JP2016148694A - Black matrix substrate, manufacturing method of black matrix substrate, electro-optical device, and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a black matrix substrate that can realize excellent display quality, a manufacturing method of a black matrix substrate, a liquid crystal device including the black matrix substrate, and an electronic apparatus.SOLUTION: A black matrix substrate 50 comprises: a translucent substrate 21; a first light-shielding layer 51 that is arranged on one face of the substrate 21; and a second light-shielding layer 52 that is arranged on a face of the substrate 21 on the opposite side of the first light-shielding layer 51. An end face 57 of the second light-shielding layer 52 projects more than an end face 56 of the first light-shielding layer 51 in cross-sectional view.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a black matrix substrate, a method for manufacturing the black matrix substrate, an electro-optical device using the black matrix substrate, and an electronic apparatus.

  Conventionally, as one of electro-optical devices, for example, an active drive type liquid crystal device including a transistor for each pixel as an element for switching control of a pixel electrode is known. The liquid crystal device is used for, for example, an EVF (Electronic View Finder), a head mounted display (HMD, Head Mounted Display) and the like.

  When displaying a color image in an electro-optical device such as a liquid crystal device, a counter substrate provided with a color filter layer on one surface side of a light-transmitting substrate is used. Such a counter substrate is provided with a light-shielding protrusion called a so-called black matrix between pixels (sub-pixels), and a color filter layer is provided in a recess defined by the light-shielding protrusion to be adjacent to each other. Color mixing between pixels is prevented.

  For example, Patent Document 1 discloses a liquid crystal display (liquid crystal device) in which the reflectance of a black mask (black matrix) is reduced by laminating a predetermined film, a chromium compound, and metal chromium on a transparent substrate (translucent substrate). ) Is described.

  Further, for example, Patent Document 2 describes a liquid crystal display device (liquid crystal device) having a light-transmitting substrate provided with a light shielding layer as a black matrix in which an Al layer and a Cr / CrO layer having different reflectivities are stacked. Has been.

Japanese Patent Laid-Open No. 11-14806 JP-A-9-61810

  However, in the liquid crystal device described in Patent Document 1 or Patent Document 2, it is necessary to form a thick color filter layer in order to improve the contrast of color display, and accordingly, a black matrix provided between pixels is also included. It needs to be thick. When the black matrix is formed thick, the area of the end face (side face) of the black matrix increases, and the polarized light reflected by the end face of the black matrix increases.

  For example, when the polarized light incident from the translucent substrate side is reflected by the end face of the black matrix, the polarized state of the reflected polarized light changes such as the polarization direction as compared with the incident polarized light. There is a problem that the polarization of the polarization state is mixed with the light that is transmitted through the light-transmitting substrate and incident on the liquid crystal layer, so that the contrast of the color display is lowered and the display quality of the liquid crystal device is deteriorated. .

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example] A black matrix substrate according to this application example includes a light-transmitting substrate, a first light-shielding layer disposed on one surface of the substrate, and a surface of the first light-shielding layer opposite to the substrate. And an end face of the second light-shielding layer protrudes from an end face of the first light-shielding layer in a cross-sectional view.

  According to this application example, for example, when polarized light incident from the translucent substrate side is reflected by the end face of the first light-shielding layer, the reflected polarized light changes in polarization state such as the polarization direction compared to when incident. . The 2nd light shielding layer laminated | stacked on the 1st light shielding layer has a part protruded from the edge part of a 1st light shielding layer. Therefore, at least part of the polarized light reflected by the end face of the first light shielding layer is shielded by the protruding part of the second light shielding layer, so that the polarized light transmitted through the substrate without entering the end face of the first light shielding layer, It becomes difficult to mix the polarized light reflected by the end face of one light shielding layer.

  Therefore, for example, by using such a black matrix substrate for a liquid crystal device, a reduction in display contrast caused by mixing polarized light having a different polarization state with polarized light that is transmitted through the light-transmitting substrate and incident on the liquid crystal layer is suppressed. Therefore, a liquid crystal device having excellent display quality can be realized.

  In the black matrix substrate according to the application example described above, the reflectance of the second light shielding layer is smaller than the reflectance of the first light shielding layer.

  According to this configuration, it is possible to reduce, for example, that the polarized light incident from the translucent substrate side is repeatedly reflected between the end surface of the first light shielding layer and the protruding portion of the second light shielding layer. Therefore, it is possible to suppress an increase in polarized light whose polarization state has changed due to reflection.

  In the black matrix substrate according to the application example, the first light shielding layer includes aluminum or an aluminum alloy, and the second light shielding layer includes a metal nitride.

  According to this configuration, aluminum or an aluminum alloy has light reflectivity. Therefore, for example, a part of the light incident from the translucent substrate side is reflected by the first light shielding layer, and it can be reduced that the black matrix substrate is heated by the incident light.

  On the other hand, a metal nitride has a lower reflectance than aluminum or an aluminum alloy. In other words, since the light absorptance is high, the polarized light reflected by the end face of the first light shielding layer can be absorbed by the second light shielding layer. Therefore, it is possible to suppress an increase in polarized light whose polarization state has changed due to reflection.

In the black matrix substrate according to the application example described above, a thickness of the first light shielding layer in a direction perpendicular to one surface of the substrate is d1, and an end of the first light shielding layer on the second light shielding layer side is defined as d1. The distance between the edge and the edge of the second light shielding layer on the first light shielding layer is d2, and the edge of the first light shielding layer on the substrate side and the second light shielding layer. The following formula (1) is satisfied, where α is an angle formed by an imaginary surface including an end side on the first light-shielding layer side and an end surface of the first light-shielding layer. To do.
tanα ≦ d2 / d1 (1)

  According to this configuration, when the condition of the formula (1) is satisfied, the polarized light incident from the translucent substrate side and reflected by the end face of the first light shielding layer enters the protruding portion of the second light shielding layer. It becomes easy to do. Therefore, since at least a part of the polarized light reflected by the end face of the first light shielding layer is blocked by the protruding part of the second light shielding layer, the polarized light transmitted through the substrate without entering the end face of the first light shielding layer; It becomes difficult to mix the polarized light reflected by the end face of the first light shielding layer.

In the black matrix substrate according to the application example, the α satisfies the following formula (2).
20 ° ≦ α ≦ 40 ° (2)

  According to this configuration, when the condition of Expression (2) is satisfied, the polarized light incident from the translucent substrate side and reflected by the end face of the first light shielding layer is further applied to the protruding portion of the second light shielding layer. Incidence becomes easy. Therefore, at least part of the polarized light reflected by the end face of the first light shielding layer is shielded by the protruding part of the second light shielding layer, so that the polarized light transmitted through the substrate without entering the end face of the first light shielding layer, The polarized light reflected by the end face of one light shielding layer is further difficult to mix.

  The black matrix substrate according to the application example includes a third light-shielding layer between the substrate and the first light-shielding layer, and an end surface of the third light-shielding layer is larger than an end surface of the first light-shielding layer in a cross-sectional view. Is also protruding.

  According to this configuration, it is possible to reduce polarized light incident on the end face of the first light shielding layer, as compared with a black matrix substrate that does not include the third light shielding layer. Therefore, it can suppress that the polarization | polarized-light which reflected on the end surface of the 1st light shielding layer and the polarization state changed increases.

  In the black matrix substrate according to the application example, the first light shielding layer and the second light shielding layer are alternately stacked a plurality of times.

  According to this configuration, compared with the case where the first light shielding layer and the second light shielding layer are each formed as a single layer, the polarized light reflected by the end face of the first light shielding layer is efficiently shielded by the second light shielding layer. be able to.

  In the black matrix substrate according to the application example described above, the width of the first light-shielding layer and the width of the second light-shielding layer become smaller toward the upper layer on the substrate.

  According to this configuration, even when the first light shielding layer and the second light shielding layer are laminated a plurality of times, the aperture ratio of the region partitioned by the first light shielding layer and the second light shielding layer does not decrease.

