JP2010199528A5 - - Google Patents

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Publication number
JP2010199528A5
JP2010199528A5 JP2009094065A JP2009094065A JP2010199528A5 JP 2010199528 A5 JP2010199528 A5 JP 2010199528A5 JP 2009094065 A JP2009094065 A JP 2009094065A JP 2009094065 A JP2009094065 A JP 2009094065A JP 2010199528 A5 JP2010199528 A5 JP 2010199528A5
Authority
JP
Japan
Prior art keywords
bonding wire
copper
core material
mass
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009094065A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010199528A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009094065A priority Critical patent/JP2010199528A/ja
Priority claimed from JP2009094065A external-priority patent/JP2010199528A/ja
Priority to PCT/JP2009/065735 priority patent/WO2010087053A1/ja
Priority to TW099102279A priority patent/TW201037777A/zh
Publication of JP2010199528A publication Critical patent/JP2010199528A/ja
Publication of JP2010199528A5 publication Critical patent/JP2010199528A5/ja
Pending legal-status Critical Current

Links

JP2009094065A 2009-01-27 2009-04-08 ボンディングワイヤ Pending JP2010199528A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009094065A JP2010199528A (ja) 2009-01-27 2009-04-08 ボンディングワイヤ
PCT/JP2009/065735 WO2010087053A1 (ja) 2009-01-27 2009-09-09 ボンディングワイヤ
TW099102279A TW201037777A (en) 2009-01-27 2010-01-27 Bonding wire

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2009015265 2009-01-27
JP2009094065A JP2010199528A (ja) 2009-01-27 2009-04-08 ボンディングワイヤ

Publications (2)

Publication Number Publication Date
JP2010199528A JP2010199528A (ja) 2010-09-09
JP2010199528A5 true JP2010199528A5 (zh) 2011-05-12

Family

ID=42395321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009094065A Pending JP2010199528A (ja) 2009-01-27 2009-04-08 ボンディングワイヤ

Country Status (3)

Country Link
JP (1) JP2010199528A (zh)
TW (1) TW201037777A (zh)
WO (1) WO2010087053A1 (zh)

