a transparent conductive film such as an ITO (Indium Tin Oxide) film, and is formed in an island shape for each sub-pixel 18.

  The insulating film 28 is arranged so as to cover the peripheral portions of the pixel electrodes 31B, 31R, 31G. As described above, in the insulating film 28, the opening 28KB is formed on the pixel electrode 31B, the opening 28KR is formed on the pixel electrode 31R, and the opening 28KG is formed on the pixel electrode 31G. The insulating film 28 is made of, for example, silicon oxide.

  In the portion where the openings 28KB, 28KR, 28KG are provided, the pixel electrode 31 (31B, 31R, 31G) is in contact with the light emitting functional layer 32, holes are supplied from the pixel electrode 31 to the light emitting functional layer 32, and the counter electrode is formed. Electrons are supplied from 33 and the light emitting functional layer 32 emits light. That is, the region in which the openings 28KB, 28KR, 28KG are provided becomes the region where the light emitting functional layer 32 emits light in each of the sub-pixels 18B, 18R, 18G. In the region where the insulating film 28 is provided, the supply of holes from the pixel electrode 31 to the light emitting functional layer 32 is suppressed, and the light emission of the light emitting functional layer 32 is suppressed.

  The light emitting functional layer 32 is arranged so as to cover the entire display area E1 (see FIG. 1) across the sub-pixels 18B, 18R, 18G. The light emitting functional layer 32 has, for example, a hole injecting layer, a hole transporting layer, an organic light emitting layer, and an electron transporting layer, which are sequentially stacked in the Z direction. The organic light emitting layer emits light in the wavelength range from blue to red. The organic light emitting layer may be composed of a single layer, and includes, for example, a blue light emitting layer, a green light emitting layer, and a red light emitting layer, or a blue light emitting layer and a wavelength range of red (R) and green (G). It may be composed of a plurality of layers including a yellow light emitting layer capable of obtaining light emission including.

  The counter electrode 33 is arranged so as to cover the light emitting functional layer 32. The counter electrode 33 is made of, for example, an alloy of magnesium and silver so as to have both light transmittance and light reflectance, and its film thickness is controlled.

  The sealing layer 34 that covers the counter electrode 33 includes a first sealing layer 34a, a planarizing layer 34b, and a second sealing layer 34c that are sequentially stacked in the Z direction. The first sealing layer 34a and the second sealing layer 34c are inorganic sealing layers formed using an inorganic material. As the inorganic material, for example, silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide or the like, which is difficult to pass moisture or oxygen, can be used. Such a sealing layer 34 is formed at least over the display region E1 in which the light emitting functional layer 32 (organic EL element 30) is arranged.

  Examples of the method of forming the first sealing layer 34a and the second sealing layer 34c include a vacuum vapor deposition method, an ion plating method, a sputtering method, a CVD method and the like. It is desirable to adopt the vacuum deposition method or the ion plating method because it is difficult to damage the organic EL element 30 with heat or the like. The film thicknesses of the first sealing layer 34a and the second sealing layer 34c are, for example, about 50 nm to 1000 nm, preferably about 200 nm to 400 nm so that cracks and the like are less likely to occur during film formation and translucency is obtained. Has become.

  The flattening layer 34b is a translucent organic sealing layer, and may be formed using, for example, a resin material of any one of a heat- or ultraviolet-curable epoxy resin, an acrylic resin, a urethane resin, and a silicone resin. it can. The flattening layer 34b is formed by being stacked on the first sealing layer 34a that covers the plurality of organic EL elements 30.

  The flattening layer 34b covers defects (pinholes, cracks), foreign matters, and the like during the film formation of the first sealing layer 34a, and forms a substantially flat surface. Further, the surface of the first sealing layer 34a is affected by the light-transmitting layer 26 having a different film thickness, so that unevenness is generated. Therefore, in order to reduce the unevenness, the flattening layer 34b has a film thickness of, for example, about 1 μm to 5 μm. Is preferably formed. As a result, the color filter 36 formed on the sealing layer 34 is less likely to be affected by the unevenness. The flattening layer 34b is preferably composed of an organic sealing layer that facilitates thickening from the viewpoint of alleviating the irregularities caused by the light-transmitting layer 26. However, a coating type inorganic material (such as silicon oxide) is used. You may form.

  The color filter 36 is formed on the sealing layer 34. The color filter 36 is composed of colored layers 36B, 36G, and 36R formed by photolithography using a photosensitive resin material containing blue (B), green (G), and red (R) color materials. . The coloring layer 36B is formed corresponding to the sub pixel 18B, the coloring layer 36R is formed corresponding to the sub pixel 18R, and the coloring layer 36G is formed corresponding to the sub pixel 18G.

  At the boundaries of the sub-pixels 18 on the sealing layer 34, adjacent colored layers of different colors are formed such that some of them overlap each other.

  The colored layers 36B, 36R, and 36G are formed by applying a photosensitive resin material containing color materials of respective colors by, for example, a spin coating method to form a photosensitive resin layer, and then exposing the photosensitive resin layer using a photolithography method. -It is formed by developing. In this embodiment, the colored layer 36G, the colored layer 36B, and the colored layer 36R are formed in this order.

  Therefore, the edge of the colored layer 36G in the X direction is covered by the edge of the colored layer 36B and the edge of the colored layer 36R, and the edge of the colored layer 36B in the Y direction is covered by the edge of the colored layer 36R.

  Of the three colored layers 36B, 36G, and 36R, the overcoat (OC) layer 50 is provided so as to overlap the colored layer 36B and the colored layer 36R that are repeatedly arranged adjacent to each other in the Y direction. The OC layer 50 covers the boundary portion between the coloring layer 36R (coloring layer 36B) and the coloring layer 36G, but is not provided at other portions except the boundary portion of the coloring layer 36G. Although a detailed formation method of the OC layer 50 will be described later, a light-transmissive photosensitive resin material is applied by, for example, a spin coating method to form a photosensitive resin layer, and then the photosensitive resin layer is formed by a photolithography method. It is formed by exposing and developing. That is, by forming the OC layer 50 so as to cover the colored layers 36B and 36R, the adhesive surface of the color filter 36 to which the adhesive 41 is attached is along the Y direction in which the colored layer 36G extends. The groove 50a is formed. The groove 50a is formed along the colored layer 36G of one color. The groove 50a is an example of stripe-shaped unevenness provided on the adhesive surface on the color filter in the present invention.

[Optical resonance structure]
The electro-optical device 100 according to this embodiment has an optical resonance structure between the reflective layer 25 and the counter electrode 33. In the electro-optical device 100, the light emitted by the light emitting functional layer 32 is repeatedly reflected between the reflective layer 25 and the counter electrode 33, and the light corresponding to the optical distance between the reflective layer 25 and the counter electrode 33 is identified. The intensity of the light of the wavelength (resonance wavelength) is amplified, and the light transmitted through the color filter 36 is emitted as display light from the counter substrate 40 in the Z direction.

  In the present embodiment, the translucent layer 26 has a role of adjusting the optical distance between the reflective layer 25 and the counter electrode 33. As described above, the thickness of the translucent layer 26 increases in the order of the sub pixel 18B, the sub pixel 18G, and the sub pixel 18R. As a result, the optical distance between the reflective layer 25 and the counter electrode 33 increases in the order of the sub pixel 18B, the sub pixel 18G, and the sub pixel 18R. The optical distance can be represented by the total product of the refractive index and the film thickness of each layer existing between the reflective layer 25 and the counter electrode 33.

