KR20110106851A - Thermal transport device producing method and thermal transport device - Google Patents

Abstract

[assignment]
Provide a method of making an inexpensive heat transportation device that is efficiently manufactured by a small number of processes.
[Workaround]
On the inner surface 11 of the lower plate member 1, a capillary member 5 made of a thickness larger than the thickness of the frame member 2 is placed. Subsequently, the frame member 2 is placed on the inner surface 11 of the lower plate member 1, and the upper plate member 3 is placed on the capillary member 5. Due to the difference between the thickness of the capillary member 5 and the thickness of the frame member 2, the amount G of pressing and crushing is provided between the frame member 2 and the upper plate member 3. The lower plate member 1 and the frame member 2, and the upper plate member 3 and the frame member 2 are diffusion bonded. At this time, the capillary member 5 is compressed by the amount G pressed. Since the capillary member 5 has elasticity, a part of the pressure P is absorbed, and a pressure P 'smaller than the pressure P is applied to the lower plate member 1 from the capillary member 5. . By this pressure P ', the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded.

Description

Manufacturing method and heat transportation device of a heat transportation device {THERMAL TRANSPORT DEVICE PRODUCING METHOD AND THERMAL TRANSPORT DEVICE}

TECHNICAL FIELD The present invention relates to a method for producing a heat transportation device that transfers heat by phase change of a working fluid, and a heat transportation device.

In order to cool electronic devices, such as a personal computer, cooling devices, such as a heat pipe, which transfer heat | fever which heat | fevers generate | occur | produces in the heat-generating part of the electronic device, and radiates it, is used.

In these cooling devices, the vapor of the working fluid evaporated by the heat generated in the high temperature heat generating portion of the electronic device moves to the low temperature condensation portion, and condenses in the condensation portion to release the heat, whereby the object to be cooled Is cooled.

In recent years, with miniaturization and thinning of electronic devices, heat generation of ICs and the like contained therein has become a big problem. For example, thinning of thin televisions is more strongly desired, and in order to realize this, it is necessary to cope with the above-mentioned problem of heat generation inside the electronic device. As a means to solve this problem, a compact, thin, high efficiency, inexpensive cooling device is required.

Patent Document 1 includes a plurality of diffusion bonding steps 1 for attaching a mesh to an upper cover and a lower cover constituting a heat spreader, and a diffusion bonding step 2 for joining an upper cover, a lower cover, and a reinforcing member having the mesh. The diffusion bonding process of is described. A plurality of diffusion bonding processes are performed under different suitable conditions, respectively, in different processes (paragraphs [0022] to [0032], [0033], FIG. 6A, FIG. 6B, FIG. 7, and FIG. 8 to FIG. 13).

[Patent Document]

Patent Document 1: Japanese Patent Application Laid-Open No. 2006-140435

However, when a plurality of diffusion bonding processes are performed in different processes, the time spent in manufacturing the cooling device and the time spent in the manufacture of the cooling device, depending on the time spent in each diffusion bonding process, and the cost of each diffusion bonding process. The cost increases. This makes it difficult to manufacture efficient cooling devices and to manufacture inexpensive cooling devices.

In view of the above circumstances, an object of the present invention is to provide a method for producing an inexpensive heat transportation device and a heat transportation device that are efficiently manufactured by a small number of processes.

In order to achieve the above object, a method of manufacturing a heat transportation device according to one aspect of the present invention includes a first plate and a second plate constituting a container of a heat transportation device that transfers heat using a phase change of a working fluid. And laminating the first plate, the capillary member, and the second plate so as to sandwich a capillary member that exerts a capillary force on the working fluid between the plates.

The first plate and the second plate are diffusion bonded so that the first plate and the capillary member are diffusion bonded.

In order to construct the container of the heat transportation device, the first plate and the second plate are diffusion bonded. In this diffusion bonding step, the capillary member laminated so as to be sandwiched between the first plate and the first plate and the second plate is diffusion bonded. Therefore, since a plurality of diffusion bondings are performed in the same process, a method for producing an inexpensive heat transportation device that is efficiently manufactured by a small number of processes is realized.

The capillary member may be made of an elastic material. In this case, in the diffusion bonding step, the first plate and the second plate are diffusion bonded while compressing the capillary member.

The first plate and the second plate are diffusion-bonded by a high bonding force for the purpose of sealing the container. On the other hand, in the diffusion bonding step, the first plate and the capillary member are diffusion-bonded at an appropriate pressure at which capillary force is appropriately applied to the working fluid included in the container. That is, the pressure required for each of these diffusion bondings is different. Since the capillary member has a predetermined elasticity, the capillary member absorbs part of the pressure when the first plate and the second plate are diffusion bonded, and therefore the first plate and the capillary member at a pressure smaller than the pressure. Is diffusion bonded.

The thickness of the capillary member may be larger than the thickness of the inner space of the container constituted by the first plate and the second plate.

