JP2010169379A - Method of manufacturing thermal transport device, and thermal transport device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an inexpensive thermal transport device which is efficiently manufactured in the small number of processes. <P>SOLUTION: In the method of manufacturing the thermal transport device, a capillary member 5 with its thickness thicker than that of a frame member 2 is placed on an inner surface 11 of a lower plate member 1. Then, the frame member 2 is placed on the inner surface 11 of the lower plate member 1, and an upper plate member 3 is placed on the capillary member 5. A crushing amount G is provided between the frame member 2 and the upper plate member 3 based on difference between thickness of the capillary member 5 and thickness of the frame member 2. The lower plate member 1 is diffusion-joined to the frame member 2, and the upper plate member 3 is diffusion-joined to the frame member 2. Then, the capillary member 5 is compressed by the crushing amount G. As the capillary member 5 has elasticity, a part of pressure P is absorbed, and pressure P' smaller than the pressure P is applied on the lower plate member 1 from the capillary member 5. The inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-joined by the pressure P'. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a heat transport device that transports heat by a phase change of a working fluid, and a heat transport device.

  In order to cool an electronic device such as a personal computer, a cooling device such as a heat pipe is used that transports heat generated from a heat generating portion of the electronic device to a condensing unit to dissipate heat.

  In these cooling devices, the vapor of the working fluid evaporated by the heat generated in the high temperature heat generating part of the electronic equipment moves to the low temperature condensing part, condenses in the condensing part, and releases heat. Thus, the object to be cooled is cooled.

  In recent years, with the downsizing and thinning of electronic devices and the like, heat generation of ICs and the like contained therein has become a major problem. For example, further thinning of a thin television is strongly desired, and in order to realize this, it is necessary to deal with the above-described problem of heat generation inside the electronic device. As a means for solving this problem, there is a demand for an inexpensive cooling device that is small, thin, and highly efficient.

  Patent Document 1 includes a diffusion bonding step 1 for attaching a mesh to an upper cover and a lower cover constituting a heat spreader, and a diffusion bonding step 2 for bonding the upper cover, the lower cover, and the reinforcing member having the mesh. A plurality of diffusion bonding steps are described. The plurality of diffusion bonding processes are performed in different processes under respective suitable conditions.

JP 2006-140435 A (paragraphs [0022]-[0027], [0032], [0033], FIG. 6A, FIG. 6B, FIG. 7, and FIG. 8 to FIG. 13)

  However, when a plurality of diffusion bonding processes are performed in different processes, the time spent for manufacturing each cooling bonding process due to the time spent for each diffusion bonding process and the cost for each diffusion bonding process, Such costs increase. This makes it difficult to manufacture an efficient cooling device and an inexpensive cooling device.

  In view of the circumstances as described above, an object of the present invention is to provide an inexpensive heat transport device manufacturing method and heat transport device that are efficiently manufactured by a small number of steps.

In order to achieve the above object, a method for manufacturing a heat transport device according to one aspect of the present invention includes a first plate and a second plate constituting a container of a heat transport device that transports heat using a phase change of a working fluid. And laminating the first plate, the capillary member and the second plate so as to sandwich a capillary member which applies a capillary force to the working fluid.
The first plate and the second plate are diffusion bonded so that the first plate and the capillary member are diffusion bonded.

  In order to constitute the container of the heat transport device, the first plate and the second plate are diffusion bonded. In this diffusion bonding step, the first plate and the capillary member laminated so as to be sandwiched between the first plate and the second plate are diffusion bonded. Accordingly, since a plurality of diffusion bondings are performed in the same process, an inexpensive heat transport device manufacturing method that can be efficiently manufactured by a small number of processes is realized.

  The capillary member may be made of an elastic material. In that case, in the diffusion bonding step, the first plate and the second plate are diffusion bonded while compressing the capillary member.

  The first plate and the second plate are diffusion bonded with a high bonding force for the purpose of sealing the container. On the other hand, in the diffusion bonding step, the first plate and the capillary member are diffusion bonded at an appropriate pressure such that the capillary force appropriately acts on the working fluid contained in the container. That is, the pressure required for each of these diffusion bondings is often different. Since the capillary member has a predetermined elasticity, the capillary member absorbs a part of the pressure when the first plate and the second plate are diffusion-bonded, so that the first pressure is less than that pressure. The plate 1 and the capillary member are diffusion bonded.

  The thickness of the capillary member may be larger than the thickness of the internal space of the container constituted by the first plate and the second plate.

  Thus, in the diffusion bonding step, the capillary member is reliably compressed, and a part of the pressure when the first plate and the second plate are diffusion bonded is reliably absorbed.

  The capillary member has a first mesh layer and a second mesh layer that is laminated on the first mesh layer and is a mesh that is coarser than the mesh included in the first mesh layer. May be.

  The second plate may have a protrusion. In this case, in the diffusion bonding step, the first plate and the second plate are diffusion bonded while the capillary member is compressed by the protrusion.

  The protrusion can reinforce the internal space of the container and can reliably compress the capillary member by the protrusion.

  The heat transport device may include a frame member that constitutes a side wall of the container. In that case, the first plate and the frame member, and the second plate and the frame member so that the first plate and the capillary member are diffusion bonded in the diffusion bonding step. And diffusion bonding.

  Depending on the relationship between the thickness of the frame member constituting the side wall of the container and the thickness of the capillary member, the degree to which the capillary member is compressed is adjusted, and the degree of pressure absorbed by the capillary member is adjusted. Therefore, a desired pressure required for diffusion bonding between the first plate and the capillary member can be obtained by appropriately setting the thickness of the frame member and the thickness of the capillary member.

  In the stacking step, a unit including the first plate, the capillary member, and the second plate, which are stacked so as to sandwich the capillary member between the first plate and the second plate, is formed as a concave portion. The jig part and the unit may be laminated so as to fit in the concave part of the jig part having the jig part. In that case, in the diffusion bonding step, the first plate and the second plate of the unit are diffusion bonded by applying pressure to the jig portion and the unit in the stacking direction.

  By appropriately setting the depth of the concave portion of the jig portion and the thickness of the capillary member, the pressure required for diffusion bonding between the first plate and the capillary member can be obtained without variation in the diffusion bonding step. .

  In the laminating step, the plurality of units and the plurality of units are arranged such that a jig portion is laminated between each of the plurality of units each having the first plate, the capillary member, and the second plate. A jig part may be laminated. In that case, in the diffusion bonding step, by applying pressure to the plurality of units and the plurality of jig portions in the stacking direction, the first plate and the second plate of the plurality of units Is diffusion bonded.

  By applying pressure to the plurality of units and the plurality of jig portions in the direction in which the plurality of units and the plurality of jig portions are stacked, a plurality of heat transport devices are manufactured at a time. This shortens the manufacturing time.

The capillary member may include a first member and a second member.
The first member has a first spring constant and is diffusion bonded to the first plate.
The second member has a second spring constant larger than the first spring constant and is stacked on the first member.

  Since the first member has a small spring constant and is easily deformed, when the capillary member is compressed in the diffusion bonding step, the first member is reliably compressed, and the stress is sufficiently diffusion bonded to the first plate. Further, in the diffusion bonding step, for example, variations in the deformation amount of the second member due to dimensional tolerances are absorbed by the first member. Thereby, after the diffusion bonding step, the function of the capillary member relating to the performance of heat transport is sufficiently exhibited by the second member having a large spring constant and hardly deformed.

  The diffusion bonding step includes the first plate and the first plate so that the first plate and the capillary member are diffusion bonded and the second plate and the capillary member are diffusion bonded. It may include diffusion bonding the second plate. In this case, the capillary member includes a third member, and the third member has a third spring constant smaller than the second spring constant, and is stacked on the second member and stacked on the second member. Diffusion-bonded to the plate.