  For example, in the sub-pixel 18B, the film thickness of the translucent layer 26 is set so that the resonance wavelength (the peak wavelength at which the brightness becomes maximum) is 470 nm. In the sub-pixel 18G, the film thickness of the transparent layer 26 is set so that the resonance wavelength is 540 nm. In the sub-pixel 18R, the film thickness of the translucent layer 26 is set so that the resonance wavelength is 610 nm.

  As a result, the blue light (B) having a peak wavelength of 470 nm is emitted from the sub-pixel 18B, the green light (G) having a peak wavelength of 540 nm is emitted from the sub-pixel 18G, and the peak wavelength of 610 nm is emitted from the sub-pixel 18R. A red light (R) is emitted. In other words, the electro-optical device 100 has an optical resonance structure that amplifies the intensity of light of a specific wavelength, the sub-pixel 18B extracts the blue light component from the white light emitted by the light-emitting functional layer 32, and the sub-pixel 18G The green light component is extracted from the white light emitted from the light emitting functional layer 32, and the red light component is extracted from the white light emitted from the light emitting functional layer 32 in the sub-pixel 18R.

  Instead of the translucent layer 26, the film thickness of the pixel electrodes 31 (31B, 31G, 31R) is made different from each other to adjust the optical distance between the reflective layer 25 and the counter electrode 33. Good.

  In such sub-pixels 18B, 18G, and 18R, the color filter 36 is arranged on the sealing layer 34. The coloring layer 36B is arranged on the organic EL element 30B of the sub-pixel 18B with the sealing layer 34 interposed therebetween. Therefore, the blue light (B) having a peak wavelength of 470 nm is transmitted through the colored layer 36B, so that the color purity is improved. Similarly, the coloring layer 36G is arranged on the organic EL element 30G of the sub-pixel 18G via the sealing layer 34, and the coloring layer 36R is arranged on the organic EL element 30R of the sub-pixel 18R via the sealing layer 34. . Therefore, the color purity is increased by transmitting the green light (G) having a peak wavelength of 540 nm through the colored layer 36G, and the red light (R) having a peak wavelength of 610 nm is transmitted through the colored layer 36R. Is increased.

  The optical characteristics such as the color purity of each color light also depend on the film thickness of the colored layers 36B, 36G, and 36R. In this embodiment, the blue colored layer 36B and the red colored layer 36R are formed so that the average film thickness on the sealing layer 34 is 2 μm, and the average film thickness is also about 1 μm. A green colored layer 36G is formed. The setting of the film thickness of the colored layers 36B, 36G, 36R is not limited to this.

  As described above, the light emitted from the sub-pixel 18 is the light emitted from the counter electrode 33 to the sealing layer 34 side and transmitted through the colored layers 36B, 36G, 36R, and the light emitting functional layer of the organic EL element 30. The light has a spectrum different from the spectrum of the light emitted inside 32.

[Adhesive structure between element substrate and counter substrate]
Next, the bonding structure between the element substrate 10 and the counter substrate 40 will be described with reference to FIGS. 5 and 6. FIG. 5 is a schematic plan view showing the arrangement of the light shielding portions on the element substrate, and FIG. 6 is a schematic sectional view showing the structure of the electro-optical device taken along the line CC ′ of FIG. The line CC ′ in FIG. 5 is a line segment that crosses the light-shielding portion and the display area E1 in the X direction. In FIG. 6, the display of the pixel circuit 20 on the element substrate 10, the scanning line 12, the data line 13, the power supply line 14, the data line driving circuit 15, and the scanning line driving circuit 16 connected to the pixel circuit 20 are omitted.

  As shown in FIG. 5, the element substrate 10 of the electro-optical device 100 is provided with a frame-shaped light shielding portion 36S that surrounds the display area E1. The light shielding portion 36S is provided so as to overlap with the scanning line drive circuit 16 (see FIG. 1) provided in the non-display area E2 outside the display area E1 in a plan view. Further, a dummy color filter area E4 (hereinafter referred to as a dummy CF area E4) is provided between the inner edge of the frame-shaped light-shielding portion 36S and the display area E1. As described above, by providing the frame-shaped light-shielding portion 36S surrounding the display area E1, the light emitted from the display area E1 is reflected by other portions to affect the display light, the scanning line driving circuit 16 or the like. It is possible to prevent the operation of the transistors and the like included in the peripheral circuit from becoming unstable due to incidence on the peripheral circuit. Hereinafter, a region in which the light shielding portion 36S is provided in a frame shape is referred to as a light shielding region E3.

  As shown in FIG. 6, the element substrate 10 and the counter substrate 40 are arranged and bonded to each other with an adhesive 41 in between. On the base material 11 of the element substrate 10, the light emitting functional layer 32 and the counter electrode 33 that constitute the organic EL element 30 are provided over the display area E1. Further, a sealing layer 34 that covers the light emitting function layer 32 and the counter electrode 33 is provided. The outer edge 34e of the sealing layer 34 is located slightly outside the light shielding area E3 (see FIG. 5).

  On the sealing layer 34, colored layers 36B, 36G, 36R are provided in the display region E1 corresponding to the sub-pixels 18B, 18G, 18R of the pixel P. The light shielding portion 36S described above is provided at a position surrounding the display area E1. The light-shielding portion 36S is configured to shield incident light by stacking the colored layer 36G, the colored layer 36B, and the colored layer 36R in this order. The width of the frame-shaped light-shielding portion 36S (light-shielding region E3) on the sealing layer 34 is, for example, about 0.5 mm to 1.0 mm.

  On the sealing layer 34, a colored layer 36R is provided as a dummy CF in the dummy CF region E4 between the light shield 36S and the color filter 36 corresponding to the pixel P in the display region E1. The dummy CF is not limited to the red (R) colored layer 36R and may be a colored layer of another color. However, in consideration of light leakage, in this case, the colored layer 36R having a larger film thickness than the colored layer 36G is formed. preferable. The width of the dummy CF region E4 between the display region E1 and the light shielding region E3 is, for example, 50 μm to 300 μm.

  In the display area E1, as described above, the OC layer 50 is provided in a stripe shape so as to overlap the colored layers 36B and 36R arranged in the Y direction of the color filter 36. The pixel P includes a portion where the OC layer 50 is provided and a portion where the OC layer 50 is not provided and forms a groove 50a between the adjacent pixels P. That is, on the adhesive surface of the color filter 36, which is in contact with the adhesive 41, the stripe-shaped grooves 50a extending in the Y direction are provided for each pixel P arranged in the X direction. The number of stripe-shaped OC layers 50 and grooves 50a in the display region E1 shown in FIG. 5 is determined by the number of pixels P arranged in the X direction. 5 and 6, the stripe-shaped OC layer 50 and the groove 50a are shown in a visible number.

<Method for manufacturing electro-optical device>
Next, a method for manufacturing the electro-optical device 100 will be described with reference to FIGS. FIG. 7 is a flowchart showing the method for manufacturing the electro-optical device according to the first embodiment, and FIGS. 8 to 11 are schematic cross-sectional views showing the method for manufacturing the electro-optical device according to the first embodiment.

  As shown in FIG. 7, the method of manufacturing the electro-optical device 100 includes a step of forming a plurality of organic EL elements 30 on the base material 11 (step S1) and a sealing for sealing the plurality of organic EL elements 30. The sealing layer forming step of forming the stop layer 34 (step S2), the color filter forming step of forming the color filter 36 on the sealing layer 34 (step S3), and the overcoat (OC) layer 50 forming over. The process includes a coat (OC) layer forming step (step S4) and a step of attaching the counter substrate 40 to the element substrate 10 (step S5). The process of forming the data line driving circuit 15, the peripheral circuits such as the scanning line driving circuit 16 and the pixel circuit 20, the wiring connecting these circuits, the external connection terminal 102, and the like on the base material 11 are described above. Known methods can be used as described above. The same applies to the reflective layer 25 and the translucent layer 26. Therefore, step S1 will be described first.