As a result, in the diffusion bonding step, the capillary member is surely compressed, and part of the pressure when the first plate and the second plate are diffusion bonded is reliably absorbed.

The capillary member may have a first mesh layer and a second mesh layer made of a mesh thicker than the mesh included in the first mesh layer, which is laminated on the first mesh layer.

The second plate may have a protrusion. In this case, in the diffusion bonding step, the first plate and the second plate are diffusion bonded while compressing the capillary member by the protrusion.

The protrusion can reinforce the inner space of the container, and the protrusion can reliably compress the capillary member.

The heat transportation device may have a frame member constituting the side wall of the container. In this case, in the diffusion bonding step, the first plate and the frame member are further diffusion bonded to the second plate and the frame member so that the first plate and the capillary member are diffusion bonded.

By the relationship between the thickness of the frame member constituting the side wall of the container and the thickness of the capillary member, the degree of compression of the capillary member is controlled, and the degree of pressure absorbed by the capillary member is adjusted. Therefore, by setting the thickness of the frame member and the thickness of the capillary member appropriately, the desired pressure required for the diffusion bonding between the first plate and the capillary member can be obtained.

The said lamination | stacking process is the jig | tool which has the recessed part and the unit which has the said 1st board, the said capillary member, and the said 2nd board laminated | stacked so that the said capillary member may be sandwiched between the said 1st board and the said 2nd. The jig and the unit may be laminated so as to be fitted into the recess of the clad part. In this case, in the diffusion bonding step, pressure is applied to the jig and the unit in the stacking direction, so that the first plate and the second plate of the unit are diffusion bonded.

By appropriately setting the depth of the recessed portion of the jig and the thickness of the capillary member, the pressure required for the diffusion bonding between the first plate and the capillary member can be obtained without variation in the diffusion bonding step.

In the lamination step, the plurality of units and the plurality of jig parts may be laminated such that each jig part is laminated between each of the plurality of units each having the first plate, the capillary member, and the second plate. . In this case, in the diffusion bonding step, pressure is applied to the plurality of units and the plurality of jig parts in the stacking direction so that the first plate and the second plate of the plurality of units are diffusion bonded. .

A plurality of heat transportation devices are manufactured at once by applying pressure to the plurality of units and the plurality of jig units in the direction in which the plurality of units and the plurality of jig units are stacked. Thereby, manufacturing time is shortened.

The capillary member may include a first member and a second member.

The first member has a first spring constant and is diffusion bonded to the first plate.

The second member has a second spring constant that is greater than the first spring constant and is laminated to the first member.

Since the first member has a small spring constant and is easy to deform, the first member is surely compressed when the capillary member is compressed in the above diffusion bonding step, and is sufficiently diffusion bonded to the first plate by the stress. In the diffusion bonding step, the first member absorbs, for example, variations in the amount of deformation of the second member due to dimensional tolerances. Thereby, after the diffusion bonding process, the function of the capillary member regarding the performance of heat transportation is fully exhibited by the second member having a large spring constant and being hard to deform.

The diffusion bonding step includes diffusion bonding the first plate and the second plate such that the first plate and the capillary member are diffusion bonded, and the second plate and the capillary member are diffusion bonded. It may also include. In this case, the capillary member includes a third member, and the third member has a third spring constant that is smaller than the second spring constant, and is laminated on the second member to form the second member. It is diffusion bonded with the plate.

As the capillary member is diffusion bonded to the first and second plates, the inner space of the container of the heat transportation device is reinforced by the capillary member. At this time, the third member and the second plate having a small spring constant are diffusion-bonded, whereby the capillary member and the second plate are sufficiently diffusion-bonded.

According to another aspect of the present invention, there is provided a method of manufacturing a heat transportation device, wherein a capillary force is applied to the working fluid by bending a plate for constituting a container of the heat transportation device that transports heat using a phase change of the working fluid. The capillary member to be made is inserted at the first and second portions of the plate formed by the bending.

And the said container is formed by the diffusion bonding of the edge part of the said 1st site | part, and the edge part of a said 2nd site | part so that at least the said 1st site | part and said capillary member may be diffusion-bonded.

Thereby, since one board is bent and a container is formed, the number of parts can be reduced and cost can be reduced. Moreover, when a container is comprised by several components, the predetermined positioning precision of each of those components is needed, but in the present invention, such high positioning precision is not necessary.

A heat transportation device according to an aspect of the present invention includes a container having an inner surface, a working fluid, and a capillary member.

The working fluid is accommodated in the container and transports heat by phase change.

The capillary member includes a first member and a second member, and generates capillary force on the working fluid.

The first member has a first spring constant and is diffusion bonded to the inner surface.

The second member has a second spring constant that is greater than the first spring constant and is laminated to the first member.

A heat transportation device according to another aspect of the present invention includes a container having sidewalls, a working fluid, and a capillary member.

