JP2010177525A5 - - Google Patents

Download PDF

Info

Publication number
JP2010177525A5
JP2010177525A5 JP2009019851A JP2009019851A JP2010177525A5 JP 2010177525 A5 JP2010177525 A5 JP 2010177525A5 JP 2009019851 A JP2009019851 A JP 2009019851A JP 2009019851 A JP2009019851 A JP 2009019851A JP 2010177525 A5 JP2010177525 A5 JP 2010177525A5
Authority
JP
Japan
Prior art keywords
cable
length
plasma processing
plasma
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009019851A
Other languages
English (en)
Japanese (ja)
Other versions
JP5210905B2 (ja
JP2010177525A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2009019851A priority Critical patent/JP5210905B2/ja
Priority claimed from JP2009019851A external-priority patent/JP5210905B2/ja
Publication of JP2010177525A publication Critical patent/JP2010177525A/ja
Publication of JP2010177525A5 publication Critical patent/JP2010177525A5/ja
Application granted granted Critical
Publication of JP5210905B2 publication Critical patent/JP5210905B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2009019851A 2009-01-30 2009-01-30 プラズマ処理装置 Expired - Fee Related JP5210905B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009019851A JP5210905B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009019851A JP5210905B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置

Publications (3)

Publication Number Publication Date
JP2010177525A JP2010177525A (ja) 2010-08-12
JP2010177525A5 true JP2010177525A5 (enExample) 2012-02-23
JP5210905B2 JP5210905B2 (ja) 2013-06-12

Family

ID=42708156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009019851A Expired - Fee Related JP5210905B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JP5210905B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534366B2 (ja) 2012-06-18 2014-06-25 株式会社京三製作所 高周波電力供給装置、及びイグニッション電圧選定方法
JP6661190B2 (ja) * 2015-11-16 2020-03-11 国立大学法人豊橋技術科学大学 可変リアクタンス回路
JP7154119B2 (ja) * 2018-12-06 2022-10-17 東京エレクトロン株式会社 制御方法及びプラズマ処理装置
KR102192299B1 (ko) * 2019-08-28 2020-12-17 세메스 주식회사 기판 처리 장치
US11043387B2 (en) * 2019-10-30 2021-06-22 Applied Materials, Inc. Methods and apparatus for processing a substrate
CN120280325A (zh) * 2019-12-02 2025-07-08 朗姆研究公司 射频辅助等离子体生成中的阻抗变换
CN114019206B (zh) * 2021-11-01 2024-04-12 北京北方华创微电子装备有限公司 电缆长度调节装置
KR102771011B1 (ko) 2021-12-17 2025-02-24 세메스 주식회사 플라즈마 공정 설비의 케이블 길이 선정 방법 및 케이블 길이 선정 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4456694B2 (ja) * 1999-06-22 2010-04-28 東京エレクトロン株式会社 プラズマ処理装置
JP4388287B2 (ja) * 2003-02-12 2009-12-24 東京エレクトロン株式会社 プラズマ処理装置及び高周波電力供給装置
ATE484607T1 (de) * 2003-04-16 2010-10-15 Toyo Seikan Kaisha Ltd Mikrowellenplasmaverarbeitungsverfahren
JP5013979B2 (ja) * 2007-06-12 2012-08-29 東京エレクトロン株式会社 同軸ケーブルの異常検知システムとその異常検知方法、及びその異常検知システムを備えた処理装置

Similar Documents

Publication Publication Date Title
JP2010177525A5 (enExample)
KR102279088B1 (ko) 플라즈마 처리 장치
JP2013182996A5 (enExample)
TWI601182B (zh) Plasma processing apparatus and plasma processing method
JP2007250755A5 (enExample)
TWI604494B (zh) Plasma processing apparatus, plasma processing method, and high frequency generator
TW200727343A (en) Plasma treatment device and control method thereof
EP2618366A3 (en) Etching method and etching apparatus
JP2010135298A5 (enExample)
JP2014179576A5 (ja) プラズマ処理装置の制御方法、プラズマ処理方法及びプラズマ処理装置
JP2018107304A5 (enExample)
KR101764767B1 (ko) 플라즈마 처리 방법 및 플라즈마 처리 장치
JP2016092342A5 (enExample)
TW201130032A (en) Plasma processing apparatus and plasma processing method
WO2010011521A3 (en) Workpiece support for a plasma reactor with controlled apportionment of rf power to a process kit ring
TW200420201A (en) Plasma generation device, plasma control method and substrate manufacturing method
EP4421844A3 (en) Plasma treatment device, plasma treatment method, program, and memory medium
WO2009063755A1 (ja) プラズマ処理装置および半導体基板のプラズマ処理方法
JP2014204050A5 (enExample)
JP2011029475A5 (enExample)
JP6670697B2 (ja) プラズマ処理装置
TW200641981A (en) Plasma processing apparatus
TW201613421A (en) Plasma processing apparatus and plasma processing method
JP2019057547A5 (enExample)
JP2006066905A5 (enExample)