KR102286361B1 - Organic light emmiting diode display device and method thereof - Google Patents

Abstract

The present invention discloses an organic light emitting display device. In particular, the present invention is a white-top emission type organic light emitting display device that implements WRGB by adopting a color filter in a white OLED (White OLED), which has excellent moisture barrier properties and improved transmittance. It relates to an organic light emitting display device to which a structure is applied and a method for manufacturing the same.
According to an embodiment of the present invention, an organic light emitting diode emitting white color is provided, a light transmission pattern is formed with a material having excellent transmittance properties on the light emitting area, and a filler having excellent moisture blocking properties is applied on the non-emission area. There is an effect of simultaneously improving the transmittance and moisture barrier properties of the electroluminescent display device, and increasing the reliability of the device.

Description

Organic light emitting display device and manufacturing method thereof

The present invention relates to an organic light emitting display device, and more particularly, a white-top emission type organic light emitting display device in which WRGB is realized by employing a color filter in a white OLED (OLED). It relates to an organic light emitting display device to which a structure having excellent moisture barrier properties and improved transmittance is applied, and a method for manufacturing the same.

Organic Light Emitting Diode Display Device (OLED) is a flat panel display device to which an organic light emitting diode with a functional thin film type organic light emitting layer is inserted between an anode and a cathode, and a hole and a cathode respectively. It is a display device to which the principle of emitting light as electrons and holes recombine in the organic light emitting layer by injection of electrons is applied.

An organic light emitting diode display having such characteristics is largely divided into a passive matrix type and an active matrix type. The passive matrix type has a structure in which devices are configured in a matrix form while crossing signal lines, and the active matrix type has a structure in which thin film transistors, which are switching devices that turn on/off pixels, are positioned for each pixel.

As a recent trend, research on an active matrix type organic light emitting display device capable of realizing a high resolution or a large screen is being actively conducted because the passive matrix type has many limiting factors such as resolution, power consumption, and lifespan.

1 is a diagram schematically showing a cross-section of a part of a conventional active matrix type organic light emitting display device.

In general, the organic light emitting display device 10 is divided into a top emission type and a bottom emission type according to the transmission direction of the light emitted through the organic light emitting layer 15, the bottom emission type Silver has a high degree of stability and freedom of the process, but there is a limit to the aperture ratio, so there is a limit to its application to high-resolution products. Accordingly, recently, research on a top emission method having a high aperture ratio and high resolution is being actively conducted. In the drawing, the structure of the white-top emission type organic light emitting display device 10 is exemplified.

Referring to FIG. 1 , a conventional organic light emitting display device 10 is configured by bonding a lower substrate 11 and an upper substrate 21 disposed to face the lower substrate 11 . The lower substrate 11 and the upper substrate 21 are spaced apart from each other by a predetermined distance, and are bonded through a seal pattern 30 formed at an edge thereof. A filler 35 is interposed between the lower substrate 11 and the upper substrate 21 .

At least one thin film transistor Tr for each pixel area and an organic light emitting diode EL connected thereto are formed on one surface of the lower substrate 11, and the organic light emitting diode EL includes a first electrode 13 and a first An organic light emitting layer 15 emitting light of a specific color is formed on an upper portion of the electrode 13 , and a second electrode 17 opposite to the first electrode 13 is formed on the organic light emitting layer 15 . The organic light emitting diode EL having such a structure is configured by using the first electrode 13 as an anode and the second electrode 17 as a cathode. In addition, each thin film transistor Tr is connected to the first electrode 13 as an anode.

Here, the organic light emitting layer 15 expresses red, green, and blue (R, G, B), and a separate organic material emitting red, green, and blue (R, G, B) is patterned for each pixel area. use it

Such an organic light emitting display device has a disadvantage in that the thin film transistor Tr and the organic light emitting layer 15 are deteriorated due to the penetration of external oxygen and moisture. In order to improve this disadvantage, an additive (getter) made of an organic or inorganic material having a moisture barrier property may be added to the filler 35 interposed inside the substrate. In this case, there is a problem in that the light transmittance inside the substrate is lowered.

In particular, in the upper emission method illustrated in FIG. 1 , when light emitted from the organic light emitting layer 15 passes through the upper filler 35 and exits to the outside of the upper substrate 21 , the transmittance is lowered by the filler 35 . Accordingly, there is a problem in that the luminance of the image is lowered. In addition, light emitted from the organic light emitting layer 15 is light corresponding to red, green, and blue (R, G, and B) and may have different luminance as well as color characteristics while passing through the filler 35 . In order to compensate for this, increasing the luminance causes another problem in that power consumption increases.

