JP2010199528A5 - - Google Patents
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- Publication number
- JP2010199528A5 JP2010199528A5 JP2009094065A JP2009094065A JP2010199528A5 JP 2010199528 A5 JP2010199528 A5 JP 2010199528A5 JP 2009094065 A JP2009094065 A JP 2009094065A JP 2009094065 A JP2009094065 A JP 2009094065A JP 2010199528 A5 JP2010199528 A5 JP 2010199528A5
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- copper
- core material
- mass
- melting point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- 239000011162 core material Substances 0.000 claims 3
- 239000011247 coating layer Substances 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009094065A JP2010199528A (ja) | 2009-01-27 | 2009-04-08 | ボンディングワイヤ |
PCT/JP2009/065735 WO2010087053A1 (ja) | 2009-01-27 | 2009-09-09 | ボンディングワイヤ |
TW099102279A TW201037777A (en) | 2009-01-27 | 2010-01-27 | Bonding wire |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009015265 | 2009-01-27 | ||
JP2009094065A JP2010199528A (ja) | 2009-01-27 | 2009-04-08 | ボンディングワイヤ |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010199528A JP2010199528A (ja) | 2010-09-09 |
JP2010199528A5 true JP2010199528A5 (zh) | 2011-05-12 |
Family
ID=42395321
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009094065A Pending JP2010199528A (ja) | 2009-01-27 | 2009-04-08 | ボンディングワイヤ |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2010199528A (zh) |
TW (1) | TW201037777A (zh) |
WO (1) | WO2010087053A1 (zh) |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101053079A (zh) | 2004-11-03 | 2007-10-10 | 德塞拉股份有限公司 | 堆叠式封装的改进 |
US8058101B2 (en) | 2005-12-23 | 2011-11-15 | Tessera, Inc. | Microelectronic packages and methods therefor |
US9159708B2 (en) | 2010-07-19 | 2015-10-13 | Tessera, Inc. | Stackable molded microelectronic packages with area array unit connectors |
US8482111B2 (en) | 2010-07-19 | 2013-07-09 | Tessera, Inc. | Stackable molded microelectronic packages |
CN102130068B (zh) * | 2011-01-07 | 2012-09-05 | 四川威纳尔特种电子材料有限公司 | 一种表面有复合镀层的合金型键合丝 |
JP4860004B1 (ja) * | 2011-02-28 | 2012-01-25 | タツタ電線株式会社 | ボンディングワイヤ及びその製造方法 |
KR101128063B1 (ko) | 2011-05-03 | 2012-04-23 | 테세라, 인코포레이티드 | 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리 |
US8836136B2 (en) | 2011-10-17 | 2014-09-16 | Invensas Corporation | Package-on-package assembly with wire bond vias |
CN102324392B (zh) * | 2011-10-19 | 2013-03-27 | 广东佳博电子科技有限公司 | 一种防氧化的铜基键合丝的制备工艺 |
US8946757B2 (en) | 2012-02-17 | 2015-02-03 | Invensas Corporation | Heat spreading substrate with embedded interconnects |
US8372741B1 (en) | 2012-02-24 | 2013-02-12 | Invensas Corporation | Method for package-on-package assembly with wire bonds to encapsulation surface |
US8835228B2 (en) | 2012-05-22 | 2014-09-16 | Invensas Corporation | Substrate-less stackable package with wire-bond interconnect |
US9391008B2 (en) | 2012-07-31 | 2016-07-12 | Invensas Corporation | Reconstituted wafer-level package DRAM |
US9502390B2 (en) | 2012-08-03 | 2016-11-22 | Invensas Corporation | BVA interposer |
US8878353B2 (en) | 2012-12-20 | 2014-11-04 | Invensas Corporation | Structure for microelectronic packaging with bond elements to encapsulation surface |
US9136254B2 (en) | 2013-02-01 | 2015-09-15 | Invensas Corporation | Microelectronic package having wire bond vias and stiffening layer |
CN103219247B (zh) * | 2013-03-01 | 2015-11-25 | 溧阳市虹翔机械制造有限公司 | 一种镀银键合铜丝的制造方法 |
CN103219246B (zh) * | 2013-03-01 | 2015-11-25 | 溧阳市虹翔机械制造有限公司 | 一种镀钯镀银的双镀层键合铜丝的制造方法 |
US9167710B2 (en) | 2013-08-07 | 2015-10-20 | Invensas Corporation | Embedded packaging with preformed vias |
US9685365B2 (en) | 2013-08-08 | 2017-06-20 | Invensas Corporation | Method of forming a wire bond having a free end |