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101053079A (zh) 2004-11-03 2007-10-10 德塞拉股份有限公司 堆叠式封装的改进
US8058101B2 (en) 2005-12-23 2011-11-15 Tessera, Inc. Microelectronic packages and methods therefor
US9159708B2 (en) 2010-07-19 2015-10-13 Tessera, Inc. Stackable molded microelectronic packages with area array unit connectors
US8482111B2 (en) 2010-07-19 2013-07-09 Tessera, Inc. Stackable molded microelectronic packages
CN102130068B (zh) * 2011-01-07 2012-09-05 四川威纳尔特种电子材料有限公司 一种表面有复合镀层的合金型键合丝
JP4860004B1 (ja) * 2011-02-28 2012-01-25 タツタ電線株式会社 ボンディングワイヤ及びその製造方法
KR101128063B1 (ko) 2011-05-03 2012-04-23 테세라, 인코포레이티드 캡슐화 층의 표면에 와이어 본드를 구비하는 패키지 적층형 어셈블리
US8836136B2 (en) 2011-10-17 2014-09-16 Invensas Corporation Package-on-package assembly with wire bond vias
CN102324392B (zh) * 2011-10-19 2013-03-27 广东佳博电子科技有限公司 一种防氧化的铜基键合丝的制备工艺
US8946757B2 (en) 2012-02-17 2015-02-03 Invensas Corporation Heat spreading substrate with embedded interconnects
US8372741B1 (en) 2012-02-24 2013-02-12 Invensas Corporation Method for package-on-package assembly with wire bonds to encapsulation surface
US8835228B2 (en) 2012-05-22 2014-09-16 Invensas Corporation Substrate-less stackable package with wire-bond interconnect
US9391008B2 (en) 2012-07-31 2016-07-12 Invensas Corporation Reconstituted wafer-level package DRAM
US9502390B2 (en) 2012-08-03 2016-11-22 Invensas Corporation BVA interposer
US8878353B2 (en) 2012-12-20 2014-11-04 Invensas Corporation Structure for microelectronic packaging with bond elements to encapsulation surface
US9136254B2 (en) 2013-02-01 2015-09-15 Invensas Corporation Microelectronic package having wire bond vias and stiffening layer
CN103219247B (zh) * 2013-03-01 2015-11-25 溧阳市虹翔机械制造有限公司 一种镀银键合铜丝的制造方法
CN103219246B (zh) * 2013-03-01 2015-11-25 溧阳市虹翔机械制造有限公司 一种镀钯镀银的双镀层键合铜丝的制造方法
US9167710B2 (en) 2013-08-07 2015-10-20 Invensas Corporation Embedded packaging with preformed vias
US9685365B2 (en) 2013-08-08 2017-06-20 Invensas Corporation Method of forming a wire bond having a free end
US20150076714A1 (en) 2013-09-16 2015-03-19 Invensas Corporation Microelectronic element with bond elements to encapsulation surface
US9583456B2 (en) 2013-11-22 2017-02-28 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9379074B2 (en) 2013-11-22 2016-06-28 Invensas Corporation Die stacks with one or more bond via arrays of wire bond wires and with one or more arrays of bump interconnects
US9263394B2 (en) 2013-11-22 2016-02-16 Invensas Corporation Multiple bond via arrays of different wire heights on a same substrate
US9583411B2 (en) 2014-01-17 2017-02-28 Invensas Corporation Fine pitch BVA using reconstituted wafer with area array accessible for testing
US10381326B2 (en) 2014-05-28 2019-08-13 Invensas Corporation Structure and method for integrated circuits packaging with increased density
US9412714B2 (en) 2014-05-30 2016-08-09 Invensas Corporation Wire bond support structure and microelectronic package including wire bonds therefrom
US9735084B2 (en) 2014-12-11 2017-08-15 Invensas Corporation Bond via array for thermal conductivity
US9888579B2 (en) 2015-03-05 2018-02-06 Invensas Corporation Pressing of wire bond wire tips to provide bent-over tips
US9502372B1 (en) 2015-04-30 2016-11-22 Invensas Corporation Wafer-level packaging using wire bond wires in place of a redistribution layer
US9761554B2 (en) 2015-05-07 2017-09-12 Invensas Corporation Ball bonding metal wire bond wires to metal pads
US10490528B2 (en) 2015-10-12 2019-11-26 Invensas Corporation Embedded wire bond wires
US9490222B1 (en) 2015-10-12 2016-11-08 Invensas Corporation Wire bond wires for interference shielding
US10332854B2 (en) 2015-10-23 2019-06-25 Invensas Corporation Anchoring structure of fine pitch bva
US10181457B2 (en) 2015-10-26 2019-01-15 Invensas Corporation Microelectronic package for wafer-level chip scale packaging with fan-out
US10043779B2 (en) 2015-11-17 2018-08-07 Invensas Corporation Packaged microelectronic device for a package-on-package device
US9659848B1 (en) 2015-11-18 2017-05-23 Invensas Corporation Stiffened wires for offset BVA
US9984992B2 (en) 2015-12-30 2018-05-29 Invensas Corporation Embedded wire bond wires for vertical integration with separate surface mount and wire bond mounting surfaces
US9935075B2 (en) 2016-07-29 2018-04-03 Invensas Corporation Wire bonding method and apparatus for electromagnetic interference shielding
US10299368B2 (en) 2016-12-21 2019-05-21 Invensas Corporation Surface integrated waveguides and circuit structures therefor
CN109411591B (zh) * 2018-09-14 2020-09-18 汕头市骏码凯撒有限公司 一种led封装用银合金线及其制作方法
JP7412998B2 (ja) 2019-12-12 2024-01-15 ローム株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6278863A (ja) * 1985-09-30 1987-04-11 Tanaka Denshi Kogyo Kk 半導体素子のボンデイング用銅線
JPS6297360A (ja) * 1985-10-24 1987-05-06 Mitsubishi Metal Corp 半導体装置のボンデイングワイヤ用表面被覆高純度銅極細線
JPH0786325A (ja) * 1993-09-14 1995-03-31 Hitachi Cable Ltd 電子機器用銅線
WO2002023618A1 (fr) * 2000-09-18 2002-03-21 Nippon Steel Corporation Fil de connexion de semi-conducteur et son procede de fabrication
JP2003133361A (ja) * 2001-10-23 2003-05-09 Sumiden Magnet Wire Kk ボンディングワイヤー
JP2004064033A (ja) * 2001-10-23 2004-02-26 Sumitomo Electric Wintec Inc ボンディングワイヤー

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