Accordingly, it is difficult to use an additive for blocking moisture in the filler 35 for blocking moisture. will do

Accordingly, there is a need for an organic light emitting display device that satisfies both the light transmittance improvement and the moisture blocking function, and a method for manufacturing the same.

An object of the present invention is an organic light emitting display device that overcomes the problem of lowering transmittance while blocking moisture penetration into the interior by adding an additive having a water penetration characteristic to a filler interposed between two substrates in a top emission type organic light emitting display device. And to provide a manufacturing method thereof.

According to an embodiment of the present invention, there is provided an organic light emitting display device comprising: a lower substrate having a light emitting area and a non-emission area; an organic light emitting diode formed on the lower substrate; a light transmission pattern disposed on the organic light emitting diode and formed to correspond to the light emitting region; and a filler formed in the non-emissive region to fill between the light transmitting patterns.

In addition, a method of manufacturing an organic light emitting display device according to an embodiment of the present invention includes the steps of: forming an organic light emitting diode on a lower substrate having a light emitting region and a non-emitting region; forming a light transmitting pattern on an upper substrate to correspond to the light emitting region; forming a filler in the non-emission area to fill in the space between the light transmission patterns; and bonding the upper substrate and the lower substrate.

According to an embodiment of the present invention, a light-transmitting pattern is formed with an organic light-emitting diode emitting white light, a material having excellent transmittance properties is formed on the light-emitting area, and a filler having excellent moisture blocking properties is applied on the non-emissive area. And it is possible to provide an organic light emitting display device having improved moisture barrier properties at the same time, and a method for manufacturing the same.

1 is a diagram schematically showing a cross-section of a part of a conventional active matrix type organic light emitting display device.
2A and 2B are a plan view and a cross-sectional view of an organic light emitting display device according to a preferred embodiment of the present invention, and FIG. 2C is an enlarged view of part A of FIG. 2A .
3 is a view showing a partial cross-section (a cross-sectional view taken along III-III' of FIG. 2C) of an organic light emitting display device according to an embodiment of the present invention.
4A to 4F are cross-sectional views illustrating a manufacturing method of an upper substrate of an organic light emitting display device according to an embodiment of the present invention.
5A to 5D are views showing cross-sectional views of a manufacturing process of a lower substrate.
6 is a diagram schematically illustrating a cross-section of an organic light emitting display device according to another embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the technical field to which the present invention belongs It is provided to fully inform the possessor of the scope of the invention, and the present invention is only defined by the scope of the claims.

The shapes, sizes, proportions, angles, numbers, etc. disclosed in the drawings for explaining the embodiments of the present invention are exemplary, and thus the present invention is not limited to the illustrated matters. Like reference numerals refer to like elements throughout. In addition, in describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

When 'including', 'having', 'consisting', etc. mentioned in this specification are used, other parts may be added unless 'only' is used. When a component is expressed in the singular, the case in which the plural is included is included unless otherwise explicitly stated.

In interpreting the components, it is interpreted as including an error range even if there is no separate explicit description.

In the case of a description of the positional relationship, for example, when the positional relationship of two parts is described as 'on', 'on', 'on', 'beside', etc., 'right' Alternatively, one or more other parts may be positioned between the two parts unless 'directly' is used.

In the case of a description of a temporal relationship, for example, 'immediately' or 'directly' when a temporal relationship is described with 'after', 'following', 'after', 'before', etc. It may include cases that are not continuous unless this is used.

Although the first, second, etc. are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from another. Accordingly, the first component mentioned below may be the second component within the spirit of the present invention.

Each feature of the various embodiments of the present invention may be partially or wholly combined or combined with each other, technically various interlocking and driving are possible, and each of the embodiments may be implemented independently of each other or may be implemented together in a related relationship. may be

Hereinafter, an organic light emitting display device and a manufacturing method thereof according to a preferred embodiment of the present invention will be described with reference to the drawings.

A white organic light emitting diode (WOLED) is applied to the organic light emitting display device of the present invention in an advantageous manner such as improvement of fairness and yield. The white organic light emitting display device may be implemented by forming all of a plurality of organic light emitting materials emitting red, green, and blue respectively in the organic light emitting layer, or by forming at least two organic light emitting materials having a complementary color relationship with each other.

