JP5502602B2 - 個々のセンサデバイスを処理する方法及び装置 - Google Patents

個々のセンサデバイスを処理する方法及び装置 Download PDF

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JP5502602B2
JP5502602B2 JP2010128388A JP2010128388A JP5502602B2 JP 5502602 B2 JP5502602 B2 JP 5502602B2 JP 2010128388 A JP2010128388 A JP 2010128388A JP 2010128388 A JP2010128388 A JP 2010128388A JP 5502602 B2 JP5502602 B2 JP 5502602B2
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test
sensor devices
several
sensor
tray
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JP2010281820A (ja
JP2010281820A5 (enExample
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フェーリクス・メイヤー
マルクス・グラフ
ドミニク・ニーダーベルガー
マルティン・フィッツィ
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ゼンジリオン・アーゲー
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D2218/00—Indexing scheme relating to details of testing or calibration
    • G01D2218/10—Testing of sensors or measuring arrangements

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Calibration Of Command Recording Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2010128388A 2009-06-04 2010-06-04 個々のセンサデバイスを処理する方法及び装置 Active JP5502602B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP09007394.1 2009-06-04
EP09007394A EP2259027B1 (en) 2009-06-04 2009-06-04 Method and apparatus for processing individual sensor devices

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JP2010281820A JP2010281820A (ja) 2010-12-16
JP2010281820A5 JP2010281820A5 (enExample) 2013-07-25
JP5502602B2 true JP5502602B2 (ja) 2014-05-28

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US (1) US8499609B2 (enExample)
EP (1) EP2259027B1 (enExample)
JP (1) JP5502602B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110095143A (zh) * 2019-06-04 2019-08-06 哈尔滨理工大学 一种槽型光电传感器的可靠性检测设备

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US9711392B2 (en) 2012-07-25 2017-07-18 Infineon Technologies Ag Field emission devices and methods of making thereof
US9594111B2 (en) * 2013-02-27 2017-03-14 Infineon Technologies Ag Turret handlers and methods of operations thereof
DE102013205133A1 (de) 2013-03-22 2014-09-25 Schaeffler Technologies Gmbh & Co. Kg Motor für einen Direktantrieb eines Drehtisches
US10317382B2 (en) * 2014-02-27 2019-06-11 Life Safety Distribution Ag Gas sensor packaging including structure to maintain devices in a state of readiness
US9606171B2 (en) * 2015-01-28 2017-03-28 Asm Technology Singapore Pte Ltd High throughput test handler system
EP3106426B1 (en) 2015-06-19 2019-11-06 Invensense, Inc. Pressure sensor
US20180188318A1 (en) * 2016-12-30 2018-07-05 Asm Technology Singapore Pte Ltd Dual-feed test handling system
CN108318067B (zh) * 2018-02-28 2024-02-02 广东万家乐燃气具有限公司 自动检测装置及质检系统

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110095143A (zh) * 2019-06-04 2019-08-06 哈尔滨理工大学 一种槽型光电传感器的可靠性检测设备

Also Published As

Publication number Publication date
US8499609B2 (en) 2013-08-06
EP2259027B1 (en) 2012-12-05
EP2259027A1 (en) 2010-12-08
JP2010281820A (ja) 2010-12-16
US20100310343A1 (en) 2010-12-09

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