WO2012144170A1 - Tape attachment device, tape attachment method, and display device - Google Patents

Tape attachment device, tape attachment method, and display device Download PDF

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Publication number
WO2012144170A1
WO2012144170A1 PCT/JP2012/002542 JP2012002542W WO2012144170A1 WO 2012144170 A1 WO2012144170 A1 WO 2012144170A1 JP 2012002542 W JP2012002542 W JP 2012002542W WO 2012144170 A1 WO2012144170 A1 WO 2012144170A1
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Prior art keywords
tape
cutting
island
substrate
portions
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PCT/JP2012/002542
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French (fr)
Japanese (ja)
Inventor
田村　耐
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シャープ株式会社
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Publication of WO2012144170A1 publication Critical patent/WO2012144170A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • the present invention relates to a tape applying device, a tape applying method, and a display device.
  • a circuit board on which an electronic circuit is mounted is connected to a substrate constituting a display panel such as a liquid crystal display device and an organic EL display device.
  • a circuit board is configured by a film board such as TCP (Tape Carrier Package), a printed board (Printed Wiring Board: PWB), or the like.
  • the circuit board is mounted by being crimped to a plurality of terminals formed on the substrate of the display panel via a tape such as an anisotropic conductive film (ACF).
  • ACF anisotropic conductive film
  • Patent Document 1 discloses a tape sticking device that sequentially sticks to a work to be pasted while pulling out a tape material from a reel portion.
  • FIG. 9 is an explanatory view showing a main part of a conventional tape applicator.
  • the tape material 100 has, for example, a two-layer structure of a separator layer 101 that is a support tape and an ACF layer 102. Since the plurality of terminals formed on the substrate of the display panel are gathered over a region having a predetermined length, the ACF layer 102 is formed to a length corresponding to the length of the region.
  • the conventional tape applicator has a hollow unit 110 for removing a part of the ACF layer 102 as shown in FIG.
  • the hollow unit 110 includes a pair of reel portions 112 around which a long hollow tape 111 is wound, a pedestal portion 113 that supports the hollow tape 111 drawn from the reel portion 112 from the side opposite to the adhesive surface, It has the cutter part 114 arrange
  • the hollowing unit 110 When the hollowing unit 110 is raised and pressed against the ACF layer 102 of the tape material 100, the ACF layer 102 is cut by the pair of cutter portions 114, and one ACF layer 102 between the pair of cutter portions 114. The part 102b sticks to the adhesive surface of the hollow tape 111. Subsequently, when the hollowing unit 110 is lowered, a part 102 b of the ACF layer 102 is hollowed and removed from the tape material 100.
  • the hollow unit 110 removes the portion 102b of the ACF layer 102 at a predetermined interval, thereby forming the portion of the ACF layer 102 left between the removed regions as the adhesive tape portion 102a. ing.
  • the adhesive tape portion 102a is pressed from the separator layer 101 side by an unillustrated crimping unit in a state where the adhesive tape portion 102a is positioned at a predetermined position, and is attached to the terminal of the substrate.
  • the conventional tape applicator has a problem that the ACF layer having a predetermined length is removed by the hollowing unit, so that the ACF layer is wasted and it is difficult to reduce the manufacturing cost.
  • the ACF portion that is actually affixed to the terminal it is unavoidable that displacement occurs. Therefore, it is necessary to secure a displacement margin by setting a part of the ACF layer to be removed longer. Therefore, it is difficult to shorten a part of the ACF layer to be removed.
  • the present invention has been made in view of such a point, and the object of the present invention is to reduce manufacturing costs by reducing waste of members while securely attaching a tape to an object to be attached. is there.
  • the adhesive medium layer is cut with respect to a long tape material having a separator layer and an adhesive medium layer laminated on the separator layer.
  • a sticking tape portion comprising a cutting unit for forming a plurality of cutting regions having cutting portions so as to be aligned in the length direction of the tape material, and the sticking medium layer disposed between the cutting regions,
  • a crimping unit that crimps and adheres to a predetermined region of the object.
  • the cutting unit includes a plurality of island-shaped portions formed of the plurality of cutting portions and the sticking medium layer formed between the cutting portions and arranged at least in the length direction of the tape material. Are formed in the cutting region.
  • the tape sticking method according to the present invention is a cutting having a plurality of cut portions in which the sticking medium layer is cut with respect to a long tape material having a separator layer and a sticking medium layer laminated on the separator layer.
  • a cutting step for forming the region so as to be aligned in the length direction of the tape material, and an adhesive tape layer composed of the adhesive medium layer disposed between the cutting regions are pressure-bonded to a predetermined region of the object to be applied.
  • a pressure bonding step of attaching is a pressure bonding.
  • a plurality of said island-like parts which consist of a plurality of above-mentioned cut parts and the above-mentioned pasting medium layer formed along with at least the length direction of the above-mentioned tape material while being formed between these cut parts Are formed in the cutting region.
  • the display device includes a first substrate on which a terminal portion is formed, a second substrate disposed to face the first substrate, and a substrate mounted on the terminal portion of the first substrate. And an adhesive tape layer made of an adhesive medium layer pressure-bonded to the substrate, and a plurality of island-like portions made of the adhesive medium layer that are pressure-bonded to the substrate on the side of the adhesive tape portion.
  • the adhesive medium layer has a plurality of cut portions cut, and a plurality of island-shaped portions formed between the cut portions and arranged at least in the length direction of the tape material.
  • the cut region By forming the cut region, it is not necessary to hollow out the pasting medium layer in a large area, so that it is possible to reduce the waste of members and reduce the manufacturing cost.
  • a plurality of island-shaped portions are provided on both the left and right sides of the adhesive tape portion, even if the adhesive tape portion is slightly misaligned, the island-like portion and the adhesive tape portion correspond to the misalignment. Since it is affixed to a sticking object, a tape can be reliably affixed to a sticking object.
  • FIG. 1 is a side view showing a schematic configuration of the tape applying apparatus according to the first embodiment.
  • FIG. 2 is an enlarged plan view showing the cutting area of the tape material in the first embodiment.
  • FIG. 3 is a plan view showing a substrate on which a plurality of terminal portions are formed.
  • FIG. 4 is a side view showing the substrate and the tape material arranged to face each other.
  • FIG. 5 is an enlarged plan view showing the sticking tape portion attached to the substrate.
  • FIG. 6 is a cross-sectional view illustrating a schematic configuration of the liquid crystal display device.
  • FIG. 7 is an enlarged plan view showing a cutting area of the tape material in the second embodiment.
  • FIG. 8 is an enlarged plan view showing a cutting area of the tape material in the third embodiment.
  • FIG. 9 is an explanatory view showing a main part of a conventional tape applicator.
  • Embodiment 1 of the Invention 1 to 6 show Embodiment 1 of the present invention.
  • FIG. 1 is a side view showing a schematic configuration of a tape applying device 1 according to the first embodiment.
  • FIG. 2 is an enlarged plan view showing the cutting region 36 of the tape material 10 according to the first embodiment.
  • FIG. 3 is a plan view showing the substrate 18 on which the plurality of terminal portions 20 are formed.
  • FIG. 4 is a side view showing the substrate 18 and the tape material 10 arranged to face each other.
  • FIG. 5 is an enlarged plan view showing the adhesive tape portion 15 attached to the substrate 18.
  • FIG. 6 is a cross-sectional view illustrating a schematic configuration of the liquid crystal display device 50.
  • the tape applicator 1 in the present embodiment includes a reel unit 11 around which a long tape material 10 is wound, a pulling mechanism 25 for pulling out the tape material 10 from the reel unit 11, and a tape material 10.
  • a plurality of guide rollers 13 for guiding, a cutting unit 30 for forming the adhesive tape portion 15 on the tape material 10, and a pressure-bonding unit 40 for pressing the adhesive tape portion 15 to the substrate 18 as an object to be attached are provided.
  • the cutting unit 30 is disposed between the reel unit 11 and the drawer mechanism 25.
  • the crimping unit 40 is disposed between the cutting unit 30 and the drawer mechanism 25.
  • the substrate 18 is, for example, a printed circuit board (PWB), and has a chip portion 19 that is a plurality of drive circuits and a plurality of terminal portions 20 that are formed by a plurality of terminals. And have.
  • the plurality of terminal portions 20 are arranged along one side of the substrate 18.
  • the liquid crystal display device 50 As a display device to which the substrate 18 is connected will be described.
  • the liquid crystal display device 50 includes a TFT substrate 51 as an active matrix substrate that is a first substrate, a counter substrate 52 that is a second substrate disposed to face the TFT substrate 51, and a TFT substrate. 51 and a liquid crystal layer 53 provided between the counter substrate 52.
  • the liquid crystal display device 50 includes a display area in which a plurality of pixels arranged in a matrix are formed, and a frame-like non-display area provided around the display area.
  • the counter substrate 52 is provided with a color filter, a common electrode, etc. (not shown).
  • the liquid crystal layer 53 is sealed by a sealing member 54 provided between the TFT substrate 51 and the counter substrate 52.
  • each pixel is formed with a TFT (Thin-Film Transistor) as a switching element and a pixel electrode connected to the TFT.
  • the TFT is connected to the source wiring and the gate wiring.