The container has a frame member constituting the side wall, and a first plate and a second plate joined to the frame member so as to sandwich the frame member.

The working fluid transports heat by phase change in the vessel.

The capillary member exerts capillary buoyancy on the working fluid.

In this heat transportation device, a container can be comprised by the component of a simple structure. In addition, since the volume of the internal space of the container is determined by the thickness of the frame member, by appropriately setting the thickness of the frame member, the volume of the internal space can be easily set.

As mentioned above, according to this invention, the manufacturing method of an inexpensive heat transportation device manufactured efficiently by a few process, and a heat transportation device are realized.

BRIEF DESCRIPTION OF THE DRAWINGS It is typical sectional drawing which shows the heat transportation device manufactured by the manufacturing method of the heat transportation device which concerns on 1st Embodiment.
FIG. 2 is a schematic exploded perspective view showing a heat transportation device manufactured by the method for manufacturing a heat transportation device according to the first embodiment. FIG.
3 is a view for explaining a method for manufacturing a heat transportation device according to the first embodiment.
4 is a schematic sectional view sequentially showing a method for manufacturing a heat transportation device according to the first embodiment.
Fig. 5 is a table showing the amount of crushing and the leak failure rate of the heat transportation device manufactured by the amount of crushing.
FIG. 6 is a view of the inner surface of the lower plate member of the heat transportation device manufactured by the first embodiment. FIG.
7 is a schematic sectional view sequentially illustrating a method for manufacturing a heat transportation device according to a second embodiment.
8 is a schematic cross-sectional view showing a heat transportation device manufactured by a method for manufacturing a heat transportation device according to a third embodiment.
FIG. 9 is a view of the inner surface of the lower plate member of the heat transportation device manufactured by the third embodiment. FIG.
10 is a view for explaining a method for manufacturing a heat transportation device using a jig.
11 is a schematic sectional view sequentially illustrating a method for manufacturing a heat transportation device according to a fourth embodiment.
12 is a schematic sectional view sequentially illustrating a method for manufacturing a heat transportation device according to a fifth embodiment.
Fig. 13 is a sectional view showing a heat transportation device in which a heat source is arranged on the side close to the gas phase side.
14 is a perspective view illustrating a heat transportation device according to a sixth embodiment.
FIG. 15 is a cross-sectional view between AA shown in FIG. 14. FIG.
16 is an exploded view of a plate member constituting a container of a heat transportation device according to a sixth embodiment.
FIG. 17 is a diagram showing a method for manufacturing a heat transportation device according to the sixth embodiment. FIG.
18 is an exploded view of a plate member for explaining a heat transportation device according to a modification.
19 is a perspective view illustrating a heat transportation device according to a seventh embodiment.
20 is a cross-sectional view taken along the line AA in FIG. 19.
21 is an exploded view of a plate member constituting a container of a heat transportation device according to a seventh embodiment.
The figure for demonstrating the manufacturing method of the heat transportation device which concerns on 8th Embodiment.
FIG. 23 is a schematic graph showing the relationship between the stress applied to each mesh member and the amount of deformation (amount crushed) due to the stress; FIG.
24 is a schematic sectional view sequentially illustrating a method for manufacturing a heat transportation device according to an eighth embodiment.
FIG. 25 is an enlarged view of the upper plate member, the joining mesh member, and the second mesh member shown in FIG. 24. FIG.
Fig. 26 is an enlarged view showing diffusion bonding between a capillary member and a top plate member, which are heard as a comparative example.
Fig. 27 is a schematic view showing mesh members in which the fine metal wires are woven in different ways, respectively.
FIG. 28 shows a modification of the capillary member shown in FIG. 22; FIG.
29 is a diagram for explaining a heat transportation device according to the ninth embodiment.
30 is an enlarged plan view of the injection hole and the injection path shown in FIG. 29;
FIG. 31 is a diagram for explaining a heat transportation device according to a tenth embodiment. FIG.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described based on drawing.

<1st embodiment>

[Configuration of Heat Transport Device]

FIG. 1: is a schematic cross section which shows the heat transportation device manufactured by the manufacturing method of the heat transportation device which concerns on the 1st Embodiment of this invention. 2 is an exploded perspective view thereof. 1 is a cross-sectional view in the longitudinal direction of the heat transportation device 100. Thereafter, the direction of the cross section is the same.

The heat transportation device 100 includes a container 4 and a capillary member 5 provided in the container 4. The container 4 is comprised by the lower board member 1, the frame member 2, and the upper board member 3. As shown in FIG. The frame member 2 constitutes a side wall in the container 4. In the container 4, a working fluid (not shown) that transports heat by phase change is enclosed, and a capillary member 5 is formed to apply a capillary force to the working fluid. The capillary member 5 includes a first mesh layer 6 and a second mesh layer 7 laminated on the first mesh layer 6. The second mesh layer 7 is made of a mesh whose eyes are thicker than the mesh included in the first mesh layer 6.