In the black matrix substrate according to the application example described above, the lower second light shielding layer disposed below the first light shielding layer among the end surfaces of the first light shielding layer among the light shielding layers stacked a plurality of times. The distance between the side edge and the edge of the lower second light shielding layer on the first light shielding layer side is d3, and the first light shielding layer of the lower second light shielding layer is d3. A virtual surface including an edge on the side and an edge on the first light-shielding layer side of the upper second light-shielding layer disposed in an upper layer of the first light-shielding layer, and a direction perpendicular to one surface of the substrate The following formula (3) is satisfied, where β is an angle formed by.
tanβ ≦ (d3-d2) / d1 (3)

  According to this configuration, when the condition of Expression (3) is satisfied, for example, polarized light incident from the translucent substrate side is blocked by the lower second light shielding layer and positioned in the upper layer of the lower second light shielding layer. It becomes difficult to enter the end face of the first light shielding layer. In addition, the polarized light reflected by the end face of the first light shielding layer is likely to enter the protruding portion of the upper second light shielding layer. Therefore, since at least a part of the polarized light reflected by the end face of the first light shielding layer is blocked by the protruding portion of the upper second light shielding layer, the polarized light transmitted through the substrate without entering the end face of the first light shielding layer; It becomes difficult to mix the polarized light reflected by the end face of the first light shielding layer.

In the black matrix substrate according to the application example, the β satisfies the following formula (4).
20 ° ≦ β ≦ 40 ° (4)

  According to this configuration, when the condition of the formula (4) is satisfied, for example, the light incident from the translucent substrate side and reflected by the end face of the first light shielding layer is the protruding portion of the second light shielding layer. It becomes easier to enter. Therefore, since at least a part of the polarized light reflected by the end face of the first light shielding layer is blocked by the protruding part of the second light shielding layer, the polarized light transmitted through the substrate without entering the end face of the first light shielding layer; It becomes difficult to mix the polarized light reflected by the end face of the first light shielding layer.

  In the black matrix substrate according to the application example, the black matrix substrate is provided in a region partitioned by the first light shielding layer and the second light shielding layer, and is selected from at least R (red), G (green), and B (blue). It is characterized by having a colored layer.

  According to this configuration, since the colored layers of the three primary colors of light are included, for example, when used in a liquid crystal device, a decrease in display contrast is suppressed, and excellent color display quality can be realized. it can.

  In the black matrix substrate according to the application example described above, the size of the region in which the colored layer of one color is provided among the colored layers of R (red), G (green), and B (blue) is different colors. The size of the region provided with the colored layer is different.

  According to this configuration, since it is possible to vary the size of the region where the colored layer is provided depending on the color of the colored layer, the optical characteristics of the colored layer of each color, such as transmittance, saturation, etc. Differences can be corrected. By using such a black matrix substrate in a liquid crystal device, for example, excellent color reproducibility can be realized.

  An electro-optical device according to this application example includes the black matrix substrate described in the application example.

  According to this configuration, by using such a black matrix substrate for an electro-optical device, it is possible to provide an electro-optical device having an excellent display quality, in which a reduction in display contrast is suppressed.

  An electronic apparatus according to this application example includes the black matrix substrate described in the application example.

  According to this configuration, by using such a black matrix substrate for an electronic device, a reduction in display contrast is suppressed, and an electronic device having excellent display quality can be provided.

  A method for manufacturing a black matrix substrate according to this application example includes a film forming step in which a first light shielding layer and a second light shielding layer are formed on a light-transmitting substrate to form a laminated film, and an opening is formed on the laminated film. A resist pattern forming step of forming a resist pattern having a portion, and an etching step of performing a dry etching process on the laminated film using the resist pattern as a mask to remove the laminated film in the opening to form a recess. The etching rate of the second light shielding layer is slower than the etching rate of the first light shielding layer.

  According to this method, since the etching rate of the second light shielding layer is slower than the etching rate of the first light shielding layer, when the etching of the second light shielding layer proceeds, the first light shielding layer is over-etched. Therefore, in the opening after the etching, in the cross section in the stacking direction in which the first light shielding layer and the second light shielding layer are laminated, a shape in which the second light shielding layer is laminated on the first light shielding layer and protrudes is obtained.

  Therefore, since at least a part of the polarized light reflected by the end face of the first light shielding layer is blocked by the protruding part of the second light shielding layer, the polarized light transmitted through the substrate without entering the end face of the first light shielding layer; It becomes difficult to mix the polarized light reflected by the end face of the first light shielding layer.

  In the method for manufacturing a black matrix substrate according to the application example, in the film formation step, the second light shielding layer is formed using a film forming material having a reflectance lower than that of the first light shielding layer.

  According to this method, it is possible to reduce that the polarized light incident from the translucent substrate side is repeatedly reflected between the end face of the first light shielding layer and the protruding portion of the second light shielding layer. Therefore, it is possible to suppress an increase in polarized light whose polarization state has changed due to reflection.

  In the black matrix substrate manufacturing method according to the application example, the film forming step includes a step of forming a third light shielding layer between the substrate and the first light shielding layer, and is the same film as the second light shielding layer. The third light shielding layer is formed using a forming material.

  According to this method, as compared with a black matrix substrate that does not include the third light shielding layer, it is possible to reduce the polarized light reflected by the end face of the first light shielding layer.

  The method for manufacturing a black matrix substrate according to the application example includes a colored layer forming step of forming a colored layer selected from at least R (red), G (green), and B (blue) in the concave portion. It is characterized by that.

  According to this method, for example, it is possible to manufacture a black matrix substrate that can suppress a decrease in display contrast and can realize excellent color display quality.

  In the method for manufacturing a black matrix substrate according to the application example, an overcoat layer forming step of forming an overcoat layer covering at least the laminated film and the colored layer, and forming a transparent conductive film by laminating the overcoat layer And a transparent conductive film forming step.

  According to this method, the unevenness on the substrate due to the laminated film and the colored layer is relaxed by the overcoat layer, and a black matrix substrate having a transparent conductive film with a substantially flat surface can be manufactured.

  In the black matrix substrate manufacturing method according to the application example, the colored layer forming step includes at least the colored layer of B (blue) among the colored layers of R (red), G (green), and B (blue). It is formed last.

  It is difficult to ensure the color purity of the B (blue) colored layer as compared with the colored layers of other colors. Since the color purity is proportional to the film thickness, according to this method, by forming R (red) and G (green) first, the depth of the recess for forming B (blue) is increased, and the film thickness is increased. Easy to earn. That is, it becomes easy to achieve a desired color purity in the B (blue) colored layer.

1 is a schematic plan view showing a configuration of a liquid crystal device according to a first embodiment. FIG. 2 is a schematic cross-sectional view taken along line H-H ′ of the liquid crystal device illustrated in FIG. 1. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the liquid crystal device. FIG. 3 is a cross-sectional view showing a main part of the structure of the liquid crystal device. (A)-(c) is explanatory drawing explaining the polarized light reflected on the end surface of a 1st light shielding layer. (A)-(f) is a schematic sectional drawing which shows the manufacturing method of a black matrix substrate. The schematic sectional drawing which shows the structure of the black matrix substrate which concerns on 2nd Embodiment. Explanatory drawing explaining the polarized light reflected on the end surface of a 1st light shielding layer. FIG. 5 is a schematic cross-sectional view illustrating a configuration of a black matrix substrate according to a third embodiment. Schematic which shows a head mounted display as an example of an electronic device. The perspective view which shows the structure of the other example of an electronic device.

  DESCRIPTION OF EMBODIMENTS Embodiments embodying the present invention will be described below with reference to the drawings. In the following figures, the scale of each component is described on a scale different from the actual scale so that each component can be recognized on the drawing for easy understanding. There is.

  In the following embodiments, for example, when “on the substrate” is described, when disposed so as to be in contact with the substrate, or when disposed on the substrate via another component, or It is assumed that a part of the substrate is disposed so as to be in contact with the substrate and a part of the substrate is disposed through another component.

  In this embodiment, an active matrix liquid crystal device 100 including a thin film transistor (TFT) as a pixel switching element will be described as an example of an electro-optical device. The liquid crystal device 100 can be suitably used for, for example, an EVF (Electronic View Finder), a head mounted display (HMD), a light modulation element (liquid crystal light valve) of a projection display device (liquid crystal projector), and the like.

(First embodiment)
<Configuration of liquid crystal device>
FIG. 1 is a schematic plan view showing the configuration of the liquid crystal device 100 according to the first embodiment. FIG. 2 is a schematic cross-sectional view taken along the line HH ′ of the liquid crystal device 100 shown in FIG. Hereinafter, the configuration of the liquid crystal device 100 will be described with reference to FIGS. 1 and 2.