  • a terminal portion 55 in which a plurality of terminals are gathered and formed is formed.
  • the terminal portion 55 is connected to the source wiring or the gate wiring.
  • the terminal portion 55 of the TFT substrate 51 is connected to the terminal portion 20 of the substrate 18 through the adhesive tape portion 15 made of an anisotropic conductive film (hereinafter referred to as ACF).
  • the tape material 10 includes a separator layer 21 that is a support tape, and an ACF layer 22 that is a sticking medium layer supported by being laminated on the separator layer 21. A part of the ACF layer 22 is pressure-bonded to the substrate 18 as the adhesive tape portion 15. The tape material 10 is wound around the reel unit 11 in a state where the separator layer 21 is disposed on the radially inner side of the reel unit 11.
  • the drawer mechanism 25 has a fixed chuck 26 and a drawer chuck 27 as shown in FIG.
  • the fixed chuck 26 and the drawer chuck 27 are configured to be able to pinch or release the tape material 10, respectively.
  • the drawer mechanism 25 slides the tape material 10 so that the drawer chuck 27 holding the tape material 10 is separated from the fixed chuck 26 with the fixed chuck 26 opened.
  • a predetermined length is drawn from the reel unit 11.
  • the fixed chuck 26 holds the tape material 10.
  • the drawer chuck 27 slides so as to approach the fixed chuck 26 with the tape material 10 opened. By repeating this series of operations, the tape material 10 is pulled out by a predetermined length.
  • the tape material 10 drawn out from the reel unit 11 is guided by the plurality of guide rollers 13 and supplied to the crimping unit 40 via the cutting unit 30.
  • the cutting unit 30 includes a backup 31 that is a pedestal and a main body 33 to which a blade 32 is attached. As shown in FIGS. 2 and 4, the cutting unit 30 has a plurality of cutting regions 36 each having a cutting portion 35 in which the ACF layer 22 of the tape material 10 is cut with respect to the long tape material 10. Are arranged side by side in the length direction.
  • the main body 33 is configured to be able to advance and retreat so as to be in contact with and away from the backup 31. Then, when the main body 33 approaches the backup 31, a plurality of cutting edges of the blade 32 are cut into the ACF layer 22 of the tape 10 supported by the backup 31, and the tape 10 is half-cut. A plurality of cutting portions 35 are formed in the tape material 10. In the cut portion 35, the separator layer 21 is exposed from the ACF layer 22.
  • the cutting region 36 is formed between a plurality of cutting portions 35 and the cutting portions 35 and at least the length direction of the tape material 10 (that is, the horizontal direction in FIG. 2). And a plurality of island-shaped portions 37 made of the ACF layer 22 arranged side by side.
  • the blade part 32 has at least three line-shaped blade edges. Accordingly, the cutting unit 30 is configured to form a plurality of strip-shaped island portions 37 extending in the width direction of the tape material 10 (that is, the vertical direction in FIG. 2). In the present embodiment, for example, four blade edges are provided on the blade portion 32. Therefore, four cut portions 35 and three island-shaped portions 37 are formed in the tape material 10.
  • the length of the adhesive tape portion 15 is shorter than the terminal portion 20 of the substrate 18. Further, the total length of the adhesive tape portion 15 and the lengths of the cut regions 36 on the left and right sides of the adhesive tape portion 15 are longer than the terminal portion 20 of the substrate 18.
  • the crimping unit 40 includes a backup 41, a crimping tool 42, and a reel portion 44 around which a cushioning material 43 is wound. As shown in FIGS. 3 and 4, the crimping unit 40 is configured so that the adhesive tape portion 15 formed of the ACF layer 22 disposed between the cutting regions 36 is adhered to a predetermined region on the substrate 18 by pressure bonding. It is configured.
  • the crimping tool 42 is configured to be movable up and down so as to be in contact with and separated from the backup 41.
  • the crimping surface of the crimping tool 42 is covered with a cushioning material 43 that is unwound from the reel portion 44.
  • the buffer material 43 can be made of, for example, silicon rubber.
  • the crimping tool 42 approaches the backup 41 in a state where the tape material 10 and the substrate 18 are positioned and arranged on the backup 41. Then, the crimping surface of the crimping tool 42 presses the tape material 10 against the substrate 18 through the buffer material 43. As a result, as shown in FIG. 5, the adhesive tape portion 15 is pressure-bonded to the terminal portion 20 of the substrate 18.
  • the adhesive tape portion 15 and a part of the plurality of island-like portions 37 arranged in the vicinity of the adhesive tape portion 15 in the tape material 10 are pressure-bonded to the terminal portion 20 of the substrate 18. ing.
  • the liquid crystal display device 50 on which the substrate 18 is mounted has the adhesive tape portion 15 that is pressure-bonded to the substrate 18 and a plurality of island-shaped portions 37 that are pressure-bonded to the substrate 18 on the side of the adhesive tape portion 15. That is, the adhesive tape portion 15 and the island portion 37 are interposed between the terminal portion 20 of the substrate 18 and the terminal portion 55 of the TFT substrate 51.
  • a step of pulling out the tape material 10 from the reel portion 11 by a predetermined length by the pull-out mechanism 25 is performed.
  • the drawer chuck 27 holding the tape material 10 is slid away from the fixed chuck 26 to remove the tape material 10 from the reel portion 11. Pull out the specified length.
  • the drawer chuck 27 is brought close to the fixed chuck 26 with the tape material 10 released in a state where the fixed chuck 26 holds the tape material 10. Slide to.
  • the tape material 10 drawn from the reel unit 11 is guided by a plurality of guide rollers 13 and is first supplied to the cutting unit 30.
  • a cutting process for forming the cutting region 36 in the tape material 10 is performed.
  • the main body 33 is brought close to the backup 31 in a state where the tape material 10 is disposed between the backup 31 and the main body 33.
  • a plurality of line-shaped cutting edges in the blade portion 32 are cut into the ACF layer 22 of the tape material 10 supported by the backup 31 to half-cut the tape material 10, and a plurality of cutting portions 35 are formed in the tape material 10.
  • a cutting region 36 having a plurality of line-shaped cutting portions 35 and island-shaped portions 37 arranged side by side in the length direction of the tape material 10 is formed.
  • the island portion 37 is formed in a strip shape extending in the width direction of the tape material 10. The cutting step is performed each time the tape material 10 is pulled out by a predetermined length. Thereby, a plurality of cutting regions 36 are formed so as to be aligned in the length direction of the tape material 10.
  • a crimping process for crimping the adhesive tape portion 15 to the terminal portion 20 of the substrate 18 is performed.
  • the tape material 10 is disposed between the backup 41 and the crimping tool 42, and the adhesive tape portion 15 and the terminal portion 20 of the substrate 18 are aligned as shown in FIGS.
  • the crimping tool 42 is brought close to the backup 41.
  • the tape material 10 is pressed against the substrate 18 through the cushioning material 43 on the crimping surface of the crimping tool 42.
  • the adhesive tape portion 15 and the plurality of island portions 37 are pressure-bonded to the terminal portion 20 of the substrate 18.
  • the adhesive tape portion 15 is bonded to the terminal portion 20 as a predetermined area of the substrate 18 by pressure bonding. Thereafter, the substrate 18 to which the adhesive tape portion 15 or the like is pressure-bonded is pressure-bonded to the terminal portion 55 of the TFT substrate 51 and mounted.
  • Embodiment 1- Therefore, according to the first embodiment, it is possible to reduce the manufacturing cost by reducing the waste of the members such as the tape material 10 while securely attaching the adhesive tape part 15 to the terminal part 20 to be applied. .
  • the positional deviation in the length direction of the tape material 10 becomes a big problem between the adhesive tape portion 15 and the terminal portion 20.
  • the plurality of island portions 37 arranged in the length direction of the tape material 10 are provided on both the left and right sides of the adhesive tape portion 15, there is a slight positional deviation in the adhesive tape portion 15. Even if it exists, as a result of sticking the island-shaped part 37 to the terminal part 20 together with the sticking tape part 15 by the amount of positional deviation, the ACF layer 22 can be reliably stuck over substantially the entire terminal part 20.
  • the shape of the cutting portion 35 is a line shape
  • the cutting edge of the blade portion 32 can be a simple line shape, and the cost of parts of the blade portion 32 can be reduced.
  • FIG. 7 shows Embodiment 2 of the present invention.
  • FIG. 7 is an enlarged plan view showing the cutting region 36 of the tape material 10 according to the second embodiment.
  • the same portions as those in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.
  • the cutting edge of the blade portion 32 in the cutting unit 30 has a plurality of lines, but this embodiment is different in that the cutting edge of the blade portion 32 is formed in a lattice shape. Yes.
  • the blade portion 32 of the cutting unit 30 in the present embodiment has a lattice shape in which a plurality of blade edges are orthogonal to each other.
  • the cutting portions 35 where the separator layer 21 is exposed in a lattice shape and the plurality of island-shaped portions 37 arranged in a matrix shape are formed. It has become.
  • the rows of island portions 37 extending in the width direction of the tape material 10 are arranged in three rows in the length direction of the tape material 10.
  • the adhesive tape portion 15. can be reliably affixed to the terminal part 20 to be affixed, while reducing the waste of members such as the tape material 10 and the like, thereby reducing the manufacturing cost.