As the working fluid, pure water or ethanol is used.

Copper is typically used as the material of the lower plate member 1, the frame member 2 and the upper plate member 3 constituting the container 4. In addition, nickel, aluminum, stainless steel, etc. may be used, for example. The thickness of the lower board member 1 and the upper board member 3 is typically 0.1 mm to 0.8 mm. The width a of the frame member 2 is typically 2 mm.

The thickness of the frame member 2 is appropriately set in relation to the thickness of the capillary member 5 as described later. The material and numerical value etc. which are taken as a typical example here do not mean that it is limited to this, and it is the same also after that.

As shown in FIG. 2, the 1st mesh layer 6 and the 2nd mesh layer 7 have one mesh member 8 which has the net-shaped mesh by a fine metal wire, or Plural sheets are stacked and formed. The thickness of each mesh member 8 is typically 0.02 mm to 0.05 mm.

As the capillary member 5, a thing other than the mesh layer may be used. For example, a plurality of wires are bundled. The capillary force may be applied to the working fluid and may have any elasticity. In the present embodiment, two to five mesh members 8 are laminated as the first mesh layer 6, and one sheet is used as the second mesh layer 7 on the first mesh layer 6. The mesh member 8 is laminated | stacked. The plurality of mesh members 8 are laminated by, for example, soldering, bonding using an adhesive, plating, or the like.

When the heat transportation device 100 is not operated, the working fluid is mainly toward the first mesh layer 6 having the strong capillary force among the first mesh layer 6 and the second mesh layer 7. Pulled and held.

[Operation of the heat transportation device]

The operation of the heat transportation device 100 will be described. In the heat absorbing portion V (see FIG. 1) of the heat transportation device 100, for example, heat is received from a heat source 9 such as a circuit device, and the working fluid in the liquid phase evaporates. The working fluid in the gaseous phase moves inside the vessel 4 to the heat dissipation unit W, releases heat from the heat dissipation unit W, and condenses it. The working fluid which becomes a liquid in the heat dissipation unit W moves the vessel 4 to the heat absorbing unit V and receives heat from the heat source 9 and evaporates again. By repeating this cycle, the heat source 9 is cooled. In the heat transportation device 100 according to the present embodiment, the working fluid in the gaseous phase mainly moves through the second mesh layer 7. In addition, under the capillary force by the first mesh layer 6, the working fluid in the liquid phase moves.

In addition, in FIG. 1, the heat source 9 has shown the example arrange | positioned at the side near the liquid phase side of the heat-transport device 100, ie, the side near the 1st mesh layer 6. However, since the heat transportation device 100 is formed in a thin plate shape, as shown in FIG. 13, for example, the side near the gaseous side of the heat transportation device 100, that is, the second mesh layer 7 is shown. Even if it is arrange | positioned at the side near to) side, high heat transportation performance can be exhibited.

[Manufacturing Method of Heat Transfer Device 100]

3 is a view for explaining a method of manufacturing the heat transportation device 100. Here, the thickness of the first layer of mesh (6) and a second capillary member 5 is made of a mesh layer 7 of the stacked on the t _1. Further, the thickness of the lower plate member 1 and the top plate member 3 and the frame member (2) is diffusion bonding whereby the container 4 thickness, that is the frame member (2) of the inner space of which is composed of t _2. As shown in FIG. 3, when the thickness t ₁ of the capillary member 5 is compared with the thickness t ₂ of the frame member 2, the thickness t ₁ of the capillary member 5 is larger. . The difference between the thickness (t ₂₎ of the capillary member 5, the thickness (t ₁₎ and the frame member (2) of, typically a 0㎜ to 0.2㎜.

4 is a schematic cross-sectional view showing a manufacturing method of the heat transportation device 100 in sequence.

As shown in FIG. 4A, the inner surface side of the lower plate member 1 is the inner surface 11 of the lower plate member 1 of the lower plate member 1. The capillary member 5 is mounted on this inner surface 11.

As shown in FIG. 4B, the frame member 2 is placed on the inner surface 11 of the lower plate member 1, and the upper plate member 3 is placed on the capillary member 5. That is, the lower plate member 1, the capillary member 5, and the upper plate member 3 are laminated so that the capillary member 5 is sandwiched between the lower plate member 1 and the upper plate member 3.

The thickness (t ₁₎ to the thickness (t ₂₎ of the frame member (2) of the capillary member 5 as described above, the larger side of the thickness (t ₁₎ of the capillary member (5). Therefore, as shown in FIG. 4B, the upper plate member 3 is placed on the capillary member 5, and the upper plate member 3 and the frame member 2 are spaced apart. The surface of the upper plate member 3 on the inner space side of the container 4 is the inner surface 31 of the upper plate member 3, and the surface facing the upper plate member 3 of the frame member 2 is the opposite surface. It is set to (21). In addition, the space | interval of the inner surface 31 of the upper plate member 3, and the opposing surface 21 of the frame member 2 is set to G. FIG.