2A and 2B are a plan view and a cross-sectional view of an organic light emitting display device according to a preferred embodiment of the present invention, and FIG. 2C is an enlarged view of part A of FIG. 2A .

2A to 2C , the organic light emitting display device 100 of the present invention includes a lower substrate 110 on which an array element layer D is formed, and an upper substrate 210 on which a color filter 245 is formed. , and a seal pattern 300 for bonding the two substrates and sealing the inside.

The array element layer D formed on one surface of the lower substrate 110 may include a plurality of organic light emitting diodes for each pixel area PX and a plurality of thin film transistors connected to each organic light emitting diode.

In addition, referring to FIGS. 2A and 2C , the black matrix 243 corresponding to the non-emission region is formed on the upper substrate 210, and the three primary color light emitting parts R, G, and B and the white light emitting part (R, G, B) and the white light emitting part ( W) is defined. A color filter 245 for realizing red, green, and blue is included in the three primary color light emitting units R, G, and B. Here, as the organic light emitting diode emits white light, a color resin for a specific color constituting the color filter 245 is formed in the region corresponding to the white light emitting part W except for the three primary color light emitting parts R, G, and B. It consists of an empty space that cannot be filled.

Then, the lower substrate 110 and the upper substrate 210 are spaced apart from each other by a predetermined distance and are bonded to each other so that the inside is sealed by the seal pattern 300 surrounding the four side edge regions of the substrate. According to this configuration, in the organic light emitting display device 100 of the present invention, an organic light emitting diode emitting white light is provided on the lower substrate 110 , and a color filter 245 for implementing three primary colors is provided on the upper substrate 210 . As it is provided in the structure, color characteristics may be improved compared to the conventional structure.

Also, as shown in FIG. 2B , a plurality of light transmitting patterns 260 are formed between the color filter 245 of the upper substrate 210 and the array element layer D. As shown in FIG. The light transmitting pattern 260 is positioned between the array element layer D and the color filter 245 in the vertical direction, including the white light emitting part W, and corresponds to all the light emitting parts R, G, B, and W. formed to be In particular, since the color filter 245 does not exist in the white light emitting portion W, the light transmitting pattern 260 ′ corresponding to the white light emitting portion W is directly formed on the upper substrate 210 .

In addition, the filler 280 is filled in between each light transmission pattern 260 so that an empty space is not generated inside the substrate. That is, the filler 280 fills the space between the light transmission patterns 260 and is formed in the non-emission area.

The light transmission pattern 260 is made of a transparent resin material having high transmittance, and allows light emitted from the organic light emitting diode to be emitted upward through the color filter 245 without loss due to the filler 280 . In addition, the filler 280 filled inside the substrate except for the light transmission pattern 260 further contains an additive made of an organic or inorganic material capable of blocking moisture penetration, thereby minimizing damage to the organic light emitting diode due to moisture ingress and The reliability of the display device is improved.

Hereinafter, the structure of an organic light emitting display device according to an embodiment of the present invention will be described in more detail with reference to the drawings.

FIG. 3 is a view showing a partial cross-section (a cross-sectional view taken along III-III' of FIG. 2C) of an organic light emitting display device according to an embodiment of the present invention.

Referring to FIG. 3 , in the organic light emitting display device 100 of the present invention, a lower substrate 110 on which a plurality of thin film transistors Tr are formed, is formed on an upper portion of the thin film transistor Tr, and the thin film transistor Tr ) and a plurality of first electrodes 126 independently connected to each other, a bank 128 formed between the first electrodes 126, a red color formed on the first electrode 126 and the bank 128, It includes an organic light emitting layer 129 defining green, blue, and white light emitting regions, and a second electrode 131 formed on the organic light emitting layer 129 . In addition, the upper substrate 210 facing the lower substrate 110, the color filter 245 formed on the upper substrate 210 to correspond to the light emitting area, and the black matrix 243 formed in the non-emissive area; A plurality of light transmitting patterns 260 formed on the upper substrate 210 and the color filter 245 to correspond to the light emitting region are included, and a filler 280 is applied between the light transmitting patterns 260 . do. A seal pattern (not shown) formed to surround an edge of the substrate may be further included between the lower substrate 110 and the upper substrate 210 .

In the organic light emitting display device 100 according to an embodiment of the present invention, red (R), green (G), blue (B), and white light emitting portions W are defined for each pixel area PX, and a thin film transistor It has a structure in which the lower substrate 110 on which (Tr) and the organic light emitting diode EL are formed and the upper substrate 210 on which the color filter 245 is formed face each other and are bonded together.