  • FIG. 8 shows Embodiment 3 of the present invention.
  • FIG. 8 is an enlarged plan view showing the cutting region 36 of the tape material 10 according to the third embodiment.
  • the third embodiment is similar to the second embodiment, in that the cutting edge of the blade portion 32 in the cutting unit 30 is formed in a lattice shape, and the cutting edge of the blade portion 32 is a plurality of lines. Is different.
  • the blade portion 32 of the cutting unit 30 in the present embodiment has a lattice shape in which a plurality of blade edges cross each other obliquely.
  • the cutting region 36 of the tape material 10 is formed with cutting portions 35 in which the separator layer 21 is exposed in a lattice shape and a plurality of island-like portions 37 arranged in a staggered manner. It has become.
  • the rows of island portions 37 extending in the width direction of the tape material 10 are arranged in three rows in the length direction of the tape material 10.
  • the plurality of island-shaped portions 37 are arranged in the cutting region 36 so as to be aligned in the length direction of the tape material 10, so that the adhesive tape portion 15 is the same as in the first embodiment. Can be reliably affixed to the terminal part 20 to be affixed, while reducing the waste of members such as the tape material 10 and the like, thereby reducing the manufacturing cost.
  • the tape material 10 in which the sticking medium layer is the ACF layer 22 has been described.
  • the present invention is not limited to this, and other sticking medium layers such as a conductive layer having conductivity may be used.
  • the object to be attached of the tape attaching apparatus is the printed circuit board 18
  • the present invention is not limited to this, and for example, an active matrix substrate constituting a display panel, a circuit member, and the like Other pasting objects may be used.
  • the present invention is not limited to the above-described first to third embodiments, and the present invention includes a configuration in which these first to third embodiments are appropriately combined.
  • the present invention is useful for a tape sticking device, a tape sticking method, and a display device.

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  • Physics & Mathematics (AREA)
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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
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Abstract

A tape attachment device is provided with: a cutting unit for causing a cutting region, which has a cutting section in which an attachment-medium layer is cut, to be formed in the lengthwise direction of a long tape material having a separator layer and the attachment-medium layer; and a pressure-joining unit for causing an attachment tape section comprising the attachment-medium layer between cutting regions to be pressure-joined and attached to a prescribed region of an object to be subjected to attaching. The cutting unit is configured in a manner such that the cutting regions have a plurality of cutting sections and a plurality of island-shaped sections comprising the attachment-medium layer, and formed between the cutting sections and at least positioned in alignment in the lengthwise direction of the tape material.

Description

テープ貼付装置、テープ貼付方法及び表示装置Tape sticking device, tape sticking method and display device
　本発明は、テープ貼付装置、テープ貼付方法及び表示装置に関するものである。 The present invention relates to a tape applying device, a tape applying method, and a display device.
　一般に、液晶表示装置及び有機ＥＬ表示装置等の表示パネルを構成する基板には、電子回路が搭載された回路基板が接続されている。このような回路基板は、例えばＴＣＰ（Tape Carrier Package）等のフィルム基板や、プリント基板（Printed Wiring Board：ＰＷＢ）等によって構成されている。そして、回路基板は、表示パネルの基板に形成された複数の端子に対し、異方性導電膜（Anisotropic Conductive Film：ＡＣＦ）等のテープを介して圧着されることにより実装されている。また、特許文献１には、テープ材をリール部から引き出しながら、貼り付け対象であるワークに順次貼り付けるテープ貼付装置が開示されている。 Generally, a circuit board on which an electronic circuit is mounted is connected to a substrate constituting a display panel such as a liquid crystal display device and an organic EL display device. Such a circuit board is configured by a film board such as TCP (Tape Carrier Package), a printed board (Printed Wiring Board: PWB), or the like. The circuit board is mounted by being crimped to a plurality of terminals formed on the substrate of the display panel via a tape such as an anisotropic conductive film (ACF). Further, Patent Document 1 discloses a tape sticking device that sequentially sticks to a work to be pasted while pulling out a tape material from a reel portion.
　ここで、図９は、従来のテープ貼付装置の要部を示す説明図である。テープ材１００は、例えば、支持テープであるセパレータ層１０１と、ＡＣＦ層１０２との２層構造を有している。表示パネルの基板に形成されている複数の端子は、所定の長さの領域に亘って集合しているので、ＡＣＦ層１０２はその領域の長さに対応する長さに成形される。 Here, FIG. 9 is an explanatory view showing a main part of a conventional tape applicator. The tape material 100 has, for example, a two-layer structure of a separator layer 101 that is a support tape and an ACF layer 102. Since the plurality of terminals formed on the substrate of the display panel are gathered over a region having a predetermined length, the ACF layer 102 is formed to a length corresponding to the length of the region.
　すなわち、従来のテープ貼付装置は、図９に示すように、ＡＣＦ層１０２の一部を除去する中抜きユニット１１０を有している。中抜きユニット１１０は、長尺の中抜きテープ１１１が巻き付けられた一対のリール部１１２と、リール部１１２から引き出された中抜きテープ１１１をその粘着面と反対側から支持する台座部１１３と、台座部１１３の左右両側に所定間隔で配置されたカッター部１１４とを有している。 That is, the conventional tape applicator has a hollow unit 110 for removing a part of the ACF layer 102 as shown in FIG. The hollow unit 110 includes a pair of reel portions 112 around which a long hollow tape 111 is wound, a pedestal portion 113 that supports the hollow tape 111 drawn from the reel portion 112 from the side opposite to the adhesive surface, It has the cutter part 114 arrange | positioned by the predetermined space | interval on the right-and-left both sides of the base part 113. FIG.
　中抜きユニット１１０が上昇してテープ材１００のＡＣＦ層１０２に押し付けられると、ＡＣＦ層１０２が一対のカッター部１１４によりカットされると共に、この一対のカッター部１１４同士の間におけるＡＣＦ層１０２の一部１０２ｂが中抜きテープ１１１の粘着面に貼り付く。続いて、中抜きユニット１１０が下降することにより、ＡＣＦ層１０２の一部１０２ｂがそのテープ材１００から中抜きされて除去される。 When the hollowing unit 110 is raised and pressed against the ACF layer 102 of the tape material 100, the ACF layer 102 is cut by the pair of cutter portions 114, and one ACF layer 102 between the pair of cutter portions 114. The part 102b sticks to the adhesive surface of the hollow tape 111. Subsequently, when the hollowing unit 110 is lowered, a part 102 b of the ACF layer 102 is hollowed and removed from the tape material 100.
　こうして、中抜きユニット１１０は、所定の間隔でＡＣＦ層１０２の一部１０２ｂを除去することにより、その除去領域の間に残されたＡＣＦ層１０２の部分を貼付テープ部１０２ａとして形成するようになっている。 In this way, the hollow unit 110 removes the portion 102b of the ACF layer 102 at a predetermined interval, thereby forming the portion of the ACF layer 102 left between the removed regions as the adhesive tape portion 102a. ing.
　その後、貼付テープ部１０２ａは、所定位置に位置決めされた状態で、図示省略の圧着ユニットによりセパレータ層１０１側から押圧されて基板の端子上に貼り付けられる。 After that, the adhesive tape portion 102a is pressed from the separator layer 101 side by an unillustrated crimping unit in a state where the adhesive tape portion 102a is positioned at a predetermined position, and is attached to the terminal of the substrate.
特開２００４－２７９６９８号公報JP 2004-279698 A
　しかし、上記従来のテープ貼付装置では、中抜きユニットによって所定長さのＡＣＦ層が除去されるため、ＡＣＦ層の無駄が多く、製造コストを低減することが難しいという問題がある。特に、実際に端子に貼り付けられるＡＣＦ部を位置決めするにあたって、位置ずれが生じることが避けられないため、除去するＡＣＦ層の一部を長めに設定して位置ずれマージンを確保する必要がある。したがって、上記除去されるＡＣＦ層の一部を短くすることは困難である。 However, the conventional tape applicator has a problem that the ACF layer having a predetermined length is removed by the hollowing unit, so that the ACF layer is wasted and it is difficult to reduce the manufacturing cost. In particular, when positioning the ACF portion that is actually affixed to the terminal, it is unavoidable that displacement occurs. Therefore, it is necessary to secure a displacement margin by setting a part of the ACF layer to be removed longer. Therefore, it is difficult to shorten a part of the ACF layer to be removed.
　さらに、上記除去されるＡＣＦ層の一部を中抜きするために、中抜きテープという別の部材が必要になる点においても、製造コストの低減を図ることは難しい。 Furthermore, it is difficult to reduce the manufacturing cost in that another member called a hollow tape is required to hollow out a part of the ACF layer to be removed.
　本発明は、斯かる点に鑑みてなされたものであり、その目的とするところは、テープを貼付対象に確実に貼り付けながらも、部材の無駄を少なくして製造コストの低減を図ることにある。 The present invention has been made in view of such a point, and the object of the present invention is to reduce manufacturing costs by reducing waste of members while securely attaching a tape to an object to be attached. is there.
