JP2010169379A - 熱輸送デバイスの製造方法及び熱輸送デバイス - Google Patents

熱輸送デバイスの製造方法及び熱輸送デバイス Download PDF

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Publication number
JP2010169379A
JP2010169379A JP2009127374A JP2009127374A JP2010169379A JP 2010169379 A JP2010169379 A JP 2010169379A JP 2009127374 A JP2009127374 A JP 2009127374A JP 2009127374 A JP2009127374 A JP 2009127374A JP 2010169379 A JP2010169379 A JP 2010169379A
Authority
JP
Japan
Prior art keywords
transport device
plate
heat transport
capillary
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009127374A
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Yoshitaka
弘幸 良尊
Takashi Yajima
孝 谷島
Kazunao Oniki
一直 鬼木
Hiroto Kasai
弘人 河西
Takashi Hirata
昂士 平田
Mitsuo Hashimoto
光生 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Sony Corp
Original Assignee
Sony Corp
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp, Sony Chemical and Information Device Corp filed Critical Sony Corp
Priority to JP2009127374A priority Critical patent/JP2010169379A/ja
Priority to US13/141,121 priority patent/US20110253345A1/en
Priority to KR1020117013809A priority patent/KR20110106851A/ko
Priority to PCT/JP2009/006816 priority patent/WO2010073525A1/ja
Priority to CN2009801559994A priority patent/CN102308176A/zh
Priority to TW098143692A priority patent/TW201040481A/zh
Publication of JP2010169379A publication Critical patent/JP2010169379A/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/16—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating with interposition of special material to facilitate connection of the parts, e.g. material for absorbing or producing gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283—Means for filling or sealing heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/04—Tubular or hollow articles
    • B23K2101/14—Heat exchangers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49393—Heat exchanger or boiler making with metallurgical bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
JP2009127374A 2008-12-24 2009-05-27 熱輸送デバイスの製造方法及び熱輸送デバイス Pending JP2010169379A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2009127374A JP2010169379A (ja) 2008-12-24 2009-05-27 熱輸送デバイスの製造方法及び熱輸送デバイス
US13/141,121 US20110253345A1 (en) 2008-12-24 2009-12-11 Heat transportation device production method and heat transportation device
KR1020117013809A KR20110106851A (ko) 2008-12-24 2009-12-11 열수송 디바이스의 제조 방법 및 열수송 디바이스
PCT/JP2009/006816 WO2010073525A1 (ja) 2008-12-24 2009-12-11 熱輸送デバイスの製造方法及び熱輸送デバイス
CN2009801559994A CN102308176A (zh) 2008-12-24 2009-12-11 热传输装置制造方法和热传输装置
TW098143692A TW201040481A (en) 2008-12-24 2009-12-18 Manufacturing method of heat transport device and heat transport device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008328863 2008-12-24
JP2009127374A JP2010169379A (ja) 2008-12-24 2009-05-27 熱輸送デバイスの製造方法及び熱輸送デバイス

Publications (1)

Publication Number Publication Date
JP2010169379A true JP2010169379A (ja) 2010-08-05

Family

ID=42287183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009127374A Pending JP2010169379A (ja) 2008-12-24 2009-05-27 熱輸送デバイスの製造方法及び熱輸送デバイス

Country Status (6)

Country Link
US (1) US20110253345A1 (zh)
JP (1) JP2010169379A (zh)
KR (1) KR20110106851A (zh)
CN (1) CN102308176A (zh)
TW (1) TW201040481A (zh)
WO (1) WO2010073525A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014061144A1 (ja) * 2012-10-18 2014-04-24 株式会社 旭 複合金属材の製造方法、金型の製造方法、金属製品の製造方法及び複合金属材
JP2020020494A (ja) * 2018-07-30 2020-02-06 株式会社リコー ウィック、ループ型ヒートパイプ、冷却装置、電子機器、及びウィック製造方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM394682U (en) * 2010-04-26 2010-12-11 Asia Vital Components Co Ltd Miniature heat spreader structure
KR101642625B1 (ko) * 2012-04-16 2016-07-25 후루카와 덴키 고교 가부시키가이샤 히트 파이프
US20140131013A1 (en) * 2012-11-15 2014-05-15 Chin-Hsing Horng Low-profile heat pipe
US9835383B1 (en) * 2013-03-15 2017-12-05 Hrl Laboratories, Llc Planar heat pipe with architected core and vapor tolerant arterial wick
FR3007329B1 (fr) 2013-06-20 2017-04-21 Valeo Systemes Thermiques Element destine au refroidissement de l'air d'un vehicule automobile
WO2015122882A1 (en) * 2014-02-12 2015-08-20 Hewlett-Packard Development Company, L.P. Forming a casing of an electronics device
US10458716B2 (en) 2014-11-04 2019-10-29 Roccor, Llc Conformal thermal ground planes
US20160223267A1 (en) * 2015-02-02 2016-08-04 Asia Vital Components Co., Ltd. Flat-plate heat pipe structure
CN105293055A (zh) * 2015-02-07 2016-02-03 成都奥能普科技有限公司 固体粒块高温传热弹射驱动传热系统
JP2016156584A (ja) * 2015-02-25 2016-09-01 株式会社フジクラ 薄板ヒートパイプ型熱拡散板
US10269682B2 (en) * 2015-10-09 2019-04-23 Taiwan Semiconductor Manufacturing Company, Ltd. Cooling devices, packaged semiconductor devices, and methods of packaging semiconductor devices
CN105352352A (zh) * 2015-11-18 2016-02-24 上海利正卫星应用技术有限公司 一种超薄均温板装置及其制作方法
DE102018106343B4 (de) * 2018-03-19 2021-09-02 Asia Vital Components Co., Ltd. Zwischenelement für Wärmeableiteinrichtungen und Wärmeableiteinrichtung
CN111811306A (zh) * 2019-04-11 2020-10-23 讯凯国际股份有限公司 散热装置及其制造方法
KR102282814B1 (ko) 2020-01-15 2021-07-29 주식회사 에이치비세계로 도로의 중앙분리대
CN112283955A (zh) * 2020-10-30 2021-01-29 兰州交通大学 翼盒微槽热管集热板、组成的百叶平板太阳能集热器及应用

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005053371A1 (en) * 2003-11-27 2005-06-09 Ls Cable Ltd. Flat plate heat transfer device
JP4112602B2 (ja) * 2005-09-01 2008-07-02 株式会社渕上ミクロ ヒートパイプ

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014061144A1 (ja) * 2012-10-18 2014-04-24 株式会社 旭 複合金属材の製造方法、金型の製造方法、金属製品の製造方法及び複合金属材
US9604307B2 (en) 2012-10-18 2017-03-28 Asahi Co., Ltd. Method of manufacturing composite metal material, method of manufacturing mold, method of manufacturing metal product, and composite metal material
JP2020020494A (ja) * 2018-07-30 2020-02-06 株式会社リコー ウィック、ループ型ヒートパイプ、冷却装置、電子機器、及びウィック製造方法
JP7116912B2 (ja) 2018-07-30 2022-08-12 株式会社リコー ウィック、ループ型ヒートパイプ、冷却装置、電子機器、及びウィック製造方法

Also Published As

Publication number Publication date
US20110253345A1 (en) 2011-10-20
WO2010073525A1 (ja) 2010-07-01
CN102308176A (zh) 2012-01-04
KR20110106851A (ko) 2011-09-29
TW201040481A (en) 2010-11-16

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