JP2010245372A - 電子部品実装装置 - Google Patents
電子部品実装装置 Download PDFInfo
- Publication number
- JP2010245372A JP2010245372A JP2009093806A JP2009093806A JP2010245372A JP 2010245372 A JP2010245372 A JP 2010245372A JP 2009093806 A JP2009093806 A JP 2009093806A JP 2009093806 A JP2009093806 A JP 2009093806A JP 2010245372 A JP2010245372 A JP 2010245372A
- Authority
- JP
- Japan
- Prior art keywords
- paste
- transfer
- substrate
- electronic component
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
- Y10T156/1702—For plural parts or plural areas of single part
- Y10T156/1744—Means bringing discrete articles into assembled relationship
- Y10T156/1776—Means separating articles from bulk source
- Y10T156/1778—Stacked sheet source
- Y10T156/178—Rotary or pivoted picker
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
Abstract
【解決手段】同心円状に配置された2つの環状の貯留槽32、33を基板9に対して転写ヘッド4の移動方向に離れた位置に配置し、転写ヘッド4が貯留槽32、33と基板9の間を直線移動できるようにした。内側の貯留槽32にはペーストが貯留され、外側の貯留槽33はペーストと捨て打ち場になっており、転写ヘッド4は貯留槽32に設定された位置P1と基板9との間を移動しながらペーストの転写作業を行う。貯留槽33には捨て打ちを行う位置P2が転写ヘッド4の動線上に設定されている。
【選択図】図3
Description
うちの1つを捨て打ちの場として用いることで、専用の捨て打ちの場を設ける必要がなくなり、また、捨て打ちのために転写ヘッドが移動する距離を短縮することができる。
したりすることもできる。ピックアップヘッド2から受け取る場合は、ピックアップヘッド2の反転に伴って上下反転したチップ20を吸着し、反転したままの姿勢で実装するフリップチップ実装となる。
らペーストの転写作業を行う。第2貯留槽33には捨て打ちを行う位置P2が転写ヘッド4の動線上に設定されている。
ーのゼロリセットを行う(ST2)。捨て打ち回数カウンターは電子部品実装装置1の制御系に備わっており、捨て打ちを行った回数をカウントアップする。捨て打ち回数カウンターには前回の稼動時に行われた捨て打ち回数がカウントアップされたままとなっている場合があるので、新たな稼動開始に際してはゼロリセットする必要がある。
2 ピックアップヘッド
3 ボンディングヘッド
4 転写ヘッド
5 部品供給テーブル
6 部品中継テーブル
7 実装テーブル
8 ペースト供給テーブル
9 基板
14 第4カメラ
28 転写ピン
32 第1貯留槽
33 第2貯留槽
35 遮蔽板
38、39 底壁
50 洗浄材
Claims (3)
- 電子部品を基板に接合するためのペーストを貯留するペースト貯留部と、前記ペースト貯留部のペーストを転写ピンに付着させて基板に転写する転写ヘッドと、ペーストが転写された基板に電子部品を実装する実装ヘッドを備え、
前記ペースト貯留部は、同心円状に配置された少なくとも2つの環状の槽と、前記槽を前記同心円の中心軸周りに回転させる槽回転手段と、前記槽の断面を遮蔽する遮蔽板と、前記遮蔽板と前記槽の底壁との隙間を調節する隙間調節手段を備え、少なくとも1つの前記槽は、前記転写ピンに残留するペーストを底壁に捨て打ちするために用いられることを特徴とする電子部品実装装置。 - 前記底壁に捨て打ちされたペーストの形状を認識するためのカメラを備えたことを特徴とする請求項1に記載の電子部品実装装置。
- 前記底壁に前記転写ピンを洗浄する洗浄材を配置したことを特徴とする請求項1または2に記載の電子部品実装装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009093806A JP4766144B2 (ja) | 2009-04-08 | 2009-04-08 | 電子部品実装装置 |
US12/755,695 US8756800B2 (en) | 2009-04-08 | 2010-04-07 | Electronic component mounting method |
CN201010164017.2A CN101861091B (zh) | 2009-04-08 | 2010-04-08 | 电子元件安装设备 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009093806A JP4766144B2 (ja) | 2009-04-08 | 2009-04-08 | 電子部品実装装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010245372A true JP2010245372A (ja) | 2010-10-28 |
JP4766144B2 JP4766144B2 (ja) | 2011-09-07 |
Family
ID=42933174
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009093806A Active JP4766144B2 (ja) | 2009-04-08 | 2009-04-08 | 電子部品実装装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8756800B2 (ja) |
JP (1) | JP4766144B2 (ja) |
CN (1) | CN101861091B (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200931543A (en) * | 2007-12-03 | 2009-07-16 | Panasonic Corp | Chip mounting system |
CH705802B1 (de) * | 2011-11-25 | 2016-04-15 | Esec Ag | Einrichtung für die Montage von Halbleiterchips. |
JP6262243B2 (ja) * | 2013-09-25 | 2018-01-17 | 富士機械製造株式会社 | 部品装着装置 |
KR102238649B1 (ko) * | 2014-09-16 | 2021-04-09 | 삼성전자주식회사 | 반도체 칩 본딩 장치 |
WO2017013733A1 (ja) * | 2015-07-21 | 2017-01-26 | 富士機械製造株式会社 | 部品実装装置およびそれに用いるノズル交換方法 |
US10932401B2 (en) * | 2015-07-23 | 2021-02-23 | Fuji Corporation | Component mounting machine |
CH711536B1 (de) * | 2015-08-31 | 2019-02-15 | Besi Switzerland Ag | Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats. |