In this embodiment, since the difference between the capillary member 5, the thickness (t ₁₎ and the frame member (2) the thickness (t ₂₎ of a 0㎜ to 0.2㎜, the inner surface of the top plate member (3) 31 And the distance G between the opposing surface 21 of the frame member 2 is in the range of 0 mm to 0.2 mm. Since the upper plate member 3 and the frame member 2 are diffusion bonded, the gap G is pressed and crushed by the pressure required for the diffusion bonding. Thereafter, the interval G is referred to as the amount G to be crushed.

As shown in FIG. 4C, the pressure P is applied from the upper plate member 3 side, so that the lower plate member 1, the frame member 2, and the upper plate member 3 and the frame member 2. ) Is diffusion bonded. At this time, the capillary member 5 is compressed by the amount G pressed. Since the capillary member 5 has elasticity, a part of the pressure P is absorbed, and a pressure P 'smaller than the pressure P is applied to the lower plate member 1 from the capillary member 5. . By this pressure P ', the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded.

For example, the lower plate member 1 and the frame member 2, and the upper plate member 3 and the frame member 2 have a high bonding force in order to prevent leak defects in which the airtightness in the container 4 is broken by a small hole or the like. Diffusion bonding under pressure P). The lower plate member 1 and the first mesh layer 6 are diffusion-bonded at a suitable pressure (pressure P ') in which capillary forces properly act on the working fluid.

In addition, due to the reaction of the pressure P ', a pressure P " smaller than the pressure P is applied to the upper plate member 3 from the compressed capillary member 5. This pressure P " The inner surface 31 and the capillary member 5 are diffusion bonded. In this embodiment, although the pressure P is added from the upper plate member 3 side, the pressure P may be added from the lower plate member 1 side.

By pressing when the tree is distorted amount (G) is 0㎜ is, the difference between the thickness of the capillary member (t ₁₎ to the thickness (t ₂₎ of the frame member 2, and the 0㎜, is that t ₁ = t _2. However, even when the amount G pressed is 0 mm, the upper plate member 3 placed on the capillary member 5 in FIG. 4B is attached to the capillary member 5 and the frame member 2. Wit In FIG. 4C, since the diffusion bonding step is performed in a high temperature state, the upper plate member 3 also becomes high temperature and slightly deforms. By this deformation, the capillary member 5 is compressed.

FIG. 5 is a table showing the leak failure rate of the heat transportation device 100 manufactured in the amount G pressed and the amount G pressed. As shown in the table of FIG. 5, the leak defective rate of 0% was confirmed in the range of 0 to 0.10 mm of pressing amount G, for example.

FIG. 6A is a photograph of the inner surface 11 of the lower plate member 1 of the heat transportation device 100 manufactured by pressing the amount G to be 0.10 mm. In the same manner as in FIG. 6B, this is the inner surface 11 of the lower plate member 1 of the heat transportation device 100 manufactured by pressing amount G to be 0 mm.

6 (A) and (B), in the inner surface 11 of the lower plate member 1, the recesses arranged at substantially equal intervals are seen (K surrounded by circles). This dent is a dent caused by diffusion bonding between the inner surface 11 of the lower plate member 1 and the first mesh layer 6. That is, in the range of 0 mm-0.10 mm of crushing, in the diffusion bonding process of FIG. 4C, the inner surface 11 and the 1st mesh layer 6 of the lower board member 1 reliably diffuse. It can be seen that it is bonded.

As mentioned above, in the manufacturing method of the heat transportation device 100 which concerns on this embodiment, in order to comprise the container 4 of the heat transportation device 100, the lower board member 1, the frame member 2, and the frame member (2) and the upper plate member 3 are diffusion bonded. In this diffusion bonding step, the lower plate member 1 and the capillary member 5 laminated so as to be sandwiched between the lower plate member 1 and the upper plate member 3 are diffusion bonded. Therefore, since a plurality of diffusion bondings are performed in the same process, a method for producing an inexpensive heat transportation device that is efficiently manufactured by a small number of processes is realized.

When a plurality of diffusion bondings are performed in different processes, the heat transportation device is exposed to a high temperature state for each diffusion bonding. This causes a decrease in yield in the manufacture of the heat transportation device. For example, after the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion bonded (diffusion bonding α), in another step, the lower plate member 1 and the frame member 2 and the frame member (2) and the top plate member 3 are diffusion-bonded, and the container 4 is comprised (diffusion bonding (beta)). In this case, since the lower plate member 1, the frame member 2 and the upper plate member 3 are exposed to high temperature once in the diffusion bonding α, a small hole is opened in the container 4 formed by the diffusion bonding β. This happens a lot. However, in the manufacturing method of the heat transportation device 100 which concerns on this embodiment, the fall of the yield as mentioned above can be prevented and cost can be held down.