  Since the capillary member is diffusion-bonded to the first and second plates, the internal space of the container of the heat transport device is reinforced by the capillary member. At this time, the capillary member and the second plate are sufficiently diffusion-bonded by diffusion-bonding the third member having a small spring constant and the second plate.

According to another aspect of the present invention, there is provided a method for manufacturing a heat transport device, comprising: bending a plate for constructing a container of a heat transport device that transports heat using a phase change of the working fluid; A capillary member for applying a force is sandwiched between a first portion and a second portion of the plate formed by bending.
And the container is made by diffusion bonding the end of the first part and the end of the second part so that at least the first part and the capillary member are diffusion bonded. It is formed.

  Thereby, since one board is bent and a container is formed, the number of parts can be reduced and the cost can be reduced. Moreover, when a container is comprised by several components, although the predetermined positioning accuracy of each of those components is required, in this invention, such high positioning accuracy is not required.

A heat transport device according to one embodiment of the present invention includes a container having an inner surface, a working fluid, and a capillary member.
The working fluid is contained in the container and transports heat by changing phase.
The capillary member includes a first member and a second member, and generates a capillary force in the working fluid.
The first member has a first spring constant and is diffusion bonded to the inner surface.
The second member has a second spring constant larger than the first spring constant and is stacked on the first member.

A heat transport device according to another aspect of the present invention includes a container having a side wall, a working fluid, and a capillary member.
The container includes a frame member constituting the side wall, and a first plate and a second plate joined to the frame member so as to sandwich the frame member.
The working fluid transports heat by phase change in the container.
The capillary member causes a capillary force to act on the working fluid.

  In this heat transport device, the container can be configured with simple components. Moreover, since the volume of the internal space of the container is determined by the thickness of the frame member, the volume of the internal space can be easily set by appropriately setting the thickness of the frame member.

  As described above, according to the present invention, an inexpensive heat transport device manufacturing method and heat transport device that are efficiently manufactured by a small number of steps are realized.

It is typical sectional drawing which shows the heat transport device manufactured with the manufacturing method of the heat transport device which concerns on 1st Embodiment. It is a typical exploded perspective view showing the heat transport device manufactured by the manufacturing method of the heat transport device concerning a 1st embodiment. It is a figure for demonstrating the manufacturing method of the heat transport device which concerns on 1st Embodiment. It is typical sectional drawing which shows the manufacturing method of the heat transport device which concerns on 1st Embodiment in order. It is a table | surface showing the amount of crushing, and the leak defect rate of the heat transport device manufactured with the crushing amount. It is the figure which observed the inner surface of the lower board member of the heat transport device manufactured by 1st Embodiment. It is typical sectional drawing which shows the manufacturing method of the heat transport device which concerns on 2nd Embodiment in order. It is typical sectional drawing which shows the heat transport device manufactured with the manufacturing method of the heat transport device which concerns on 3rd Embodiment. It is the figure which observed the inner surface of the lower board member of the heat transport device manufactured by 3rd Embodiment. It is a figure for demonstrating the manufacturing method of the heat transport device using a jig | tool. It is typical sectional drawing which shows the manufacturing method of the heat transport device which concerns on 4th Embodiment in order. It is typical sectional drawing which shows the manufacturing method of the heat transport device which concerns on 5th Embodiment in order. It is sectional drawing which shows the heat transport device with which the heat source was arrange | positioned at the side close | similar to the gaseous-phase side. It is a perspective view which shows the heat transport device which concerns on 6th Embodiment. It is sectional drawing between AA shown in FIG. It is an expanded view of the plate member which comprises the container of the heat transport device which concerns on 6th Embodiment. It is a figure which shows the manufacturing method of the heat transport device which concerns on 6th Embodiment. It is a figure for demonstrating the heat transport device which concerns on a modification, and is a development view of a plate member. It is a perspective view which shows the heat transport device which concerns on 7th Embodiment. It is sectional drawing between AA shown in FIG. It is an expanded view of the plate member which comprises the container of the heat transport device which concerns on 7th Embodiment. It is a figure for demonstrating the manufacturing method of the heat transport device which concerns on 8th Embodiment. It is a typical graph which shows the relationship between the stress added to each mesh member, and the deformation amount (crush amount) by the stress. It is typical sectional drawing which shows the manufacturing method of the heat transport device which concerns on 8th Embodiment in order. It is the figure which expanded and showed the upper board member shown in FIG. 24, the mesh member for joining, and the 2nd mesh member. It is the enlarged view which showed the diffusion joining of the capillary member mentioned as a comparative example, and an upper board member. It is the schematic diagram which each showed the mesh member from which the way of knitting a metal fine wire differs. It is the figure which showed the modification of the capillary member shown in FIG. It is a figure for demonstrating the heat transport device which concerns on 9th Embodiment. It is the top view which expanded and showed the injection inlet and injection path shown in FIG. It is a figure for demonstrating the heat transport device which concerns on 10th Embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<First Embodiment>
[Configuration of heat transport device]
FIG. 1 is a schematic cross-sectional view showing a heat transport device manufactured by the method for manufacturing a heat transport device according to the first embodiment of the present invention. FIG. 2 is an exploded perspective view thereof. The cross-sectional view of FIG. 1 is a cross-sectional view in the longitudinal direction of the heat transport device 100. Henceforth, the direction of sectional drawing is the same.

  The heat transport device 100 includes a container 4 and a capillary member 5 provided in the container 4. The container 4 includes a lower plate member 1, a frame member 2, and an upper plate member 3. The frame member 2 constitutes a side wall in the container 4. A working fluid (not shown) that transports heat by phase change is sealed inside the container 4, and a capillary member 5 that applies a capillary force to the working fluid is formed. The capillary member 5 includes a first mesh layer 6 and a second mesh layer 7 laminated on the first mesh layer 6. The second mesh layer 7 is made of a coarser mesh than the mesh included in the first mesh layer 6.

  As the working fluid, pure water, ethanol or the like is used.

  As a material of the lower plate member 1, the frame member 2 and the upper plate member 3 constituting the container 4, copper is typically used. In addition, for example, nickel, aluminum, stainless steel, or the like may be used. The thickness of the lower plate member 1 and the upper plate member 3 is typically 0.1 mm to 0.8 mm. The width a of the frame member 2 is typically 2 mm.

  The thickness of the frame member 2 is appropriately set in relation to the thickness of the capillary member 5 as will be described later. The materials and numerical values given as typical examples here are not limited to these, and the same applies to the following.

  As shown in FIG. 2, the first mesh layer 6 and the second mesh layer 7 are formed by laminating one or a plurality of mesh members 8 having a mesh-like mesh made of fine metal wires. The thickness of each mesh member 8 is typically 0.02 mm to 0.05 mm.

  A thing other than the mesh layer may be used as the capillary member 5. For example, a plurality of wires are bundled. Any material may be used as long as it applies a capillary force to the working fluid and has a predetermined elasticity. In the present embodiment, 2 to 5 mesh members 8 are stacked as the first mesh layer 6, and one mesh member 8 is stacked as the second mesh layer 7 on the first mesh layer 6. Has been. The plurality of mesh members 8 are stacked by, for example, brazing, bonding using an adhesive, plating treatment, or the like.

  When the heat transport device 100 is not operating, the working fluid is attracted toward the first mesh layer 6 having a strong capillary force among the first mesh layer 6 and the second mesh layer 7. Is retained.