A semiconductor layer 113 is formed on the lower substrate 110 , and the semiconductor layer 113 may be made of one of amorphous silicon (a-Si), polycrystalline silicon (poly-Si), or oxide. A gate insulating layer 115 is formed on the semiconductor layer 113 , and a gate electrode 117 is formed on the gate insulating layer 115 to correspond to the semiconductor layer 113 . In addition, although not shown in the drawings, the gate electrode 117 may extend in one direction to be connected to a gate line (not shown).

In addition, an interlayer insulating film 121 is formed on the entire upper surface of the gate electrode 117 , and a portion of the interlayer insulating film 121 has first and second semiconductor layer contact holes exposing a portion of the semiconductor layer 113 ( 122a, 122b) are formed.

The first and second semiconductor layer contact holes 122a and 122b are covered on the upper portion of the interlayer insulating layer 121 , and the source and drain electrodes 123 and 124 contacting the semiconductor layer 113 through the contact holes are spaced apart from each other. has been formed In addition, although not shown in the drawing, a data line (not shown) defining the pixel area PX is formed crossing the gate line (not shown), and is formed on the same layer as the source and drain electrodes 123 and 124 . can be

Accordingly, the source and drain electrodes 123 and 124, the semiconductor layer 113 in contact therewith, and the gate electrode 117 formed on the semiconductor layer 113 form one thin film transistor Tr.

A first protective layer 125 is formed on the source and drain electrodes 123 and 124 of the thin film transistor Tr and the interlayer insulating film 121 exposed between the electrodes 123 and 124 .

A contact hole for exposing a portion of the drain electrode 124 is further formed in the first protective layer 125 , and is connected to the drain electrode 124 of the thin film transistor Tr through the contact hole and is connected to the first protective layer ( 125) A first electrode 126 forming an anode as a component constituting the organic light emitting diode EL is made of a material having a relatively high work function value in the region for substantially displaying an image, that is, the light emitting region. is formed Although not shown in FIG. 3 , the first electrode 126 may be connected to the source electrode 123 depending on the type of the thin film transistor Tr.

The first electrode 126 is formed for each pixel area PX, and a bank 128 is formed between each first electrode 126 formed for each pixel area PX.

The bank 128 serves as a boundary portion for each pixel area PX, and accordingly, the first electrode 126 has a separate structure for each pixel area PX.

Next, an organic light emitting layer 129 emitting white light is formed over the entire surface of the substrate 110 including the bank 128 and the first electrode 126 exposed between the banks 128 . In addition, the organic light emitting layer 129 further includes a hole injection layer, a hole transporting layer, an electron transporting layer and an electron injection layer in order to increase luminous efficiency. can do. In addition, a second electrode 131 constituting a cathode is formed on the entire surface of the organic light emitting layer 129 . According to this structure, the first and second electrodes 126 and 131 and the organic light emitting layer 129 formed between the first and second electrodes 126 and 131 form one organic light emitting diode EL.

Here, since the second electrode 131 is formed of a translucent metal film in which a metal material having a low work function is thinly deposited, the light emitted from the organic light emitting layer 129 is emitted in the direction of the second electrode 131 in the upper emission method. is driven

In addition, a second passivation layer 135 is formed on the second electrode 131 . The second passivation layer 135 may be formed of an inorganic insulating layer or an organic insulating layer.

In addition, in order to further improve the moisture barrier effect on the upper layer of the lower substrate 110, a moisture barrier film 140 may be further attached, and the moisture barrier film 140 may be omitted depending on the characteristics or structure of the device. .

Meanwhile, a black matrix 243 is formed in a non-emission region on the upper substrate 210 that faces and faces the lower substrate 110 . The black matrix 243 may use an opaque resin or have a laminated structure of chromium (Cr) and a chromium compound (Cr/CrOX).

In addition to the black matrix 243 , the red (R), green (G), blue (G), and white light emitting parts (W) for each pixel area PX are red except for the white light emitting part (W). , green and blue color filters 245 are repeatedly arranged in sequence.

Light transmission patterns 260 and 260' having a predetermined height are formed between the color filter 245 and the lower substrate 110 .

The light transmitting pattern 260 is a transparent material and may be made of photo acryl having good light transmittance or a resin material including one or more photo acryl compounds, and the width of each light emitting part R, G ,B,W).

