JP2010225923A - Bonding apparatus and bonding method for adhesive tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus which can reliably release a mold release tape from an adhesive tape bonded on a substrate. <P>SOLUTION: The bonding apparatus includes a cutting mechanism 34 for forming opening parts 3 at intervals of a predetermined distance in an adhesive tape 2 fed from a supply reel 19 together with a mold release tape 1 along a pair of cutting lines 4 reaching to the depth of the mold release tape 1 and also for forming a bent line 4a between the pair of cutting lines of the mold release tape, a removal mechanism 35 for removing the opening part of the adhesive tape from the mold release tape, a pressing tool 24 for bonding a predetermined length of the adhesive tape which has the open part removed therefrom and is positioned to face a side of the substrate on a substrate, a releasing means 26 which has releasing rollers 52, 53 for bending the opening-part removed part of the mold release tape along the cutting and bending lines and which releases the mold release tape from the adhesive tape bonded on the substrate by the releasing roller, and a take-up reel 22 for taking up the mold release tape released from the adhesive tape. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an adhesive tape attaching apparatus and an attaching method for attaching an adhesive tape to an adherend such as a glass substrate used in a liquid crystal display panel.

  For example, in a manufacturing process of a flat panel display typified by a liquid crystal display panel or a plasma display panel, a TCP (Tape Carrier Package) is attached to a terminal portion provided on a side surface of a glass substrate as an adherend member. There is a step of attaching an electronic component such as) through an anisotropic conductive adhesive tape formed of a thermosetting resin containing metal particles having a diameter of μm.

  Before the electronic component is attached to the terminal portion on the upper surface of the side portion of the substrate, the adhesive tape cut to a predetermined length is attached to the upper surface of the side portion of the substrate. The pressure-sensitive adhesive tape is wound around a supply reel while being stuck to a release tape formed of a synthetic resin.

  When attaching an electronic component to the upper surface of the side portion of the substrate with an adhesive tape, first, the adhesive tape fed out from the supply reel together with the release tape is cut into a predetermined length.

  The adhesive tape cut to a predetermined length is positioned so as to face the terminal portion on the upper surface of the side portion of the substrate that is pulled out from the supply reel together with the release tape by a chuck or the like and held by suction on the upper surface of the table.

  Then, the cut adhesive tape is pressed and heated on the side of the substrate by a pressure tool having a heater, and then has a peeling means for peeling the release tape from the adhesive tape adhered to the substrate. If it is peeled off, the peeled release tape is taken up on a take-up reel. At the same time, a new substrate is supplied and placed on the table.

  By winding the release tape on the take-up reel, a new portion of the adhesive tape cut to a predetermined length is positioned above the side portion of the new substrate on the table. Thereby, it is repeatedly performed that the new part cut | disconnected by the predetermined length of the adhesive tape is affixed on the said board | substrate. Such prior art is disclosed in Patent Document 1.

  As shown in FIG. 6 (a), when the adhesive tape 2 attached to the release tape 1 is cut to a predetermined length L, a pair of adhesive tapes 2 cut to a predetermined length The hollow portion 3 is cut and formed by the cutting line 4. In order to reliably divide the hollow portion 3 from the other portion of the adhesive tape 2, the cutting line 4 reaches about one half of the thickness of the release tape 1 as shown in FIG. 6 (b). Formed in depth. That is, the release tape 1 is half cut.

  The hollow portion 3 of the adhesive tape 2 is extracted before the adhesive tape 2 cut to a predetermined length is attached to the substrate. Accordingly, when the pressure-sensitive adhesive tape 2 cut to a predetermined length is pressed and heated on a substrate by a pressure tool, the portion of the pressure-sensitive adhesive tape 2 cut to a predetermined length by the pressure tool is attached. The entire length can be reliably pressed and securely attached to the substrate.

  In other words, the pressurizing tool reliably pressurizes only the adhesive tape 2 cut to a predetermined length to be attached to the substrate, and pressurizes the end of the adhesive tape located on the upstream side of the adhesive tape 2. Can be prevented.