[Operation of heat transport device]
The operation of the heat transport device 100 will be described. In the heat absorption part V (see FIG. 1) of the heat transport device 100, for example, heat is received from a heat source 9 such as a circuit device, and the liquid-phase working fluid is evaporated. The working fluid that has become a gas phase moves in the container 4 to the heat radiating portion W, releases heat in the heat radiating portion W, and condenses. The working fluid that has become a liquid phase in the heat radiating portion W moves to the heat absorbing portion V in the container 4, receives the heat from the heat source 9, and evaporates again. The heat source 9 is cooled by repeating this cycle. In the heat transport device 100 according to the present embodiment, the gas-phase working fluid moves mainly through the second mesh layer 7. In addition, the liquid-phase working fluid moves under the capillary force of the first mesh layer 6.

  1 shows an example in which the heat source 9 is disposed on the side close to the liquid phase side of the heat transport device 100, that is, on the side close to the first mesh layer 6. However, since the heat transport device 100 is formed in a thin plate shape, as shown in FIG. 13, for example, the heat transport device 100 is disposed on the side close to the gas phase side of the heat transport device 100, that is, on the side close to the second mesh layer 7 side. Even if it is done, high heat transport performance can be exhibited.

[Method of Manufacturing Heat Transport Device 100]
FIG. 3 is a diagram for explaining a method of manufacturing the heat transport device 100. Here, the thickness of the capillary member 5 including the first mesh layer 6 and the second mesh layer 7 laminated thereon is defined as t ₁ . Further, the lower plate member 1 and the upper plate member 3 and the frame member 2 is an internal space of the thickness of the container 4, i.e. the thickness of the frame member 2 and t ₂ formed by being diffusion bonded. As shown in FIG. 3, compared to the thickness t ₂ of the thickness t ₁ and the frame member 2 of the capillary member 5, the larger the thickness t ₁ of the capillary member 5. The difference between the thickness t ₂ of the thickness t ₁ and the frame member 2 of the capillary member 5 is typically a 0Mm～0.2Mm.

  FIG. 4 is a schematic cross-sectional view sequentially illustrating a method for manufacturing the heat transport device 100.

  As shown in FIG. 4A, the surface of the lower plate member 1 on the inner space side in the container 4 is an inner surface 11 of the lower plate member 1. The capillary member 5 is placed on the inner surface 11.

  As shown in FIG. 4B, the frame member 2 is placed on the inner surface 11 of the lower plate member 1, and the upper plate member 3 is placed on the capillary member 5. That is, the lower plate member 1, the capillary member 5, and the upper plate member 3 are laminated so that the capillary member 5 is sandwiched between the lower plate member 1 and the upper plate member 3.

As described above, the thickness t ₁ of the capillary member 5 is larger between the thickness t ₁ of the capillary member 5 and the thickness t ₂ of the frame member 2. Therefore, as shown in FIG. 4B, the upper plate member 3 is placed on the capillary member 5, and the upper plate member 3 and the frame member 2 are spaced apart. A surface of the upper plate member 3 on the inner space side in the container 4 is an inner surface 31 of the upper plate member 3, and a surface facing the upper plate member 3 of the frame member 2 is an opposing surface 21. Further, G is the distance between the inner surface 31 of the upper plate member 3 and the facing surface 21 of the frame member 2.

In the present embodiment, since the difference between the thickness t ₂ of the thickness t ₁ and the frame member 2 of the capillary member 5 and 0Mm～0.2Mm, the opposing surface 21 of the inner surface 31 and the frame member 2 of the upper member 3 The gap G is in the range of 0 mm to 0.2 mm. Since the upper plate member 3 and the frame member 2 are diffusion bonded, the gap G is crushed by the pressure required for the diffusion bonding. Hereinafter, the interval G is referred to as a crushing amount G.

  As shown in FIG. 4C, pressure P is applied from the upper plate member 3 side, and the lower plate member 1 and the frame member 2 and the upper plate member 3 and the frame member 2 are diffusion bonded. At this time, the capillary member 5 is compressed by the crushing amount G. Since the capillary member 5 has elasticity, a part of the pressure P is absorbed, and a pressure P ′ smaller than the pressure P is applied from the capillary member 5 to the lower plate member 1. By this pressure P ′, the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion bonded.

  For example, the lower plate member 1 and the frame member 2, and the upper plate member 3 and the frame member 2 are diffused with a high bonding force (pressure P) in order to prevent a leak failure in which the airtightness in the container 4 is broken by a small hole or the like Be joined. The lower plate member 1 and the first mesh layer 6 are diffusion-bonded at an appropriate pressure (pressure P ′) such that the capillary force appropriately acts on the working fluid.

  Further, due to the reaction of the pressure P ′, a pressure P ″ smaller than the pressure P is also applied to the upper plate member 3 from the compressed capillary member 5. By this pressure P ″, the inner surface 31 of the upper plate member 3 and the capillary member 5 are diffusion bonded. In the present embodiment, the pressure P is applied from the upper plate member 3 side, but the pressure P may be applied from the lower plate member 1 side.

If squashing amount G of 0mm, the difference between the thickness t ₂ of the thickness t ₁ and the frame member 2 of the capillary member becomes 0mm next, t ₁ = t _2. However, even when the crushing amount G is 0 mm, the upper plate member 3 placed on the capillary member 5 in FIG. 4B is placed on the capillary member 5 and the frame member 2. Since the diffusion bonding process in FIG. 4C is performed at a high temperature, the upper plate member 3 is also heated to be slightly deformed. By this deformation, the capillary member 5 is compressed.

  FIG. 5 is a table showing the crushing amount G and the leakage failure rate of the heat transport device 100 manufactured with the crushing amount G. As shown in the table of FIG. 5, a leakage failure rate of 0% was confirmed when the crushing amount G was in the range of 0 mm to 0.10 mm, for example.

  FIG. 6A is a photograph of the inner surface 11 of the lower plate member 1 of the heat transport device 100 manufactured with a crushing amount G of 0.10 mm. The same applies to FIG. 6B, and this is the inner surface 11 of the lower plate member 1 of the heat transport device 100 manufactured with a crushing amount G of 0 mm.

  6 (A) and 6 (B), dents arranged at almost equal intervals are visible on the inner surface 11 of the lower plate member 1 (K surrounded by a circle). This recess is a recess formed by diffusion bonding between the inner surface 11 of the lower plate member 1 and the first mesh layer 6. That is, it can be seen that the inner surface 11 of the lower plate member 1 and the first mesh layer 6 are reliably diffusion-bonded in the diffusion bonding step of FIG. 4C within a crushing amount of 0 mm to 0.10 mm.

  As described above, in the method for manufacturing the heat transport device 100 according to the present embodiment, the lower plate member 1 and the frame member 2 and the frame member 2 and the upper plate member 3 are diffused to form the container 4 of the heat transport device 100. Be joined. In this diffusion bonding step, the lower plate member 1 and the capillary member 5 laminated so as to be sandwiched between the lower plate member 1 and the upper plate member 3 are diffusion bonded. Accordingly, since a plurality of diffusion bondings are performed in the same process, an inexpensive heat transport device manufacturing method that can be efficiently manufactured by a small number of processes is realized.

  When multiple diffusion bonding is performed in a separate process, the heat transport device is exposed to a high temperature state for each diffusion bonding. This causes a decrease in yield in manufacturing the heat transport device. For example, after the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion bonded (diffusion bonding α), the lower plate member 1 and the frame member 2 and the frame member 2 and the upper plate member 3 are separated in another process. The container 4 is formed by diffusion bonding (diffusion bonding β). In this case, since the lower plate member 1, the frame member 2 and the upper plate member 3 are once exposed to a high temperature in the diffusion bonding α, many defects such as small holes in the container 4 formed in the diffusion bonding β occur. To do. However, in the method for manufacturing the heat transport device 100 according to the present embodiment, it is possible to prevent the yield from being reduced as described above and to reduce the cost.