Moreover, the degree to which the capillary member 5 is compressed is controlled by the relationship between the thickness t ₂ of the frame member 2 constituting the side wall of the container 4 and the thickness t _{1 of the} capillary member 5. The portion of the pressure P absorbed by the capillary member 5 is adjusted. Therefore, by appropriately setting the thickness t ₂ of the frame member 2 and the thickness t ₁ of the capillary member 5, the diffusion bonding between the inner surface 11 of the lower plate member 1 and the capillary member 5 is performed. The desired pressure P 'can be obtained.

<2nd embodiment>

A second embodiment of the present invention will be described. In the following description, the description of the same parts as the configuration and operation in the manufacturing method of the heat transportation device 100 described in the first embodiment will be omitted or simplified.

[Configuration of Heat Transport Device]

FIG. 7: is a schematic cross section which shows the manufacturing method of the heat transportation device which concerns on 2nd Embodiment of this invention in order. The heat transportation device 200 has the upper plate member 203 in place of the upper plate member 3 and the frame member 2 in the heat transportation device 100 according to the first embodiment. The upper plate member 203 and the lower plate member 1 constitute a container 204 of the heat transportation device 200.

The upper plate member 203 has a vessel shape, an upper plate portion 203a mounted on the capillary member 5, side wall portions 203b constituting the sidewall of the container 204, and a lower plate member 1. And a junction portion 203c to be diffusion bonded.

When the height (referred to as the height of the later, the side wall portion (203b)) of the side wall portion (203b) on the inner space side of the container 204 to t _3, the thickness of the inner space of the container 204 is to t ₃ . Comparing the thickness (t ₁₎ of the height (t _3), and a capillary member (5) of the side wall portion (203b), a greater thickness (t ₁₎ side of the capillary member (5).

[Manufacturing Method of Heat Transport Device 200]

As shown in FIG. 7A, the capillary member 5 is placed on the inner surface 11 of the lower plate member 1.

As shown in FIG. 7B, the upper plate member 203 is placed on the capillary member 5. Since the thickness t ₁ of the capillary member 5 is larger than the height t ₃ of the side wall portion 203b, the upper plate member 203 is placed on the capillary member 5, and the upper plate member 203 is provided. ) And the lower plate member 1 are spaced apart. The surface opposing the lower plate member 1 at the joint portion 203c of the upper plate member 203 is the opposing surface 231, and the gap between the opposing surface 231 and the inner surface 11 of the lower plate member 1. Press to set the amount of crushing.

As shown in FIG. 7C, the pressure P is applied from the upper plate member 203 side to diffusely join the lower plate member 1 and the upper plate member 203. At this time, the capillary member 5 is compressed by the amount G to be pressed and a part of the pressure P is absorbed. A pressure P 'smaller than the pressure P from the capillary member 5 is applied to the lower plate member 1, and the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded by this pressure P'. .

From the above, in the manufacturing method of the heat transport device 200 according to this embodiment, by appropriately setting the thickness (t ₁₎ of the height (t ₃₎ and the capillary member 5 of the side wall portion (203b), the first The same effect as the manufacturing method of the heat transportation device 100 which concerns on this embodiment can be acquired. Moreover, the cost in manufacture of the heat transportation device 200 can be suppressed by manufacturing the upper plate member 203 using die processing, such as press working or casting. In addition, since the upper plate member 203 has the joining portion 203c, the joining area of the upper plate member 203 and the lower plate member 1 can be sufficiently taken. Thereby, the airtightness of the container 204 formed by diffusion bonding of the upper board member 203 and the lower board member 1 becomes high.

<Third embodiment>

FIG. 8: is a schematic cross section which shows the heat transportation device manufactured by the manufacturing method of the heat transportation device which concerns on 3rd Embodiment. 8 is a cross-sectional view of the short side direction of the heat transportation device 300. In addition, in the following description, the capillary member 5 is simplified and shown.

The heat transportation device 300 has the upper plate member 303 in place of the upper plate member 203 in the heat transportation device 200 according to the second embodiment. The upper plate member 303 and the lower plate member 1 constitute a container 304 of the heat transportation device 300.

The top plate member 303 has a top plate portion 303a, side wall portions 303b, and a junction portion 303c, similar to the top plate member 203 of the heat transportation device 200 according to the second embodiment. . The upper plate portion 303a differs from the upper plate member 203 in that the upper plate portion 303a has the protruding portion 313.

The protrusion 313 protrudes toward the inner space side of the container 304 of the heat transportation device 300. The protruding portion 313 has an elongated shape along the longitudinal direction of the heat transportation device 300, and is provided in the upper plate portion 303a of the upper plate member 303.