  Step S1 is a step of forming the organic EL element 30, in which the pixel electrode 31 is formed for each sub-pixel 18 in the display region E1, and the light-emitting functional layer 32 and the counter electrode 33 are formed so as to extend over the plurality of sub-pixels 18. Then, the organic EL element 30 is formed for each sub-pixel 18. Then, the process proceeds to step S2.

  Step S2 is a step of forming the sealing layer 34, in which the sealing layer 34 for sealing the plurality of organic EL elements 30 formed in the display area E1 is formed. Specifically, the first sealing layer 34a is formed using an inorganic material so as to cover the counter electrode 33. Subsequently, an organic sealing layer is formed using a resin material, and the organic sealing layer is patterned to form the planarization layer 34b. A second sealing layer 34c is formed using an inorganic material so as to cover the planarizing layer 34b and to cover the first sealing layer 34a protruding from the planarizing layer 34b. Thereby, the sealing layer 34 is formed. The first sealing layer 34a and the second sealing layer 34c made of an inorganic material sandwich the flattening layer 34b made of an organic material vertically from the viewpoint of improving the sealing property, and at the outer peripheral edge of the base material 11. It is preferable to form the entire structure. Then, the process proceeds to step S3.

  Step S3 is a step of forming the color filter 36. In the display area E1, the colored layers 36B, 36G and 36R are formed on the sealing layer 34 so as to correspond to the three sub-pixels 18B, 18G and 18R. As described above, the coloring layers 36B, 36G, and 36R are formed by applying a photosensitive resin material containing a coloring material by spin coating to form a photosensitive resin layer, and then forming the photosensitive resin layer by photolithography. It is formed by exposing and developing using. In this embodiment, the colored layer 36G, the colored layer 36B, and the colored layer 36R are formed in this order. In the step of forming the color filter 36, the colored layers 36G, 36B, 36R are formed in the display area E1, and at the same time, the three colored layers 36G, 36B, 36R are sequentially stacked in the light shielding area E3 surrounding the display area E1 to shield light. The part 36S is formed. Further, in the present embodiment, in the dummy CF region E4 between the display region E1 and the light shielding region E3, the coloring layer 36R having a large film thickness and capable of contributing to the light shielding property is formed among the three coloring layers 36B, 36G, 36R. . The order of forming the three colored layers 36B, 36G, and 36R is not limited to green (G), blue (B), and red (R). Since the colored layers of different colors are overlapped at the boundaries of the sub-pixels 18, it is preferable to form the layers with the smaller thickness first. Then, the process proceeds to step S4.

  Step S4 is a step of forming the overcoat (OC) layer 50. First, as shown in FIG. 8, for example, a photosensitive resin material containing no coloring material is used to spin the display area E1 by spin coating or the like. The OC layer 50 is formed so as to cover the formed color filter 36, the light shielding portion 36S, and the colored layer 36R that is the dummy CF. The thickness of the OC layer 50 at this time is, for example, about 1 μm.

  Next, as shown in FIG. 9, the OC layer 50 is irradiated with, for example, ultraviolet rays (UV) through the exposure mask 60. The mask 60 is provided with a light shielding pattern 61. The light-shielding pattern 61 has a plurality of stripe-shaped light-shielding layers extending in the Y direction at positions overlapping the colored layers 36B and 36R formed in the display area E1. Further, the light shielding layer formed in a frame shape is provided at a position overlapping the colored layer 36R formed in the dummy CF region E4.

  When the OC layer 50 irradiated with ultraviolet rays (UV) is developed, as shown in FIG. 10, the coloring layer 36B and the coloring layer 36R overlap with each other in the display region E1 and the coloring layer that is a dummy CF in the dummy CF region E4. An OC layer 50 patterned so as to overlap 36R is formed. As a result, the patterned OC layer 50 is provided with the groove 50a extending in the Y direction at a position overlapping the colored layer 36G in the display region E1. Further, the OC layer 50 is formed inside the light shielding portion 36S. Further, since the OC layer 50 is formed so as to cover the coloring layers 36B and 36R arranged in the Y direction, the coloring layers 36B and 36R may have different film thicknesses. Then, the process proceeds to step S5.

  Step S5 is a bonding step of bonding the element substrate 10 on which the OC layer 50 is formed and the counter substrate 40 with the adhesive 41. Specifically, as shown in FIG. 11, a predetermined amount of adhesive 41 is applied on the color filter 36 of the element substrate 10, and the counter substrate 40 is attached from above to spread the applied adhesive 41. Press toward 10. Since the plurality of grooves 50a are formed on the adhesive surface on the color filter 36 along the Y direction, the adhesive 41 spreads along the plurality of grooves 50a.

  Since the light shield 36S surrounding the display area E1 is formed by sequentially stacking the three colored layers 36G, 36B, 36R, the height of the light shield 36S on the sealing layer 34 is about 5 μm. On the other hand, the height of the color filter 36 on the sealing layer 34 is about 2 μm at the maximum. An OC layer 50 having a thickness of about 1 μm is formed on the colored layer 36R serving as a dummy CF provided between the light-shielding area E3 and the display area E1. Therefore, since the substantial height of the dummy CF on the sealing layer 34 is about 3 μm, the step between the light shielding portion 36S and the color filter 36 is relaxed as compared with the case where the dummy CF is not provided. . Therefore, the adhesive 41 spread on the color filter 36 fills the step between the light shield 36S and the color filter 36 more easily than in the past, and gets over the light shield 36S. In a state where the adhesive 41 has spread to a predetermined application range on the base material 11, the adhesive 41 is cured to bond the element substrate 10 and the counter substrate 40 together.

  After that, the FPC 103 is mounted on the terminal portion of the element substrate 10 to complete the electro-optical device 100 shown in FIG.

According to the electro-optical device 100 of the first embodiment and the manufacturing method thereof, the following effects can be obtained.
(1) In the color filter 36, the colored layer 36B and the colored layer 36R are formed so that both ends thereof overlap at the boundary portion in the Y direction. Further, the colored layer 36G is formed so as to overlap the colored layer 36B and the colored layer 36R at both ends at the boundary portion in the X direction. On the color filter 36 of the element substrate 10 as described above, the OC layer 50 is patterned and formed at a position overlapping the colored layers 36B and 36R arranged in the Y direction. As a result, a plurality of grooves 50a as stripe-shaped irregularities extending in the Y direction are formed on the surface of the color filter 36 that is bonded to the adhesive 41. The groove 50a is formed at a position overlapping with the colored layer 36G that also extends in the Y direction in the sub-pixel 18G. That is, no step is formed at the bottom of the groove 50a. In the bonding step of bonding the element substrate 10 and the counter substrate 40, when the counter substrate 40 is pressed so as to spread the adhesive 41 applied to the element substrate 10, the adhesive 41 spreads along the plurality of grooves 50a. Therefore, for example, as compared with the case where the three colored layers 36B, 36G, and 36R have different film thicknesses, the OC layer 50 is not present, and a complicated step is formed on the color filter 36, uneven application of the adhesive 41 is caused. Hard to happen. Further, since the adhesive 41 spreads along the plurality of grooves 50a having no step at the bottom extending in the Y direction as the first direction, bubbles are unlikely to be generated in the grooves 50a. That is, it is possible to provide the electro-optical device 100 in which bubbles that affect display are unlikely to occur and a method for manufacturing the same.