  When the release tape 1 is peeled off from the adhesive tape 2 adhered to the substrate by the peeling roller, the release tape 1 is held and fixed by the chuck, and then the peeling roller engaged with the release tape 1 is placed on the substrate side. Drive along the side. Thereby, the release tape 1 is peeled off while being bent upward with respect to the adhesive tape 2 attached to the substrate.

  When the release tape 1 is peeled from the adhesive tape 2, the start of peeling starts from a portion 1a from which the hollow portion 3 of the release tape 1 is removed as shown in FIG. Since a pair of cutting lines 4 are formed at predetermined intervals when the hollow portion 3 is cut in the portion 1a, the release tape 1 is peeled while being bent upward by the pair of cutting lines 4. become.

Japanese Patent Laid-Open No. 10-135274

  By the way, the part from which the said hollow part 3 of the said release tape 1 was removed only has a pair of cutting line 4 formed in the space | interval corresponding to the length dimension of the hollow part 3. FIG. Therefore, when the release tape 1 is peeled from the adhesive tape 2, the portion 1 a from which the hollow portion 3 of the release tape 1 is removed bends at the place where the pair of cutting lines 4 are formed, but a pair of cuts. It may be difficult to bend (bend) the portion between the lines 4 as compared to the portion where the cutting lines 4 are formed. That is, the portion 1a from which the hollow portion 3 of the release tape 1 is removed may be difficult to bend with a small radius as a whole.

  Therefore, since the portion 1a from which the hollow portion 3 serving as a start end of the release tape 1 from the adhesive tape 2 is removed is difficult to bend with respect to the adhesive tape 2 at a large angle, that is, with a small radius, the adhesive tape The release of the release tape 1 from 2 could not be started smoothly, and a tensile force applied to the release tape 1 was applied to the end of the pressure-sensitive adhesive tape 2 and the end was bent from the substrate.

  In this invention, when the release tape is peeled from the adhesive tape attached to the adherend member, the release tape can be bent so that the angle with the adhesive tape is increased, thereby releasing the mold. An object of the present invention is to provide an adhesive tape sticking device and a sticking method capable of easily and reliably peeling a tape.

This invention is a sticking device for sticking a pressure-sensitive adhesive tape cut to a predetermined length on a side portion of a member to be stuck,
A supply reel wound with a release tape to which the adhesive tape is attached;
The adhesive tape fed out from the supply reel together with the release tape forms a hollow portion at a predetermined interval by a pair of cutting lines having a depth reaching the release tape, and the pair of cuts of the release tape. Cutting means for forming a fold line in a portion between the lines;
Removing means for removing the hollowed out portion of the adhesive tape cut and formed by the cutting means from the release tape;
A pressure-sensitive adhesive tape having a predetermined length remaining on the release tape positioned so as to face the side portion of the adherend member after the hollow portion is removed by the removing means is pressed against the adherend member. A pressure means for attaching;
A peeling roller that bends the portion of the release tape from which the hollow portion has been removed by the cutting line and the folding line, and the peeling roller is driven along a side portion of the adherend member; A peeling means for peeling the release tape from the adhesive tape attached to the adherend member;
There is provided a pressure-sensitive adhesive tape sticking apparatus comprising: a take-up reel that winds up a release tape peeled off from the pressure-sensitive adhesive tape stuck to the pressure-sensitive adhesive member by the peeling means.

  The cutting means has a movable body that is driven by a drive source in a direction to contact with and separate from the adhesive tape attached to the release tape, and a pair of cutting lines is formed on the movable body. The first cutting blades are preferably provided at predetermined intervals, and a second cutting blade for forming the fold line is provided between the pair of first cutting blades.

This invention is a sticking method for sticking a pressure-sensitive adhesive tape cut to a predetermined length on a side portion of an adherend member,
In the adhesive tape fed out together with the release tape from the supply reel, hollow portions are formed at predetermined intervals by a pair of cutting lines having a depth reaching the release tape, and the pair of cutting lines of the release tape. Forming a fold line in a portion between,
Removing the hollow portion cut and formed in the adhesive tape from the release tape;
A step of pressurizing and sticking the adhesive tape of a predetermined length remaining on the release tape to the adherend by removing the hollow portion;
A part of the release tape from which the hollow portion is removed and the side of the adherend member facing the side is bent by a peeling roller at the cutting line and the fold line, and the peeling roller is attached. A step of peeling the release tape from the adhesive tape attached to the adherend member by driving along the side of the member;
And a step of winding the release tape peeled off from the pressure-sensitive adhesive tape adhered to the adherend member.