　上記の目的を達成するために、本発明に係るテープ貼付装置は、セパレータ層と該セパレータ層に積層された貼付媒体層とを有する長尺のテープ材に対し、上記貼付媒体層が切断された切断部を有する複数の切断領域を上記テープ材の長さ方向に並ぶように形成する切断ユニットと、上記切断領域同士の間に配置されている上記貼付媒体層からなる貼付テープ部を、貼付対象物の所定領域に圧着して貼り付ける圧着ユニットとを備えている。そして、上記切断ユニットは、複数の上記切断部と、該切断部同士の間に形成されると共に少なくとも上記テープ材の長さ方向に並んで配置された上記貼付媒体層からなる複数の島状部とを上記切断領域に形成するように構成されている。 In order to achieve the above object, in the tape applying device according to the present invention, the adhesive medium layer is cut with respect to a long tape material having a separator layer and an adhesive medium layer laminated on the separator layer. A sticking tape portion comprising a cutting unit for forming a plurality of cutting regions having cutting portions so as to be aligned in the length direction of the tape material, and the sticking medium layer disposed between the cutting regions, A crimping unit that crimps and adheres to a predetermined region of the object. The cutting unit includes a plurality of island-shaped portions formed of the plurality of cutting portions and the sticking medium layer formed between the cutting portions and arranged at least in the length direction of the tape material. Are formed in the cutting region.
　また、本発明に係るテープ貼付方法は、セパレータ層と該セパレータ層に積層された貼付媒体層とを有する長尺のテープ材に対し、上記貼付媒体層が切断された複数の切断部を有する切断領域を上記テープ材の長さ方向に並ぶように形成する切断工程と、上記切断領域同士の間に配置されている上記貼付媒体層からなる貼付テープ部を、貼付対象物の所定領域に圧着して貼り付ける圧着工程とを有している。そして、上記切断工程では、複数の上記切断部と、該切断部同士の間に形成されると共に少なくとも上記テープ材の長さ方向に並んで配置された上記貼付媒体層からなる複数の島状部とを上記切断領域に形成する。 Moreover, the tape sticking method according to the present invention is a cutting having a plurality of cut portions in which the sticking medium layer is cut with respect to a long tape material having a separator layer and a sticking medium layer laminated on the separator layer. A cutting step for forming the region so as to be aligned in the length direction of the tape material, and an adhesive tape layer composed of the adhesive medium layer disposed between the cutting regions are pressure-bonded to a predetermined region of the object to be applied. And a pressure bonding step of attaching. And in the said cutting process, a plurality of said island-like parts which consist of a plurality of above-mentioned cut parts and the above-mentioned pasting medium layer formed along with at least the length direction of the above-mentioned tape material while being formed between these cut parts Are formed in the cutting region.
　また、本発明に係る表示装置は、端子部が形成された第１基板と、上記第１基板に対向して配置された第２基板と、上記第１基板の端子部に実装された基板と、上記基板に圧着された貼付媒体層からなる貼付テープ部と、上記貼付テープ部の側方において上記基板に圧着されると共に上記貼付媒体層からなる複数の島状部とを備えている。 The display device according to the present invention includes a first substrate on which a terminal portion is formed, a second substrate disposed to face the first substrate, and a substrate mounted on the terminal portion of the first substrate. And an adhesive tape layer made of an adhesive medium layer pressure-bonded to the substrate, and a plurality of island-like portions made of the adhesive medium layer that are pressure-bonded to the substrate on the side of the adhesive tape portion.
　本発明によれば、貼付媒体層が切断された複数の切断部と、切断部同士の間に形成されると共に少なくともテープ材の長さ方向に並んで配置された複数の島状部とを有する切断領域を形成することによって、貼付媒体層を大きな面積で中抜きする必要がないため部材の無駄を少なくして製造コストの低減を図ることが可能になる。しかも、貼付テープ部の左右両側に複数の島状部がそれぞれ設けられているために当該貼付テープ部に多少の位置ずれがあったとしても、位置ずれの分だけ島状部が貼付テープ部と共に貼付対象に貼り付けられるため、テープを貼付対象に確実に貼り付けることができる。 According to the present invention, the adhesive medium layer has a plurality of cut portions cut, and a plurality of island-shaped portions formed between the cut portions and arranged at least in the length direction of the tape material. By forming the cut region, it is not necessary to hollow out the pasting medium layer in a large area, so that it is possible to reduce the waste of members and reduce the manufacturing cost. In addition, since a plurality of island-shaped portions are provided on both the left and right sides of the adhesive tape portion, even if the adhesive tape portion is slightly misaligned, the island-like portion and the adhesive tape portion correspond to the misalignment. Since it is affixed to a sticking object, a tape can be reliably affixed to a sticking object.
図１は、本実施形態１におけるテープ貼付装置の概略構成を示す側面図である。FIG. 1 is a side view showing a schematic configuration of the tape applying apparatus according to the first embodiment. 図２は、本実施形態１におけるテープ材の切断領域を拡大して示す平面図である。FIG. 2 is an enlarged plan view showing the cutting area of the tape material in the first embodiment. 図３は、複数の端子部が形成された基板を示す平面図である。FIG. 3 is a plan view showing a substrate on which a plurality of terminal portions are formed. 図４は、互いに対向配置された基板及びテープ材を示す側面図である。FIG. 4 is a side view showing the substrate and the tape material arranged to face each other. 図５は、基板に貼り付けられた貼付テープ部を拡大して示す平面図である。FIG. 5 is an enlarged plan view showing the sticking tape portion attached to the substrate. 図６は、液晶表示装置の概略構成を示す断面図である。FIG. 6 is a cross-sectional view illustrating a schematic configuration of the liquid crystal display device. 図７は、本実施形態２におけるテープ材の切断領域を拡大して示す平面図である。FIG. 7 is an enlarged plan view showing a cutting area of the tape material in the second embodiment. 図８は、本実施形態３におけるテープ材の切断領域を拡大して示す平面図である。FIG. 8 is an enlarged plan view showing a cutting area of the tape material in the third embodiment. 図９は、従来のテープ貼付装置の要部を示す説明図である。FIG. 9 is an explanatory view showing a main part of a conventional tape applicator.
　以下、本発明の実施形態を図面に基づいて詳細に説明する。尚、本発明は、以下の実施形態に限定されるものではない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.
　《発明の実施形態１》
　図１～図６は、本発明の実施形態１を示している。 Embodiment 1 of the Invention
1 to 6 show Embodiment 1 of the present invention.
　図１は、本実施形態１におけるテープ貼付装置１の概略構成を示す側面図である。図２は、本実施形態１におけるテープ材１０の切断領域３６を拡大して示す平面図である。図３は、複数の端子部２０が形成された基板１８を示す平面図である。図４は、互いに対向配置された基板１８及びテープ材１０を示す側面図である。図５は、基板１８に貼り付けられた貼付テープ部１５を拡大して示す平面図である。図６は、液晶表示装置５０の概略構成を示す断面図である。 FIG. 1 is a side view showing a schematic configuration of a tape applying device 1 according to the first embodiment. FIG. 2 is an enlarged plan view showing the cutting region 36 of the tape material 10 according to the first embodiment. FIG. 3 is a plan view showing the substrate 18 on which the plurality of terminal portions 20 are formed. FIG. 4 is a side view showing the substrate 18 and the tape material 10 arranged to face each other. FIG. 5 is an enlarged plan view showing the adhesive tape portion 15 attached to the substrate 18. FIG. 6 is a cross-sectional view illustrating a schematic configuration of the liquid crystal display device 50.
　本実施形態におけるテープ貼付装置１は、図１に示すように、長尺のテープ材１０が巻き付けられたリール部１１と、リール部１１からテープ材１０を引き出す引き出し機構２５と、テープ材１０を案内する複数のガイドローラ１３と、テープ材１０に貼付テープ部１５を形成する切断ユニット３０と、貼付テープ部１５を貼付対象物である基板１８に圧着する圧着ユニット４０とを有している。 As shown in FIG. 1, the tape applicator 1 in the present embodiment includes a reel unit 11 around which a long tape material 10 is wound, a pulling mechanism 25 for pulling out the tape material 10 from the reel unit 11, and a tape material 10. A plurality of guide rollers 13 for guiding, a cutting unit 30 for forming the adhesive tape portion 15 on the tape material 10, and a pressure-bonding unit 40 for pressing the adhesive tape portion 15 to the substrate 18 as an object to be attached are provided.
　切断ユニット３０は、リール部１１と引き出し機構２５との間に配置されている。また、圧着ユニット４０は、切断ユニット３０と引き出し機構２５との間に配置されている。 The cutting unit 30 is disposed between the reel unit 11 and the drawer mechanism 25. The crimping unit 40 is disposed between the cutting unit 30 and the drawer mechanism 25.
　（基板）
　基板１８は、図３に示すように、例えばプリント基板（ＰＷＢ）であって、その表面に複数の駆動回路であるチップ部１９と、複数の端子が集合して形成された複数の端子部２０とを有している。複数の端子部２０は、基板１８の１辺に沿って配置されている。 (substrate)
As shown in FIG. 3, the substrate 18 is, for example, a printed circuit board (PWB), and has a chip portion 19 that is a plurality of drive circuits and a plurality of terminal portions 20 that are formed by a plurality of terminals. And have. The plurality of terminal portions 20 are arranged along one side of the substrate 18.