In addition, the light transmission pattern 260 on the color filter 245 is formed of the lower substrate 110 in consideration of the gap between the two substrates 110 and 210 and the thickness of the color filters 245R, 245G, and 245B. The upper part, that is, in FIG. 3 , may be formed to a thickness of 3 μm or more and 5 μm or less, which is a thickness (d) enough to touch the moisture barrier film 140 . Here, the light transmission pattern 260 may have a different thickness and protrusion from the substrate depending on the characteristics or structure of the device. In this case, the exposure and development processes in the patterning process are delayed due to the increase in thickness, which makes it unsuitable for the process time.

In addition, the thickness of each of the light transmission patterns 260 and 260 ′ may or may not be the same. In more detail, since the color filter is not formed in the white light emitting part W, the light transmitting pattern 260' on the white light emitting part W is the light transmitting pattern of the three primary color light emitting parts R, G, and B. By forming it to be relatively thicker than 260 , a gap in the entire area of the lower substrate 110 and the upper substrate 210 may be maintained the same. Alternatively, in consideration of process convenience, the thicknesses of the light transmitting patterns 260 and 260' may be the same for both the three primary color light emitting parts R, G, and B and the white light emitting part W. In this case, the light transmitting pattern 260 ′ formed on the white light emitting part W has a height deviation from the light transmitting pattern 260 formed on the three primary color light emitting parts R, G, and B by the thickness of the color filter 245 . However, it may be formed to fill the gap by using the moisture barrier film 140 or the like.

The light transmission patterns 260 and 260' are positioned on the path of the light emitted from the organic light emitting layer 129 of the lower substrate 110, so that the light traveling upward is not lost due to the filler 280 through the color filter ( 245), and it plays a role in allowing light to exit to the outside. In addition, as described above, the light transmission patterns 260 and 260 ′ are formed to contact the upper layer of the lower substrate 110 , and thus also serve as a spacer.

In addition, referring to FIGS. 2A and 2C , although the island shape in which the light transmission patterns 260 and 260 ′ are respectively patterned to correspond to the light emitting region is shown as an example, it may also be formed in a bar shape. . That is, the light transmitting patterns 260 and 260' are formed in a manufacturing step, and are patterned so that adjacent patterns are connected in either a vertical direction or a horizontal direction on a substrate, so that a straight structure, not an island structure, is arranged side by side. It can be formed into a bar shape. The bar-shaped light transmitting patterns 260 and 260' may be formed to connect adjacent light emitting regions.

The bar shape may be somewhat disadvantageous in blocking moisture, but has the advantage of simplifying the pattern.

Meanwhile, a predetermined filler 280 is interposed between each of the light transmission patterns 260 and 260 ′. The filler 280 serves to fill the interior of the lower and upper substrates 110 and 210 so that empty spaces do not occur and at the same time play a role of blocking moisture. getter) or silica may be further included.

The filler 280 may be formed of an epoxy or one or more acryl compounds. Alternatively, if an opaque epoxy is used or an opaque material is used as an additive, the black matrix 243 may be substituted. In this case, the black matrix 243 may be omitted.

Meanwhile, although not shown, a seal pattern (not shown) for enclosing and sealing the inside is provided on four edges of the lower and upper substrates 110 and 210 so that the two substrates are bonded to form one organic light emitting display device. do.

Here, a predetermined dam (not shown) may be further provided inside the seal pattern to further increase the moisture blocking effect. The dam may be formed of a high-viscosity epoxy-based resin material, and may be formed by adding a getter having a moisture barrier property.

Accordingly, the present invention forms a light transmission pattern with good light transmittance on a light path in an organic light emitting display device to which a white organic light emitting diode having a color filter on an upper substrate is applied, and a filler having moisture blocking properties therebetween. By interposing the , there is an effect that it is possible to provide a display device with improved light efficiency and minimized moisture penetration.

Hereinafter, a method of manufacturing an organic light emitting display device according to an embodiment of the present invention will be described with reference to the drawings.

4A to 4F are cross-sectional views illustrating a method of manufacturing an upper substrate of an organic light emitting display device according to an embodiment of the present invention, and FIGS. 5A to 5D are views illustrating a cross-sectional view illustrating a manufacturing process of the lower substrate.

4A to 4F, first, as shown in FIG. 4A, a semiconductor material is deposited on the upper substrate 110, and the deposited semiconductor material is patterned through a photolithography process using a mask to form a semiconductor. A layer 113 is formed.