  It is preferable that the pair of cutting lines and the folding line are simultaneously formed on the release tape.

  According to this invention, when the peeling tape is peeled from the adhesive tape stuck to the adherend member, the hollow portion is removed from the portion where the hollowed portion of the release tape that is the starting end of peeling is removed. In addition to a pair of cutting lines for removal, a fold line is formed between the cutting lines.

  Therefore, when the release tape is peeled off from the adhesive tape by the peeling roller, the part that becomes the starting end of the release of the release tape is smoothly curved along the outer peripheral surface of the release tape so that the angle with respect to the adhesive tape is large. Therefore, the release tape can be reliably peeled off.

The schematic block diagram of the sticking apparatus of the adhesive tape which shows one embodiment of this invention. The front view which expands and shows a cutting | disconnection unit. (A) is an enlarged view of the adhesive tape which formed the hollow part, (b) is an enlarged view of the adhesive tape which removed the hollow part. (A) is explanatory drawing when curving the release tape in which a pair of cutting lines and a fold line were formed, (b) is explanation when curving the release tape in which only a pair of cutting lines were formed. Figure. (A) is a top view of the board | substrate with which the electronic component was stuck to one side part, (b) is a top view of the board | substrate before an electronic component is stuck. (A) is the conventional explanatory drawing which cut | disconnects an adhesive tape to predetermined length, (b) is an enlarged view of the part in which the cutting line was formed in the adhesive tape.

  Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 shows a sticking apparatus according to an embodiment of the present invention, and the sticking apparatus includes a substrate stage 15. The substrate stage 15 has a base 16, and a table 17 that is driven in the X, Y, and θ directions by an X drive source 16 a, a Y drive source 16 b, and a θ drive source 16 c is provided on the upper surface of the base 16.

  On the table 17, as shown in FIG. 5A, a substrate W made of a liquid crystal display panel as an adherend member is supplied and held by suction. On one side portion of the upper surface of the substrate W, as shown in FIG. 5B, a plurality of terminal portions T formed in a plurality of terminals t at a predetermined interval, in this embodiment, three terminal portions T are provided.

  On the upper surface of the side portion where the terminal portion T of the substrate W is provided, anisotropic conductivity made of a thermosetting resin mixed with metal particles cut into a length over three terminal portions T as will be described later. Adhesive tape 2 is attached as shown in FIG. An electronic component 13 such as TCP is attached to each terminal portion T via the adhesive tape 2.

  As shown in FIG. 1, the adhesive tape 2 is attached to a release tape 1 made of a synthetic resin tape and wound around a supply reel 19, and a pair of guide rollers 21 with the adhesive tape 2 facing downward. Guided by As a result, the adhesive tape 2 is opposed to the upper side of the terminal portion T of the substrate W placed on the table 17.

  Above the table 17, a pressurizing tool 23 as an attaching means having a heater 23 a is provided so as to be movable up and down by a vertical drive mechanism 24. The pressure-sensitive adhesive tape 2 is cut to a predetermined length by a cutting unit 33 described later, and a portion 2a cut to the predetermined length is positioned below the pressure tool 23 as described later.

  When the portion 2a cut to a predetermined length of the adhesive tape 2 is positioned, the pressing tool 23 descends and the portion 2a of the adhesive tape 2 cut to a predetermined length becomes the terminal portion T of the substrate W. Is attached to the side portion provided with Thereafter, the release tape 1 is peeled off from the adhesive tape 2 by a peeling means 26 described later, and only the release tape 1 is wound on the take-up reel 22.

  The pressure-sensitive adhesive tape 2 and the release tape 1 are transported by a feeding device 30 as feeding means. The feeding device 30 has a chuck 31 formed so as to be able to sandwich the release tape 1. The chuck 31 is reciprocally driven in a direction indicated by an arrow X in FIG. 1 by a first drive mechanism 32 including, for example, a drive source (not shown) and a drive screw rotated by the drive source.