  As shown in FIGS. 1 and 2, a liquid crystal device 100 as an electro-optical device of the present embodiment includes an element substrate 10 and a counter substrate 20 that are disposed to face each other, a liquid crystal layer 8 that is sandwiched between the pair of substrates, Have

  The element substrate 10 includes a transparent base material 11 made of, for example, quartz glass, a pixel electrode 17 provided for each of a plurality of pixels P on the base material 11, and a thin film transistor 30 (hereinafter referred to as TFT 30) as a switching element. ), Signal wiring (not shown), and an alignment film 18 covering them. “Translucency” in this embodiment means that the transmittance of light in the visible light wavelength region is, for example, 85% or more.

  The base material 11 of the element substrate 10 is not limited to quartz glass, and for example, a translucent material such as borosilicate glass, non-alkali glass, synthetic quartz plate, transparent resin film, optical resin plate, or the like may be used. .

  The element substrate 10 is slightly larger than the counter substrate 20, and both the substrates are bonded via a sealing material 9 disposed along the outer periphery of the counter substrate 20. Liquid crystal layer 8 is configured by sealing liquid crystal having positive or negative dielectric anisotropy in the gap.

  The sealing material 9 is an adhesive for bonding the element substrate 10 and the counter substrate 20 around them, and is formed of, for example, a photo-curing resin, a thermosetting resin, or an ultraviolet-curing epoxy resin, and both substrates A spacer (not shown) such as glass fiber or glass bead is mixed to keep the interval between them constant.

  A display area E in which a plurality of pixels P are arranged is provided on the inner side surrounded by the sealing material 9. The display area E may include dummy pixels arranged so as to surround the plurality of pixels P in addition to the plurality of pixels P contributing to display.

  The pixel electrode 17 can be formed by using a transparent conductive film such as light-transmitting ITO (Indium Tin Oxide).

  Further, a data line driving circuit 23 is provided between the side portion 12 of the element substrate 10 and the sealing material 9 along the side portion 12, and the sealing material along the side portion 13 facing the side portion 12. 9 and a display area E are provided with an inspection circuit 24. The arrangement of the inspection circuit 24 is not limited to this, and the inspection circuit 24 may be provided between the sealing material 9 and the display area E along the data line driving circuit 23.

  A scanning line driving circuit 25 is provided between the sealing material 9 and the display area E along the side portions 14 and 15 that are orthogonal to the side portions 12 and 13 and face each other. A plurality of wirings 26 that connect the two scanning line driving circuits 25 are provided between the seal material 9 along the side portion 13 and the inspection circuit 24.

  Wirings connected to the data line driving circuit 23 and the scanning line driving circuit 25 are connected to a plurality of external connection terminals 27 arranged along the side portion 12. Hereinafter, the direction along the side parts 12 and 13 is the X-axis direction, the direction along the side parts 14 and 15 is the Y-axis direction, and the direction in which the counter substrate 20 and the element substrate 10 are stacked is the Z-axis direction. explain.

  On the other hand, the counter substrate 20 has a base 21 as a translucent substrate made of translucent quartz, for example, a planarization layer (protective film) 16 on the base 21, and a planarization layer 16. A counter electrode (common electrode) 19 provided in common to the plurality of pixels P, an alignment film 22, and a light shielding portion (parting portion) 28 are provided.

  The base material 21 of the counter substrate 20 is not limited to quartz glass. For example, as with the base material 11 of the element substrate 10, borosilicate glass, alkali-free glass, synthetic quartz plate, transparent resin film, optical resin plate, etc. A light-transmitting material may be used.

  The planarization layer 16 is made of a light-transmitting inorganic material such as silicon oxide, for example, and is provided so as to cover the light shielding portion 28. As a method for forming such a planarization layer 16, for example, a method of forming a film using a plasma CVD (Chemical Vapor Deposition) method or the like can be cited.

  The counter electrode 19 is made of, for example, a transparent conductive film such as ITO, and covers the planarization layer 16 and is electrically connected to the wiring on the element substrate 10 side by a vertical conduction portion 29 provided at a corner of the counter substrate 20. ing. The counter electrode 19 is covered with an alignment film 22.

  The alignment film 22 and the alignment film 18 described above are, for example, an organic alignment film that aligns liquid crystal molecules having positive dielectric anisotropy substantially horizontally by forming an organic material such as polyimide and rubbing the surface thereof. Alternatively, an inorganic alignment film can be used in which an inorganic material such as SiOx (silicon oxide) is formed using a vapor phase growth method and liquid crystal molecules having negative dielectric anisotropy are approximately vertically aligned.

  The alignment film 18 and the alignment film 22 of this embodiment are formed of an inorganic alignment film. The alignment film 18 and the alignment film 22 cause the liquid crystal molecules of the liquid crystal layer 8 to assume a predetermined alignment state in a state where an electric field is not applied.

  A light-shielding portion 28 is also provided in the same frame shape inside the sealing material 9 arranged in a frame shape on the counter substrate 20 side. Inside the light shielding portion 28 is a display area E in which a plurality of pixels P are arranged.

  The light shielding portion 28 surrounds the display area E and is provided in a position that overlaps the inspection circuit 24 and the scanning line driving circuit 25 in a plan view, thereby including these driving circuits from the base 21 side of the counter substrate 20. It serves to shield the light incident on the peripheral circuit and prevent the peripheral circuit from malfunctioning due to the light. The light shielding unit 28 shields unnecessary stray light from entering the display area E, and ensures high contrast in the display of the display area E.

  The counter substrate 20 includes a black matrix substrate, which will be described later, although not shown in FIGS. The black matrix substrate is provided with a light-shielding pattern including a light-shielding layer that improves the contrast of liquid crystal display (color display) by dividing a plurality of pixels P in the display area E in a plane.

  In this embodiment, a color filter layer 64 including at least a red colored layer (R) 61, a green colored layer (G) 62, and a blue colored layer (B) 63 is provided on the base material 21 of the counter substrate 20. On the color filter layer 64, the counter electrode 19 is provided over the entire surface. The pixel P includes any one of the colored layers 61, 62, and 63.

  The colored layer (R) 61 is a color filter that passes only red light (for example, light having a wavelength of 625 to 740 nm), and the colored layer (G) 62 is green light (for example, 500 to 565 nm). The colored layer (B) 63 is a color filter that allows only blue light (for example, light having a wavelength of 450 to 485 nm) to pass therethrough.

  Such a liquid crystal device 100 is, for example, of a transmissive type, and adopts an optical design of a normally white mode in which the pixel P is brightly displayed when not driven and a normally black mode in which the pixel P is darkly displayed when not driven. . Polarizing elements are arranged and used according to the optical design on the light incident side and the light exit side, respectively. In this embodiment, a normally white mode is employed.

<Electrical configuration of liquid crystal device>
FIG. 3 is an equivalent circuit diagram showing an electrical configuration of the liquid crystal device 100. The electrical configuration of the liquid crystal device 100 will be described with reference to FIG.
As shown in FIG. 3, the liquid crystal device 100 includes a plurality of scanning lines 3 a and a plurality of data lines 6 a that are insulated from each other and orthogonal to each other at least in the display region E, and capacitance lines 3 b. The direction in which the scanning line 3a extends is the X-axis direction, and the direction in which the data line 6a extends is the Y-axis direction.

  The pixel circuit 43 of the pixel P includes the pixel electrode 17, the TFT 30, and the capacitive element 41. The gate of the TFT 30 is electrically connected to the scanning line 3 a, the data line side source / drain region (source region) of the TFT 30 is electrically connected to the data line 6 a, and the pixel electrode side source / drain region (drain region) of the TFT 30. ) Is electrically connected to the pixel electrode 17 and the capacitor 41.

  The data line 6a is connected to a data line driving circuit 23 (see FIGS. 1 and 2), and supplies image signals D1, D2,..., Dn supplied from the data line driving circuit 23 to the pixels P. The scanning line 3a is connected to the scanning line driving circuit 25 (see FIG. 1), and supplies the scanning signals SC1, SC2,..., SCm supplied from the scanning line driving circuit 25 to each pixel P.

  The image signals D1 to Dn supplied from the data line driving circuit 23 to the data line 6a may be supplied line-sequentially in this order, or may be supplied to a plurality of adjacent data lines 6a for each group. Good. The scanning line driving circuit 25 supplies the scanning signals SC1 to SCm to the scanning line 3a in a pulse-sequential manner at a predetermined timing.