At the time of manufacture of the heat transportation device 300 of this embodiment, the capillary member 5 is compressed and pressed by the protrusion part 313, and is crushed, and the upper plate member 303 and the lower plate member 1 spread | diffused. Are bonded. In addition, by this diffusion bonding step, the capillary member 5 and the lower plate member 1 are diffusion bonded.

9 is a photograph of the inner surface 11 of the lower plate member 1 of the heat transportation device 300 manufactured according to the present embodiment.

The capillary member 5 is compressed by the protrusion 313. Diffusion bonding between the inner surface 11 of the lower plate member 1 and the capillary member 5 centered on an area on the inner surface 11 of the lower plate member 1 corresponding to the compressed portion (area enclosed by a broken circle). You can see the dent by the K (circle encirclement). In this embodiment, two projection parts 313 are provided along the longitudinal direction of the heat transportation device 300. As shown in FIG. 9, two indentations arranged at approximately equal intervals on the inner surface 11 can be confirmed (L1 and L2).

As mentioned above, in the heat transportation device 300 which concerns on this embodiment, since the upper board member 303 has the projection part 313, the internal space of the container 304 can be reinforced by this projection part 313. FIG. In addition, the capillary member 5 can be compressed with certainty. Further, the protrusion 313 allows the capillary member 5 to be compressed even in a range in which the thickness t ₁ of the capillary member 5 is smaller than the thickness of the inner space of the container 304. For example, a desired design can be provided in which the capillary member 5 is provided in the flow path of the working fluid in the liquid phase and not in the flow path of the working fluid in the gas phase (see FIG. 8).

In addition, the protrusion part 313 can be formed by die processing or etching techniques, such as reactive ion etching (RIE), for example, and can suppress the cost in manufacture of the heat transportation device 300. FIG.

In this embodiment, although the protrusion part 313 has a long shape along the longitudinal direction of the heat transportation device 300, it is not limited to this. A desired number of projections 313 may be provided at a desired position of the upper plate portion 303a. As a result, for example, the volume of the flow path of the working fluid in the gas phase becomes large, and the effect of raising the heat transportation efficiency of the heat transportation device 300 can be realized.

<4th embodiment>

It is a figure for demonstrating the manufacturing method of the heat transportation device using a jig | tool.

The heat transportation device 400 is substantially the same as the heat transportation device 200 according to the second embodiment. The side wall portion 403b of the upper plate member 403 having a Vessel shape is inclined with respect to the thickness direction of the container 404, which is different from the configuration of the heat transportation device 200. In this embodiment, the upper plate part 403a, the side wall part 403b, and the junction part 403c of the upper plate member 403 have substantially the same thickness.

The heat transportation device unit 450 is constituted by the upper plate member 403, the lower plate member 1, and the capillary member 5 sandwiched therein.

The jig 600 has a mounting surface 610 on which the upper plate member 403 of the heat transportation device unit 450 is placed. The mounting surface 610 of the jig part 600 has a lower end surface 610a on which the upper plate part 403a of the upper plate member 403 is placed, and an upper end surface on which the junction part 403c is placed. 610b. The lower end surface 610a and the upper end surface 610b are connected through a step | step, and the recess, the jig | tool part 600 is formed by this step | step, the lower end surface 610a, and the upper end surface 610b.

The height from the lower surface 610a to the upper surface 610b, which is the depth of the recessed portion of the jig 600, is t ₄ . Comparing the height t ₄ and the thickness t _{1 of the} capillary member 5, the thickness t ₁ of the capillary member 5 is larger from 0 mm to 0.2 mm.

As a material of the jig | tool part 600, carbon or stainless steel is used typically.

[Manufacturing Method of Heat Transport Device 400]

11 is a schematic sectional view sequentially showing a method for manufacturing the heat transportation device 400.

As illustrated in FIG. 11A, the upper plate member 403, the capillary member 5, and the lower plate member 1 are sequentially stacked on the mounting surface 610 of the jig 600. A pressing force G is provided between the junction portion 403c of the upper plate member 403 and the lower plate member 1. The amount G to be crushed is obtained by adding the height t ₄ and the thickness of the joint 403c (height X), the thickness t ₁ of the capillary member 5, and the top plate 403a. It is difference with thickness (height Y).

In this embodiment, the upper plate part 403a and the junction part 403c become almost the same thickness. Therefore, the amount of crushing G is substantially equal to the difference between the height t ₄ and the thickness t ₁ of the capillary member 5.

As shown in FIG. 11B, the upper plate member 403 and the lower plate member 1 of the heat transportation device unit 450 in the direction in which the heat transportation device unit 450 and the jig part 600 are stacked. The pressure P required for diffusion bonding with is applied. At this time, the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded by the pressure P ″ applied to the lower plate member 1 from the elastic capillary member 5.