　（液晶表示装置）
　ここで、基板１８が接続される表示装置としての液晶表示装置５０について説明する。図６に示すように、液晶表示装置５０は、第１基板であるアクティブマトリクス基板としてのＴＦＴ基板５１と、ＴＦＴ基板５１に対向して配置された第２基板である対向基板５２と、ＴＦＴ基板５１及び対向基板５２の間に設けられた液晶層５３とを有する。 (Liquid crystal display device)
Here, a liquid crystal display device 50 as a display device to which the substrate 18 is connected will be described. As shown in FIG. 6, the liquid crystal display device 50 includes a TFT substrate 51 as an active matrix substrate that is a first substrate, a counter substrate 52 that is a second substrate disposed to face the TFT substrate 51, and a TFT substrate. 51 and a liquid crystal layer 53 provided between the counter substrate 52.
　また、図示を省略するが、液晶表示装置５０は、マトリクス状に配置された複数の画素が形成された表示領域と、その周囲に設けられた額縁状の非表示領域とを有している。 Although not shown, the liquid crystal display device 50 includes a display area in which a plurality of pixels arranged in a matrix are formed, and a frame-like non-display area provided around the display area.
　上記対向基板５２には、それぞれ図示省略のカラーフィルタ及び共通電極等が形成されている。また、液晶層５３は、上記ＴＦＴ基板５１と対向基板５２との間に設けられたシール部材５４によって封止されている。 The counter substrate 52 is provided with a color filter, a common electrode, etc. (not shown). The liquid crystal layer 53 is sealed by a sealing member 54 provided between the TFT substrate 51 and the counter substrate 52.
　一方、ＴＦＴ基板５１には、互いに並行して延びる複数のソース配線（図示省略）と、これらに直交して延びる複数のゲート配線（図示省略）とが形成されている。すなわち、ゲート配線及びソース配線からなる配線群は、全体として格子状に形成されている。その格子状の領域に、上記画素が形成されている。各画素には、それぞれ図示を省略するが、スイッチング素子であるＴＦＴ（Thin-Film Transistor：薄膜トランジスタ）と、これに接続された画素電極とが形成されている。また、ＴＦＴは、上記ソース配線及びゲート配線に接続されている。 On the other hand, on the TFT substrate 51, a plurality of source wirings (not shown) extending in parallel with each other and a plurality of gate wirings (not shown) extending orthogonally to these are formed. That is, the wiring group composed of the gate wiring and the source wiring is formed in a lattice shape as a whole. The pixels are formed in the lattice area. Although not shown, each pixel is formed with a TFT (Thin-Film Transistor) as a switching element and a pixel electrode connected to the TFT. The TFT is connected to the source wiring and the gate wiring.
　ＴＦＴ基板５１の非表示領域には、複数の端子が集合して配置された端子部５５が形成されている。端子部５５は、上記ソース配線又はゲート配線に接続されている。そうして、このＴＦＴ基板５１の端子部５５は、異方性導電膜（以下、ＡＣＦという）からなる貼付テープ部１５を介して、上記基板１８の端子部２０に接続されている。 In the non-display area of the TFT substrate 51, a terminal portion 55 in which a plurality of terminals are gathered and formed is formed. The terminal portion 55 is connected to the source wiring or the gate wiring. Thus, the terminal portion 55 of the TFT substrate 51 is connected to the terminal portion 20 of the substrate 18 through the adhesive tape portion 15 made of an anisotropic conductive film (hereinafter referred to as ACF).
　（テープ材）
　テープ材１０は、図４に示すように、支持テープであるセパレータ層２１と、セパレータ層２１に積層されることにより支持された貼付媒体層としてのＡＣＦ層２２とを有している。このＡＣＦ層２２の一部が貼付テープ部１５として、基板１８に圧着される。テープ材１０は、リール部１１の径方向内側にセパレータ層２１が配置された状態で、当該リール部１１に巻き付けられている。 (Tape material)
As shown in FIG. 4, the tape material 10 includes a separator layer 21 that is a support tape, and an ACF layer 22 that is a sticking medium layer supported by being laminated on the separator layer 21. A part of the ACF layer 22 is pressure-bonded to the substrate 18 as the adhesive tape portion 15. The tape material 10 is wound around the reel unit 11 in a state where the separator layer 21 is disposed on the radially inner side of the reel unit 11.
　（引き出し機構）
　引き出し機構２５は、図１に示すように、固定チャック２６及び引き出しチャック２７を有している。固定チャック２６及び引き出しチャック２７は、それぞれ、テープ材１０を狭持又は開放可能に構成されている。 (Drawer mechanism)
The drawer mechanism 25 has a fixed chuck 26 and a drawer chuck 27 as shown in FIG. The fixed chuck 26 and the drawer chuck 27 are configured to be able to pinch or release the tape material 10, respectively.
　そうして、引き出し機構２５は、固定チャック２６が開放された状態で、テープ材１０を狭持している引き出しチャック２７が固定チャック２６から離隔するようにスライド移動することにより、テープ材１０をリール部１１から所定長さだけ引き出すようになっている。テープ材１０が所定長さだけ引き出された後に、固定チャック２６がテープ材１０を狭持する。次に、引き出しチャック２７が、テープ材１０を開放した状態で、固定チャック２６に接近するようにスライド移動する。この一連の動作を繰り返すことによって、テープ材１０が所定長さずつ引き出されるようになっている。 Then, the drawer mechanism 25 slides the tape material 10 so that the drawer chuck 27 holding the tape material 10 is separated from the fixed chuck 26 with the fixed chuck 26 opened. A predetermined length is drawn from the reel unit 11. After the tape material 10 is pulled out by a predetermined length, the fixed chuck 26 holds the tape material 10. Next, the drawer chuck 27 slides so as to approach the fixed chuck 26 with the tape material 10 opened. By repeating this series of operations, the tape material 10 is pulled out by a predetermined length.
　そして、リール部１１から引き出されたテープ材１０は、複数のガイドローラ１３によって案内され、切断ユニット３０を経由して圧着ユニット４０へ供給されることとなる。 Then, the tape material 10 drawn out from the reel unit 11 is guided by the plurality of guide rollers 13 and supplied to the crimping unit 40 via the cutting unit 30.
　（切断ユニット）
　切断ユニット３０は、図１に示すように、台座部であるバックアップ３１と、刃部３２が装着された本体部３３とを有している。切断ユニット３０は、図２及び図４に示すように、長尺のテープ材１０に対し、当該テープ材１０のＡＣＦ層２２が切断された切断部３５を有する複数の切断領域３６をテープ材１０の長さ方向に並んで形成するように構成されている。 (Cutting unit)
As shown in FIG. 1, the cutting unit 30 includes a backup 31 that is a pedestal and a main body 33 to which a blade 32 is attached. As shown in FIGS. 2 and 4, the cutting unit 30 has a plurality of cutting regions 36 each having a cutting portion 35 in which the ACF layer 22 of the tape material 10 is cut with respect to the long tape material 10. Are arranged side by side in the length direction.
　すなわち、本体部３３は、バックアップ３１に接離するように進退可能に構成されている。そうして、本体部３３がバックアップ３１に接近することにより、刃部３２の複数の刃先がバックアップ３１に支持されたテープ材１０のＡＣＦ層２２に切り込んで当該テープ材１０をハーフカットし、そのテープ材１０に複数の切断部３５を形成するようになっている。切断部３５では、ＡＣＦ層２２からセパレータ層２１が露出している。 That is, the main body 33 is configured to be able to advance and retreat so as to be in contact with and away from the backup 31. Then, when the main body 33 approaches the backup 31, a plurality of cutting edges of the blade 32 are cut into the ACF layer 22 of the tape 10 supported by the backup 31, and the tape 10 is half-cut. A plurality of cutting portions 35 are formed in the tape material 10. In the cut portion 35, the separator layer 21 is exposed from the ACF layer 22.
　また、切断領域３６には、図２に示すように、複数の切断部３５と、この切断部３５同士の間に形成されると共に少なくともテープ材１０の長さ方向（つまり、図２で左右方向）に並んで配置されたＡＣＦ層２２からなる複数の島状部３７とが形成されている。 Further, as shown in FIG. 2, the cutting region 36 is formed between a plurality of cutting portions 35 and the cutting portions 35 and at least the length direction of the tape material 10 (that is, the horizontal direction in FIG. 2). And a plurality of island-shaped portions 37 made of the ACF layer 22 arranged side by side.
　刃部３２は、ライン状の刃先を少なくとも３つ有している。そのことにより、切断ユニット３０は、テープ材１０の幅方向（つまり、図２で上下方向）に伸びる短冊状の複数の島状部３７を形成するように構成されている。本実施形態では例えば４つの刃先が刃部３２に設けられている。したがって、テープ材１０には、４つの切断部３５と、３つの島状部３７とが形成される。 The blade part 32 has at least three line-shaped blade edges. Accordingly, the cutting unit 30 is configured to form a plurality of strip-shaped island portions 37 extending in the width direction of the tape material 10 (that is, the vertical direction in FIG. 2). In the present embodiment, for example, four blade edges are provided on the blade portion 32. Therefore, four cut portions 35 and three island-shaped portions 37 are formed in the tape material 10.
