JP2010281820A5 - - Google Patents

Download PDF

Info

Publication number
JP2010281820A5
JP2010281820A5 JP2010128388A JP2010128388A JP2010281820A5 JP 2010281820 A5 JP2010281820 A5 JP 2010281820A5 JP 2010128388 A JP2010128388 A JP 2010128388A JP 2010128388 A JP2010128388 A JP 2010128388A JP 2010281820 A5 JP2010281820 A5 JP 2010281820A5
Authority
JP
Japan
Prior art keywords
test
sensor devices
sensor
sensor device
handling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2010128388A
Other languages
English (en)
Japanese (ja)
Other versions
JP5502602B2 (ja
JP2010281820A (ja
Filing date
Publication date
Priority claimed from EP09007394A external-priority patent/EP2259027B1/en
Application filed filed Critical
Publication of JP2010281820A publication Critical patent/JP2010281820A/ja
Publication of JP2010281820A5 publication Critical patent/JP2010281820A5/ja
Application granted granted Critical
Publication of JP5502602B2 publication Critical patent/JP5502602B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2010128388A 2009-06-04 2010-06-04 個々のセンサデバイスを処理する方法及び装置 Active JP5502602B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09007394.1 2009-06-04
EP09007394A EP2259027B1 (en) 2009-06-04 2009-06-04 Method and apparatus for processing individual sensor devices

Publications (3)

Publication Number Publication Date
JP2010281820A JP2010281820A (ja) 2010-12-16
JP2010281820A5 true JP2010281820A5 (enExample) 2013-07-25
JP5502602B2 JP5502602B2 (ja) 2014-05-28

Family

ID=41236439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010128388A Active JP5502602B2 (ja) 2009-06-04 2010-06-04 個々のセンサデバイスを処理する方法及び装置

Country Status (3)

Country Link
US (1) US8499609B2 (enExample)
EP (1) EP2259027B1 (enExample)
JP (1) JP5502602B2 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2418503B1 (en) 2010-07-14 2013-07-03 Sensirion AG Needle head
JP5901226B2 (ja) * 2011-10-27 2016-04-06 株式会社ディスコ ユニット搬出入装置
US9519007B2 (en) * 2012-02-10 2016-12-13 Asm Technology Singapore Pte Ltd Handling system for testing electronic components
US9711392B2 (en) 2012-07-25 2017-07-18 Infineon Technologies Ag Field emission devices and methods of making thereof
US9594111B2 (en) * 2013-02-27 2017-03-14 Infineon Technologies Ag Turret handlers and methods of operations thereof
DE102013205133A1 (de) 2013-03-22 2014-09-25 Schaeffler Technologies Gmbh & Co. Kg Motor für einen Direktantrieb eines Drehtisches
US10317382B2 (en) * 2014-02-27 2019-06-11 Life Safety Distribution Ag Gas sensor packaging including structure to maintain devices in a state of readiness
US9606171B2 (en) * 2015-01-28 2017-03-28 Asm Technology Singapore Pte Ltd High throughput test handler system
EP3106426B1 (en) 2015-06-19 2019-11-06 Invensense, Inc. Pressure sensor
US20180188318A1 (en) * 2016-12-30 2018-07-05 Asm Technology Singapore Pte Ltd Dual-feed test handling system
CN108318067B (zh) * 2018-02-28 2024-02-02 广东万家乐燃气具有限公司 自动检测装置及质检系统
CN110095143B (zh) * 2019-06-04 2020-02-18 哈尔滨理工大学 一种槽型光电传感器的可靠性检测设备

