JP2010199492A5 - - Google Patents

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Publication number
JP2010199492A5
JP2010199492A5 JP2009045570A JP2009045570A JP2010199492A5 JP 2010199492 A5 JP2010199492 A5 JP 2010199492A5 JP 2009045570 A JP2009045570 A JP 2009045570A JP 2009045570 A JP2009045570 A JP 2009045570A JP 2010199492 A5 JP2010199492 A5 JP 2010199492A5
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JP
Japan
Prior art keywords
island
semiconductor device
manufacturing
metal fine
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009045570A
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English (en)
Japanese (ja)
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JP2010199492A (ja
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Publication date
Application filed filed Critical
Priority to JP2009045570A priority Critical patent/JP2010199492A/ja
Priority claimed from JP2009045570A external-priority patent/JP2010199492A/ja
Priority to US13/203,447 priority patent/US8633511B2/en
Priority to PCT/JP2010/053489 priority patent/WO2010098501A1/ja
Priority to CN201080009373.5A priority patent/CN102334186B/zh
Publication of JP2010199492A publication Critical patent/JP2010199492A/ja
Publication of JP2010199492A5 publication Critical patent/JP2010199492A5/ja
Pending legal-status Critical Current

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JP2009045570A 2009-02-27 2009-02-27 半導体装置およびその製造方法 Pending JP2010199492A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009045570A JP2010199492A (ja) 2009-02-27 2009-02-27 半導体装置およびその製造方法
US13/203,447 US8633511B2 (en) 2009-02-27 2010-02-25 Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation material
PCT/JP2010/053489 WO2010098501A1 (ja) 2009-02-27 2010-02-25 半導体装置およびその製造方法
CN201080009373.5A CN102334186B (zh) 2009-02-27 2010-02-25 半导体装置及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009045570A JP2010199492A (ja) 2009-02-27 2009-02-27 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2010199492A JP2010199492A (ja) 2010-09-09
JP2010199492A5 true JP2010199492A5 (cg-RX-API-DMAC7.html) 2011-10-20

Family

ID=42665695

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009045570A Pending JP2010199492A (ja) 2009-02-27 2009-02-27 半導体装置およびその製造方法

Country Status (4)

Country Link
US (1) US8633511B2 (cg-RX-API-DMAC7.html)
JP (1) JP2010199492A (cg-RX-API-DMAC7.html)
CN (1) CN102334186B (cg-RX-API-DMAC7.html)
WO (1) WO2010098501A1 (cg-RX-API-DMAC7.html)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6161251B2 (ja) * 2012-10-17 2017-07-12 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
WO2014064822A1 (ja) * 2012-10-26 2014-05-01 株式会社日立産機システム パワー半導体モジュールおよびこれを搭載した電力変換装置
US10290907B2 (en) 2015-07-27 2019-05-14 Semiconductor Components Industries, Llc Automatically programmable battery protection system and related methods
US10186498B2 (en) 2015-07-27 2019-01-22 Semiconductor Components Industries, Llc Semiconductor leadframes and packages with solder dams and related methods
US10205330B2 (en) 2015-07-27 2019-02-12 Semiconductor Components Industries, Llc Programmable battery protection system and related methods
US9997476B2 (en) 2015-10-30 2018-06-12 Infineon Technologies Ag Multi-die package having different types of semiconductor dies attached to the same thermally conductive flange
CN107408553B (zh) * 2016-03-11 2019-07-26 新电元工业株式会社 半导体装置
JP2019054296A (ja) * 2019-01-10 2019-04-04 京セラ株式会社 パワー半導体モジュール
JP7655201B2 (ja) * 2021-11-19 2025-04-02 住友電気工業株式会社 半導体装置
JP2024080210A (ja) * 2022-12-02 2024-06-13 三菱電機株式会社 半導体装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01183129A (ja) * 1988-01-18 1989-07-20 Fujitsu Ltd 半導体装置
JPH0350758A (ja) * 1989-07-18 1991-03-05 Toshiba Corp 樹脂封止型半導体装置
US5309322A (en) * 1992-10-13 1994-05-03 Motorola, Inc. Leadframe strip for semiconductor packages and method
JPH06177312A (ja) * 1992-12-08 1994-06-24 Fuji Electric Co Ltd 半導体装置およびリードフレーム
US5625235A (en) * 1995-06-15 1997-04-29 National Semiconductor Corporation Multichip integrated circuit module with crossed bonding wires
US5739582A (en) * 1995-11-24 1998-04-14 Xerox Corporation Method of packaging a high voltage device array in a multi-chip module
JP3308461B2 (ja) * 1996-11-14 2002-07-29 富士通株式会社 半導体装置及びリードフレーム
JP3474736B2 (ja) * 1997-08-29 2003-12-08 トリニティ工業株式会社 空調装置の温湿度制御装置と温湿度制御方法
KR100335481B1 (ko) * 1999-09-13 2002-05-04 김덕중 멀티 칩 패키지 구조의 전력소자
JP2001320009A (ja) 2000-05-10 2001-11-16 Matsushita Electric Ind Co Ltd 半導体装置
TWI236126B (en) * 2002-07-02 2005-07-11 Alpha & Omega Semiconductor Integrated circuit package for semiconductor devices with improved electric resistance and inductance

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