In the liquid crystal device 100, the TFT 30 as a switching element is turned on for a predetermined period by the input of the scanning signals SC1 to SCm, so that the image signals D1 to Dn supplied from the data line 6a are supplied to the pixel electrode 17 at a predetermined timing. It is the structure written in.
The image signals D1 to Dn of a predetermined level written to the liquid crystal layer 8 through the pixel electrode 17 are held for a certain period between the pixel electrode 17 and the counter electrode 19 arranged to face each other through the liquid crystal layer 8. The

  In order to prevent the held image signals D1 to Dn from leaking, the capacitive element 41 is connected in parallel with the liquid crystal capacitance formed between the pixel electrode 17 and the counter electrode 19. The capacitive element 41 is provided between the pixel electrode side source / drain region of the TFT 30 and the capacitive line 3b. The capacitive element 41 has a dielectric layer between two capacitive electrodes.

<Configuration of black matrix substrate>
FIG. 4 is a cross-sectional view of a main part showing the configuration of the liquid crystal device 100. As shown in FIG. 4, the black matrix substrate 50 includes a base material 21, a laminated film 55 laminated on the base material 21, a planarizing layer 16 laminated so as to cover the laminated film 55, and a planarizing layer. 16 and a counter electrode (common electrode) 19 stacked on top of each other.
The polarized light L incident from the substrate 21 side is polarized light L1 that is incident on the liquid crystal layer 8 without being incident on the end face 56 of the first light shielding layer 51, and polarized light L2 that is reflected by the end face 56 of the first light shielding layer 51. , Including.

  The black matrix substrate 50 according to this embodiment includes a color filter layer 64 including a colored layer (R) 61, a colored layer (G) 62, and a colored layer (B) 63 in the recesses 35 partitioned by the laminated film 55. Yes.

  Hereinafter, the direction in which the element substrate 10 is disposed with respect to the counter substrate 20 is referred to as an upper direction (upper side) or an upper layer, and the direction in which the counter substrate 20 is disposed with respect to the element substrate 10 is referred to as a lower direction (lower side). Or called the lower layer.

  In the color filter layer 64, the colored layers 61, 62, 63 of different colors are repeatedly arranged in the order of R, G, B in the X-axis direction. The colored layers of the same color are arranged along the Y-axis direction. Such colored layers 61, 62, and 63 are called a stripe method. The arrangement of the colored layer is not limited to the stripe method, and may be a mosaic method or a delta method.

  The laminated film 55 includes a first light shielding layer 51 and a second light shielding layer 52 laminated on the first light shielding layer 51, and is arranged side by side in the X-axis direction with an interval at which the color filter layer 64 can be formed in the recess 35. ing.

  In the present embodiment, the first light shielding layer 51 and the second light shielding layer 52 are alternately laminated on the base material 21 of the counter substrate 20 to form a laminated film 55 having a six-layer structure. The laminated film 55 is not limited to a six-layer structure, and may be a two-layer structure or a four-layer structure including a first light-shielding layer 51 and a second light-shielding layer 52.

  The first light shielding layer 51 is made of, for example, Al (aluminum). The first light shielding layer 51 is not limited to Al alone, and may be formed including Al or an Al alloy.

  Since the first light shielding layer 51 has light reflectivity, for example, light incident from the substrate 21 side is reflected by the first light shielding layer 51. Therefore, it is possible to reduce heating of the black matrix substrate 50 (laminated film 55) by absorbing incident light.

  The second light shielding layer 52 is made of, for example, TiN (titanium nitride). The second light shielding layer 52 is not limited to TiN, and may be formed including a nitride of another metal.

  In a cross-sectional view from the Y-axis direction, the end surface (side surface) 57 of the second light-shielding layer 52 has a + X-axis direction and −X more than the end surface (side surface) 56 of the first light-shielding layer 51 disposed in the lower layer. Projects in the axial direction. That is, in the X-axis direction, the second light shielding layer 52 is formed longer than the first light shielding layer 51, and includes a flange portion 58 that protrudes like a ridge above the first light shielding layer 51. Details of the collar portion 58 will be described below.

<Polarized light reflected from the end face of the first light shielding layer>
5A to 5C are explanatory views for explaining the polarized light L2 reflected by the end face 56 of the first light shielding layer 51. The polarized light L2 incident at an incident angle θ from the base material 21 side of the counter substrate 20 is illustrated. 2 shows a state in which the light is reflected upward (at the liquid crystal layer 8 side) by the end face 56 of the first light shielding layer 51 and is blocked by the flange portion 58 which is a part of the second light shielding layer 52.

5A, in the first light-shielding layer 51, when the length in the X-axis direction on the second light-shielding layer 52 side is equal to the length in the X-axis direction on the substrate 21 side (the end face 56 of the first light-shielding layer 51). Indicates a vertical state).
FIG. 5B shows a case where the length of the first light shielding layer 51 in the X-axis direction on the second light shielding layer 52 side is shorter than the length in the X-axis direction on the base material 21 side.
FIG. 5C shows a case where the length of the first light shielding layer 51 in the X axis direction on the second light shielding layer 52 side is longer than the length in the X axis direction on the substrate 21 side.
In the following drawings, the direction in which the first light shielding layer 51 and the second light shielding layer 52 are sequentially laminated on the base material 21 is defined as a laminating direction (Z-axis direction).

  Of the laminated film 55 of the black matrix substrate 50, the first light shielding layer 51 and the second light shielding layer 52 laminated on the one upper side of the first light shielding layer 51 are perpendicular to one surface of the substrate 21. That is, the thickness of the first light shielding layer 51 in the stacking direction (Z-axis direction) is d1, and the thickness of the second light shielding layer 52 is d4. d4 is about 10 times smaller than d1.

  Further, the distance between the edge 71 of the first light shielding layer 51 on the second light shielding layer 52 side and the edge 72 of the second light shielding layer 52 on the first light shielding layer 51 side (the length of the flange 58 in the X-axis direction). ) Is d2, and the angle formed by the virtual surface 75 including the end side 72 and the end side 73 of the first light shielding layer 51 on the base material 21 side and the end surface 56 of the first light shielding layer 51 is α.

At this time, the black matrix substrate 50 satisfies the following formula (1).
tanα ≦ d2 / d1 (1)

  Specifically, as shown in FIG. 5A, when the black matrix substrate 50 has, for example, an incident angle θ of 30 °, d1 = 0.500 μm, and d4 = 0.050 μm, d2 ≧ It is 0.289 μm. In other words, in this case, when the incident angle is 30 °, α = α1 = 30 °, and therefore the length of the second light shielding layer 52 protruding from the first light shielding layer 51 in the X-axis direction (the flange portion 58). The second light shielding layer 52 is formed so that the length of the second light shielding layer 52 is 0.289 μm or more.

  By adopting such a configuration, the polarized light L2 that is incident from the base material 21 side at the incident angle θ and reflected by the end face 56 of the first light shielding layer 51 is reflected on the second light shielding layer 52 protruding in the X-axis direction. It becomes easy to enter into the collar part 58 and is blocked and absorbed by the collar part 58. Therefore, the polarized light L1 that is incident on the liquid crystal layer 8 without being incident on the end face 56 of the first light shielding layer 51 is less likely to be mixed with the polarized light L2 that is reflected by the end face 56 of the first light shielding layer 51.

  The first light shielding layer 51 shown in FIG. 5B satisfies α2> α1. Therefore, as compared with the case of FIG. 5A, the polarized light L <b> 2 reflected by the end face 56 of the first light shielding layer 51 is blocked by the collar portion 58 and is easily absorbed. Therefore, it is possible to more effectively suppress the polarization L2 that has been reflected by the end face 56 of the first light shielding layer 51 and whose polarization state has changed.

  The first light shielding layer 51 shown in FIG. 5C has α3 <α1. Therefore, compared with the case of the laminated film 55 shown in FIGS. 5A and 5B, the effect that the polarized light L2 reflected by the end face 56 of the first light shielding layer 51 is blocked and absorbed by the flange portion 58 is not as great. However, compared with a laminated film in which the second light shielding layer 52 is not provided with the flange portion 58, the polarized light L2 reflected by the end face 56 of the first light shielding layer 51 is easily blocked and absorbed by the flange portion 58. Yes. Therefore, the same effect as shown in FIGS. 5A and 5B can be obtained.