  (2) The light-shielding portion 36S formed at a position surrounding the display area E1 is formed by sequentially stacking three colored layers 36G, 36B, 36R having different colors, and the height on the sealing layer 34 is about 5 μm. Has become. A dummy CF region E4 is provided in a frame shape between the light-shielding region E3 provided with the light-shielding portion 36S and the display region E1 provided with the color filter 36. In the dummy CF area E4, a red colored layer 36R as a dummy CF and a patterned OC layer 50 are provided. The height of the colored layer 36R and the OC layer 50 on the sealing layer 34 is 3 μm. That is, by forming such a dummy CF area E4 between the light-shielding area E3 and the display area E1, it is possible to reduce the step between the light-shielding portion 36S and the color filter 36 while ensuring the light-shielding property. it can. Therefore, when the element substrate 10 and the counter substrate 40 are bonded using the adhesive 41, the light-shielding portion 36S having the highest height on the sealing layer 34 and the color filter 36 are bonded together with bubbles mixed therein. Can be suppressed.

  (3) The plurality of grooves 50a obtained by patterning the OC layer 50 are formed so as to overlap the colored layer 36G having the smallest film thickness among the three colored layers 36B, 36G, and 36R. Therefore, the depth of the groove 50a becomes deeper than in the case where the thickness of the colored layer 36G is the same as that of the other colored layers 36B and 36R, and the adhesive 41 in the bonding of the element substrate 10 and the counter substrate 40 becomes larger. It becomes easier to regulate the pushing and spreading direction. Therefore, it is possible to suppress the occurrence of coating unevenness of the adhesive 41 and make a uniform coating state. In other words, the coloring layer 36G arranged in the X direction as the second direction intersecting the Y direction with respect to the coloring layers 36B, 36R arranged in the Y direction as the first direction forming the OC layer 50 has a film thickness. However, it is preferable that the film thickness is small.

  In the pixel P of the electro-optical device 100 according to the first embodiment, the sub pixel 18B (coloring layer 36B) and the sub pixel 18R (coloring layer 36R) are arranged in the Y direction as the first direction, and the sub pixel The sub-pixel 18G (coloring layer 36G) is arranged in the X direction as the second direction with respect to the 18B (coloring layer 36B) and the sub-pixel 18R (coloring layer 36R), but is not limited to this. is not. For example, the sub-pixel 18B (coloring layer 36B) and the sub-pixel 18R (coloring layer 36R) are arranged in the X direction as the first direction, and the sub-pixel 18B (coloring layer 36B) and the sub-pixel 18R (coloring layer 36R) are arranged. In contrast, the sub-pixel 18G (coloring layer 36G) may be arranged in the Y direction as the second direction. According to this, a plurality of grooves 50a as stripe-shaped irregularities extending in the X direction are arranged on the adhesive surface on the color filter 36. In other words, the direction in which the plurality of stripe-shaped grooves 50a as the unevenness extends is not limited to the Y direction, and may be the X direction.

(Second embodiment)
Next, an electro-optical device according to the second embodiment and a method for manufacturing the same will be described with reference to FIGS. 12 and 13. FIG. 12 is a schematic sectional view showing the structure of the electro-optical device according to the second embodiment, and FIG. 13 is an enlarged sectional view showing the structures of the color filter and the overcoat layer in the electro-optical device according to the second embodiment. Note that FIG. 12 is a schematic sectional view corresponding to FIG. 6 of the first embodiment.

  The electro-optical device 200 according to the second embodiment is different from the electro-optical device 100 according to the first embodiment in the configuration of the overcoat layer 50, and other configurations are the same. The same components as those of the electro-optical device 100 according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIG. 12, in the electro-optical device 200 of this embodiment, an element substrate 210 having a plurality of organic EL elements 30 and a color filter 36, and a translucent counter substrate 40 with an adhesive 41 interposed therebetween. It is a self-luminous display device which is arranged facing and bonded.

  On the element substrate 210, each of the plurality of pixels P arranged in the display area E1 includes three sub-pixels 18B, 18G, and 18R. Each of the sub-pixels 18B, 18G, and 18R has an organic EL element 30 including a light emitting functional layer 32 formed between a pixel electrode 31 and a counter electrode 33. The light emitting functional layer 32 and the counter electrode 33 are formed over the display region E1 and are sealed by the sealing layer 34.

  A color filter 36 is formed in the display area E1 on the sealing layer 34. The color filter 36 includes a blue coloring layer 36B, a green coloring layer 36G, and a red coloring layer 36R, which are formed corresponding to the sub-pixels 18B, 18G, and 18R.

  A dummy CF region E4 is provided in a frame shape in a position surrounding the display region E1 on the sealing layer 34, and a red colored layer 36R as a dummy CF is formed in the dummy CF region E4. Further, a light-shielding portion 36S (light-shielding area E3) is provided in a frame shape surrounding the dummy CF area E4. The light shielding portion 36S is formed by sequentially stacking colored layers 36G, 36B, 36R of different colors. The average thickness of the colored layer 36G is about 1 μm, and the average thickness of the colored layers 36B and 36R is about 2 μm.

  A first overcoat (OC) layer 51 is formed so as to cover the colored layers 36B, 36G, 36R in the display area E1 and the colored layer 36R in the dummy CF area E4. Further, a second overcoat (OC) layer 52 is patterned and formed on the first overcoat (OC) layer 51 at a position overlapping the colored layers 36B and 36R arranged in the Y direction in a plan view. ing. That is, the overcoat (OC) layer 50 of the present embodiment includes the first OC layer 51 formed over the display region E1 and the dummy CF region E4, and stripes extending in the Y direction for each pixel P. And a second OC layer 52 formed in the shape of a circle.

  That is, the stripe-shaped unevenness extending in the Y direction by the first OC layer 51 and the patterned second OC layer 52 on the surface of the element substrate 210 that is bonded to the adhesive 41 on the color filter 36. Are formed with a plurality of grooves 52a. As shown in FIG. 13, the groove 52a is formed at a position overlapping the colored layer 36G in the color filter 36. The thickness of the first OC layer 51 on the color filter 36 is, for example, 1.5 μm from the viewpoint of covering the color filter 36 over the display region E1 and ensuring flatness. The film thickness of the second OC layer 52 on the first OC layer 51 is, for example, 1 μm smaller than the film thickness of the first OC layer 51 because it defines the depth of the groove 52a.

  The manufacturing method of such an electro-optical device 200 is basically the same as the manufacturing method of the electro-optical device 100 of the first embodiment, and the overcoat layer forming step (step S4) of the present embodiment is performed by A step of forming a translucent first OC layer 51 covering the filter 36, and a step of forming a second OC layer 52 extending in the Y direction as a first direction on the first OC layer 51. It is configured to include and. Both the first OC layer 51 and the second OC layer 52 are formed by a photolithography method using a light-transmissive photosensitive resin material.

According to the electro-optical device 200 of the second embodiment and the manufacturing method thereof, the following effects can be obtained.
(1) Regardless of the film thickness settings of the three colored layers 36B, 36G, and 36R that form the color filter 36, the first OC layer 51 and the patterning are formed on the adhesive surface of the color filter 36 with the adhesive 41. With the formed second OC layer 52, a plurality of grooves 52a as stripe-shaped irregularities extending in the Y direction are formed. In other words, even if the three colored layers 36B, 36G, and 36R have different thicknesses and a complicated step is formed on the color filter 36, the color filter 36 is covered by the first OC layer 51. In the bonding step of bonding the element substrate 210 and the counter substrate 40, uneven application of the adhesive 41 is unlikely to occur. Moreover, since the adhesive 41 spreads along the plurality of grooves 52a having no step at the bottom extending in the Y direction as the first direction, bubbles are unlikely to be generated in the grooves 52a. That is, it is possible to provide the electro-optical device 200 in which bubbles that affect display are unlikely to occur and a method for manufacturing the same.

