JP5210905B2 - プラズマ処理装置 - Google Patents

プラズマ処理装置 Download PDF

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Publication number
JP5210905B2
JP5210905B2 JP2009019851A JP2009019851A JP5210905B2 JP 5210905 B2 JP5210905 B2 JP 5210905B2 JP 2009019851 A JP2009019851 A JP 2009019851A JP 2009019851 A JP2009019851 A JP 2009019851A JP 5210905 B2 JP5210905 B2 JP 5210905B2
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Japan
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plasma processing
plasma
cable
frequency power
reflected wave
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JP2009019851A
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Japanese (ja)
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JP2010177525A (ja
JP2010177525A5 (enExample
Inventor
飯田　　勉
康雄 大越
温司 伊藤
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Hitachi High Tech Corp
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Hitachi High Technologies Corp
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  • Drying Of Semiconductors (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Plasma Technology (AREA)
JP2009019851A 2009-01-30 2009-01-30 プラズマ処理装置 Expired - Fee Related JP5210905B2 (ja)

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JP2009019851A JP5210905B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置

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JP2009019851A JP5210905B2 (ja) 2009-01-30 2009-01-30 プラズマ処理装置

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JP2010177525A JP2010177525A (ja) 2010-08-12
JP2010177525A5 JP2010177525A5 (enExample) 2012-02-23
JP5210905B2 true JP5210905B2 (ja) 2013-06-12

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12276684B2 (en) 2021-12-17 2025-04-15 Semes Co., Ltd. Method and apparatus for determining cable length for plasma processing equipment

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5534366B2 (ja) 2012-06-18 2014-06-25 株式会社京三製作所 高周波電力供給装置、及びイグニッション電圧選定方法
JP6661190B2 (ja) * 2015-11-16 2020-03-11 国立大学法人豊橋技術科学大学 可変リアクタンス回路
JP7154119B2 (ja) * 2018-12-06 2022-10-17 東京エレクトロン株式会社 制御方法及びプラズマ処理装置
KR102192299B1 (ko) * 2019-08-28 2020-12-17 세메스 주식회사 기판 처리 장치
US11043387B2 (en) * 2019-10-30 2021-06-22 Applied Materials, Inc. Methods and apparatus for processing a substrate
CN120280325A (zh) * 2019-12-02 2025-07-08 朗姆研究公司 射频辅助等离子体生成中的阻抗变换
CN114019206B (zh) * 2021-11-01 2024-04-12 北京北方华创微电子装备有限公司 电缆长度调节装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4456694B2 (ja) * 1999-06-22 2010-04-28 東京エレクトロン株式会社 プラズマ処理装置
JP4388287B2 (ja) * 2003-02-12 2009-12-24 東京エレクトロン株式会社 プラズマ処理装置及び高周波電力供給装置
ATE484607T1 (de) * 2003-04-16 2010-10-15 Toyo Seikan Kaisha Ltd Mikrowellenplasmaverarbeitungsverfahren
JP5013979B2 (ja) * 2007-06-12 2012-08-29 東京エレクトロン株式会社 同軸ケーブルの異常検知システムとその異常検知方法、及びその異常検知システムを備えた処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12276684B2 (en) 2021-12-17 2025-04-15 Semes Co., Ltd. Method and apparatus for determining cable length for plasma processing equipment

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JP2010177525A (ja) 2010-08-12

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