　図５に示すように、貼付テープ部１５の長さは、基板１８の端子部２０よりも短くなっている。さらに、貼付テープ部１５の長さと、その貼付テープ部１５の左右両側の各切断領域３６との長さの合計は、基板１８の端子部２０よりも長くなっている。 As shown in FIG. 5, the length of the adhesive tape portion 15 is shorter than the terminal portion 20 of the substrate 18. Further, the total length of the adhesive tape portion 15 and the lengths of the cut regions 36 on the left and right sides of the adhesive tape portion 15 are longer than the terminal portion 20 of the substrate 18.
　（圧着ユニット）
　圧着ユニット４０は、図１に示すように、バックアップ４１と、圧着ツール４２と、緩衝材４３が巻き付けられたリール部４４とを有している。圧着ユニット４０は、図３及び図４に示すように、切断領域３６同士の間に配置されているＡＣＦ層２２からなる貼付テープ部１５を、基板１８上の所定領域に圧着して貼り付けるように構成されている。 (Crimp unit)
As shown in FIG. 1, the crimping unit 40 includes a backup 41, a crimping tool 42, and a reel portion 44 around which a cushioning material 43 is wound. As shown in FIGS. 3 and 4, the crimping unit 40 is configured so that the adhesive tape portion 15 formed of the ACF layer 22 disposed between the cutting regions 36 is adhered to a predetermined region on the substrate 18 by pressure bonding. It is configured.
　すなわち、圧着ツール４２は、バックアップ４１に接離するように昇降可能に構成されている。圧着ツール４２の圧着面は、リール部４４から巻き出された緩衝材４３によって覆われている。緩衝材４３は、例えばシリコンゴム等によって構成することが可能である。 That is, the crimping tool 42 is configured to be movable up and down so as to be in contact with and separated from the backup 41. The crimping surface of the crimping tool 42 is covered with a cushioning material 43 that is unwound from the reel portion 44. The buffer material 43 can be made of, for example, silicon rubber.
　そうして、図３及び図４に示すように、バックアップ４１上にテープ材１０及び基板１８が互いに位置決めして配置された状態で、圧着ツール４２がバックアップ４１に接近する。そして、圧着ツール４２の圧着面が緩衝材４３を介してテープ材１０を基板１８に押し付ける。そのことにより、図５に示すように、基板１８の端子部２０に貼付テープ部１５が圧着されるようになっている。 3 and 4, the crimping tool 42 approaches the backup 41 in a state where the tape material 10 and the substrate 18 are positioned and arranged on the backup 41. Then, the crimping surface of the crimping tool 42 presses the tape material 10 against the substrate 18 through the buffer material 43. As a result, as shown in FIG. 5, the adhesive tape portion 15 is pressure-bonded to the terminal portion 20 of the substrate 18.
　図５に示すように、基板１８の端子部２０には、貼付テープ部１５と、テープ材１０において貼付テープ部１５の近傍に配置されていた複数の島状部３７の一部とが圧着されている。 As shown in FIG. 5, the adhesive tape portion 15 and a part of the plurality of island-like portions 37 arranged in the vicinity of the adhesive tape portion 15 in the tape material 10 are pressure-bonded to the terminal portion 20 of the substrate 18. ing.
　よって、基板１８が実装された液晶表示装置５０は、基板１８に圧着された貼付テープ部１５と、貼付テープ部１５の側方において基板１８に圧着された複数の島状部３７とを有する。すなわち、基板１８の端子部２０と、ＴＦＴ基板５１の端子部５５との間には、貼付テープ部１５及び島状部３７が介在されている。 Therefore, the liquid crystal display device 50 on which the substrate 18 is mounted has the adhesive tape portion 15 that is pressure-bonded to the substrate 18 and a plurality of island-shaped portions 37 that are pressure-bonded to the substrate 18 on the side of the adhesive tape portion 15. That is, the adhesive tape portion 15 and the island portion 37 are interposed between the terminal portion 20 of the substrate 18 and the terminal portion 55 of the TFT substrate 51.
　　－貼付方法－
　次に、上記テープ貼付装置１によるテープ貼付方法について説明する。 -Paste method-
Next, the tape sticking method by the tape sticking apparatus 1 will be described.
　まず、引き出し機構２５によってリール部１１からテープ材１０を所定の長さ分だけ引き出す工程を行う。この工程では、固定チャック２６が開放された状態で、テープ材１０を狭持している引き出しチャック２７を、固定チャック２６から離隔するようにスライド移動させることにより、テープ材１０をリール部１１から所定長さだけ引き出す。 First, a step of pulling out the tape material 10 from the reel portion 11 by a predetermined length by the pull-out mechanism 25 is performed. In this step, with the fixed chuck 26 being opened, the drawer chuck 27 holding the tape material 10 is slid away from the fixed chuck 26 to remove the tape material 10 from the reel portion 11. Pull out the specified length.
　また、テープ材１０が所定長さだけ引き出された後に、固定チャック２６がテープ材１０を狭持した状態で、引き出しチャック２７を、テープ材１０を開放した状態で、固定チャック２６に接近するようにスライド移動させる。リール部１１から引き出されたテープ材１０は、複数のガイドローラ１３によって案内され、まず、切断ユニット３０に供給される。 In addition, after the tape material 10 is pulled out by a predetermined length, the drawer chuck 27 is brought close to the fixed chuck 26 with the tape material 10 released in a state where the fixed chuck 26 holds the tape material 10. Slide to. The tape material 10 drawn from the reel unit 11 is guided by a plurality of guide rollers 13 and is first supplied to the cutting unit 30.
　次に、切断領域３６をテープ材１０に形成する切断工程を行う。切断工程では、テープ材１０をバックアップ３１と本体部３３との間に配置した状態で、本体部３３をバックアップ３１に接近させる。そのことにより、刃部３２におけるライン状の複数の刃先がバックアップ３１に支持されたテープ材１０のＡＣＦ層２２に切り込んで当該テープ材１０をハーフカットし、そのテープ材１０に複数の切断部３５を形成する。 Next, a cutting process for forming the cutting region 36 in the tape material 10 is performed. In the cutting process, the main body 33 is brought close to the backup 31 in a state where the tape material 10 is disposed between the backup 31 and the main body 33. As a result, a plurality of line-shaped cutting edges in the blade portion 32 are cut into the ACF layer 22 of the tape material 10 supported by the backup 31 to half-cut the tape material 10, and a plurality of cutting portions 35 are formed in the tape material 10. Form.
　こうして、複数のライン状の切断部３５と、テープ材１０の長さ方向に並んで配置された島状部３７とを有する切断領域３６を形成する。島状部３７は、テープ材１０の幅方向に伸びる短冊状に形成される。切断工程は、上記テープ材１０が所定長さだけ引き出される毎に行う。そのことにより、複数の切断領域３６をテープ材１０の長さ方向に並ぶように形成する。 Thus, a cutting region 36 having a plurality of line-shaped cutting portions 35 and island-shaped portions 37 arranged side by side in the length direction of the tape material 10 is formed. The island portion 37 is formed in a strip shape extending in the width direction of the tape material 10. The cutting step is performed each time the tape material 10 is pulled out by a predetermined length. Thereby, a plurality of cutting regions 36 are formed so as to be aligned in the length direction of the tape material 10.
　次に、貼付テープ部１５を基板１８の端子部２０に圧着する圧着工程を行う。圧着工程では、テープ材１０をバックアップ４１と圧着ツール４２との間に配置して、図３及び図４に示すように、貼付テープ部１５と基板１８の端子部２０とを位置合わせした状態で、圧着ツール４２をバックアップ４１に接近させる。そして、圧着ツール４２の圧着面を緩衝材４３を介してテープ材１０を基板１８に押し付ける。そのことにより、図５に示すように、基板１８の端子部２０に対して、貼付テープ部１５と複数の島状部３７とを圧着する。 Next, a crimping process for crimping the adhesive tape portion 15 to the terminal portion 20 of the substrate 18 is performed. In the crimping step, the tape material 10 is disposed between the backup 41 and the crimping tool 42, and the adhesive tape portion 15 and the terminal portion 20 of the substrate 18 are aligned as shown in FIGS. Then, the crimping tool 42 is brought close to the backup 41. Then, the tape material 10 is pressed against the substrate 18 through the cushioning material 43 on the crimping surface of the crimping tool 42. As a result, as shown in FIG. 5, the adhesive tape portion 15 and the plurality of island portions 37 are pressure-bonded to the terminal portion 20 of the substrate 18.
　こうして、基板１８の所定領域としての端子部２０に貼付テープ部１５を圧着して貼り付ける。その後、この貼付テープ部１５等が圧着された基板１８を、ＴＦＴ基板５１の端子部５５に圧着して実装する。 In this way, the adhesive tape portion 15 is bonded to the terminal portion 20 as a predetermined area of the substrate 18 by pressure bonding. Thereafter, the substrate 18 to which the adhesive tape portion 15 or the like is pressure-bonded is pressure-bonded to the terminal portion 55 of the TFT substrate 51 and mounted.
　　－実施形態１の効果－
　したがって、この実施形態１によると、貼付テープ部１５を貼付対象である端子部２０に確実に貼り付けながらも、テープ材１０等の部材の無駄を少なくして製造コストの低減を図ることができる。 -Effect of Embodiment 1-
Therefore, according to the first embodiment, it is possible to reduce the manufacturing cost by reducing the waste of the members such as the tape material 10 while securely attaching the adhesive tape part 15 to the terminal part 20 to be applied. .