  (2) In the dummy CF region E4 between the light-shielding region E3 and the display region E1, the first OC layer 51 and the second OC layer 52 are stacked in addition to the colored layer 36R as the dummy CF. The height on the sealing layer 34 is about 4.5 μm. Therefore, as compared with the configuration of the first embodiment, the step between the light shield 36S and the color filter 36 is further reduced. Therefore, in the bonding step of bonding the element substrate 210 and the counter substrate 40 using the adhesive 41, the adhesive 41 easily gets over the light shielding portion 36S, and the light shielding portion 36S having the highest height on the sealing layer 34 is formed. It is possible to further suppress the bonding performed in the state where air bubbles are mixed with the color filter 36.

  Since the color filter 36 is covered with the first OC layer 51, a step related to the setting of the film thickness of the colored layers 36B, 36G, and 36R does not affect the bonding process, and thus the first OC layer 51 is not covered. The extending direction of the second OC layer 52 formed in is not limited to the Y direction and may be the X direction.

(Third Embodiment)
Next, an electro-optical device according to the third embodiment and a method for manufacturing the same will be described with reference to FIGS. 14 and 15. FIG. 14 is a schematic sectional view showing the structure of the electro-optical device of the third embodiment, and FIG. 15 is an enlarged sectional view showing the structure of the color filter in the electro-optical device of the third embodiment. Note that FIG. 14 is a schematic sectional view corresponding to FIG. 6 of the first embodiment.

  The electro-optical device 300 according to the third embodiment has a configuration in which the overcoat layer 50 is eliminated from the electro-optical device 100 according to the first embodiment, and other configurations are the same. The same components as those of the electro-optical device 100 according to the first embodiment are designated by the same reference numerals, and detailed description thereof will be omitted.

  As shown in FIG. 14, in the electro-optical device 300 of the present embodiment, an element substrate 310 having a plurality of organic EL elements 30 and a color filter 36, and a translucent counter substrate 40 with an adhesive 41 interposed therebetween. It is a self-luminous display device which is arranged facing and bonded.

  In the element substrate 310, each of the plurality of pixels P arranged in the display area E1 includes three sub-pixels 18B, 18G, 18R. Each of the sub-pixels 18B, 18G, and 18R has an organic EL element 30 including a light emitting functional layer 32 formed between a pixel electrode 31 and a counter electrode 33. The light emitting functional layer 32 and the counter electrode 33 are formed over the display region E1 and are sealed by the sealing layer 34.

  A color filter 36 is formed in the display area E1 on the sealing layer 34. The color filter 36 includes a blue coloring layer 36B, a green coloring layer 36G, and a red coloring layer 36R, which are formed corresponding to the sub-pixels 18B, 18G, and 18R.

  A dummy CF region E4 is provided in a frame shape at a position surrounding the display region E1 on the sealing layer 34, and a green coloring layer 36G and a blue coloring layer 36B as dummy CFs are stacked in the dummy CF region E4. There is. Further, a light-shielding portion 36S (light-shielding area E3) is provided in a frame shape surrounding the dummy CF area E4. The light shielding portion 36S is formed by sequentially stacking colored layers 36G, 36B, 36R of different colors. The colored layer 36G formed in the light shielding area E3 and the colored layer 36G formed in the dummy CF area E4 are connected. Similarly, the colored layer 36B formed in the light shielding area E3 and the colored layer 36B formed in the dummy CF area E4 are connected. The average thickness of the colored layer 36G is approximately 1 μm, and the average thickness of the colored layers 36B and 36R is approximately 2 μm. The arrangement of the colored layers 36B, 36G, 36R in the pixel P is the same as that in the first embodiment. That is, on the sealing layer 34, the coloring layer 36B is arranged independently of the sub-pixel 18B, and the coloring layer 36R is also arranged independently of the sub-pixel 18R. The green colored layer 36G is arranged in stripes corresponding to the plurality of sub-pixels 18G arranged in the Y direction.

  That is, a plurality of stripe-shaped grooves 36 a extending in the Y direction by the color filter 36 are formed on the surface of the element substrate 310 that is bonded to the adhesive 41 on the color filter 36. As shown in FIG. 15, the groove 36a is formed by making the film thickness of the colored layer 36G and the film thickness of the colored layer 36B (colored layer 36R) in the color filter 36 different.

  Such a method of manufacturing the electro-optical device 300 is obtained by removing the overcoat layer forming step (step S4) from the method of manufacturing the electro-optical device 100 of the first embodiment, and is the same as that of the first embodiment. In the color filter forming step (step S3), the colored layers 36B, 36G and 36R are formed corresponding to the sub-pixels 18B, 18G and 18R in the display area E1, and the light shielding area E3 and the dummy CF area E4 are formed. The colored layer 36G and the colored layer 36B are formed in a frame shape. Further, in the light-shielding region E3, the colored layer 36R is laminated in a frame shape on the colored layer 36B to form the light-shielding portion 36S.

According to the electro-optical device 300 of the third embodiment and the manufacturing method thereof, the following effects can be obtained.
(1) In the color filter 36 on the sealing layer 34, the thicknesses of the colored layer 36B (colored layer 36R) and the colored layer 36G that are adjacent to each other in the X direction as the second direction are made different, and the colored layer 36B (colored). By making the film thickness of the colored layer 36G smaller than the film thickness of the layer 36R), the groove 36a extending in the Y direction is formed on the colored layer 36G. That is, a plurality of grooves 36a as stripe-shaped irregularities are formed on the adhesive surface of the color filter 36 to the adhesive 41. In the bonding step of bonding the element substrate 310 and the counter substrate 40, the adhesive 41 spreads along the groove 36a having no step at the bottom extending in the Y direction as the first direction, and therefore bubbles are less likely to be generated in the groove 36a. That is, it is possible to provide the electro-optical device 300 in which bubbles that affect display are less likely to occur and a method for manufacturing the same.

  (2) In the dummy CF region E4 between the light-shielding region E3 and the display region E1, the colored layer 36B is stacked as the dummy CF in addition to the colored layer 36G, and the height on the sealing layer 34 is about 3 μm. . Therefore, similar to the configuration of the first embodiment, the step between the light shield 36S and the color filter 36 is reduced. Therefore, when the element substrate 310 and the counter substrate 40 are bonded using the adhesive 41, the light-shielding portion 36S, which has the highest height on the sealing layer 34, and the color filter 36 are bonded together with bubbles mixed therein. Can be suppressed.

  In the pixel P of the electro-optical device 300 of the third embodiment, similar to the electro-optical device 100 of the first embodiment, the sub-pixel 18B (coloring layer 36B) and the sub-pixel 18B (coloring layer 36B) are formed in the Y direction as the first direction. The pixel 18R (coloring layer 36R) is arranged, and the sub-pixel 18G (coloring layer 36G) is arranged in the X direction as the second direction with respect to the sub-pixel 18B (coloring layer 36B) and the sub-pixel 18R (coloring layer 36R). Although it is arranged to be arranged, it is not limited to this. For example, the sub-pixel 18B (coloring layer 36B) and the sub-pixel 18R (coloring layer 36R) are arranged in the X direction as the first direction, and the sub-pixel 18B (coloring layer 36B) and the sub-pixel 18R (coloring layer 36R) are arranged. In contrast, the sub-pixel 18G (coloring layer 36G) may be arranged in the Y direction as the second direction. According to this, a plurality of grooves 36a as stripe-shaped irregularities extending in the X direction are arranged on the adhesive surface on the color filter 36. In other words, the direction in which the plurality of grooves 36a as the stripe-shaped concavities and convexities extend is not limited to the Y direction and may be the X direction.