US20150076714A1 (en) | 2013-09-16 | 2015-03-19 | Invensas Corporation | Microelectronic element with bond elements to encapsulation surface |
US9583456B2 (en) | 2013-11-22 | 2017-02-28 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9379074B2 (en) | 2013-11-22 | 2016-06-28 | Invensas Corporation | Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects |
US9263394B2 (en) | 2013-11-22 | 2016-02-16 | Invensas Corporation | Multiple bond via arrays of different wire heights on a same substrate |
US9583411B2 (en) | 2014-01-17 | 2017-02-28 | Invensas Corporation | Fine pitch BVA using reconstituted wafer with area array accessible for testing |
US10381326B2 (en) | 2014-05-28 | 2019-08-13 | Invensas Corporation | Structure and method for integrated circuits packaging with increased density |
US9412714B2 (en) | 2014-05-30 | 2016-08-09 | Invensas Corporation | Wire bond support structure and microelectronic package including wire bonds therefrom |
US9735084B2 (en) | 2014-12-11 | 2017-08-15 | Invensas Corporation | Bond via array for thermal conductivity |
US9888579B2 (en) | 2015-03-05 | 2018-02-06 | Invensas Corporation | Pressing of wire bond wire tips to provide bent-over tips |
US9502372B1 (en) | 2015-04-30 | 2016-11-22 | Invensas Corporation | Wafer-level packaging using wire bond wires in place of a redistribution layer |
US9761554B2 (en) | 2015-05-07 | 2017-09-12 | Invensas Corporation | Ball bonding metal wire bond wires to metal pads |
US10490528B2 (en) | 2015-10-12 | 2019-11-26 | Invensas Corporation | Embedded wire bond wires |
US9490222B1 (en) | 2015-10-12 | 2016-11-08 | Invensas Corporation | Wire bond wires for interference shielding |
US10332854B2 (en) | 2015-10-23 | 2019-06-25 | Invensas Corporation | Anchoring structure of fine pitch bva |
US10181457B2 (en) | 2015-10-26 | 2019-01-15 | Invensas Corporation | Microelectronic package for wafer-level chip scale packaging with fan-out |
US10043779B2 (en) | 2015-11-17 | 2018-08-07 | Invensas Corporation | Packaged microelectronic device for a package-on-package device |
US9659848B1 (en) | 2015-11-18 | 2017-05-23 | Invensas Corporation | Stiffened wires for offset BVA |
US9984992B2 (en) | 2015-12-30 | 2018-05-29 | Invensas Corporation | Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces |
US9935075B2 (en) | 2016-07-29 | 2018-04-03 | Invensas Corporation | Wire bonding method and apparatus for electromagnetic interference shielding |
US10299368B2 (en) | 2016-12-21 | 2019-05-21 | Invensas Corporation | Surface integrated waveguides and circuit structures therefor |
CN109411591B (zh) * | 2018-09-14 | 2020-09-18 | 汕头市骏码凯撒有限公司 | 一种led封装用银合金线及其制作方法 |
JP7412998B2 (ja) | 2019-12-12 | 2024-01-15 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6278863A (ja) * | 1985-09-30 | 1987-04-11 | Tanaka Denshi Kogyo Kk | 半導体素子のボンデイング用銅線 |
JPS6297360A (ja) * | 1985-10-24 | 1987-05-06 | Mitsubishi Metal Corp | 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線 |
JPH0786325A (ja) * | 1993-09-14 | 1995-03-31 | Hitachi Cable Ltd | 電子機器用銅線 |
WO2002023618A1 (fr) * | 2000-09-18 | 2002-03-21 | Nippon Steel Corporation | Fil de connexion de semi-conducteur et son procede de fabrication |
JP2003133361A (ja) * | 2001-10-23 | 2003-05-09 | Sumiden Magnet Wire Kk | ボンディングワイヤー |
JP2004064033A (ja) * | 2001-10-23 | 2004-02-26 | Sumitomo Electric Wintec Inc | ボンディングワイヤー |
-
2009
- 2009-04-08 JP JP2009094065A patent/JP2010199528A/ja active Pending
- 2009-09-09 WO PCT/JP2009/065735 patent/WO2010087053A1/ja active Application Filing
-
2010
- 2010-01-27 TW TW099102279A patent/TW201037777A/zh unknown
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