　すなわち、本実施形態１では、ＡＣＦ層２２が切断された複数の切断部３５と、切断部３５同士の間に形成されると共に少なくともテープ材１０の長さ方向に並んで配置された複数の島状部３７とを有する切断領域３６を複数形成するようにしたので、ＡＣＦ層２２を大きな面積で中抜きする必要がなく、部材の無駄を少なくして製造コストの低減を図ることができる。 That is, in the first embodiment, the plurality of cut portions 35 in which the ACF layer 22 is cut, and the plurality of islands formed between the cut portions 35 and arranged at least in the length direction of the tape material 10. Since a plurality of cutting regions 36 having the shape portions 37 are formed, it is not necessary to hollow out the ACF layer 22 with a large area, and it is possible to reduce manufacturing costs by reducing waste of members.
　ここで、貼付テープ部１５と端子部２０とは、テープ材１０の長さ方向の位置ずれが大きな問題となる。これに対し、本実施形態では、テープ材１０の長さ方向に並ぶ複数の島状部３７を、貼付テープ部１５の左右両側に設けるようにしたので、貼付テープ部１５に多少の位置ずれがあったとしても、位置ずれの分だけ島状部３７が貼付テープ部１５と共に端子部２０に貼り付けられる結果、ＡＣＦ層２２を端子部２０の略全体に亘って確実に貼り付けることができる。 Here, the positional deviation in the length direction of the tape material 10 becomes a big problem between the adhesive tape portion 15 and the terminal portion 20. On the other hand, in this embodiment, since the plurality of island portions 37 arranged in the length direction of the tape material 10 are provided on both the left and right sides of the adhesive tape portion 15, there is a slight positional deviation in the adhesive tape portion 15. Even if it exists, as a result of sticking the island-shaped part 37 to the terminal part 20 together with the sticking tape part 15 by the amount of positional deviation, the ACF layer 22 can be reliably stuck over substantially the entire terminal part 20.
　さらに、切断部３５の形状をライン状としたので、刃部３２の刃先を簡単なライン形状とすることができ、刃部３２の部品コストの低減を図ることも可能になる。 Furthermore, since the shape of the cutting portion 35 is a line shape, the cutting edge of the blade portion 32 can be a simple line shape, and the cost of parts of the blade portion 32 can be reduced.
　《発明の実施形態２》
　図７は、本発明の実施形態２を示している。 << Embodiment 2 of the Invention >>
FIG. 7 shows Embodiment 2 of the present invention.
　図７は、本実施形態２におけるテープ材１０の切断領域３６を拡大して示す平面図である。尚、以降の各実施形態では、図１～図６と同じ部分については同じ符号を付して、その詳細な説明を省略する。 FIG. 7 is an enlarged plan view showing the cutting region 36 of the tape material 10 according to the second embodiment. In the following embodiments, the same portions as those in FIGS. 1 to 6 are denoted by the same reference numerals, and detailed description thereof is omitted.
　上記実施形態１では、切断ユニット３０における刃部３２の刃先が複数のライン状であったのに対し、本実施形態は、刃部３２の刃先が格子状に形成されている点で相違している。 In the first embodiment, the cutting edge of the blade portion 32 in the cutting unit 30 has a plurality of lines, but this embodiment is different in that the cutting edge of the blade portion 32 is formed in a lattice shape. Yes.
　すなわち、図７に示すように、本実施形態における切断ユニット３０の刃部３２は、複数の刃先が互いに直交するような格子形状となっている。そのことにより、切断工程において、テープ材１０の切断領域３６には、格子状にセパレータ層２１が露出した切断部３５と、マトリクス状に配置された複数の島状部３７とが形成されるようになっている。例えば、切断領域３６には、テープ材１０の幅方向に伸びる島状部３７の列が、テープ材１０の長さ方向に３列に並んでいる。 That is, as shown in FIG. 7, the blade portion 32 of the cutting unit 30 in the present embodiment has a lattice shape in which a plurality of blade edges are orthogonal to each other. As a result, in the cutting process, in the cutting region 36 of the tape material 10, the cutting portions 35 where the separator layer 21 is exposed in a lattice shape and the plurality of island-shaped portions 37 arranged in a matrix shape are formed. It has become. For example, in the cutting region 36, the rows of island portions 37 extending in the width direction of the tape material 10 are arranged in three rows in the length direction of the tape material 10.
　したがって、この実施形態２によっても、切断領域３６において、複数の島状部３７がテープ材１０の長さ方向に並ぶように配置されているので、上記実施形態１と同様に、貼付テープ部１５を貼付対象である端子部２０に確実に貼り付けながらも、テープ材１０等の部材の無駄を少なくして製造コストの低減を図ることができる。 Therefore, also in the second embodiment, since the plurality of island-shaped portions 37 are arranged in the cutting region 36 so as to be aligned in the length direction of the tape material 10, as in the first embodiment, the adhesive tape portion 15. Can be reliably affixed to the terminal part 20 to be affixed, while reducing the waste of members such as the tape material 10 and the like, thereby reducing the manufacturing cost.
　《発明の実施形態３》
　図８は、本発明の実施形態３を示している。図８は、本実施形態３におけるテープ材１０の切断領域３６を拡大して示す平面図である。 << Embodiment 3 of the Invention >>
FIG. 8 shows Embodiment 3 of the present invention. FIG. 8 is an enlarged plan view showing the cutting region 36 of the tape material 10 according to the third embodiment.
　本実施形態３は、上記実施形態２と同様に、切断ユニット３０における刃部３２の刃先が格子状に形成されている点で、刃部３２の刃先が複数のライン状である上記実施形態１と相違している。 The third embodiment is similar to the second embodiment, in that the cutting edge of the blade portion 32 in the cutting unit 30 is formed in a lattice shape, and the cutting edge of the blade portion 32 is a plurality of lines. Is different.
　すなわち、図８に示すように、本実施形態における切断ユニット３０の刃部３２は、複数の刃先が互いに斜めに交差するような格子形状となっている。そのことにより、切断工程において、テープ材１０の切断領域３６には、格子状にセパレータ層２１が露出した切断部３５と、千鳥状に配置された複数の島状部３７とが形成されるようになっている。本実施形態においても、例えば、切断領域３６には、テープ材１０の幅方向に伸びる島状部３７の列が、テープ材１０の長さ方向に３列に並んでいる。 That is, as shown in FIG. 8, the blade portion 32 of the cutting unit 30 in the present embodiment has a lattice shape in which a plurality of blade edges cross each other obliquely. As a result, in the cutting step, the cutting region 36 of the tape material 10 is formed with cutting portions 35 in which the separator layer 21 is exposed in a lattice shape and a plurality of island-like portions 37 arranged in a staggered manner. It has become. Also in this embodiment, for example, in the cutting region 36, the rows of island portions 37 extending in the width direction of the tape material 10 are arranged in three rows in the length direction of the tape material 10.
　したがって、この実施形態３によっても、切断領域３６において、複数の島状部３７がテープ材１０の長さ方向に並ぶように配置されているので、上記実施形態１と同様に、貼付テープ部１５を貼付対象である端子部２０に確実に貼り付けながらも、テープ材１０等の部材の無駄を少なくして製造コストの低減を図ることができる。 Accordingly, also in the third embodiment, the plurality of island-shaped portions 37 are arranged in the cutting region 36 so as to be aligned in the length direction of the tape material 10, so that the adhesive tape portion 15 is the same as in the first embodiment. Can be reliably affixed to the terminal part 20 to be affixed, while reducing the waste of members such as the tape material 10 and the like, thereby reducing the manufacturing cost.
　《その他の実施形態》
　上記各実施形態では、貼付媒体層がＡＣＦ層２２であるテープ材１０について説明したが、本発明はこれに限らず、導電性を有する導電層等の他の貼付媒体層であってもよい。 << Other Embodiments >>
In each of the above embodiments, the tape material 10 in which the sticking medium layer is the ACF layer 22 has been described. However, the present invention is not limited to this, and other sticking medium layers such as a conductive layer having conductivity may be used.
　上記各実施形態では、テープ貼付装置の貼付対象物がプリント基板からなる基板１８である例について説明したが、本発明はこれに限らず、例えば表示パネルを構成するアクティブマトリクス基板や、回路部材等の他の貼付対象物であってもよい。 In each of the above embodiments, the example in which the object to be attached of the tape attaching apparatus is the printed circuit board 18 has been described. However, the present invention is not limited to this, and for example, an active matrix substrate constituting a display panel, a circuit member, and the like Other pasting objects may be used.
　また、本発明は上記実施形態１～３に限定されるものでなく、本発明には、これらの実施形態１～３を適宜組み合わせた構成が含まれる。 Further, the present invention is not limited to the above-described first to third embodiments, and the present invention includes a configuration in which these first to third embodiments are appropriately combined.
　以上説明したように、本発明は、テープ貼付装置、テープ貼付方法及び表示装置について有用である。 As described above, the present invention is useful for a tape sticking device, a tape sticking method, and a display device.