In the black matrix substrate 50, α satisfies the following formula (2).
20 ° ≦ α ≦ 40 ° (2)

  In the case of α <20 ° (α = α1, α2, or α3), the portion of the second light shielding layer 52 protruding from the first light shielding layer 51 is small in the X-axis direction. The polarized light L2 reflected by the light 56 is hardly blocked by the flange portion 58, and most of the polarized light L2 travels in the direction of the liquid crystal layer 8. For this reason, it is mixed with the polarized light L1 that does not enter the end face 56 of the first light shielding layer 51 but enters the liquid crystal layer 8, and the contrast of the color display is lowered.

  On the other hand, when α> 40 ° (α = α1, α2, or α3), the portion where the second light shielding layer 52 protrudes from the first light shielding layer 51 is large in the X-axis direction. Not only the polarized light L2 reflected by the end face 56 but also the polarized light L1 that does not enter the end face 56 of the first light shielding layer 51 and is about to enter the liquid crystal layer 8 side is easily blocked by the collar portion 58. Therefore, the aperture ratio of the liquid crystal device 100 is reduced.

  For this reason, when the above formula (2) is satisfied, the polarized light L2 that is incident from the substrate 21 side and reflected by the end face 56 of the first light shielding layer 51 is the flange portion 58 of the second light shielding layer 52. It becomes easy to enter. Therefore, the polarization L1 that is incident on the liquid crystal layer 8 without being incident on the end face 56 of the first light shielding layer 51 and the polarization L2 that is reflected by the end face 56 of the first light shielding layer 51 without reducing the aperture ratio of the liquid crystal device 100. Can be made difficult to mix.

  In the above formula (2), for example, if d1 = 0.500 μm, d2≈0.182 μm when α = 20 °. When α = 40 °, d2≈0.420 μm. In this way, by forming d2 in accordance with the distribution of the incident angles θ of the polarized light L2 reflected by the first light shielding layer 51, the polarized light L2 reflected by the first light shielding layer 51 can be efficiently blocked by the flange portion 58. it can.

As described above, according to the black matrix substrate 50 of the present embodiment, the following effects can be obtained.
For example, the polarized light L2 incident from the substrate 21 side is reflected by the end face 56 of the first light shielding layer 51, and the polarization state such as the polarization direction changes as compared with the incident light. The second light shielding layer 52 laminated on the first light shielding layer 51 has a flange portion 58 that protrudes like a flange from the end portion of the first light shielding layer 51, and therefore the end surface 56 of the first light shielding layer 51. At least a part of the reflected polarized light L <b> 2 can be blocked by the flange portion 58 of the second light shielding layer 52. As a result, it is difficult to mix the polarized light L1 that is incident on the liquid crystal layer 8 without entering the end face 56 of the first light shielding layer 51 and the polarized light L2 that is reflected by the end face 56 of the first light shielding layer 51 and whose polarization state is changed. be able to.

  Therefore, for example, by using such a black matrix substrate 50 for the liquid crystal device 100, a decrease in display contrast caused by mixing the polarized light L2 incident on the liquid crystal layer 8 with the polarized light L2 whose polarization state has changed is suppressed. Therefore, the liquid crystal device 100 having excellent display quality can be realized.

  Further, the reflectance of the second light shielding layer 52 is smaller than the reflectance of the first light shielding layer 51. By doing in this way, the light absorption rate of the second light shielding layer 52 is higher than that of the first light shielding layer 51, and the polarized light L2 incident from the substrate 21 side is efficiently absorbed by the second light shielding layer 52. be able to. Therefore, repeated reflections between the end face 56 of the first light shielding layer 51 and the flange portion 58 of the second light shielding layer 52 can be reduced. As a result, it is possible to suppress an increase in the polarization L2 whose polarization state has changed due to reflection.

The laminated film 55 may be formed by laminating the first light shielding layer 51 and the second light shielding layer 52 one by one, and the first light shielding layer 51 and the second light shielding layer 52 are alternately laminated a plurality of times. Also good.
When the first light shielding layer 51 and the second light shielding layer 52 are alternately laminated a plurality of times to form the laminated film 55, the first light shielding layer 51 and the second light shielding layer 52 are each formed as a single layer. Compared with the case where it exists, the polarized light L2 reflected by the end surface 56 of the 1st light shielding layer 51 can be efficiently light-shielded by the collar part 58. FIG.

  Further, in the laminated film 55, the width of the first light shielding layer 51 in the X-axis direction and the width of the second light shielding layer 52 in the X-axis direction become smaller toward the upper layer, that is, the lamination direction (+ Z-axis direction).

  By doing so, even when the first light shielding layer 51 and the second light shielding layer 52 are laminated a plurality of times, the opening of the recess 35 defined by the first light shielding layer 51 and the second light shielding layer 52 is the liquid crystal. It does not become narrower toward the layer 8 side. As a result, it is possible to obtain the black matrix substrate 50 in which the aperture ratio of the liquid crystal device 100 is reduced.

  In addition, in the color filter layer 64 described above, the size of the region where the color filter layer of one color, for example, the colored layer (B) 63 is provided is the colored layer (R) 61 or the colored layer (G). The area 62 may be different from the size of the area.

  By varying the size of the colored layer region in this way, it is possible to correct differences in optical characteristics such as transmittance and saturation in the colored layers of the respective colors.

  Therefore, for example, by making the area where the colored layer (B) 63 is provided larger than the area where the colored layer (R) 61 and the colored layer (G) 62 are provided, the colored layer (R) 61 and the colored layer are arranged. (G) The transmittance of the colored layer (B) 63 having a smaller transmittance than 62 can be corrected and brightened.

<Black matrix substrate manufacturing method>
6A to 6F are schematic cross-sectional views illustrating a method for manufacturing the black matrix substrate 50. In the manufacturing method of the black matrix substrate 50 according to the present embodiment, the first light shielding film 81 and the second light shielding film 82 are formed on the base material 21 of the counter substrate 20 to form the laminated film 85 (step S1). ), A resist pattern forming step (step S2) for forming a resist pattern 90 having an opening 36 on the laminated film 85, and using the resist pattern 90 as a mask, the laminated film 85 is subjected to a dry etching process in the opening 36. And an etching step (step S3) for removing the laminated film and forming the recess 35.

  Further, the black matrix substrate 50 is manufactured by forming a color filter layer in the recess 35 by forming a color filter layer 64 as a colored layer selected from at least R (red), G (green), and B (blue). The process (step S4-step S6) is provided.

  Further, the manufacturing method of the black matrix substrate 50 includes an overcoat layer forming step (step S7) for forming an overcoat layer covering at least the laminated film 55 and the color filter layer 64, and a transparent conductive film laminated on the overcoat layer. And forming a transparent conductive film (step S8).

  Hereinafter, a method for manufacturing the black matrix substrate 50 will be described with reference to FIG. Here, a manufacturing method of the black matrix substrate 50 (see FIG. 4) including a six-layer structure in which the first light shielding layers 51 and the second light shielding layers 52 are alternately stacked on the base material 21 will be described as an example.

(Step S1) (Film formation process)
As shown in FIG. 6 (a), the first light shielding is performed by alternately sputtering three times each of Al serving as the first light shielding film 81 and TiN serving as the second light shielding film 82 on the entire surface of one side of the cleaned base material 21. A laminated film 85 having a six-layer structure in which the film 81 and the second light shielding film 82 are alternately laminated by three layers is formed.
At this time, the film thickness of Al in each sputtering is, for example, 0.500 μm, and the film thickness of TiN is, for example, 0.050 μm.

(Step S2) (resist pattern forming step)
As shown in FIG. 6B, a photosensitive resist is applied to the upper surface of the laminated film 85 formed in step S1, in other words, the upper surface of the second light shielding film 82 disposed in the uppermost layer. A photosensitive resist layer is formed. Then, it is exposed through a photomask on which a desired pattern is formed and developed to form a resist pattern 90 having an opening 36.

(Step S3) (etching process)
As shown in FIG. 6B, dry etching is performed from above the laminated film 85 through the resist pattern 90, and as shown in FIG. 6C, the laminated film 85 in the opening 36 formed in step S2 is formed. Remove. After the dry etching is finished, the resist pattern 90 is peeled off.

  Specifically, if the Al etching rate is 0.45 μm / min and the TiN etching rate is 0.25 μm / min, for example, the first light shielding layer 51 and the second light shielding layer The difference in the etching rate of 52 is 0.200 μm / min.