Also, the relationship between the thickness t ₁ of the frame member 2 having a thickness t ₂ and the capillary member 5 constituting the side wall of the container 4, is adjusted the degree to which the capillary member 5 is compressed, the pressure P to be absorbed by the capillary member 5 A part of is adjusted. Therefore, by setting the thickness t ₁ of the thickness t ₂ and the capillary member 5 of the frame member 2 as appropriate, required for diffusion bonding between the inner surface 11 and the capillary member 5 of the lower plate member 1, the desired pressure P' Obtainable.

<Second Embodiment>
A second embodiment of the present invention will be described. In the following description, the description of the same parts as the configuration and operation in the method for manufacturing the heat transport device 100 described in the first embodiment will be omitted or simplified.

[Configuration of heat transport device]
FIG. 7 is a schematic cross-sectional view sequentially illustrating a method for manufacturing a heat transport device according to the second embodiment of the present invention. The heat transport device 200 includes an upper plate member 203 in place of the upper plate member 3 and the frame member 2 in the heat transport device 100 according to the first embodiment. The upper plate member 203 and the lower plate member 1 constitute a container 204 of the heat transport device 200.

  The upper plate member 203 has a vessel-like shape, and is diffusion bonded to the upper plate portion 203 a placed on the capillary member 5, the side wall portion 203 b constituting the side wall of the container 204, and the lower plate member 1. And a joint portion 203c.

The height of the side wall portion 203b as viewed from the inner space side of the container 204 (hereinafter, referred to as the height of the side wall portion 203b) when the the t _3, the thickness of the internal space of the container 204 becomes t _3. High t ₃ of the side wall portion 203b, compared to the thickness t ₁ of the capillary member 5, the larger the thickness t ₁ of the capillary member 5.

[Method of Manufacturing Heat Transport Device 200]
As shown in FIG. 7A, the capillary member 5 is placed on the inner surface 11 of the lower plate member 1.

As shown in FIG. 7B, the upper plate member 203 is placed on the capillary member 5. Since the thickness t ₁ of the capillary member 5 is larger than the height t ₃ of the side wall portion 203b, the upper plate member 203 is placed on the capillary member 5, and the upper plate member 203 and the lower plate member 1 are placed. There is an interval. A surface facing the lower plate member 1 in the joint portion 203c of the upper plate member 203 is defined as a facing surface 231, and a distance between the facing surface 231 and the inner surface 11 of the lower plate member 1 is defined as a crushing amount G.

  As shown in FIG. 7C, pressure P is applied from the upper plate member 203 side, and the lower plate member 1 and the upper plate member 203 are diffusion bonded. At this time, the capillary member 5 is compressed by the crushing amount G, and a part of the pressure P is absorbed. A pressure P ′ smaller than the pressure P is applied from the capillary member 5 to the lower plate member 1, and the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded by this pressure P ′.

As described above, in the method for manufacturing the heat transport device 200 according to this embodiment, the heat transport according to the first embodiment is set by appropriately setting the height t ₃ of the side wall portion 203b and the thickness t ₁ of the capillary member 5. The same effects as those of the device 100 manufacturing method can be obtained. Moreover, the manufacturing cost of the heat transport device 200 can be reduced by manufacturing the upper plate member 203 using, for example, mold processing such as press processing or casting. Further, since the upper plate member 203 has the joint portion 203c, a sufficient joint area between the upper plate member 203 and the lower plate member 1 can be taken. Thereby, the airtightness of the container 204 formed by the diffusion bonding of the upper plate member 203 and the lower plate member 1 is improved.

<Third Embodiment>
FIG. 8 is a schematic cross-sectional view showing a heat transport device manufactured by the method for manufacturing a heat transport device according to the third embodiment. The cross-sectional view of FIG. 8 is a cross-sectional view of the heat transport device 300 in the short direction. In the following description, the capillary member 5 is illustrated in a simplified manner.

  The heat transport device 300 includes an upper plate member 303 instead of the upper plate member 203 in the heat transport device 200 according to the second embodiment. The upper plate member 303 and the lower plate member 1 constitute a container 304 of the heat transport device 300.

  Similar to the upper plate member 203 included in the heat transport device 200 according to the second embodiment, the upper plate member 303 includes an upper plate portion 303a, a side wall portion 303b, and a joint portion 303c. It differs from the upper plate member 203 in that the upper plate portion 303a has a protrusion 313.

  The protrusion 313 protrudes toward the internal space in the container 304 of the heat transport device 300. The protruding portion 313 has a long shape along the longitudinal direction of the heat transport device 300 and is provided on the upper plate portion 303 a of the upper plate member 303.

  At the time of manufacturing the heat transport device 300 according to the present embodiment, the upper plate member 303 and the lower plate member 1 are diffusion-bonded in a state where the capillary member 5 is compressed and crushed by the protrusion 313. Further, the capillary member 5 and the lower plate member 1 are diffusion bonded by this diffusion bonding process.

  FIG. 9 is a photograph of the inner surface 11 of the lower plate member 1 of the heat transport device 300 manufactured according to this embodiment.

  The capillary member 5 is compressed by the protrusion 313. A depression due to diffusion bonding between the inner surface 11 of the lower plate member 1 and the capillary member 5 can be seen around a region on the inner surface 11 of the lower plate member 1 corresponding to the compressed portion (a region surrounded by a broken-line circle). (K circled). In the present embodiment, two protrusions 313 are provided along the longitudinal direction of the heat transport device 300. As shown in FIG. 9, two dents arranged at substantially equal intervals on the inner surface 11 can be confirmed (L1 and L2).

As described above, in the heat transport device 300 according to the present embodiment, since the upper plate member 303 has the protruding portion 313, the internal space of the container 304 can be reinforced by the protruding portion 313, and reliably. The capillary member 5 can be compressed. Further, the protrusion 313 enables the capillary member 5 to be compressed even in a range where the thickness t ₁ of the capillary member 5 is smaller than the thickness of the internal space of the container 304. For example, a desired design is possible in which the capillary member 5 is provided in the flow path of the liquid-phase working fluid and not provided in the flow path of the gas-phase working fluid (see FIG. 8).

  Further, the protruding portion 313 can be formed by die processing or an etching technique such as RIE (Reactive Ion Etching), for example, and the cost in manufacturing the heat transport device 300 can be suppressed.

  In the present embodiment, the protrusion 313 has a long shape along the longitudinal direction of the heat transport device 300, but is not limited thereto. A desired number of protrusions 313 may be provided at a desired position of the upper plate portion 303a. Thereby, for example, the volume of the gas-phase working fluid channel is increased, and the heat transport efficiency of the heat transport device 300 can be improved.

<Fourth Embodiment>
FIG. 10 is a diagram for explaining a method of manufacturing a heat transport device using a jig.

  The heat transport device 400 has substantially the same configuration as the heat transport device 200 according to the second embodiment. The side wall portion 403b of the upper plate member 403 having a vessel shape is different from the configuration of the heat transport device 200 in that the side wall portion 403b is inclined with respect to the thickness direction of the container 404. In the present embodiment, the upper plate portion 403a, the side wall portion 403b, and the joint portion 403c of the upper plate member 403 have substantially the same thickness.

  The upper plate member 403, the lower plate member 1, and the capillary member 5 sandwiched between them constitute a heat transport device unit 450.