  Therefore, if the chuck 31 is driven in the direction indicated by + X in FIG. 1 with the release tape 1 being sandwiched, the adhesive tape 2 is pulled out from the supply reel 19 in the + X direction together with the release tape 1, and its predetermined length is obtained. The portion 2a that has been cut can be positioned below the pressing tool 23.

  The cutting unit 33 is arranged upstream of the substrate W held on the table 17 in the transport direction of the adhesive tape 2. The cutting unit 33 includes a cutting mechanism 34 and a removing mechanism 35, and the adhesive tape 2 is cut into a predetermined length by the cutting mechanism 34.

  The upper surface of the part facing the cutting mechanism 34 and the removing / separating mechanism 35 of the release tape 1 having the adhesive tape 2 attached to the lower surface is held by the lower surface of the holding block 36.

  As shown in FIG. 2, the cutting mechanism 34 has a movable body 38 that is driven in the vertical direction by a cylinder 37 as a drive source.

  A pair of first cutting blades 39 are provided on the upper surface of the movable body 38 at a predetermined interval. At least one second cutting blade 40 is provided between the pair of first cutting blades 39. The movable body 38 has a height that allows the first cutting blade 39 and the second cutting blade 40 to cut about one-half of the thickness of the release tape 1 held by the holding block 36 by the cylinder 37. Driven in the upward direction. That is, the release tape 1 is half-cut by the first cutting blade 39 and the second cutting blade 40.

  When the movable body 38 is driven in the upward direction, as shown in FIG. 3A, a pair of cuts reaching a depth about half the thickness of the release tape 1 by the pair of first cutting blades 39. Line 4 is formed. A hollow portion 3 is cut and formed in the adhesive tape 2 by a pair of cutting lines 4. Further, a folding line 4 a that divides the hollow portion 3 formed by the pair of cutting lines 4 into two by the second cutting blade 40 is formed at a depth about half the thickness of the release tape 1. .

  As shown in FIG. 2, the holding block 36 is slidably provided with an extruding member 42 that presses the upper surface of the release tape 1. The pushing member 42 is pressed at a predetermined timing by a cylinder (not shown) or the like.

  A peeling head 43 constituting the removing mechanism 35 is disposed on the lower surface side of the adhesive tape 2 facing the push-out member 42. The peeling head 43 is attached to the base plate 44. The base plate 44 is provided with a supply reel 46 around which an adhesive tape 45 is wound. The adhesive tape 45 travels along the upper surface of the peeling head 43 and is wound around a take-up reel 47. Yes.

  The base plate 44 is driven in the vertical direction by a cylinder 48. When the base plate 44 is driven in the upward direction, the hollow portion 3 cut by the pair of cutting lines 4 of the adhesive tape 2 is pressed by the pushing member 42.

  As a result, the hollow portion 3 cut by the pair of cutting lines 4 of the adhesive tape 2 is pressed against the adhesive tape 45 of the peeling head 43, so that the hollow portion 3 is released as shown in FIG. It is removed from the tape 1.

  The adhesive tape 2 has a pair of cutting lines 4 formed by the first cutting blades 39 of the removing mechanism 35 at intervals corresponding to the length of the adhesive tape 2 attached to the substrate W. Then, by removing the hollow portion 3 between the pair of cutting lines 4 by the removing mechanism 35, the part 2a of the adhesive tape 2 cut to a predetermined length remains on the release tape 1. Therefore, the portion 2 a of the adhesive tape 2 cut to a predetermined length is attached to the side portion of the substrate W by the pressure tool 23.

  The portion 2a of the adhesive tape 2 cut to a predetermined length is positioned below the pressurizing tool 23 when the chuck 31 sandwiches the release tape 1 and is driven in the + X direction. Before the portion 2a cut to a predetermined length of the adhesive tape 2 is positioned, the table 7 on which the substrate W is placed is driven in the X, Y, and θ directions so that the terminal portion T of the substrate W is moved. The provided one side portion is positioned so as to face the lower side of the portion 2a of the adhesive tape 2 cut to a predetermined length.