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832882A (en) * 1973-05-10 1974-09-03 Us Navy Humidity testing apparatus
US4177667A (en) * 1978-03-03 1979-12-11 The United States Of America As Represented By The Secretary Of The Navy Quick response humidity chamber
US4647432A (en) * 1982-11-30 1987-03-03 Japan Tectron Instruments Corporation Tokuyama Soda Kabushiki Kaisha Automatic analysis apparatus
US4590789A (en) * 1984-08-31 1986-05-27 Kunze Manfred C Remote calibrator
US4733553A (en) * 1986-08-25 1988-03-29 Motorola Inc. Method and apparatus for low pressure testing of a solid state pressure sensor
US4777716A (en) * 1986-08-25 1988-10-18 Motorola Inc. Method for low pressure testing of a solid state pressure sensor
EP0265816B1 (en) * 1986-10-28 1991-08-28 Sumitomo Electric Industries Limited Method of measuring semiconductor pressure sensor
US4973241A (en) * 1987-12-23 1990-11-27 Liquid Container Corporation Apparatus for in-mold labeling of a blow molded article
US5248672A (en) * 1990-11-01 1993-09-28 The Regents Of The University Of Michigan Polysubstituted benzimidazole nucleosides as antiviral agents
US5285690A (en) * 1992-01-24 1994-02-15 The Foxboro Company Pressure sensor having a laminated substrate
US5345170A (en) * 1992-06-11 1994-09-06 Cascade Microtech, Inc. Wafer probe station having integrated guarding, Kelvin connection and shielding systems
US5267467A (en) 1992-07-27 1993-12-07 Ford Motor Company Mass air flow sensor two temperature production line test apparatus
US5642056A (en) * 1993-12-22 1997-06-24 Tokyo Electron Limited Probe apparatus for correcting the probe card posture before testing
JPH10160597A (ja) 1996-11-28 1998-06-19 Fenwall Controls Of Japan Ltd 温度検出装置及びその校正装置
US5848122A (en) * 1997-03-25 1998-12-08 Advanced Technology Materials, Inc. Apparatus for rapid in-situ X-ray stress measurement during thermal cycling of semiconductor wafers
US5963027A (en) * 1997-06-06 1999-10-05 Cascade Microtech, Inc. Probe station having environment control chambers with orthogonally flexible lateral wall assembly
WO1999004276A1 (en) 1997-07-15 1999-01-28 Wentworth Laboratories, Inc. Probe station with emi shielding
WO1999046572A1 (en) * 1998-03-11 1999-09-16 True Technology, Inc. Method and apparatus for detection of leaks in hermetic packages
US6085576A (en) * 1998-03-20 2000-07-11 Cyrano Sciences, Inc. Handheld sensing apparatus
US6134941A (en) * 1998-03-23 2000-10-24 Motorola, Inc. Method of testing sensors and apparatus therefor
US6286363B1 (en) * 1998-04-02 2001-09-11 Reliance Electric Technologies, Llc Integrated multi-element lubrication sensor and health lubricant assessment system
US6867535B1 (en) * 1999-11-05 2005-03-15 Sensant Corporation Method of and apparatus for wafer-scale packaging of surface microfabricated transducers
WO2001040784A2 (de) * 1999-11-30 2001-06-07 Sensirion Ag Sensor in einem gehäuse
ATE310950T1 (de) * 1999-12-08 2005-12-15 Sensirion Ag Kapazitiver sensor
DE10000133C2 (de) * 2000-01-04 2003-06-26 Karl Suss Dresden Gmbh Prober für Drucksensoren
US6359253B1 (en) 2000-07-12 2002-03-19 Advanced Micro Devices, Inc. Unit-in-tray pocket checker
DE10047194C1 (de) * 2000-09-23 2002-03-07 Bosch Gmbh Robert Vorrichtung und Verfahren zur Prüfung eines Brandmelders
EP1397656B1 (de) 2001-06-11 2009-05-06 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und vorrichtung zum testen oder kalibrieren eines drucksensors an einem wafer
JP2003168707A (ja) * 2001-11-30 2003-06-13 Tokyo Electron Ltd プローブ装置
US7046025B2 (en) * 2002-10-02 2006-05-16 Suss Microtec Testsystems Gmbh Test apparatus for testing substrates at low temperatures
EP1628132B1 (en) * 2004-08-17 2015-01-07 Sensirion Holding AG Method and device for calibrating sensors
EP1864102A2 (en) * 2005-02-28 2007-12-12 Advanced Technology Materials, Inc. Apparatus and process for leak-testing and qualification of fluid dispensing vessels

Similar Documents

Publication Publication Date Title
JP5502602B2 (ja) 個々のセンサデバイスを処理する方法及び装置
JP2010281820A5 (enExample)
CN102301845B (zh) 用于利用电子元件来填充载带的方法和设备
TWI480560B (zh) 用於測試電子元件的分選系統及方法
TWI676036B (zh) 一體化測試及搬運機構及用以支撐複數個組件、將真空實施於複數個組件上或將一組件對準之方法
KR101561746B1 (ko) 디스플레이 셀들을 검사하기 위한 장치
EP3091566B1 (en) Substrate rotary loader
KR101854015B1 (ko) 프로브 카드 수납 장치
CN105874342B (zh) 电子零件搬送装置
US6967475B2 (en) Device transfer mechanism for a test handler
TWI546883B (zh) Semiconductor manufacturing device
KR20110048478A (ko) 반도체 부품의 고속 전달 시스템 및 방법
JP7363100B2 (ja) ピックアップ装置及びワークの搬送方法
KR101435323B1 (ko) 디스플레이 셀들을 검사하기 위한 장치
JPH05136219A (ja) 検査装置
CN114156200B (zh) 用于存储载具的装置和存储载具的方法
JP2013038348A (ja) 半導体素子の検査処理方法
KR101471752B1 (ko) 디스플레이 셀들을 검사하기 위한 장치
JP3797732B2 (ja) パーティクルの測定装置および測定方法
CN114514601A (zh) 传送系统
CN222440535U (zh) 使用旋转转塔系统测试半导体器件的系统
KR101373507B1 (ko) 디스플레이 셀들을 검사하기 위한 장치
CN111128797A (zh) 晶粒输送系统
TW201930168A (zh) 基片輸送方法和裝置
TW201916208A (zh) 檢查裝置與檢查方法