(Fourth Embodiment)
<Electronic equipment>
Next, a head mounted display (HMD) will be described as an example of an electronic apparatus in which the electro-optical device according to the present embodiment is applied to a display unit, and will be described with reference to FIG. 16. FIG. 16 is a schematic diagram showing a configuration of a head mounted display as an electronic device.

  A head mount display (HMD) 1000 has a pair of optical units 1010L and 1010R for displaying information corresponding to the left and right eyes, and a pair of optical units 1010L and 1010R mounted on a user's head. It has a mounting part (not shown) for doing so, a power supply part, a control part (not shown), and the like. Here, since the pair of optical units 1010L and 1010R have a bilaterally symmetrical configuration, the optical unit 1010R for the right eye will be described as an example.

  The optical unit 1010R includes a display portion 1001R, a frame-shaped case portion 1002, a condensing optical system 1003, and a light guide body 1004 bent in an L shape. The light guide body 1004 is provided with a half mirror layer 1005. In the optical unit 1010R, the display light emitted from the display unit 1001R enters the light guide body 1004 by the condensing optical system 1003, is reflected by the half mirror layer 1005, and is guided to the right eye. The display light (image) projected on the half mirror layer 1005 is a virtual image. Therefore, the user can visually recognize both the display (virtual image) by the display unit 1001R and the outside world beyond the half mirror layer 1005. That is, the HMD 1000 is a transmissive (see-through) projection display device.

  The light guide body 1004 is a combination of rod lenses and forms a rod integrator. A light collecting optical system 1003 and a display unit 1001R are arranged on the light incident side of the light guide body 1004, and the rod lens receives the display light collected by the light collecting optical system 1003. . Further, the half mirror layer 1005 of the light guide body 1004 has an angle to reflect the light flux that is condensed by the condensing optical system 1003 and is totally reflected and transmitted in the rod lens toward the right eye. .

  The display unit 1001R can display the display signal transmitted from the control unit in the display area as image information such as characters and images. The displayed image information is converted from a real image to a virtual image by the condensing optical system 1003. In the present embodiment, the self-luminous electro-optical device 100 of the first embodiment is applied to the display unit 1001R. In order that light emitted from areas other than the display area of the display section 1001R is condensed by the condensing optical system 1003 and does not affect the display, a frame shape surrounding the display area is provided on the condensing optical system 1003 side of the display section 1001R. The case portion 1002 is provided.

  As described above, the optical unit 1010L for the left eye also has the display unit 1001L to which the electro-optical device 100 of the first embodiment is applied, and the configuration and function are the same as the optical unit 1010R for the right eye. Is the same.

  According to the present embodiment, since the self-luminous electro-optical device 100 is applied as the display units 1001L and 1001R, a lighting device such as a backlight is not required as compared with the case of using the light receiving liquid crystal device. Therefore, it is possible to provide a see-through type HMD 1000 that is small and lightweight and has a good appearance.

  The HMD 1000 to which the electro-optical device 100 according to the first embodiment is applied is not limited to the configuration including the pair of optical units 1010L and 1010R corresponding to both eyes, and for example, the configuration including one optical unit 1010R. It may be. Further, it is not limited to the see-through type, and may be an immersive type in which the display is visually recognized in a state where the outside light is shielded.

  Further, the electro-optical device 200 according to the second embodiment or the electro-optical device 300 according to the third embodiment may be applied to the display units 1001L and 1001R.

  The present invention is not limited to the above-described embodiments, and various changes and improvements can be added to the above-described embodiments. A modified example will be described below.

(Modification 1) The planar arrangement of the sub-pixels 18B, 18G, 18R and the corresponding color filter 36 in the pixel P is not limited to the arrangement shown in FIG. 3 of the first embodiment. FIG. 17 is a schematic plan view showing the arrangement of the sub-pixels and the color filter of Modification 1, and FIG. 18 is a schematic cross-sectional view showing the structure of the color filter and the overcoat layer along the line DD ′ of FIG.
As shown in FIG. 17, in Modification 1, in the pixels P adjacent to each other in the X direction, the sub pixel 18G of one pixel P and the sub pixel 18G of the other pixel P are arranged to be adjacent to each other in the X direction. ing. The colored layer 36G is arranged in a stripe pattern with respect to the two columns of sub-pixels 18G arranged in the Y direction. Therefore, as shown in FIG. 18, if the OC layer 50 is patterned so as to overlap the colored layers 36B and 36R, the groove 50b extending in the Y direction across two pixels P adjacent in the X direction is formed. It is formed. That is, the groove 50b wider than the groove 50a in the first embodiment is formed. Therefore, in the bonding step of bonding the element substrate 10 and the counter substrate 40, the adhesive 41 is spread by the wide groove 50b, and bubbles are less likely to be mixed in the groove 50b. Note that, as described in the first embodiment, the arrangement of the sub-pixels 18B, 18G, 18R in the pixel P is not limited to this, and thus the modified example obtained by patterning the OC layer 50. There may be a configuration in which one groove 50b extends in the X direction.

(Modification 2) The planar arrangement of the sub-pixels 18B, 18G, 18R and the corresponding color filter 36 in the pixel P is not limited to the arrangement shown in FIG. 3 of the first embodiment. FIG. 19 is a schematic plan view showing the arrangement of the sub-pixels and the color filter of Modification 2, and FIG. 20 is a schematic cross-sectional view showing the structure of the color filter and the overcoat layer along the line FF ′ of FIG.
As shown in FIG. 19, in the modified example 2, the pixel P has, for example, two sub-pixels 18B, and one sub-pixel 18G and one sub-pixel 18R, respectively. In the pixel P, the sub pixel 18B and the sub pixel 18R are arranged in the Y direction. A sub pixel 18G is arranged adjacent to the sub pixel 18B in the X direction. Further, another sub pixel 18B is arranged adjacent to the sub pixel 18R in the X direction. Although the size of the opening in each of the sub-pixels 18B, 18G, and 18R is the same, since the pixel P includes two sub-pixels 18B, the area in which blue light emission is substantially obtained is large. ing. The colored layers 36B, 36G, 36R of the color filter 36 are independently arranged corresponding to the arrangement of the sub-pixels 18B, 18G, 18R. In the arrangement of the colored layers 36B, 36G, 36R, if the thickness of each colored layer is different, a complicated step is formed on the color filter 36 in the pixel P. In Modification 2, as shown in FIG. 20, after the first OC layer 51 is formed so as to cover the color filter 36 in the same manner as in the second embodiment, for example, the coloring layer 36B and the coloring layer 36B are planarly viewed. A second OC layer 52 is patterned and formed on the first OC layer 51 at a position overlapping with the layer 36R. Then, a plurality of stripe-shaped grooves 52a extending in the Y direction are formed on the color filter 36 at positions overlapping the colored layers 36G and 36B in a plan view. Therefore, in the bonding step of bonding the element substrate and the counter substrate 40 of the modified example 2, the adhesive 41 is spread and spread along the plurality of grooves 52a, and it becomes difficult for bubbles to be mixed in the grooves 52a. Note that the pixel P is not limited to include the three sub-pixels 18B, 18G, and 18R, and includes, for example, a yellow (Y) sub-pixel 18Y in addition to blue (B), green (G), and red (R). May be Further, even if the pixel P includes a total of four sub-pixels 18, the extending direction of the plurality of grooves 52a formed on the color filter 36 is the Y direction as described in the second embodiment. However, it may be in the X direction.