  Therefore, as described above, for example, in order to set d2 = 0.182 μm, the laminated film 55 can be formed by over-etching. For example, in order to set d2 = 0.420 μm, the laminated film 55 can be formed by over-etching.

  In this way, a laminated film 55 composed of the first light shielding layer 51 and the second light shielding layer 52 is completed, and a recess 35 for forming the color filter layer 64 is formed in a portion corresponding to the opening 36 of the laminated film 85. Complete. As a peeling method of the resist pattern 90, for example, an ashing process is exemplified.

(Step S4) (color filter layer forming step)
As shown in FIG. 6D, the color filter material is filled for each color in the recess 35 formed in step S3. For example, an R (red) liquid photosensitive color filter material is applied to one of the recesses 35 by spin coating. The coating amount is filled from the bottom of the recess 35 to a position where the height is the same as the upper surface of the laminated film 55.

  Thereafter, exposure and development are performed so that only the colored layer (R) 61 remains. Thereafter, post-baking is performed to evaporate and cure the solvent component from the color filter forming material, thereby forming a colored layer (R) 61.

(Step S5) (color filter layer forming step)
As shown in FIG. 6E, as in step S4, the G (green) liquid color filter material is placed in the adjacent concave portion 35 in which the colored layer (R) 61 is formed using the spin coat method. Apply. The coating amount is filled so that at least a part of R (red) overlaps with the upper surface of the laminated film 55.

  Thereafter, as in step S4, exposure and development are performed so that only the colored layer (G) 62 remains. Thereafter, post-baking is performed, and the solvent component is evaporated from the color filter forming material and cured to form the colored layer (G) 62.

(Step S6) (color filter layer forming step)
As shown in FIG. 6 (f), as in steps S4 and S5, a B (blue) liquid color filter is formed in the adjacent concave portion 35 in which the colored layer (G) 62 is formed by using the spin coat method. Apply material. The coating amount is filled so that at least a part of G (green) overlaps the upper surface of the laminated film 55.

  Thereafter, as in steps S4 and S5, exposure and development are performed so that only the colored layer (B) 63 remains. Thereafter, post-baking is performed to evaporate and cure the solvent component from the color filter forming material, thereby forming the colored layer (B) 63. In this way, the colored layer (R) 61, the colored layer (G) 62, and the colored layer (B) 63 are formed, and the color filter layer 64 is completed.

(Step S7) (Overcoat layer forming step)
On the upper side of the color filter layer 64, for example, the planarizing layer 16 as an overcoat layer made of a translucent resin layer is formed. Thereafter, a planarization process is performed to planarize the planarization layer 16 as necessary.

(Step S8) (Transparent conductive film forming step)
A counter electrode 19 made of ITO is formed on the planarizing layer 16 by using a photolithography technique and an etching technique. Then, an alignment film 22 is formed on the counter electrode 19. For example, the alignment film 22 is formed by using an oblique deposition method. Thus, the counter substrate 20 is completed.

  Thereafter, the element substrate 10 and the counter substrate 20 are bonded together with the liquid crystal layer 8 interposed therebetween, whereby the liquid crystal device 100 is completed.

  As described above, according to the manufacturing method of the black matrix substrate 50 according to the present embodiment, it is possible to manufacture the black matrix substrate 50 that can suppress the decrease in display contrast and can realize excellent color display quality. Can do.

  By using such a black matrix substrate 50 for the liquid crystal device 100, it is possible to provide the liquid crystal device 100 having excellent display quality by suppressing a decrease in display contrast.

  In step S <b> 1, the second light shielding film 82 is formed using a film forming material having a reflectance lower than that of the first light shielding film 81.

  According to this manufacturing method, the polarized light L2 incident from the base material 21 side is repeatedly reflected between the end face 56 of the first light shielding layer 51 and the protruding portion (the flange portion 58) of the second light shielding layer 52. Can be reduced. Therefore, it can suppress that the polarization | polarized-light L2 from which the polarization state changed by reflection increases.

  In step S <b> 3, the etching rate of the second light shielding film 82 is slower than the etching rate of the first light shielding film 81. That is, when the etching of the laminated film 85 proceeds, the first light shielding film 81 is over-etched as compared with the second light shielding film 82.

  Therefore, in the recessed portion 35 after etching, the end surface (side surface) 57 of the second light shielding layer 52 protrudes in the X axis direction from the end surface (side surface) 56 of the first light shielding layer 51 in a sectional view from the Y axis direction. . That is, in the X-axis direction, the second light shielding layer 52 is formed longer than the first light shielding layer 51, and includes a flange portion 58 that protrudes like a ridge above the first light shielding layer 51.

  Therefore, at least a part of the polarized light L2 reflected by the end face 56 of the first light shielding layer 51 is blocked by the flange portion 58 of the second light shielding layer 52, so that the liquid crystal layer does not enter the end face 56 of the first light shielding layer 51. The black matrix substrate 50 in which the polarized light L1 incident on the light 8 and the polarized light L2 reflected by the end face 56 of the first light shielding layer 51 are difficult to be mixed can be obtained.

  In the color filter layer forming step of steps S4 to S6, among the color filter layer 64 including at least the colored layer (R) 61, the colored layer (G) 62, and the colored layer (B) 63, the colored layer (B) Preferably 63 is formed last.

  According to this manufacturing method, it is difficult to ensure the color purity of the colored layer (B) 63 as compared with the colored layers of other colors, and the color purity is proportional to the film thickness. Therefore, when the color filter layer 64 is formed, the colored layer (R) 61 and the colored layer (G) 62 are formed first, and finally the colored layer (B) 63 is formed, whereby the colored layer (B). The depth of the concave portion 35 forming 63 is increased, and the film thickness is increased, so that desired color purity is easily realized.

(Second Embodiment)
<Configuration of black matrix substrate>
FIG. 7 is a schematic cross-sectional view showing the configuration of the black matrix substrate 150 according to the second embodiment. In the present embodiment, the first light-shielding layer 151 and the second light-shielding layer 152 are alternately laminated three times each, and further laminated on the base 21 and the base 21 of the counter substrate 20 one above. A third light shielding layer 153 is provided between the first light shielding layer 151. The third light shielding layer 153 is made of the same TiN as the second light shielding layer 152.

  Similarly to the first embodiment, the end surface (side surface) 157 of the second light shielding layer 152 is disposed on the lower side of the second light shielding layer 152 in the cross-sectional view from the Y-axis direction. It protrudes in the X-axis direction from the end face (side face) 156 of. In other words, in the X-axis direction, the second light shielding layer 152 is formed to be longer than the first light shielding layer 151 disposed on the lower side of the second light shielding layer 152, and above the first light shielding layer 151. It has a flange portion 158b protruding like a flange.

  Furthermore, in the present embodiment, the end surface (side surface) 159 of the third light shielding layer 153 is the end surface of the first light shielding layer 151 disposed on the upper side of the third light shielding layer 153 in a cross-sectional view from the Y-axis direction. It projects in the X-axis direction from 156. In other words, in the X-axis direction, the third light shielding layer 153 is formed longer than the first light shielding layer 151 disposed on the one upper side of the third light shielding layer 153, and below the first light shielding layer 151. And has a flange portion 158a projecting from the bottom.

Further, the end surface 159 protrudes in the X-axis direction from the end surface 157 in a cross-sectional view from the Y-axis direction. That is, the third light shielding layer 153 is formed longer than the second light shielding layer 152 in the X-axis direction.
Also in the laminated film 155, similarly to the laminated film 55 described above, the width of the first light shielding layer 151 in the X-axis direction and the width of the second light shielding layer 152 (the lowermost layer is the third light shielding layer 153) in the X-axis direction. However, it becomes smaller toward the upper layer, that is, the stacking direction (+ Z-axis direction).

<Polarized light reflected from the end face of the first light shielding layer>
FIG. 8 is an explanatory diagram for explaining the polarized light L <b> 2 reflected by the end surface 156 of the first light shielding layer 151. FIG. 8 shows that the polarized light L2 incident at an incident angle φ from the lower second light-shielding layer 152a provided below the arbitrary first light-shielding layer 151 in the laminated film 155 laminated a plurality of times. The upper second light-shielding layer 152b is reflected from the end face 156 of the first light-shielding layer 151 to the upper side, that is, the liquid crystal layer (not shown in FIG. 8) side, and is provided one above the first light-shielding layer 151. The state blocked | interrupted with the collar part 158b is shown. In addition, when the arbitrary 1st light shielding layer 151 is corresponded to the 1st light shielding layer of the lowest layer, the lower layer 2nd light shielding layer 152a turns into the 3rd light shielding layer 153.