  The jig part 600 has a placement surface 610 on which the upper plate member 403 of the heat transport device unit 450 is placed. The placement surface 610 of the jig portion 600 includes a lower step surface 610a on which the upper plate portion 403a of the upper plate member 403 is placed, and an upper step surface 610b on which the joint portion 403c is placed. The lower step surface 610a and the upper step surface 610b are connected via a step, and the recess of the jig portion 600 is formed by the step, the lower step surface 610a, and the upper step surface 610b.

The depth of the recess of the jig unit 600, the height from the lower surface 610a to upper surface 610b and t _4. When the height t ₄ and the thickness t ₁ of the capillary member 5 are compared, the thickness t ₁ of the capillary member 5 is larger by 0 mm to 0.2 mm.

  As a material of the jig part 600, carbon or stainless steel is typically used.

[Method for Manufacturing Heat Transport Device 400]
FIG. 11 is a schematic cross-sectional view sequentially illustrating a method for manufacturing the heat transport device 400.

As shown in FIG. 11A, the upper plate member 403, the capillary member 5, and the lower plate member 1 are sequentially stacked on the mounting surface 610 of the jig unit 600. A crushing amount G is provided between the joint portion 403 c of the upper plate member 403 and the lower plate member 1. This crushing amount G is obtained by adding the height t ₄ and the thickness of the joint portion 403c (height X), and adding the thickness t ₁ of the capillary member 5 and the thickness of the upper plate portion 403a (height Y). Is the difference.

In the present embodiment, the upper plate portion 403a and the joint portion 403c have substantially the same thickness. Therefore, the crushing amount G is substantially equal to the difference between the height t ₄ and the thickness t ₁ of the capillary member 5.

  As shown in FIG. 11B, the pressure required for diffusion bonding of the upper plate member 403 and the lower plate member 1 of the heat transport device unit 450 in the direction in which the heat transport device unit 450 and the jig portion 600 are laminated. P is applied. At this time, the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded by the pressure P ″ applied to the lower plate member 1 from the capillary member 5 having elasticity.

  For example, when a plurality of upper plate members 403 are formed by die processing or the like, there may be a case where the heights of the side wall portions 403b of the plurality of upper plate members 403 are not uniform due to an error in formation or the like.

However, in the present embodiment, the joining portion 403c of the upper plate member 403 is diffusion joined to the lower plate member 1 while being pressed against the upper stage surface 610b of the jig portion 600. Therefore, the crushing amount G is determined by the difference between the height t ₄ and the thickness t ₁ of the capillary member 5 regardless of variations in the height of the side wall portions 403b. Accordingly, in the diffusion bonding step shown in FIG. 11 (B), the capillary member 5 is compressed by the squeezing amount G without variation, so that the pressure P ″ required for the diffusion bonding between the lower plate member 1 and the capillary member 5 is reduced. , Can be obtained without variation.

In the present embodiment, the upper plate portion 403a and the joint portion 403c of the upper plate member 403 have substantially the same thickness, but are not limited thereto. Based on the shape of the upper member 403, the thickness t ₁ of the height t ₄ and the capillary member 5 is properly set, can be provided the desired squashing amount G.

<Fifth Embodiment>
FIG. 12 is a schematic cross-sectional view sequentially illustrating a method for manufacturing a heat transport device using a plurality of jigs. The jig part 700 and the heat transport device 500 have substantially the same configuration as the jig part 600 and the heat transport device 400 according to the fourth embodiment.

  As illustrated in FIG. 12A, the upper plate member 503, the capillary member 5, and the lower plate member 1 are sequentially stacked on the placement surface 710 of the jig unit 700. Further, the jig portion 700 is laminated on the lower plate member 1, and the upper plate member 503, the capillary member 5, and the lower plate member 1 are sequentially laminated on the mounting surface 710 of the jig portion 700. . In this way, the plurality of heat transport device units 550 and the plurality of jig portions 700 are stacked. A crushing amount G is provided between the joint portion 503 c of the upper plate member 503 and the lower plate member 1 of each heat transport device unit 550.

  As shown in FIG. 12B, diffusion between the upper plate member 503 and the lower plate member 1 of each heat transport device unit 550 in the direction in which the plurality of heat transport device units 550 and the plurality of jig portions 700 are stacked. Pressure P required for joining is applied. At this time, the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded by the pressure P ″ applied to the lower plate member 1 from the capillary member 5 having elasticity.

  As described above, in the method for manufacturing the heat transport device 500 of the present embodiment, the plurality of heat transport device units 550 and the plurality of jig portions are arranged in the direction in which the plurality of heat transport device units 550 and the plurality of jig portions 700 are stacked. By applying the pressure P to 700, a plurality of heat transport devices 500 are manufactured at a time. That is, batch processing in manufacturing the heat transport device 500 becomes possible.

  Since diffusion bonding is performed with a large load in a vacuum environment, the cost for one diffusion bonding process is high. In addition, the diffusion bonding process includes a process in which the heat transport device is cooled in a vacuum environment after the container of the heat transport device is bonded in a high temperature state, so that much time is consumed. However, according to the manufacturing method of the heat transport device 500 in the present embodiment, since the batch processing described above is possible, the cost is suppressed and the manufacturing time is shortened. This realizes a more efficient and inexpensive method for manufacturing a heat transport device.

<Sixth Embodiment>
Next, a sixth embodiment of the present invention will be described.

  In the above embodiments, the container is described as being formed by an upper plate member, a lower plate member, and the like. On the other hand, in the sixth embodiment, the container is formed by bending one plate member. Therefore, this point will be mainly described.

  FIG. 14 is a perspective view showing a heat transport device according to the sixth embodiment. 15 is a cross-sectional view taken along the line AA in FIG. FIG. 16 is a development view of a plate member constituting the container of the heat transport device.

  As shown in FIG. 14, the heat transport device 110 includes a container 51 having a rectangular thin plate shape that is long in one direction (Y-axis direction). The container 51 is formed by bending one plate member 52.

  The plate member 52 is typically made of oxygen-free copper, tough pitch copper, or a copper alloy. However, the present invention is not limited to this, and the plate member 52 may be made of a metal other than copper, or other materials having high thermal conductivity may be used.

  As shown in FIG.14 and FIG.15, the container 51 is made into the shape where the side part 51c in the direction in alignment with a longitudinal direction (Y-axis direction) curved. That is, the container 51 is formed such that the plate member 52 shown in FIG. 16 is bent at substantially the center of the plate member 52, and thus the side portion 51c is curved. Hereinafter, the side part 51c may be referred to as a curved part 51c.

  The container 51 has a joint portion 53 at a side portion 51d opposite to the side portion 51c (curved portion 51c) and side portions 51e and 51f in the direction along the short side direction. The joint portion 53 is provided so as to protrude from the respective side portions 51d, 51e, 51f. In the joint portion 53, the bent plate member 52 is joined. The joining portion 53 corresponds to the joining region 52a (the region indicated by oblique lines) of the plate member 52 shown in FIG. The joining region 52 a is a region within a predetermined distance d from the edge 52 b of the plate member 52.

  A capillary member 5 is provided inside the container 51. The capillary member 5 includes one or more mesh members 8 as described above. The thickness of the capillary member 5 can be set to about the thickness of the internal space of the container 51 (may be slightly larger or smaller than the thickness of the internal space).

[Method for Manufacturing Heat Transport Device 110]
FIG. 17 is a diagram illustrating a method for manufacturing a heat transport device.

  As shown in FIG. 17A, first, a plate member 52 is prepared. Then, the plate member 52 is bent substantially at the center of the plate member 52.

  When the plate member 52 is bent to a predetermined angle, the capillary member 5 is inserted between the bent plate members 52 as shown in FIG. The capillary member 5 may be disposed at a predetermined position on the plate member 52 before the bending of the plate member 52 is started.