  (Modification 3) In the second embodiment, the second OC layer 52 is formed by patterning on the first OC layer 51 at a position overlapping the colored layers 36B and 36R arranged in the Y direction in plan view. However, the method for forming the second OC layer 52 is not limited to this. Since the first OC layer 51 is formed so as to cover the color filter 36, the bonding step is not affected by the difference in the film thickness of the colored layers 36B, 36G, 36R of the color filter 36. Therefore, the direction in which the second OC layer 52 is formed in a stripe shape is not limited to the Y direction and may be the X direction. Further, the present invention is not limited to forming the stripe-shaped second OC layer 52 for each pixel P. In this case, the stripe-shaped second OC layer 52 is formed on the first OC layer 51 with an arbitrary interval. The OC layer 52 may be formed.

  (Modification 4) The electronic apparatus to which the electro-optical device according to each of the above embodiments is applied is not limited to the head mounted display (HMD) according to the above fourth embodiment. For example, it can be suitably used for an electronic viewfinder such as a digital camera, a head-up display, a display unit of a portable information terminal, and the like.

  The contents derived from the embodiment will be described below.

  An electro-optical device according to the present application includes a first substrate having a plurality of light emitting elements and a color filter provided corresponding to the plurality of light emitting elements, and a translucent surface that is arranged to face the first substrate via an adhesive. And a second substrate, and stripe-shaped unevenness is provided on the adhesive surface of the first substrate on the color filter.

  According to the configuration of the present application, in bonding the first substrate and the second substrate, the adhesive is spread according to the stripe-shaped unevenness provided on the bonding surface on the color filter. Therefore, even if the thickness of the colored layer forming the color filter is different for each color, for example, and a complicated step is formed on the color filter, it is possible to reduce the uneven application of the adhesive and the problem that air bubbles are mixed in the adhesive. That is, it is possible to provide an electro-optical device in which bubbles that affect display are unlikely to occur.

Further, in the above electro-optical device, it is preferable that a translucent overcoat layer is provided on the color filter, and the overcoat layer is provided with stripe-shaped irregularities.
According to this configuration, since the overcoat layer is provided on the color filter, it is less likely to be affected by the step difference caused by the difference in the film thickness of the colored layer. That is, it is possible to provide an electro-optical device in which bubbles that affect display are less likely to occur.

In the electro-optical device described above, it is preferable that the color filter includes at least three colored layers, and the overcoat layer covers at least three colored layers arranged in the first direction.
According to this configuration, stripe-shaped irregularities can be realized by the overcoat layer for each pixel in which at least three colored layers are provided.

In the electro-optical device described above, the colored layers arranged in the first direction may include colored layers having different film thicknesses.
According to this configuration, the colored layers arranged in the first direction and having different film thicknesses are covered with the overcoat layer, so that the colored layers having different film thicknesses are not affected when the first substrate and the second substrate are bonded. .

In the electro-optical device described above, the colored layers arranged in the second direction intersecting the first direction may have different film thicknesses with respect to the colored layers arranged in the first direction.
According to this structure, the thickness of the colored layers arranged in the second direction is different from that of the colored layers arranged in the first direction, so that the colored layers extending in the first direction extend on the adhesive surface on the color filter. The stripe-shaped unevenness can be formed.

In the electro-optical device described above, the overcoat layer includes a first overcoat layer that covers the color filter and a second overcoat layer that extends in the first direction on the first overcoat layer. In addition, it is preferable that the first overcoat layer and the second overcoat layer form stripe unevenness.
According to this configuration, since the color filter is covered with the first overcoat layer, even if the color layers constituting the color filter have different thicknesses for each color, for example, they are not affected by the step of the color layer. In addition, the first substrate and the second substrate can be bonded together via an adhesive.

  In the electro-optical device described above, the color filter includes colored layers of at least three colors, and two colored layers having different colors among the colored layers of at least three colors are made different in thickness to form a stripe shape. It may be uneven.

  According to this configuration, the adhesive surface on the color filter is provided with stripe-shaped irregularities by making the thicknesses of the two colored layers having different colors different from each other. Therefore, when the first substrate and the second substrate are bonded using the adhesive, the adhesive is spread according to the unevenness, and the first substrate and the second substrate are bonded in a state in which bubbles are difficult to be mixed with the adhesive. can do.

Further, in the electro-optical device described above, the color filter includes a colored layer of at least three colors, and a light-shielding portion formed by stacking colored layers of at least three colors in a position surrounding a light emitting region in which a plurality of light emitting elements are arranged. Is preferably provided.
According to this configuration, since the light-shielding portion formed by stacking the colored layers of at least three colors is provided in the position surrounding the light-emitting region, light leakage from the light-emitting region is shielded by the light-shielding portion to provide a good-looking display. An electro-optical device that can be used can be provided.

  A method of manufacturing an electro-optical device according to the present application is a method of manufacturing an electro-optical device including a plurality of light emitting elements and a color filter, wherein a plurality of light emitting areas of a first substrate are arranged over a light emitting region. A sealing layer forming step of forming a sealing layer for sealing the light emitting element, and a color filter forming step of forming a colored layer of at least three colors on the sealing layer so as to correspond to the plurality of light emitting elements. An overcoat layer forming step of forming a translucent overcoat layer to cover the colored layers arranged in the first direction among the three colored layers; a first substrate on which the overcoat layer is formed; And a bonding step of bonding the flexible second substrate with an adhesive.

  According to the method of the present application, stripe-shaped unevenness extending in the first direction can be formed on the adhesive surface of the color filter in the overcoat layer forming step. Therefore, in the bonding step, since the adhesive can be spread according to the stripe-shaped irregularities, uneven application of the adhesive and the adhesive can be achieved without being affected by the step due to the thickness of the colored layer in the color filter. The first substrate and the second substrate can be bonded to each other by reducing the problem that air bubbles are mixed in. That is, it is possible to provide a method for manufacturing an electro-optical device in which bubbles that affect display are unlikely to occur.

  Another method of manufacturing an electro-optical device according to the present application is a method of manufacturing an electro-optical device including a plurality of light emitting elements and a color filter, the method covering a light emitting region of the first substrate in which the plurality of light emitting elements are arranged. A sealing layer forming step of forming a sealing layer for sealing a plurality of light emitting elements, and a color filter forming step of forming at least three colored layers corresponding to the plurality of light emitting elements on the sealing layer. An overcoat forming a light-transmitting first overcoat layer covering the color filter, and forming a light-transmitting second overcoat layer extending in the first direction on the first overcoat layer A layer forming step; and an adhering step of adhering the first substrate on which the first overcoat layer and the second overcoat layer are formed, and the translucent second substrate with an adhesive. It is characterized by

  According to another method of the present application, in the overcoat layer forming step, a first overcoat layer is formed to cover the color filter, and a second overcoat layer is further formed on the first overcoat layer. Thus, stripe-shaped irregularities can be formed on the adhesive surface of the color filter by the second overcoat layer extending in the first direction. Therefore, in the bonding step, since the adhesive can be spread according to the stripe-shaped irregularities, uneven application of the adhesive and the adhesive can be achieved without being affected by the step due to the thickness of the colored layer in the color filter. The first substrate and the second substrate can be bonded to each other by reducing the problem that air bubbles are mixed in. That is, it is possible to provide a method for manufacturing an electro-optical device in which bubbles that affect display are unlikely to occur.