  As shown in FIG. 8, of the first light shielding layer 151, an end 173 on the lower second light shielding layer 152 a side disposed below the first light shielding layer 151 and an end surface of the lower second light shielding layer 152 a The distance between the edge 174 on the first light shielding layer 151 side is d3. Further, a virtual plane 175 including the end side 174 and the end side 172 on the first light shielding layer 151 side of the upper second light shielding layer 152b, and a direction perpendicular to one surface of the substrate 21 of the first light shielding layer 51, that is, The angle formed by the stacking direction (Z-axis direction) is β.

At this time, the black matrix substrate 150 satisfies the following mathematical formula (3).
tanβ ≦ (d3-d2) / d1 (3)

  Specifically, when the black matrix substrate 150 has, for example, β = 30 ° and d1 = 0.500 μm, d3−d2 ≧ 0.289 μm. In other words, the third light shielding layer 153 is formed such that the length of the third light shielding layer 153 protruding from the second light shielding layer 152 in the X-axis direction is 0.289 μm or more.

  With this configuration, at least a part of the polarized light L2 that is incident from the base material 21 side at the incident angle φ and incident on the end surface 156 of the first light shielding layer 151 is blocked by the third light shielding layer 153. Decrease. As a result, the polarized light L1 incident on the liquid crystal layer 8 without entering the end face 156 of the first light shielding layer 151 and the polarized light L2 reflected on the end face of the first light shielding layer 151 are difficult to be mixed.

In the black matrix substrate 150, β satisfies the following mathematical formula (4).
20 ° ≦ β ≦ 40 ° (4)

  When β <20 °, the portion where the lower second light-shielding layer 152a protrudes from the upper second light-shielding layer 152b is small in the X-axis direction. Therefore, the polarized light L2 reflected by the end face 156 of the first light-shielding layer 151 is Therefore, most of the polarized light L2 travels in the upper layer direction. For this reason, the light is mixed with the polarized light L1 incident on the liquid crystal layer 8 without entering the end face 156 of the first light shielding layer 151, and the contrast of the color display is lowered.

  On the other hand, when β> 40 °, the lower second light-shielding layer 152a is larger than the upper second light-shielding layer 152b, so that not only the polarized light L2 reflected by the end face 156 of the first light-shielding layer 151, Even the polarized light L1 that does not enter the end face 156 of the first light shielding layer 151 and is about to enter the liquid crystal layer 8 is blocked by the flange 158a of the lower second light shielding layer 152a. Therefore, the aperture ratio of the liquid crystal device 100 is reduced.

  For this reason, when the above formula (4) is satisfied, at least a part of the polarized light L2 incident from the substrate 21 side and incident on the end face 156 of the first light shielding layer 151 is blocked by the flange 158a. It is done. Therefore, the polarization L1 incident on the liquid crystal layer 8 without entering the end surface 156 of the first light shielding layer 151 and the polarization L2 reflected on the end surface 156 of the first light shielding layer 151 are mixed while suppressing a decrease in the aperture ratio. Can be difficult.

  Further, in the above formula (4), for example, if d1 = 0.500 μm, then d3−d2≈0.182 μm when β = 20 °. When β = 40 °, d3−d2 = 0.420 μm. In this way, by forming d3-d2 in accordance with the distribution of the incident angle φ of the polarized light incident on the third light shielding layer 153, the polarization L2 reflected by the end face 156 of the first light shielding layer 151 is efficiently reflected by the flange portion 158a. Can block well.

As described above, according to the black matrix substrate 150 according to the present embodiment, the following effects can be obtained.
The black matrix substrate 150 includes the third light-shielding layer 153 between the base material 21 and the first light-shielding layer 151, so that the first light-shielding layer 151 is compared with the case where the third light-shielding layer 153 is not provided. The polarized light L2 that is about to enter the end face 156 is blocked by the third light shielding layer 153, and the polarized light L2 reflected by the end face 156 of the first light shielding layer 151 can be reduced.

  As a result, the polarized light L1 that is incident on the liquid crystal layer 8 without being incident on the end face 156 of the first light shielding layer 151 and the polarized light L2 that is reflected by the end face 156 of the first light shielding layer 151 and whose polarization state is changed are hardly mixed. be able to.

  In addition, the present embodiment includes a step of forming the third light shielding layer 153 between the base material 21 and the first light shielding layer 51 in Step S1 of the method for manufacturing the black matrix substrate 50 described in the first embodiment. The third light shielding layer 153 is formed using the same film forming material as that of the second light shielding layer 52.

  According to this manufacturing method, as compared with the black matrix substrate 50 that does not include the third light shielding layer 153, the polarization L2 reflected by the end face 156 of the first light shielding layer 51 can be reduced.

  In addition, since the third light shielding layer 153 has light absorptivity, when the liquid crystal device 100 is a direct-view type, it is possible to suppress a decrease in appearance due to external light reflection.

(Third embodiment)
<Configuration of black matrix substrate>
FIG. 9 is a schematic cross-sectional view showing the configuration of the black matrix substrate 250 according to the third embodiment. The black matrix substrate 250 according to this embodiment is different from the black matrix substrate 50 described in the first embodiment in that the color filter layer 64 is not provided.

  As shown in FIG. 9, the black matrix substrate 250 is similar to the black matrix substrate 50 described in the first embodiment, and the first light shielding layer 51 and the first light shielding layer 51 are formed on the base material 21 and the base material 21. A laminated film 55 having a six-layer structure including the laminated second light shielding layer 52.

  Since the black matrix substrate 250 does not include the color filter layer 64, the upper layer is uneven. Accordingly, a planarization layer (protective film) 216 is formed as an overcoat layer so as to fill the concave portion 35 on the laminated film 55 and planarized. Further, a counter electrode (common electrode) 219 as a transparent conductive film is provided on the planarization layer 216.

  The end surface (side surface) 57 of the second light shielding layer 52 protrudes from the end surface (side surface) 56 of the first light shielding layer 51 in the cross-sectional view from the Y-axis direction, as in the first embodiment. That is, the second light shielding layer 52 has a flange portion 58 protruding like a ridge on the upper layer side of the first light shielding layer 51.

  As described above, the black matrix substrate 250 according to this embodiment can obtain the same effect as that of the first embodiment even when the color filter layer 64 provided in the first embodiment is not provided. it can.

(Fourth embodiment)
<Electronic equipment>
FIG. 10 is a schematic diagram illustrating a head mounted display 400 as an example of an electronic device, and FIG. 11 is a perspective view illustrating a configuration of another example of the electronic device. An electronic apparatus as a fourth embodiment will be described with reference to FIGS. 10 and 11.

  As shown in FIG. 10, a head mounted display (HMD) 400 as an electronic device has two display units 401 provided corresponding to the left and right eyes.

  By wearing the head mounted display 400 on the head like glasses, characters and images displayed on the display unit 401 can be seen. For example, if an image in consideration of parallax is displayed on the left and right display units 401, a stereoscopic video can be seen and enjoyed.

  The display unit 401 includes the liquid crystal device 100 including the black matrix substrate 50 described in the above embodiment. Therefore, since a reduction in display contrast is suppressed, a lightweight head mounted display 400 having excellent display quality can be provided.

The head mounted display 400 is not limited to the configuration in which the display content of the display unit 401 is directly viewed, and may be configured to view the display content indirectly by a mirror or the like.
Moreover, the head mounted display 400 is not limited to having the two display units 401, and may be configured to include one display unit 401 corresponding to one of the left and right eyes.

  As shown in FIG. 11A, a mobile personal computer 500 as an example of an electronic device includes a liquid crystal device 100 as a display unit and a main body 510. The main body 510 is provided with a power switch 501 and a keyboard 502.

  As shown in FIG. 11B, a mobile phone 600 as an example of an electronic device includes a plurality of operation buttons 601 and scroll buttons 602, and a liquid crystal device 100 as a display unit. By operating the scroll button 602, the screen displayed on the liquid crystal device 100 is scrolled.

  As shown in FIG. 11C, a personal digital assistant (PDA) 700 as an example of an electronic device includes a plurality of operation buttons 701, a power switch 702, and the liquid crystal device 100 as a display unit. When the operation button 701 is operated, various types of information such as an address book and a schedule book are displayed on the liquid crystal device 100.