  When the substrate W is positioned, the pressing tool 23 is driven in the downward direction by the vertical drive mechanism 24. As a result, the portion 2a cut to a predetermined length of the adhesive tape 2 through the release tape 1 is pressure-heated and attached to the upper surface of one side of the substrate W.

  When the portion 2a of the adhesive tape 2 cut to a predetermined length is attached to the upper surface of one side of the substrate W, the release tape 1 attached to the portion 2a is peeled off by the peeling means 26.

  As shown in FIG. 1, the peeling means 26 has a movable plate 51. The movable plate 51 is provided with a lower peeling roller 52 rotatably provided at a position where the lower end in the radial direction is slightly higher than the upper surface of the substrate W, and rotatably provided at a position higher than the lower peeling roller. An upper peeling roller 53 is provided.

  The movable plate 51 is reciprocally driven in a direction indicated by an arrow X in FIG. 1 by a second drive mechanism 54 including a drive source (not shown) and a screw shaft that is rotationally driven by the drive source.

  A portion of the release tape 1 located downstream of the substrate W held on the table 17 engages with the lower peeling roller 52 and bends upward, and then engages with the upper peeling roller 53. Thus, it is led out in the horizontal direction and is held between the chucks 31.

  After the portion 2a cut to a predetermined length of the adhesive tape 2 by the pressure tool 23 is attached to the upper surface of the side portion of the substrate W, when the pressure tool 23 is raised, the movable plate 51 of the peeling means 26 is moved. Is driven in the −X direction entering between the substrate W and the pressing tool 23 by the second driving mechanism 54. At that time, the chuck 31 clamps a portion located downstream of the peeling means 26 of the release tape 1.

  When the movable plate 51 is driven in the −X direction and the lower peeling roller 52 reaches the end of the adhesive tape 2 adhered to the upper surface of the side of the substrate W, a pair of the release tape 1 located at the end. The first cutting line 4 and the part 1 b where the bending line 4 a is formed between the cutting lines 4, that is, the part from which the hollow part 3 is removed are bent by the lower peeling roller 52.

  At this time, the portion 1b of the release tape 1 corresponding to the end portion of the adhesive tape 2 is formed with the pair of cutting lines 4 and the fold line 4a as described above. As shown to a), it curves with a small radius so that it may become a big angle (theta) 1 by the said pair of cutting line 4 and bending line 4a. That is, the release tape 1 can be curved with a small radius so that the release tape 1 has a large angle θ1 that is nearly perpendicular to the adhesive tape 2 at the end of the adhesive tape 2.

  As a result, the portion 1b corresponding to the end of the adhesive tape 2 of the release tape 1 is pulled upward in the vertical direction, which is easy to peel off from the adhesive tape 2, so that the movable plate 51 provided with the lower peeling roller 52 is − By driving in the X direction, peeling of the release tape 1 from the end of the adhesive tape 2 is started reliably and smoothly.

  In addition, when the bending line 4a is not formed in the part 1b corresponding to the edge part of the said adhesive tape 2 of the said release tape 1, but only a pair of cutting line 4 is formed, as shown in FIG.4 (b). In addition, the portion 1a of the release tape 1 is difficult to be bent with a small radius. Accordingly, the bending angle θ2 of the portion 1a corresponding to the end of the adhesive tape 2 of the release tape 1 is smaller than the angle θ1 when the bending line 4a is formed with respect to the end of the adhesive tape 2. Therefore, the part 1 a of the release tape 1 is hardly peeled off from the end of the adhesive tape 2.

  As a result, the tensile force applied to the release tape 1 by the pair of peeling rollers 52 and 53 of the peeling means 26 easily acts in the direction of peeling the adhesive tape 2 from the substrate W. It is easy to drown.

  Thus, when forming the hollow part 3 in the adhesive tape 2 by the cutting mechanism 34, a pair of cutting lines 4 are formed at the portion 1a corresponding to the hollow part 3 of the release tape 1 and at the same time, these cutting lines. A fold line 4a was formed between the four.

