JP2010181288A - 半導体集積回路の解析装置及び解析方法 - Google Patents
半導体集積回路の解析装置及び解析方法 Download PDFInfo
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- JP2010181288A JP2010181288A JP2009025308A JP2009025308A JP2010181288A JP 2010181288 A JP2010181288 A JP 2010181288A JP 2009025308 A JP2009025308 A JP 2009025308A JP 2009025308 A JP2009025308 A JP 2009025308A JP 2010181288 A JP2010181288 A JP 2010181288A
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- integrated circuit
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- Investigating, Analyzing Materials By Fluorescence Or Luminescence (AREA)
- Investigating Or Analysing Materials By Optical Means (AREA)
- Tests Of Electronic Circuits (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2009025308A JP2010181288A (ja) | 2009-02-05 | 2009-02-05 | 半導体集積回路の解析装置及び解析方法 |
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| JP2009025308A JP2010181288A (ja) | 2009-02-05 | 2009-02-05 | 半導体集積回路の解析装置及び解析方法 |
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| JP2010181288A true JP2010181288A (ja) | 2010-08-19 |
| JP2010181288A5 JP2010181288A5 (enExample) | 2012-03-15 |
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| JP2009025308A Pending JP2010181288A (ja) | 2009-02-05 | 2009-02-05 | 半導体集積回路の解析装置及び解析方法 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012058247A (ja) * | 2010-09-08 | 2012-03-22 | Dcg Systems Inc | 2フォトン吸収を用いたレーザ・アシステッド・デバイス・オルタレーション |
| WO2013046534A1 (ja) * | 2011-09-30 | 2013-04-04 | ソニー株式会社 | 光伝導素子、レンズ、テラヘルツ放射顕微鏡及びデバイスの製造方法 |
| US9201096B2 (en) | 2010-09-08 | 2015-12-01 | Dcg Systems, Inc. | Laser-assisted device alteration using synchronized laser pulses |
| US9733297B2 (en) | 2013-02-19 | 2017-08-15 | Hamamatsu Photonics K.K. | Electric field concentration location observation device and electric field concentration location observation method |
| US10191111B2 (en) | 2013-03-24 | 2019-01-29 | Dcg Systems, Inc. | Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets |
| WO2022191958A1 (en) * | 2021-03-12 | 2022-09-15 | Battelle Memorial Institute | Systems and methods for backside optical carrier injection into microelectronic devices |
| JP2024522595A (ja) * | 2021-06-08 | 2024-06-21 | バテル メモリアル インスティチュート | 微小電子デバイスの高分解能結像 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10332794A (ja) * | 1997-05-15 | 1998-12-18 | Lucent Technol Inc | 半導体デバイスの画像化方法 |
| JP2004020404A (ja) * | 2002-06-18 | 2004-01-22 | Hitachi Ltd | 半導体デバイスの計測または観察方法およびその装置 |
| JP2006214950A (ja) * | 2005-02-07 | 2006-08-17 | Matsushita Electric Ind Co Ltd | 半導体チップ並びにその検査装置および検査方法 |
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2009
- 2009-02-05 JP JP2009025308A patent/JP2010181288A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10332794A (ja) * | 1997-05-15 | 1998-12-18 | Lucent Technol Inc | 半導体デバイスの画像化方法 |
| JP2004020404A (ja) * | 2002-06-18 | 2004-01-22 | Hitachi Ltd | 半導体デバイスの計測または観察方法およびその装置 |
| JP2006214950A (ja) * | 2005-02-07 | 2006-08-17 | Matsushita Electric Ind Co Ltd | 半導体チップ並びにその検査装置および検査方法 |
Cited By (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012058247A (ja) * | 2010-09-08 | 2012-03-22 | Dcg Systems Inc | 2フォトン吸収を用いたレーザ・アシステッド・デバイス・オルタレーション |
| US9201096B2 (en) | 2010-09-08 | 2015-12-01 | Dcg Systems, Inc. | Laser-assisted device alteration using synchronized laser pulses |
| US11353479B2 (en) | 2010-09-08 | 2022-06-07 | Fei Efa, Inc. | Laser-assisted device alteration using synchronized laser pulses |
| US10209274B2 (en) | 2010-09-08 | 2019-02-19 | Fei Efa, Inc. | Laser-assisted device alteration using synchronized laser pulses |
| WO2013046534A1 (ja) * | 2011-09-30 | 2013-04-04 | ソニー株式会社 | 光伝導素子、レンズ、テラヘルツ放射顕微鏡及びデバイスの製造方法 |
| CN103797355A (zh) * | 2011-09-30 | 2014-05-14 | 索尼公司 | 光传导元件、透镜、太赫兹发射显微镜及器件制造方法 |
| US9146390B2 (en) | 2011-09-30 | 2015-09-29 | Sony Corporation | Photoconductive element, lens, terahertz emission microscope and method of producing device |
| US9733297B2 (en) | 2013-02-19 | 2017-08-15 | Hamamatsu Photonics K.K. | Electric field concentration location observation device and electric field concentration location observation method |
| US11047906B2 (en) | 2013-03-24 | 2021-06-29 | Dcg Systems, Inc. | Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets |
| US10191111B2 (en) | 2013-03-24 | 2019-01-29 | Dcg Systems, Inc. | Synchronized pulsed LADA for the simultaneous acquisition of timing diagrams and laser-induced upsets |
| WO2022191958A1 (en) * | 2021-03-12 | 2022-09-15 | Battelle Memorial Institute | Systems and methods for backside optical carrier injection into microelectronic devices |
| US11899060B2 (en) | 2021-03-12 | 2024-02-13 | Battelle Memorial Institute | Systems and methods for precise signal injection into microelectronic devices |
| US12339317B2 (en) | 2021-03-12 | 2025-06-24 | Battelle Memorial Institute | Systems and methods for precise signal injection into microelectronic devices |
| JP2024522595A (ja) * | 2021-06-08 | 2024-06-21 | バテル メモリアル インスティチュート | 微小電子デバイスの高分解能結像 |
| US12315105B2 (en) | 2021-06-08 | 2025-05-27 | Battelle Memorial Institute | High resolution imaging of microelectronic devices |
| JP7729922B2 (ja) | 2021-06-08 | 2025-08-26 | バテル メモリアル インスティチュート | 微小電子デバイスの高分解能結像 |
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