JP2010181288A5 - - Google Patents
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- JP2010181288A5 JP2010181288A5 JP2009025308A JP2009025308A JP2010181288A5 JP 2010181288 A5 JP2010181288 A5 JP 2010181288A5 JP 2009025308 A JP2009025308 A JP 2009025308A JP 2009025308 A JP2009025308 A JP 2009025308A JP 2010181288 A5 JP2010181288 A5 JP 2010181288A5
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- field
- laser
- circuit analysis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000004065 semiconductor Substances 0.000 claims description 19
- 230000005284 excitation Effects 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000004458 analytical method Methods 0.000 description 12
- 241000238366 Cephalopoda Species 0.000 description 4
- 238000007654 immersion Methods 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009025308A JP2010181288A (ja) | 2009-02-05 | 2009-02-05 | 半導体集積回路の解析装置及び解析方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009025308A JP2010181288A (ja) | 2009-02-05 | 2009-02-05 | 半導体集積回路の解析装置及び解析方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010181288A JP2010181288A (ja) | 2010-08-19 |
| JP2010181288A5 true JP2010181288A5 (enExample) | 2012-03-15 |
Family
ID=42762942
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009025308A Pending JP2010181288A (ja) | 2009-02-05 | 2009-02-05 | 半導体集積回路の解析装置及び解析方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010181288A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI440869B (zh) * | 2010-09-08 | 2014-06-11 | Dcg Systems Inc | 使用雙光子吸收的雷射輔助裝置修改 |
| US9201096B2 (en) | 2010-09-08 | 2015-12-01 | Dcg Systems, Inc. | Laser-assisted device alteration using synchronized laser pulses |
| JP2013076618A (ja) | 2011-09-30 | 2013-04-25 | Sony Corp | 光伝導素子、レンズ、テラヘルツ放射顕微鏡及びデバイスの製造方法 |
| WO2014129377A1 (ja) | 2013-02-19 | 2014-08-28 | 浜松ホトニクス株式会社 | 電界集中位置観察装置および電界集中位置観察方法 |
| WO2014160618A1 (en) | 2013-03-24 | 2014-10-02 | Dcg Systems, Inc. | Pulsed lada for acquisition of timing diagrams |
| WO2022191958A1 (en) | 2021-03-12 | 2022-09-15 | Battelle Memorial Institute | Systems and methods for backside optical carrier injection into microelectronic devices |
| WO2022260923A1 (en) * | 2021-06-08 | 2022-12-15 | Battelle Memorial Institute | High resolution imaging of microelectronic devices |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6316950B1 (en) * | 1997-05-15 | 2001-11-13 | Lucent Technologies Inc. | Method and apparatus for imaging semiconductor devices |
| JP2004020404A (ja) * | 2002-06-18 | 2004-01-22 | Hitachi Ltd | 半導体デバイスの計測または観察方法およびその装置 |
| JP2006214950A (ja) * | 2005-02-07 | 2006-08-17 | Matsushita Electric Ind Co Ltd | 半導体チップ並びにその検査装置および検査方法 |
-
2009
- 2009-02-05 JP JP2009025308A patent/JP2010181288A/ja active Pending
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