  Therefore, the portion 1b of the release tape 1 corresponding to the hollow portion 3 can be curved with a small radius so as to have a large angle with respect to the adhesive tape 2, and therefore the release tape 1 is attached to the substrate W. The adhesive tape 2 can be reliably peeled off.

In the above embodiment, when the hollow portion is formed in the adhesive tape, one fold line is formed between the pair of first cutting lines. The second cutting blade may be provided, and a plurality of folding lines may be formed simultaneously with the formation of the pair of cutting lines.
If there are a plurality of bending lines, the portion between the pair of cutting lines of the release tape 1 can be curved with a smaller radius than in the case of one.

  Moreover, although the board | substrate was mentioned as an example as a to-be-adhered member, it replaced with a board | substrate as a to-be-attached member, and electronic components, such as TCP mounted on this board | substrate, may be sufficient. That is, recently, an adhesive tape may be attached to an electronic component before mounting the electronic component on a substrate, and the present invention may be applied when attaching an adhesive tape to an electronic component.

  DESCRIPTION OF SYMBOLS 1 ... Release tape, 2 ... Adhesive tape, 3 ... Hollow part, 4 ... Cutting line, 4a ... Bending line, 13 ... Electronic component, 17 ... Table, 19 ... Supply reel, 22 ... Take-up reel, 23 ... Addition Pressure tool, 26 ... peeling means, 31 ... chuck, 32 ... first drive mechanism, 34 ... cutting mechanism, 35 ... removal mechanism, 39 ... first cutting blade, 40 ... second cutting blade, 51 ... movable plate 52 ... Lower peeling roller, 53 ... Upper peeling roller, 54 ... Second drive mechanism.

Claims (4)

A sticking device for sticking a pressure-sensitive adhesive tape cut to a predetermined length on a side portion of an adherend member,
A supply reel wound with a release tape to which the adhesive tape is attached;
The adhesive tape fed out from the supply reel together with the release tape forms a hollow portion at a predetermined interval by a pair of cutting lines having a depth reaching the release tape, and the pair of cuts of the release tape. Cutting means for forming a fold line in a portion between the lines;
Removing means for removing the hollowed out portion of the adhesive tape cut and formed by the cutting means from the release tape;
A pressure-sensitive adhesive tape having a predetermined length remaining on the release tape positioned so as to face the side portion of the adherend member after the hollow portion is removed by the removing means is pressed against the adherend member. A pressure means for attaching;
A peeling roller that bends the portion of the release tape from which the hollow portion has been removed by the cutting line and the folding line, and the peeling roller is driven along a side portion of the adherend member; A peeling means for peeling the release tape from the adhesive tape attached to the adherend member;
A pressure-sensitive adhesive tape sticking device comprising: a take-up reel that winds up a release tape peeled off from the pressure-sensitive adhesive tape stuck to the pressure-sensitive adhesive member by the peeling means.   The cutting means has a movable body that is driven by a drive source in a direction to contact with and separate from the adhesive tape attached to the release tape, and a pair of cutting lines is formed on the movable body. The first cutting blades are provided at predetermined intervals, and a second cutting blade for forming the fold line is provided between the pair of first cutting blades. Item 2. An adhesive tape sticking device according to Item 1. A sticking method for sticking a pressure-sensitive adhesive tape cut to a predetermined length on a side portion of an adherend member,
In the adhesive tape fed out together with the release tape from the supply reel, hollow portions are formed at predetermined intervals by a pair of cutting lines having a depth reaching the release tape, and the pair of cutting lines of the release tape. Forming a fold line in a portion between,
Removing the hollow portion cut and formed in the adhesive tape from the release tape;
A step of pressurizing and sticking the adhesive tape of a predetermined length remaining on the release tape to the adherend by removing the hollow portion;
A part of the release tape from which the hollow portion is removed and the side of the adherend member facing the side is bent by a peeling roller at the cutting line and the fold line, and the peeling roller is attached. A step of peeling the release tape from the adhesive tape attached to the adherend member by driving along the side of the member;
And a step of winding the release tape peeled off from the pressure-sensitive adhesive tape adhered to the adherend member.   4. The method for adhering an adhesive tape according to claim 3, wherein the pair of cutting lines and the bending line are simultaneously formed on the release tape.

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