  When the capillary member 5 is inserted between the plate members 52, the plate member 52 is further bent so as to sandwich the capillary member 5 as shown in FIG. And the joining part 53 (joining area | region 52a) of the bent board member 52 is joined by diffusion joining, The capillary member 5 is joined to the upper board part 52c and the lower board part 52d of the board member 52 by diffusion joining. The

  In the case of this heat transport device 110, since the container 51 is formed by one plate member 52, the number of parts can be reduced and the cost can be reduced. Further, when the container 51 is formed of two or more members, it is necessary to align the positions of these members, but in this embodiment, it is not necessary to align the positions of the members. Therefore, the heat transport device 110 can be easily manufactured.

[Modification]
FIG. 18 is a view for explaining a modified example of the heat transport device 110 and is a development view of a plate member.

  As shown in FIG. 18, the plate member 52 has a groove 54 at the center of the plate member 52 so as to be along the longitudinal direction (Y-axis direction). The groove 54 is formed by, for example, pressing or etching, but the method for forming the groove 54 is not particularly limited.

  By providing the groove 54 in the plate member 52, the plate member 52 can be easily bent. Thereby, the heat transport device 110 can be manufactured more easily. The plate member 52 has a structure in which the plate member 52 is bent in the longitudinal direction (with the Y direction as an axis), but may be bent with a short side (in the short direction) (with the X direction as an axis).

<Seventh Embodiment>
Next, a seventh embodiment of the present invention will be described. Note that the seventh embodiment will be described mainly with respect to differences from the above-described sixth embodiment.

  FIG. 19 is a perspective view showing a heat transport device according to the seventh embodiment. 20 is a cross-sectional view taken along the line AA in FIG. FIG. 21 is an exploded view of a plate member constituting the container of the heat transport device.

  As shown in FIGS. 19 and 20, the heat transport device 120 includes a container 61 having a rectangular thin plate shape that is long in one direction (Y-axis direction).

  The container 61 is formed by folding a plate member 62 shown in FIG. 21 from the center. The plate member 62 is provided with two openings 65 at the center of the plate member 62 so as to be along the longitudinal direction of the plate member 62. By providing the opening 65 in this way, the left plate and the right plate of the plate member 62 are connected in the three regions 66.

  The container 61 has a joint portion 63 at side portions 61c and 61d in the direction along the longitudinal direction (Y-axis direction) and side portions 61e and 61f in the direction along the short-side direction (x-axis direction). Yes. In the joint portion 63, the upper plate and the lower plate are joined by diffusion joining to form the container 61. The joining portion 63 corresponds to joining regions 62a and 62b indicated by oblique lines of the plate member 62 shown in FIG.

  As a result of joining the upper plate and the lower plate in this manner, three projecting portions 64 projecting from the side portion 61c are formed.

  In the heat transport device 120, since the plate member 62 is provided with the opening 65, the plate member 62 can be bent easily. Thereby, the heat transport device 120 can be manufactured more easily.

  For example, a groove formed by pressing may be provided in a region 66 between the opening 65 and the edge portion 62 c and a region 66 between the two openings 65 of the plate member 62. Thereby, the plate member 62 can be bent more easily.

<Eighth Embodiment>
[Configuration of heat transport device]
FIG. 22 is a view for explaining the method of manufacturing the heat transport device according to the eighth embodiment of the present invention. The heat transport device 800 according to the present embodiment has a capillary member 805 having a thickness of t ₁ instead of the capillary member 5 in the heat transport device 200 according to the second embodiment.

  The capillary member 805 includes a first mesh member 860, a second mesh member 870 stacked on the first mesh member 860, and a joining mesh member 850 stacked on the second mesh member 870. In the heat transport device 800 according to this embodiment, the gas-phase working fluid moves mainly through the first mesh member 860, and the liquid-phase working fluid moves mainly through the second mesh member 870. .

  When the spring constant of the second mesh member 870 is compared with the spring constant of the joining mesh member 850, the spring constant of the second mesh member 870 is larger. The spring constant of the first mesh member 860 is also set larger than the spring constant of the joining mesh member 850. The spring constant of the first mesh member 860 and the spring constant of the second mesh member 870 may be the same or different. However, when the spring constants of the first mesh member 860 and the second mesh member 870 are different, the difference is smaller than the difference between the spring constants of the second mesh member 870 and the joining mesh member 850. It is. In the present embodiment, it is assumed that the spring constant of the first mesh member 860 and the spring constant of the second mesh member 870 are substantially equal.

  Here, the spring constant will be described. The spring constant described in the description of the present embodiment is a spring constant in the thickness direction of each mesh member. FIG. 23 shows stress and deformation in the thickness direction due to the stress applied to the joining mesh member 850 having different spring constants, the first mesh member 860, and the second mesh member 870 in the thickness direction. It is a typical graph which shows the relationship with quantity (crushing quantity).

  In the graph shown in FIG. 23, the relationship between the stress and the deformation amount of the joining mesh member 850 having a small spring constant is indicated by a broken line. On the other hand, the relationship between the stress and the deformation amount of the first mesh member 860 and the second mesh member 870 having a large spring constant is indicated by a solid line. When the same stress σ is applied to the joining mesh member 850, the first mesh member 860, and the second mesh member 870, as shown in the graph as “difference in deformation”, joining is performed. The amount of deformation of the mesh member 850 is larger. That is, the joining mesh member 850 having a small spring constant is more easily deformed than the first mesh member 860 and the second mesh member 870 having a large spring constant.

  The spring constant and the shape of the mesh member will be described. In a mesh member formed by braiding a plurality of fine metal wires, when the mesh size of the fine metal wires is the same, the larger the thickness (diameter) of the fine metal wires, the larger the spring constant. When the diameters of the fine metal wires are the same, the smaller the mesh, the larger the spring constant. Thus, the mesh member which has a desired spring constant is obtained by setting suitably the magnitude | size and diameter of the mesh | network of the metal fine wire knitted. In addition, the spring constant of the mesh member may be appropriately set by appropriately setting the material of the fine metal wire used.

  In this embodiment, the joining mesh member 850 having a small spring constant has a mesh size of the fine metal wires smaller than that of the fine metal wires knitted as the first mesh member 860 and the second mesh member 870. However, in the joining mesh member 850, a metal fine wire having a diameter smaller than that of the metal fine wire used for the first mesh member 860 and the second mesh member 870 is used. Thereby, the spring constant of the joining mesh member 850 is set to be smaller than that of the first mesh member 860 and the second mesh member 870.

[Method for Manufacturing Heat Transport Device 800]
As shown in FIG. 24A, the first mesh member 860 of the capillary member 805 is placed on the inner surface 11 of the lower plate member 1. Further, the upper plate member 203 is placed on the joining mesh member 850 of the capillary member 805. A crushing amount G is provided between the lower plate member 1 and the upper plate member 203.

  As shown in FIG. 24B, pressure P is applied from the upper plate member 203 side, and the lower plate member 1 and the upper plate member 203 are diffusion bonded. At this time, the capillary member 805 and the lower plate member 1 and the upper plate member 203 are diffusion-bonded by the pressures P ′ and P ″ from the capillary member 805 compressed by the crushing amount G, respectively.

  The diffusion bonding between the capillary member 805 and the upper plate member 203 in the diffusion bonding step shown in FIG. FIG. 25 is an enlarged view of the upper plate member 203, the joining mesh member 850, and the second mesh member 870 shown in FIG. FIG. 26 is an enlarged view showing diffusion bonding between the capillary member 895 and the upper plate member 203 given as a comparative example. The capillary member 895 is a member in which the joining mesh member 850 is not stacked on the second mesh member 870. Therefore, in FIG. 26, the upper plate member 203 and the second mesh member 870 are enlarged and illustrated. In the following description, the second mesh member 870 of the capillary member 895 will be described as a second mesh member 870 ′.