  Another method of manufacturing an electro-optical device according to the present application is a method of manufacturing an electro-optical device including a plurality of light emitting elements and a color filter, the method covering a light emitting region of the first substrate in which the plurality of light emitting elements are arranged. A sealing layer forming step of forming a sealing layer for sealing a plurality of light emitting elements, and a color filter forming step of forming at least three colored layers corresponding to the plurality of light emitting elements on the sealing layer. And a bonding step of bonding a first substrate having a color filter formed thereon and a translucent second substrate with an adhesive, wherein in the color filter forming step, at least three colored layers of The first colored layer and the second colored layer are formed so as to be arranged in the first direction, and are adjacent to the first colored layer and the second colored layer in the second direction intersecting the first direction. Are aligned, and the film thickness is different from that of the first colored layer and the second colored layer. And forming a third colored layer formed.

  According to another method of the present application, in the color filter forming step, the first colored layer and the second colored layer arranged in the first direction have different film thicknesses adjacent to each other in the second direction. By forming the third colored layer, stripe-shaped irregularities extending in the first direction are formed on the color filter. Therefore, in the bonding step, since the adhesive can be spread according to the stripe-shaped irregularities, uneven application of the adhesive and the adhesive can be achieved without being affected by the step due to the thickness of the colored layer in the color filter. The first substrate and the second substrate can be bonded to each other by reducing the problem that air bubbles are mixed in. That is, it is possible to provide a method for manufacturing an electro-optical device in which bubbles that affect display are unlikely to occur.

In the above-described method for manufacturing an electro-optical device, it is preferable that in the color filter forming step, the light shielding portion be formed by stacking colored layers of at least three colors at a position surrounding the light emitting region.
According to this method, since the light-shielding portion formed by stacking the colored layers of at least three colors is formed at the position surrounding the light-emitting region, light leakage from the light-emitting region is shielded by the light-shielding portion, and a good-looking display can be performed. An electro-optical device can be manufactured.

In the method of manufacturing the electro-optical device described above, in the color filter forming step, the light shielding portion is formed by laminating colored layers of at least three colors in a position surrounding the light emitting region, and in the overcoat layer forming step, the light shielding portion is formed. It is preferable to form an overcoat layer on the inside.
According to this method, the step difference between the light shielding portion and the color filter provided in the light emitting region can be mitigated by the overcoat layer. Therefore, in the bonding step, the adhesive can easily spread over the light shielding portion and spread, and it is possible to reduce bubbles mixed in the adhesive at the step between the light shielding portion and the color filter.

An electronic device of the present application is characterized by including the electro-optical device described above.
According to the configuration of the present application, since the self-luminous electro-optical device in which bubbles are unlikely to be contained is included in at least the light emitting region, it is possible to provide an electronic device capable of providing a good-looking display.

  DESCRIPTION OF SYMBOLS 10 ... Element substrate as a 1st substrate, 30 ... Organic EL element as a light emitting element, 34 ... Sealing layer, 36 ... Color filter, 36a ... Grooves as stripe-shaped unevenness, 36B, 36G, 36R ... Colored layer, 36S ... Shading part, 40 ... Opposite substrate as transparent second substrate, 41 ... Adhesive agent, 50 ... Overcoat layer, 50a, 50b ... Grooves as stripe unevenness, 51 ... First overcoat layer , 52 ... Second overcoat layer, 52a ... Grooves as stripe-shaped irregularities, E1 ... Display area as light emitting area.

Claims (14)

A first substrate having a plurality of light emitting elements and a color filter provided corresponding to the plurality of light emitting elements;
A translucent second substrate arranged to face the first substrate via an adhesive,
An electro-optical device, wherein stripe-shaped irregularities are provided on an adhesive surface of the first substrate on the color filter. Having a translucent overcoat layer on the color filter,
The electro-optical device according to claim 1, wherein the stripe-shaped irregularities are provided on the overcoat layer. The color filter includes colored layers of at least three colors,
The electro-optical device according to claim 2, wherein the overcoat layer covers the colored layers arranged in the first direction among the colored layers of the at least three colors.   The electro-optical device according to claim 3, wherein the colored layers arranged in the first direction include colored layers having different film thicknesses.   The electro-optical device according to claim 3, wherein the colored layers arranged in a second direction intersecting the first direction have different film thicknesses from the colored layers arranged in the first direction. The overcoat layer includes a first overcoat layer that covers the color filter, and a second overcoat layer that extends in a first direction on the first overcoat layer,
The electro-optical device according to claim 2, wherein the stripe-shaped unevenness is formed by the first overcoat layer and the second overcoat layer. The color filter includes colored layers of at least three colors,
The electro-optical device according to claim 1, wherein the stripe-shaped unevenness is formed by making the thicknesses of two colored layers having different colors different from each other among the colored layers of at least three colors. The color filter includes colored layers of at least three colors,
8. The electro-optical device according to claim 1, further comprising a light-shielding portion formed by stacking the colored layers of at least three colors at a position surrounding a light emitting region in which the plurality of light emitting elements are arranged. . A method for manufacturing an electro-optical device comprising a plurality of light emitting elements and a color filter,
A sealing layer forming step of forming a sealing layer that seals the plurality of light emitting elements over a light emitting region in which the plurality of light emitting elements are arranged on the first substrate;
A color filter forming step of forming colored layers of at least three colors corresponding to the plurality of light emitting elements on the sealing layer;
An overcoat layer forming step of forming a translucent overcoat layer by covering the colored layers arranged in the first direction among the colored layers of at least three colors;
A method of manufacturing an electro-optical device, comprising: a bonding step of bonding the first substrate having the overcoat layer formed thereon and a translucent second substrate with an adhesive. A method for manufacturing an electro-optical device comprising a plurality of light emitting elements and a color filter,
A sealing layer forming step of forming a sealing layer that seals the plurality of light emitting elements over a light emitting region in which the plurality of light emitting elements are arranged on the first substrate;
A color filter forming step of forming colored layers of at least three colors corresponding to the plurality of light emitting elements on the sealing layer;
A translucent first overcoat layer that covers the color filter is formed, and a translucent second overcoat layer that extends in a first direction is formed on the first overcoat layer. A coat layer forming step,
An adhesion step of adhering the first substrate on which the first overcoat layer and the second overcoat layer are formed and a translucent second substrate with an adhesive. Optical device manufacturing method. A method for manufacturing an electro-optical device comprising a plurality of light emitting elements and a color filter,
A sealing layer forming step of forming a sealing layer that seals the plurality of light emitting elements over a light emitting region in which the plurality of light emitting elements are arranged on the first substrate;
A color filter forming step of forming colored layers of at least three colors corresponding to the plurality of light emitting elements on the sealing layer;
And a bonding step of bonding the first substrate on which the color filter is formed and the translucent second substrate with an adhesive.
In the color filter forming step, a first coloring layer and a second coloring layer are formed so as to be arranged in the first direction among the coloring layers of at least three colors, and intersect with the first direction. A third colored layer that is arranged adjacent to the first colored layer and the second colored layer in a second direction and has a different film thickness with respect to the first colored layer and the second colored layer. And a method of manufacturing an electro-optical device.   The manufacturing of the electro-optical device according to claim 9, wherein, in the color filter forming step, the light-shielding portion is formed by stacking the colored layers of at least three colors at a position surrounding the light emitting region. Method. In the color filter forming step, a light shielding part is formed by stacking the colored layers of at least three colors at a position surrounding the light emitting region,
The method of manufacturing an electro-optical device according to claim 9, wherein in the overcoat layer forming step, the overcoat layer is formed inside the light shielding portion.   An electronic apparatus comprising the electro-optical device according to claim 1.

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