Meanwhile, although not shown in the drawings, a process of further forming a buffer layer (not shown) on the entire surface of the upper substrate 110 through a sputtering deposition method or the like before forming the semiconductor layer 113 may be added. The buffer layer is formed to protect the thin film transistor formed in a subsequent process from impurities such as alkali ions leaking from the upper substrate 110, and is selectively formed using silicon oxide (SiO2), silicon nitride (SiNx), etc. can do.

Next, although not shown, an insulating layer and a conductive material layer (not shown) are deposited on the entire surface of the substrate 110 including the patterned semiconductor layer 113 . Here, as the insulating layer, one inorganic insulating material or an insulating material made of a combination of two or more may be used, and the conductive material layer is molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium. (Ti), nickel (Ni), neodymium (Nd), and may be composed of a multi-layer consisting of any one selected from the group consisting of copper (Cu) or an alloy thereof.

Next, as shown in FIG. 4B , the metal layer and the insulating layer are selectively patterned through a patterning process using a mask to form a gate insulating layer 115 and a gate electrode 117 . In particular, when the gate electrode 117 is formed, a gate wiring (not shown) may also be formed.

Next, as shown in FIG. 4C , an interlayer insulating layer 121 is formed on the entire surface of the substrate including the gate electrode 117 . In this case, the interlayer insulating layer 121 may be formed of silicon oxide (SiOx), silicon nitride (SiNx), or multiple layers thereof, like the gate insulating layer 115 . Then, the interlayer insulating layer 121 is selectively patterned to form contact holes 122a and 122b exposing a portion of the semiconductor layer 113 .

In addition, although not shown in the drawings, a conductive material (not shown) is deposited on the interlayer insulating layer 121 including the semiconductor layer contact hole (not shown). The conductive material (not shown) may be any one of aluminum (Al), aluminum alloy (AlNd), copper (Cu), copper alloy, molybdenum (Mo), molybdenum (MoTi), chromium (Cr), and titanium (Ti). or as two or more substances.

Subsequently, as shown in FIG. 4D , a conductive material is selectively patterned to contact the second region exposed through the semiconductor layer contact hole on the upper portion of the interlayer insulating layer 121 , and the data line (not shown) and The source electrode 123 and the drain electrode 124 made of the same metal material are simultaneously formed. Accordingly, the semiconductor layer 103 , the gate electrode 117 , and the source electrode 123 and the drain electrode 124 spaced apart from each other form one thin film transistor Tr. In addition, in this process, a data line (not shown) and a power line (not shown) that intersect the gate line and define a pixel area are formed.

Next, as shown in FIG. 4E , an insulating material is deposited on the entire surface of the substrate, and a first protective layer 125 exposing the drain electrode 122b of each thin film transistor Tr is formed. In this case, as the first protective layer 125 , an insulating material, for example _{, any one of inorganic insulating materials including silicon oxide (SiO 2} ) and silicon nitride (SiNx) or an organic insulating material including photo acryl (photo acryl) It can be formed by selecting any one of the materials.

Next, a conductive material layer (not shown) is deposited on the first passivation layer 125 including a contact hole, and then selectively patterned to form a first electrode 126 . In this case, the first electrode 126 may be an anode, and since the embodiment of the present invention is a top emission method, the first electrode 126 is composed of a reflective electrode and a transparent electrode. Next, as shown in FIG. 4f, an insulating material (not shown) is deposited on the entire surface of the substrate including the first electrode 126 and then selectively patterned to insulate the adjacent first electrodes 126 from each other, A bank 128 exposing a portion of the first electrode 126 is formed. Next, an organic light emitting layer 129 is formed on the bank 128 and the exposed first electrode 126 . Here, the organic light emitting layer 129 may be implemented by forming all of a plurality of organic light emitting materials emitting red, green, and blue, respectively, or by forming pairs of two organic light emitting materials having a complementary color relationship with each other, phosphorescence or fluorescence. Constructed to emit white light using a material.

Although not shown in the drawings, the organic light emitting layer 129 may further include an electron transport layer, a hole transport layer, an electron injection layer, a hole injection layer, and the like, and various modifications are possible with respect to the arrangement and structure thereof.

Next, a second electrode 131 is formed by depositing a conductive material layer (not shown) on the entire surface of the substrate including the organic light emitting layer 129 . In this case, the second electrode 131 may be a cathode electrode, and is formed of a semi-transparent metal film to allow light to travel upward. Next, the lower substrate is completed by forming the second passivation layer 135 on the second electrode 131 . In addition, in order to further improve the moisture penetration prevention characteristics, the moisture barrier film 140 may be further attached to the upper portion of the second protective layer 135 .