  25 shows a plurality of fine metal wires 855 knitted as the joining mesh member 850 and a plurality of fine metal wires 875 (875a and 875b) knitted as the second mesh member 870. The fine metal wires 855 and 875 are knitted in the X direction shown in FIG. Similarly, FIG. 26 also shows a plurality of fine metal wires 875 '(875a' and 875b ') knitted as the second mesh member 870'. In FIG. 25 and FIG. 26, the metal fine wires knitted in the direction different from the X direction are omitted from the metal fine wires 855, 875, and 875 ′.

  FIG. 25A shows a joining mesh member 850 and a second mesh member 870 before diffusion joining to the upper plate member 203. As shown in FIG. 25 (A), the fine metal wires 855 and 875 to be knitted have variations due to dimensional tolerances at positions in the thickness direction of the heat transport device 800 (Z direction shown in FIG. 25). Similarly, the fine metal wires 875 ′ of the second mesh member 870 ′ also have variations due to dimensional tolerances.

  When the second mesh member 870 ′ having the above variation is diffusion-bonded to the upper plate member 203, the metal thin wire 875a ′ is diffusion-bonded to the upper plate member 203 as shown in FIG. The fine metal wire 875b ′ is not diffusion bonded to the upper plate member 203. In this state, the diffusion bonding between the capillary member 895 and the upper plate member 203 is not sufficient.

  When the pressure in the diffusion bonding process is increased in order to diffusely bond the fine metal wire 875b ′ to the upper plate member 203, the fine metal wire 875a ′ is larger than the fine metal wire 875b ′ as shown in FIG. It will be deformed. When such a difference in deformation amount between the thin metal wires 875a ′ and 875b ′ occurs, there is a possibility that functions related to heat transport performance such as generating capillary force in the liquid-phase working fluid may not be sufficiently exhibited.

  On the other hand, when the capillary member 805 according to the present embodiment having the bonding mesh member 850 is diffusion bonded to the upper plate member 203, the bonding mesh member 850 and the second mesh member as shown in FIG. 870 is diffusion bonded to the upper plate member 203. The joining mesh member 850 having a small spring constant is sufficiently deformed in the diffusion joining step, and is sufficiently diffusion joined to the upper plate member 203. In the second mesh member 870 having a large spring constant and not easily deformed, the fine metal wire 875a is diffusion bonded to the upper plate member 203. The fine metal wire 875b is not diffusion bonded to the upper plate member 203, but is diffusion bonded to the fine metal wire 855.

  As described above, in the present embodiment, the bonding mesh member 850 having a small spring constant is sufficiently compressed in the diffusion bonding step, and is sufficiently diffusion bonded to the upper plate member 203 by the stress. Further, the joining mesh member 850 can absorb variation in deformation due to the dimensional tolerance of the second mesh member 870. Therefore, as shown in FIG. 25B, it is possible to prevent the metal thin wire 875a diffused and bonded to the upper plate member 203 from being greatly deformed as compared with the metal thin wire 875b. Accordingly, the second mesh member 870 can be sufficiently joined to the upper plate member 203 and can sufficiently exhibit the functions related to the heat transport performance described above. For example, when the heat transport device 800 is adapted to a high heat flux density, the effect in the present embodiment is great.

In the present embodiment, the dimensional tolerance of the second mesh member 870 has been described. However, for example, variations in the deformation amount of the second mesh member 870 occur due to variations in the thickness of the upper plate member 203, the height of the side wall portion 203b (t ₃ shown in FIG. 22), and the like. It is also possible. Even in such a case, the variation in the deformation amount of the second mesh member 870 is absorbed by the joining mesh member 850.

  27 (A) and 27 (B) are schematic views respectively showing mesh members that are different from each other in how the fine metal wires are knitted. 27A and 27B show mesh members M and N in which the same fine metal wires are knitted with the same mesh size, respectively. The mesh member M shown in FIG. 27A is formed so that its thickness m is almost three times the diameter r of the fine metal wire. The mesh member N shown in FIG. 27B is formed so that its thickness n is almost twice the diameter r of the fine metal wire. That is, since the mesh member N is tightly knitted in the thickness direction of the mesh member (Z direction shown in FIG. 27) than the mesh member M, the mesh member N has a spring constant higher than that of the mesh member M. large. Thus, the spring constant may be set as appropriate depending on how the fine metal wires are knitted.

  The capillary member 805 of this embodiment is formed by laminating mesh members. However, as described in the first embodiment, any device may be used as long as it applies a capillary force to the working fluid and has a predetermined elasticity. As such, in addition to those mentioned above, for example, those formed in an interdigital shape or a lattice shape by an etching technique, and those in which grooves are formed may be mentioned. Moreover, what has the sintered structure of a metal powder may be used as a capillary member. In this case, if a member having a small spring constant and easily deformed is arranged on the side to be joined to the upper plate member of the capillary member, the same effect as in the present embodiment can be obtained. Moreover, what was mentioned above can be used as a capillary member in each embodiment of this invention.

[Modification]
FIG. 28 is a view showing a modified example of the capillary member 805. The capillary member 805 is formed by laminating a joining mesh member 840 on the opposite side of the first mesh member 860 to the side where the second mesh member 870 is laminated. The spring constant of the joining mesh member 840 is smaller than the spring constant of the first mesh member 860. That is, the joining mesh member 840 is more easily deformed than the first mesh member 860.

  The capillary member 805 is diffusion bonded to the upper plate member 203 and the lower plate member 1, whereby the internal space of the container 204 of the heat transport device 800 is reinforced. At this time, the joining mesh member 840 laminated on the first mesh member 860 and the lower plate member 1 are diffusion bonded, whereby the capillary member 805 and the lower plate member 1 are sufficiently diffusion bonded.

  The first mesh member 860 is a member that serves as a flow path for the gas-phase working fluid. Therefore, if the first mesh member 860 is greatly deformed in the diffusion bonding step, there is a possibility that the flow path resistance when the gas-phase working fluid moves increases. Further, since the first mesh member 860 is largely deformed, there is a possibility that the pressure loss when the working fluid circulates in the container 204 of the heat transport device 800 is increased. However, the use of the first mesh member 860 that has a large spring constant and is difficult to deform can prevent the above-described problem from occurring.

<Ninth Embodiment>
FIG. 29 is a view for explaining a heat transport device according to the ninth embodiment of the present invention. The heat transport device 900 according to the present embodiment is the heat transport device 100 according to the first embodiment, in which an injection port 900a and an injection path 900b described below are formed on the inner surface 11 of the lower plate member 1. is there.

  The inlet 900 a and the injection path 900 b are formed for injecting a working fluid into the container 4 during the manufacturing process of the heat transport device 900. The injection port 900a and the injection path 900b are end portions in the longitudinal direction (X direction shown in FIG. 29) of the lower plate member 1, and are formed in a region where the inner surface 11 is diffusion bonded to the frame member 2.

  FIG. 30 is an enlarged plan view showing the injection port 900a and the injection path 900b. The injection port 900 a is formed so as to penetrate the lower plate member 1. The injection path 900b is a groove formed on the inner surface 11 so as to communicate with the injection port 900a, and communicates with the inside of the container 4 at the end opposite to the side where the injection port 900a is provided. As shown in FIG. 30, the injection path 900b is formed in an L shape, for example.