  By using the liquid crystal device 100 including such a black matrix substrate 50 for an electronic device, it is possible to provide an electronic device having excellent display quality, in which display contrast is prevented from being lowered. The liquid crystal device 100 used in the display unit 401 or the display unit may be configured to include the black matrix substrate 150 of the second embodiment or the black matrix substrate 250 of the third embodiment.

  Further, the electronic device on which the black matrix substrate is mounted is not limited to the head mounted display 400, the mobile personal computer 500, the mobile phone 600, and the information mobile terminal 700.

  For example, it can be used for various electronic devices such as EVFs, small projectors, pico projectors, head-up displays, smartphones, mobile computers, digital cameras, digital video cameras, displays, in-vehicle devices, audio devices, exposure devices, and lighting devices.

  Note that the present invention is not limited to the above-described embodiment, and various modifications and improvements can be added to the above-described embodiment. A modification will be described below.

(Modification)
The electro-optical device including the black matrix substrate is not limited to the liquid crystal device 100. For example, the present invention is also applied to display devices such as OLED (Organic Light-Emitting Diode, organic EL device), SED (Surface-conduction Electron-emitter Display), MEMS (Micro Electro Mechanical Systems) display. be able to. By using the black matrix substrate, a display device capable of controlling optical characteristics such as viewing angle can be realized.

  3a ... scanning line, 3b ... capacitance line, 6a ... data line, 8 ... liquid crystal layer, 9 ... sealing material, 10 ... element substrate, 11 ... base material, 12 ... side, 13 ... side, 14 ... side DESCRIPTION OF SYMBOLS 15 ... Side part, 16 ... Planarization layer (protective film), 17 ... Pixel electrode, 18 ... Orientation film, 19 ... Counter electrode (common electrode), 20 ... Counter substrate, 21 ... Base material, 22 ... Orientation film, 23 Data line drive circuit, 24 ... Inspection circuit, 25 ... Scanning line drive circuit, 26 ... Wiring, 27 ... External connection terminal, 28 ... Light shielding part, 29 ... Vertical conduction part, 30 ... Thin film transistor (TFT), 35 ... Recessed part 36... Opening part 41. Capacitor element 43. Pixel circuit 50. Black matrix substrate 51. First light shielding layer 52. Second light shielding layer 55 55 Multilayer film 56 End face (side surface) 57 ... end face (side face), 58 ... collar, 61 ... colored layer (R), 62 ... colored layer (G), 3 ... Colored layer (B), 64 ... Color filter layer, 71 ... End side, 72 ... End side, 73 ... End side, 75 ... Virtual surface, 81 ... First light shielding film, 82 ... Second light shielding film, 85 ... Laminated film, 90 ... resist pattern, 100 ... liquid crystal device, 150 ... black matrix substrate, 151 ... first light shielding layer, 152 ... second light shielding layer, 152a ... lower second light shielding layer, 152b ... upper second light shielding layer, 153 ... third light shielding layer, 155 ... laminated film, 156 ... end face (side face), 157 ... end face (side face), 158 ... collar part, 158a ... collar part, 158b ... collar part, 159 ... end face (side face), 172 ... end Side, 173 ... End side, 174 ... End side, 175 ... Virtual plane, 216 ... Planarization layer (protective film), 219 ... Counter electrode (common electrode), 250 ... Black matrix substrate, 400 ... Head mounted display (HMD) 401 ... Display , 500 ... Personal computer, 501 ... Power switch, 502 ... Keyboard, 510 ... Main unit, 600 ... Mobile phone, 601 ... Operation button, 602 ... Scroll button, 700 ... Personal digital assistant (PDA), 701 ... Operation button, 702 ... Power switch, L ... polarized light, L1 ... polarized light, L2 ... polarized light, θ ... incident angle, φ ... incident angle.

Claims (20)

A translucent substrate;
A first light-shielding layer disposed on one surface of the substrate;
A second light-shielding layer disposed on a surface of the first light-shielding layer opposite to the substrate,
An end face of the second light shielding layer protrudes from an end face of the first light shielding layer in a sectional view.   The black matrix substrate according to claim 1, wherein a reflectance of the second light shielding layer is smaller than a reflectance of the first light shielding layer. The first light shielding layer includes aluminum or an aluminum alloy,
The black matrix substrate according to claim 1, wherein the second light shielding layer includes a metal nitride. The thickness of the first light shielding layer in the direction perpendicular to one surface of the substrate is d1,
The distance between the edge on the second light shielding layer side of the end face of the first light shielding layer and the edge on the first light shielding layer side of the end face of the second light shielding layer is d2,
A virtual surface including an end side on the substrate side of an end face of the first light shielding layer and an end side on the first light shielding layer side of an end face of the second light shielding layer; an end face of the first light shielding layer; The black matrix substrate according to any one of claims 1 to 3, wherein the following formula (1) is satisfied, where α is an angle formed by:
tanα ≦ d2 / d1 (1) The black matrix substrate according to claim 4, wherein α satisfies the following mathematical formula (2).
20 ° ≦ α ≦ 40 ° (2) A third light shielding layer is provided between the substrate and the first light shielding layer;
6. The black matrix substrate according to claim 1, wherein an end surface of the third light shielding layer protrudes from an end surface of the first light shielding layer in a cross-sectional view.   6. The black matrix substrate according to claim 1, wherein the first light-shielding layer and the second light-shielding layer are alternately laminated a plurality of times.   8. The black matrix substrate according to claim 7, wherein a width of the first light shielding layer and a width of the second light shielding layer are reduced toward an upper layer on the substrate. 9. Among the light-shielding layers laminated a plurality of times,
Of the end face of the arbitrary first light-shielding layer, the lower-side second light-shielding layer-side edge disposed in the lower layer of the first light-shielding layer and the first light-shielding layer side of the end face of the lower-layer second light-shielding layer D3 is the distance between the edge and
Among the end surfaces of the lower second light-shielding layer, the first light-shielding layer side edge and the upper second light-shielding layer side edge disposed on the first light-shielding layer are included. 8. The black matrix substrate according to claim 7, wherein the following formula (3) is satisfied, where β is an angle formed between a virtual surface and a direction perpendicular to one surface of the substrate.
tanβ ≦ (d3-d2) / d1 (3) The black matrix substrate according to claim 9, wherein β satisfies the following mathematical formula (4).
20 ° ≦ β ≦ 40 ° (4)   It is provided in a region defined by the first light shielding layer and the second light shielding layer, and includes at least a colored layer selected from R (red), G (green), and B (blue). The black matrix substrate according to any one of claims 1 to 10.   Among the colored layers of R (red), G (green), and B (blue), the size of the region where the colored layer of one color is provided is the size of the region where the colored layer of another color is provided. The black matrix substrate according to claim 11, which is different in size.   An electro-optical device comprising the black matrix substrate according to any one of claims 1 to 12.   An electronic apparatus comprising the black matrix substrate according to any one of claims 1 to 12. A film forming step of forming a laminated film by forming a first light shielding layer and a second light shielding layer on a light-transmitting substrate;
A resist pattern forming step of forming a resist pattern having an opening on the laminated film;
Using the resist pattern as a mask, performing an etching process on the laminated film to remove the laminated film in the opening and forming a recess, and
The method for manufacturing a black matrix substrate, wherein an etching rate of the second light shielding layer is slower than an etching rate of the first light shielding layer.   16. The method for manufacturing a black matrix substrate according to claim 15, wherein, in the film forming step, the second light shielding layer is formed using a film forming material having a reflectance lower than that of the first light shielding layer. The film forming step includes a step of forming a third light shielding layer between the substrate and the first light shielding layer,
17. The method for manufacturing a black matrix substrate according to claim 15, wherein the third light shielding layer is formed using the same film forming material as the second light shielding layer.   18. A colored layer forming step for forming a colored layer selected from at least R (red), G (green), and B (blue) in the concave portion. The method for producing a black matrix substrate according to any one of the above. An overcoat layer forming step of forming an overcoat layer covering at least the laminated film and the colored layer;
A transparent conductive film forming step of forming a transparent conductive film by laminating on the overcoat layer;
The method for manufacturing a black matrix substrate according to claim 18, comprising:   The colored layer forming step forms the colored layer of B (blue) last among the colored layers of at least R (red), G (green), and B (blue). The method for manufacturing a black matrix substrate according to claim 19.

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