　　　　　　１　　　テープ貼付装置 
　　　　　１０　　　テープ材 
　　　　　１５　　　貼付テープ部 
　　　　　１８　　　基板（貼付対象物） 
　　　　　２１　　　セパレータ層 
　　　　　２２　　　ＡＣＦ層（貼付媒体層） 
　　　　　３０　　　切断ユニット 
　　　　　３２　　　刃部 
　　　　　３５　　　切断部 
　　　　　３６　　　切断領域 
　　　　　３７　　　島状部 
　　　　　４０　　　圧着ユニット 
　　　　　５０　　　液晶表示装置 
　　　　　５１　　　ＴＦＴ基板（第１基板） 
　　　　　５２　　　対向基板（第２基板） 
　　　　　５５　　　端子部 　　 1 Tape applicator
10 Tape material
15 Adhesive tape section
18 Substrate (target object)
21 Separator layer
22 ACF layer (paste medium layer)
30 cutting unit
32 blades
35 Cutting part
36 Cutting area
37 island
40 Crimp unit
50 Liquid crystal display devices
51 TFT substrate (first substrate)
52 Counter substrate (second substrate)
55 Terminal

Claims (13)

  1. 　セパレータ層と該セパレータ層に積層された貼付媒体層とを有する長尺のテープ材に対し、上記貼付媒体層が切断された切断部を有する複数の切断領域を上記テープ材の長さ方向に並ぶように形成する切断ユニットと、
    　上記切断領域同士の間に配置されている上記貼付媒体層からなる貼付テープ部を、貼付対象物の所定領域に圧着して貼り付ける圧着ユニットとを備え、
    　上記切断ユニットは、複数の上記切断部と、該切断部同士の間に形成されると共に少なくとも上記テープ材の長さ方向に並んで配置された上記貼付媒体層からなる複数の島状部とを上記切断領域に形成するように構成されている
    ことを特徴とするテープ貼付装置。     For a long tape material having a separator layer and a sticking medium layer laminated on the separator layer, a plurality of cutting regions having cut portions where the sticking medium layer is cut are arranged in the length direction of the tape material. A cutting unit to be formed, and
    A pressure-bonding unit that is affixed to a predetermined region of the object to be pasted by affixing an adhesive tape layer composed of the affixing medium layer disposed between the cutting regions;
    The cutting unit includes a plurality of the cutting portions and a plurality of island-shaped portions formed between the cutting portions and arranged at least in the length direction of the tape material. A tape applicator configured to be formed in the cutting region.
  2. 　請求項１に記載されたテープ貼付装置において、
    　上記切断ユニットは、上記テープ材の幅方向に伸びる短冊状の上記複数の島状部を形成するように構成されている
    ことを特徴とするテープ貼付装置。     In the tape applicator according to claim 1,
    The tape cutting device, wherein the cutting unit is configured to form a plurality of strip-like island-shaped portions extending in the width direction of the tape material.
  3. 　請求項２に記載されたテープ貼付装置において、
    　上記切断ユニットは、ライン状の刃先を少なくとも３つ有する刃部を有している
    ことを特徴とするテープ貼付装置。     In the tape applicator according to claim 2,
    The said cutting unit has the blade part which has at least 3 line-shaped blade edge | tip, The tape sticking apparatus characterized by the above-mentioned.
  4. 　請求項１に記載されたテープ貼付装置において、
    　上記切断ユニットは、上記切断領域にマトリクス状に配置された上記複数の島状部を形成するように構成されている
    ことを特徴とするテープ貼付装置。     In the tape applicator according to claim 1,
    The tape applying apparatus, wherein the cutting unit is configured to form the plurality of island-shaped portions arranged in a matrix in the cutting region.
  5. 　請求項１に記載されたテープ貼付装置において、
    　上記切断ユニットは、上記切断領域に千鳥状に配置された上記複数の島状部を形成するように構成されている
    ことを特徴とするテープ貼付装置。     In the tape applicator according to claim 1,
    The tape applying device, wherein the cutting unit is configured to form the plurality of island-shaped portions arranged in a staggered manner in the cutting region.
  6. 　請求項４又は５に記載されたテープ貼付装置において、
    　上記切断ユニットは、格子状の刃先を有する刃部を有している
    ことを特徴とするテープ貼付装置。     In the tape applicator according to claim 4 or 5,
    The said cutting unit has a blade part which has a lattice-shaped blade edge | tip, The tape sticking apparatus characterized by the above-mentioned.
  7. 　セパレータ層と該セパレータ層に積層された貼付媒体層とを有する長尺のテープ材に対し、上記貼付媒体層が切断された切断部を有する複数の切断領域を上記テープ材の長さ方向に並ぶように形成する切断工程と、
    　上記切断領域同士の間に配置されている上記貼付媒体層からなる貼付テープ部を、貼付対象物の所定領域に圧着して貼り付ける圧着工程とを有し、
    　上記切断工程では、複数の上記切断部と、該切断部同士の間に形成されると共に少なくとも上記テープ材の長さ方向に並んで配置された上記貼付媒体層からなる複数の島状部とを上記切断領域に形成する
    ことを特徴とするテープ貼付方法。     For a long tape material having a separator layer and a sticking medium layer laminated on the separator layer, a plurality of cutting regions having cut portions where the sticking medium layer is cut are arranged in the length direction of the tape material. Cutting process to form
    A pressure-bonding step in which the adhesive tape layer composed of the adhesive medium layer disposed between the cut areas is bonded to a predetermined area of the object to be applied,
    In the cutting step, a plurality of the cutting portions, and a plurality of island-shaped portions formed between the cutting portions and formed of the sticking medium layer arranged at least in the length direction of the tape material. A method for applying a tape, wherein the method is formed in the cutting region.
  8. 　請求項７に記載されたテープ貼付方法において、
    　上記切断工程では、上記テープ材の幅方向に伸びる短冊状の上記複数の島状部を形成する
    ことを特徴とするテープ貼付方法。     In the tape sticking method according to claim 7,
    In the cutting step, the plurality of strip-like island-shaped portions extending in the width direction of the tape material are formed.
  9. 　請求項８に記載されたテープ貼付方法において、
    　上記切断工程では、ライン状の刃先を少なくとも３つ有する刃部によって、上記複数の島状部を形成する
    ことを特徴とするテープ貼付方法。     In the tape sticking method according to claim 8,
    In the cutting step, the plurality of island-shaped portions are formed by a blade portion having at least three line-shaped blade edges.
  10. 　請求項７に記載されたテープ貼付方法において、
    　上記切断工程では、上記切断領域にマトリクス状に配置された上記複数の島状部を形成する
    ことを特徴とするテープ貼付方法。     In the tape sticking method according to claim 7,
    In the cutting step, the plurality of island portions arranged in a matrix in the cutting region are formed.
  11. 　請求項７に記載されたテープ貼付方法において、
    　上記切断工程では、上記切断領域に千鳥状に配置された上記複数の島状部を形成する
    ことを特徴とするテープ貼付方法。     In the tape sticking method according to claim 7,
    In the cutting step, the plurality of island-shaped portions arranged in a staggered pattern in the cutting region are formed.
  12. 　請求項１０又は１１に記載されたテープ貼付方法において、
    　上記切断工程では、格子状の刃先を有する刃部によって、上記複数の島状部を形成する
    ことを特徴とするテープ貼付方法。     In the tape sticking method according to claim 10 or 11,
    In the cutting step, the plurality of island-shaped portions are formed by a blade portion having a lattice-shaped blade edge.
  13. 　端子部が形成された第１基板と、
    　上記第１基板に対向して配置された第２基板と、
    　上記第１基板の端子部に実装された基板と、
    　上記基板に圧着された貼付媒体層からなる貼付テープ部と、
    　上記貼付テープ部の側方において上記基板に圧着されると共に上記貼付媒体層からなる複数の島状部とを備えている
    ことを特徴とする表示装置。     A first substrate on which a terminal portion is formed;
    A second substrate disposed opposite the first substrate;
    A substrate mounted on the terminal portion of the first substrate;
    An adhesive tape portion comprising an adhesive medium layer pressure-bonded to the substrate;
    A display device, comprising: a plurality of island-shaped portions made of the sticking medium layer and being pressed against the substrate on a side of the sticking tape portion.
PCT/JP2012/002542 2011-04-18 2012-04-12 Tape attachment device, tape attachment method, and display device WO2012144170A1 (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066019A (en) * 1992-06-22 1994-01-14 Sony Corp Gluing method for anisotropic conductive film and device thereof
JP2007030085A (en) * 2005-07-25 2007-02-08 Pioneer Electronic Corp Self-adhesive film cutting device, wiring connecting device, self-adhesive film cutting method, wiring connecting method and manufacturing method of plane display device
JP2010225923A (en) * 2009-03-24 2010-10-07 Shibaura Mechatronics Corp Bonding apparatus and bonding method for adhesive tape

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH066019A (en) * 1992-06-22 1994-01-14 Sony Corp Gluing method for anisotropic conductive film and device thereof
JP2007030085A (en) * 2005-07-25 2007-02-08 Pioneer Electronic Corp Self-adhesive film cutting device, wiring connecting device, self-adhesive film cutting method, wiring connecting method and manufacturing method of plane display device
JP2010225923A (en) * 2009-03-24 2010-10-07 Shibaura Mechatronics Corp Bonding apparatus and bonding method for adhesive tape

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