The moisture barrier film 140 not only fills the space between the lower substrate 110 and the upper substrate 210 and complements the step difference, but also perfectly fills the empty space inside the substrate. do.

Hereinafter, a method of manufacturing an upper substrate of an organic light emitting display device according to an embodiment of the present invention will be described with reference to the drawings.

Referring to FIGS. 5A to 5D , first, as shown in FIG. 5A , inter-color mixing between colors and preventing light leakage at the boundary of each light emitting unit R, G, B, and W on the upper substrate 210 A black matrix 243 for blocking the area is formed. The black matrix 243 may be formed of an opaque resin or any one of chromium (Cr) and a chromium compound (Cr/CrOx).

Next, as shown in FIG. 5B , color filters 245 for the three primary colors are sequentially formed on the regions of the three primary color light emitting parts R, G, and B between the black matrices 243 . In addition, the area of the white light emitting part W is left as an empty space.

Subsequently, as shown in FIG. 5C , a transmissive material made of a resin material, such as photoacrylic, is coated on the color filter 245 and patterned through a photolithography process using a mask to provide a light transmitting pattern corresponding to each light emitting region. (260, 260'). These light transmission patterns 260 and 260' may be made of photo acryl, and have a high light transmission characteristic of 95% or more of transmittance. In addition, the light transmitting pattern 260 corresponding to the three primary color light emitting parts R, G, and B is formed to have a thickness of 3 μm or more and 5 μm or less, thereby facing the lower substrate 110 and a column spacer between the substrates. ) also plays a role. The light transmitting pattern 260 ′ corresponding to the white light emitting part W may be formed to have a thickness equal to or larger than that of the light transmitting pattern 260 corresponding to the three primary color light emitting parts R, G, and B.

Next, as shown in FIG. 5D , the filler 280 is applied so that there is no empty space between the respective light transmission patterns 260 . Here, as a method of applying the filler 280, a filler 280 to which an additive 285 of a certain viscosity is added is prepared, and the viscosity is lowered by applying heat thereto, and then an inkjet process may be performed. For this, it is preferable to use a material having a low viscosity characteristic so that the filler 280 can be sufficiently interposed between the light transmission patterns 260, and it may be configured to further have a moisture barrier property by the added additive 285. .

As the filler 280, an epoxy or one or more acryl compounds may be used. In addition, as the additive 285 added to the filler 280 , a material having a moisture barrier property or silica may be used.

On the other hand, the filler 280 should be filled without an empty space between the light transmission patterns 260 . For this purpose, a low-viscosity material is used. When an additive is added, the viscosity of the filler 280 is usually increased. The inkjet method is advantageous for applying a low-viscosity material, but when a high-viscosity material is used as a filler, a slit coating method, not an inkjet method, may be applied.

According to the slit coating method, a filler is applied while moving the slit nozzle from one side of the substrate to the other using a slit coater having a slit nozzle having a length corresponding to the width of the substrate. In particular, in the slit coating method, the filler can be filled in the space between the light transmission patterns even if the viscosity is high by controlling the discharge pressure of the filler from the slit nozzle and pushing it so that no residue of the filler remains on the upper part of the light transmission pattern. .

Next, a predetermined curing process is performed with respect to the applied filler 280 . As the curing process, any one of an ultraviolet (UV) curing process, a thermal curing process, or an ultraviolet (UV) curing process and a thermal curing process may be performed simultaneously.

Meanwhile, in the above-described embodiment, the moisture barrier film 140 attached to the lower substrate may be omitted.

Thereafter, when the curing process is completed, the organic light emitting display device 100 is completed by bonding the two substrates 110 and 210 .

Referring to FIG. 6 , a sealing material is applied to any one of the lower substrate 110 and the upper substrate 210 to surround the edge of the substrate to form the seal pattern 300 in a shape surrounding the inside of the substrate. In addition, a dam 400 for sealing the inside of the seal pattern 300 and protecting the inside of the substrate from moisture is formed. Accordingly, the lower substrate 110 on which the array element layer (D) is formed, the upper substrate 210 on which the color filter 245 is formed, and a seal pattern 300 for bonding the two substrates and sealing the inside. , a dam 400 for minimizing moisture penetration and sealing the inside of the seal pattern 300 is further formed.