  The injection path 900b may be formed by, for example, end milling, laser processing, press processing, or fine processing such as photolithography and half etching in semiconductor manufacturing. According to press working, there is a feature that burrs do not appear. In the case of laser processing and end mill processing, a mold is not required, and a free-form groove can be formed.

  The injection port 900a and the injection path 900b are sealed by, for example, caulking after the working fluid is injected into the container 4 in the manufacturing process of the heat transport device 900.

<Tenth Embodiment>
FIG. 30 is a view for explaining a heat transport device according to the tenth embodiment of the present invention. In the heat transport device 900 shown in FIG. 29, injection ports 900 a and 900 b are formed in the lower plate member 1. In the heat transport device 910 according to the present embodiment, as shown in FIG. 30, an injection port 910 a is formed in the upper plate member 3, and a groove serving as an injection path 910 b is formed in the frame member 2.

  The injection port 910a is formed at the end of the upper plate member 3 in the longitudinal direction (X direction shown in FIG. 30) so as to penetrate the upper plate member 3. The injection path 910 b is formed in a region where the frame member 2 is diffusion bonded to the upper plate member 3. The injection path 910b is formed so as to communicate with the injection port 910a, and the end of the injection path 910b opposite to the side communicating with the injection port 910a communicates with the inside of the container 4. In the present embodiment, the injection port 910a is formed in the upper plate member 3, but the injection port 910a is formed in the lower plate member 1, and the injection path 910b is in a region where the frame member 2 is diffusion bonded to the lower plate member 1. It may be formed.

  If the injection path 910b is formed in the frame member 2 by press working, a projection is formed on the surface of the frame member 2 opposite to the side on which the injection path 910b is formed. In that case, the frame member 2 and the lower plate member 1 cannot be joined. Therefore, in this embodiment, the injection path 910b may be formed by laser processing or end mill processing.

  In each embodiment according to the present invention described above, wire electric discharge machining (wire cut) may be used for processing or cutting of the upper plate member, the lower plate member, the frame member, or the capillary member. The wire electric discharge machining is a machining method for machining a member by applying a voltage to a wire such as brass, tungsten, or molybdenum to generate an electric discharge between the member to be machined and the wire. By using wire electric discharge machining, highly accurate fine machining is realized. Moreover, the processing time of a member can be shortened.

  The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, you may use the batch process in 5th Embodiment for the manufacturing method of the heat transport device in 1st, 2nd, 3rd, and 4th embodiment. If the shape of the jig portion 700 used in the fifth embodiment is made to correspond to the lower plate member and the upper plate member, batch processing in other embodiments can be performed.

DESCRIPTION OF SYMBOLS 1 ... Lower board member 2 ... Frame member 3, 203, 303, 403, 503 ... Upper board member 4, 51, 61, 204, 304, 404 ... Container 5,805 ... Capillary member 6 ... 1st mesh layer 7 ... 2nd mesh layer 8 ... Mesh member 9 ... Heat source 11 ... Inner surface of lower plate member 21 ... Opposite surface of side wall portion 31 ... Inner surface of upper plate member 52, 62 ... Plate member 100, 110, 120, 200, 300, 400 , 500, 800, 900, 910 ... heat transport device 203a, 303a, 403a ... upper plate part 203b, 303b, 403b ... side wall part 203c, 303c, 403c, 503c ... joint part 231 ... joint facing surface 313 ... projection part 450, 550 ... Heat transport device unit 600, 700 ... Jig portion 610, 710 ... Placement surface 610a ... Lower step surface 610b ... Upper step surface 840, 50 ... bonding mesh member 860 ... first mesh member 870 ... second mesh members 900a, 910a ... inlet 900b, 910b ... injection path

Claims (13)

The first plate and the second plate constituting the container of the heat transport device that transports heat using the phase change of the working fluid are arranged so that a capillary member that applies a capillary force to the working fluid is sandwiched between the first plate and the second plate. Laminating one plate, the capillary member and the second plate;
A method for manufacturing a heat transport device, wherein the first plate and the second plate are diffusion bonded so that the first plate and the capillary member are diffusion bonded. It is a manufacturing method of the heat transport device according to claim 1,
The thickness of the said capillary member is a manufacturing method of a heat transport device larger than the thickness of the internal space of the said container comprised by the said 1st board and the said 2nd board. A method for producing a heat transport device according to claim 1 or 2,
The capillary member is made of an elastic material,
The diffusion bonding step is a method for manufacturing a heat transport device in which the first plate and the second plate are diffusion bonded while compressing the capillary member. It is a manufacturing method of the heat transport device according to claim 3,
The capillary member is
A first mesh layer;
A method for manufacturing a heat transport device, comprising: a second mesh layer that is laminated on the first mesh layer and is made of a mesh having a coarser mesh than the mesh included in the first mesh layer. It is a manufacturing method of the heat transport device according to claim 3,
The second plate has a protrusion;
The diffusion bonding step is a method for manufacturing a heat transport device in which the first plate and the second plate are diffusion bonded while the capillary member is compressed by the protrusion. It is a manufacturing method of the heat transport device according to claim 1,
The heat transport device has a frame member constituting a side wall of the container,
In the diffusion bonding step, the first plate and the frame member are diffused, and the second plate and the frame member are diffused so that the first plate and the capillary member are diffusion bonded. Manufacturing method of heat transport device to be joined. It is a manufacturing method of the heat transport device according to claim 1,
In the stacking step, a unit including the first plate, the capillary member, and the second plate, which are stacked so as to sandwich the capillary member between the first plate and the second plate, is formed as a concave portion. The jig part and the unit are laminated so as to fit in the concave part of the jig part having
The diffusion bonding step is a method of manufacturing a heat transport device in which the first plate and the second plate of the unit are diffusion bonded by applying pressure to the jig portion and the unit in the stacking direction. It is a manufacturing method of the heat transport device according to claim 1,
In the laminating step, the plurality of units and the plurality of units are arranged such that a jig portion is laminated between each of the plurality of units each having the first plate, the capillary member, and the second plate. Laminate jig parts,
In the diffusion bonding step, the first plate and the second plate of the plurality of units are diffusion bonded by applying pressure to the plurality of units and the plurality of jig portions in the stacking direction. A method for manufacturing a transport device. It is a manufacturing method of the heat transport device according to claim 3,
The capillary member is
A first member having a first spring constant and diffusion bonded to the first plate;
And a second member having a second spring constant larger than the first spring constant and stacked on the first member. It is a manufacturing method of the heat transport device according to claim 9,
The diffusion bonding step includes the first plate and the first plate so that the first plate and the capillary member are diffusion bonded and the second plate and the capillary member are diffusion bonded. Diffusion bonding with the second plate,
The capillary member includes a third member, and the third member has a third spring constant smaller than the second spring constant, and is laminated on the second member and the second plate. A method of manufacturing a heat transport device to be diffusion bonded. A capillary member for applying a capillary force to the working fluid by bending a plate for constituting a container of a heat transport device that transports heat using the phase change of the working fluid is formed by bending the capillary member. Sandwiched between the first part and the second part of the plate,
The container is formed by diffusion bonding the end portion of the first portion and the end portion of the second portion so that the first portion and the capillary member are diffusion bonded. Device manufacturing method. A container having an inner surface;
A working fluid that is contained in the container and transports heat by phase change;
A first member having a first spring constant and diffusion-bonded to the inner surface; and a second member having a second spring constant larger than the first spring constant and stacked on the first member. And a capillary member for applying a capillary force to the working fluid. A container having a side wall, the container having a frame member constituting the side wall, and a first plate and a second plate joined to the frame member so as to sandwich the frame member;
A working fluid that transports heat by phase change in the container;
A heat transport device comprising: a capillary member that applies a capillary force to the working fluid.