DE102016113328B4 (de) | 2015-08-31 | 2018-07-19 | Besi Switzerland Ag | Verfahren für die Montage von mit Bumps versehenen Halbleiterchips auf Substratplätzen eines Substrats |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0269948A (ja) * | 1988-09-05 | 1990-03-08 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JPH0669285A (ja) * | 1992-08-18 | 1994-03-11 | Matsushita Electric Ind Co Ltd | フラックス供給装置 |
JPH08206825A (ja) * | 1995-02-07 | 1996-08-13 | Matsushita Electric Ind Co Ltd | 半田ボールの搭載装置および搭載方法 |
JP2001007136A (ja) * | 1999-06-23 | 2001-01-12 | Shibuya Kogyo Co Ltd | 転写ヘッドのクリーニング装置及び方法 |
JP2001358451A (ja) * | 2000-06-13 | 2001-12-26 | Nippon Steel Corp | 導電性ボール搭載装置 |
JP2002059056A (ja) * | 2000-08-22 | 2002-02-26 | Yamaha Motor Co Ltd | 塗布装置 |
JP2003298292A (ja) * | 2002-04-02 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法ならびにペースト供給装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4372605B2 (ja) * | 2004-04-15 | 2009-11-25 | パナソニック株式会社 | 電子部品搭載装置および電子部品搭載方法 |
-
2009
- 2009-04-08 JP JP2009093806A patent/JP4766144B2/ja active Active
-
2010
- 2010-04-07 US US12/755,695 patent/US8756800B2/en active Active
- 2010-04-08 CN CN201010164017.2A patent/CN101861091B/zh active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0269948A (ja) * | 1988-09-05 | 1990-03-08 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
JPH0669285A (ja) * | 1992-08-18 | 1994-03-11 | Matsushita Electric Ind Co Ltd | フラックス供給装置 |
JPH08206825A (ja) * | 1995-02-07 | 1996-08-13 | Matsushita Electric Ind Co Ltd | 半田ボールの搭載装置および搭載方法 |
JP2001007136A (ja) * | 1999-06-23 | 2001-01-12 | Shibuya Kogyo Co Ltd | 転写ヘッドのクリーニング装置及び方法 |
JP2001358451A (ja) * | 2000-06-13 | 2001-12-26 | Nippon Steel Corp | 導電性ボール搭載装置 |
JP2002059056A (ja) * | 2000-08-22 | 2002-02-26 | Yamaha Motor Co Ltd | 塗布装置 |
JP2003298292A (ja) * | 2002-04-02 | 2003-10-17 | Matsushita Electric Ind Co Ltd | 電子部品実装装置および電子部品実装方法ならびにペースト供給装置 |
Also Published As
Publication number | Publication date |
---|---|
CN101861091A (zh) | 2010-10-13 |
CN101861091B (zh) | 2014-09-17 |
JP4766144B2 (ja) | 2011-09-07 |
US8756800B2 (en) | 2014-06-24 |
US20100257728A1 (en) | 2010-10-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4766144B2 (ja) | 電子部品実装装置 | |
TWI351905B (ja) | ||
TWI480965B (zh) | Solder ball inspection repair device and solder ball detection repair method | |
JP6155468B2 (ja) | 電子部品実装方法及び電子部品実装システム | |
US20140001241A1 (en) | Solder ball printing and mounting apparatus | |
US20150163969A1 (en) | Electronic component mounting system and electronic component mounting method | |
JP6617298B2 (ja) | 電子部品実装装置 | |
US8122595B2 (en) | Electronic parts mounting device | |
JP2006108200A (ja) | はんだ印刷システム | |
JP2006318994A (ja) | 導電性ボール配列装置 | |
JP2017191798A (ja) | 電子部品実装装置およびディスペンサ | |
JP2013045873A (ja) | 実装部品検査装置及び実装部品検査方法 | |
JP2016082087A (ja) | 電子部品実装方法 | |
JP6322815B2 (ja) | 電子部品実装装置 | |
JP2007157741A (ja) | 導電性ボールの配列装置 | |
JP7005868B2 (ja) | ボール供給装置及びボール搭載装置 | |
JP6506244B2 (ja) | ボール搭載装置 | |
JP6357650B2 (ja) | 電子部品実装装置 | |
JP4985684B2 (ja) | 電子部品実装装置 | |
JP2012199326A (ja) | フラックス転写装置 | |
JP2006043882A (ja) | マウントヘッド | |
JP2006351932A (ja) | 導電性ボール配列装置 | |
JP2006253713A (ja) | 電子部品実装方法 | |
JP2010225967A (ja) | 電子部品実装装置 | |
CN115139518A (zh) | 3d打印设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110117 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20110511 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110517 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110530 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 4766144 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20140624 Year of fee payment: 3 |