In addition, the array element layer (D) formed on one surface of the lower substrate 110 includes a plurality of organic light emitting diodes for each pixel area and a plurality of thin film transistors connected to each organic light emitting diode according to the above embodiment. may be the same. The dam 400 surrounds the four side edge regions of the substrate like the seal pattern 300 , and may be formed together with the light transmitting pattern 260 when the light transmitting layer is patterned in the same process (refer to FIG. 5C ). . In addition, an additive for blocking moisture, such as the filler 280 inside, may be added separately.

According to the above-described embodiment, the organic light emitting display device and the method for manufacturing the same of the present invention include a filler having a moisture penetration prevention function inside the substrate to improve light transmittance and minimize damage to the substrate due to moisture penetration. , by forming a light transmission pattern with high transmittance on the light path, both moisture penetration prevention and luminance improvement effects can be expected.

Although the above has been described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and change the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be done.

R: Red light emitting part G: Green light emitting part
B: blue light emitting part W: white light emitting part
100: organic light emitting display device 110: lower substrate
113: semiconductor layer 115: gate insulating film
117: gate electrode 121: interlayer insulating film
123: source electrode 124: drain electrode
125: first protective layer 126: first electrode
128: bank 129: organic light emitting layer
131: second electrode 135: second protective layer
140: moisture barrier film 210: upper substrate
243: black matrix 245: color filter
260: light transmission pattern 280: filler
300: seal pattern

Claims (12)

a lower substrate having a light emitting area in which a red light emitting part, a green light emitting part, a blue light emitting part, and a white light emitting part are defined, and a non-emission area outside the light emitting area;
an organic light emitting diode formed on the lower substrate;
an upper substrate facing the lower substrate;
a color filter formed on the upper substrate and facing the organic light emitting diode and corresponding to each of the red light emitting part, the green light emitting part, and the blue light emitting part;
a light transmitting pattern formed on the upper substrate and corresponding to the light emitting area and facing the organic light emitting diode; and
a filler formed on the upper substrate and corresponding to the non-emission region and filling between the color filters and the light transmitting pattern;
The filler is made of an epoxy or one or more acrylic compounds and further comprises an additive having moisture barrier properties,
The light transmission pattern in each of the red light emitting part, the green light emitting part, and the blue light emitting part is disposed between the color filter and the organic light emitting diode,
The light transmission pattern in the white light emitting part is disposed between the upper substrate and the organic light emitting diode,
In a state in which the lower substrate and the upper substrate are bonded to each other, the light transmitting pattern is in contact with a protective film covering the organic light emitting diode on the lower substrate or in contact with a moisture blocking film on the protective film. The method of claim 1,
The light transmission pattern,
An organic light emitting display device comprising photo acryl or a resin material containing one or more photo acryl compounds. The method of claim 1,
The light transmission pattern,
An organic light emitting display device formed to have a thickness of 3 μm or more and 5 μm or less. The method of claim 1,
The light transmission pattern,
An organic light emitting display device formed in the form of an island in the light emitting region. The method of claim 1,
The light transmitting pattern is formed in the form of a bar connecting adjacent light emitting regions. delete delete forming an organic light emitting diode on a lower substrate having a light emitting region and a non-emitting region;
forming a light transmission pattern corresponding to the light emitting region and facing the organic light emitting diode on an upper substrate;
forming a filler on the upper substrate to correspond to the non-emission area and fill a space between the light-transmitting patterns; and
bonding the upper substrate and the lower substrate;
The step of forming the filler is
Preparing a filler in which an additive having a moisture barrier property is added to an epoxy or one or more acrylic compounds;
applying the filler between the light transmission patterns; and
curing the filler;
In the step of bonding the upper substrate and the lower substrate, the light transmitting pattern is in contact with a protective film covering the organic light emitting diode on the lower substrate or in contact with a moisture blocking film on the protective film. Method of manufacturing an organic light emitting display device . 9. The method of claim 8,
The step of forming the light transmission pattern,
forming a light transmitting layer by applying a resin material containing photo acryl or at least one photo acryl compound; and
and patterning the light transmitting layer to correspond to the light emitting region using a mask. delete 10. The method of claim 9,
The step of applying the filler,
A method of manufacturing an organic light emitting display device using an inkjet method or a slit coating method. 10. The method of claim 9,
The step of curing the filler,
A method of manufacturing an organic light emitting display device using at least one of an ultraviolet (UV) curing method and a thermal curing method.

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