For example, when a plurality of top plate members 403 are formed by mold processing or the like, when the heights of the side wall portions 403b of the plurality of top plate members 403 are not even and are disturbed due to an error in formation. I think.

However, in the present embodiment, the bonding portion 403c of the upper plate member 403 is diffusion-bonded with the lower plate member 1 while being pressed against the upper end surface 610b of the jig 600. Therefore, by the difference between the thickness (t ₁₎ of each side wall portion, the height, regardless of the variation in the height (t ₄₎ of (403b) and a capillary member (5), press the tree distorted amount (G) is appointed. As a result, in the diffusion bonding step shown in FIG. 11B, since the capillary member 5 is compressed by the amount G to be pressed without deviating, the diffusion between the lower plate member 1 and the capillary member 5 is performed. The pressure P "required for the joining can be obtained without variation.

In this embodiment, although the top board part 403a and the junction part 403c of the top board member 403 become substantially the same thickness, it is not limited to this. Based on the shape of the upper plate member 403, the height t ₄ and the thickness t ₁ of the capillary member 5 can be appropriately set, and a desired amount of crushing G can be provided.

<Fifth embodiment>

It is typical sectional drawing which shows the manufacturing method of the heat transportation device using several jig in order. The jig part 700 and the heat transportation device 500 are substantially the same as the jig part 600 and the heat transportation device 400 which concern on 4th Embodiment.

As shown in FIG. 12A, the upper plate member 503, the capillary member 5, and the lower plate member 1 are sequentially stacked on the mounting surface 710 of the jig part 700. Moreover, the jig | tool part 700 is laminated | stacked on the lower plate member 1, and on the mounting surface 710 of the jig | tool part 700, the upper plate member 503, the capillary member 5, and the lower plate member 1 ) Are stacked one by one. In this manner, the plurality of heat transportation device units 550 and the plurality of jig parts 700 are stacked. The amount G which presses and crushes is provided between the junction part 503c of the upper board member 503 and the lower board member 1 of each heat transportation device unit 550.

As shown in FIG. 12B, in the direction in which the plurality of heat transportation device units 550 and the plurality of jig parts 700 are stacked, the upper plate member 503 of each heat transportation device unit 550 and The pressure P required for the diffusion bonding with the lower plate member 1 is applied. At this time, the inner surface 11 of the lower plate member 1 and the capillary member 5 are diffusion-bonded by the pressure P ″ applied to the lower plate member 1 from the elastic capillary member 5.

As described above, in the manufacturing method of the heat transportation device 500 of the present embodiment, the plurality of heat transportation device units 550 in the direction in which the plurality of heat transportation device units 550 and the plurality of jig parts 700 are stacked. ) And a plurality of jig 700, a plurality of heat transportation device 500 is manufactured at once. That is, the batch processing in manufacture of the heat transportation device 500 becomes possible.

Since diffusion bonding is performed under a large load in a vacuum environment, the cost of one diffusion bonding step is large. In addition, since the diffusion bonding step includes a process in which the heat transportation device is cooled in a vacuum environment as it is after the container of the heat transportation device is bonded in a high temperature state, the time spent is also large. However, according to the manufacturing method of the heat transportation device 500 in this embodiment, since the said batch process is possible, cost is suppressed and manufacturing time is also shortened. Thereby, a more efficient and inexpensive manufacturing method of the heat transportation device is realized.

<6th embodiment>

Next, a sixth embodiment of the present invention will be described.

In each said embodiment, it demonstrated as a container formed from an upper board member, a lower board member, etc. On the other hand, in 6th Embodiment, a container is formed by bending one board member. Therefore, it demonstrates centering on the point.

14 is a perspective view illustrating a heat transportation device according to a sixth embodiment. FIG. 15 is a cross-sectional view taken along the line A-A shown in FIG. 14. It is a developed view of the plate member which comprises the container of a heat transportation device.

As shown in FIG. 14, the heat transportation device 110 includes a container 51 having a rectangular thin plate shape that is elongated in one direction (Y-axis direction). This container 51 is formed by bending one plate member 52.

The plate member 52 is typically comprised of oxygen free copper, tough pitch copper, or a copper alloy. However, the present invention is not limited to this, and the plate member 52 may be made of a metal other than copper, and a material having high thermal conductivity may be used.

As shown to FIG. 14 and FIG. 15, the container 51 has the shape which the side part 51c in the direction along the longitudinal direction (Y-axis direction) curved. That is, since the board | substrate 51 is formed by bending the board member 52 shown in FIG. 16 in the outline center of the board member 52, the side part 51c is curved shape. Hereinafter, the side part 51c may be called the curved part 51c.

The container 51 has the junction part 53 in the side part 51d on the opposite side to the side part 51c (curve part 51c), and the side parts 51e and 51f in the direction along a short side direction. The junction part 53 is provided so that it may protrude from each side part 51d, 51e, 51f. At this junction part 53, the bent plate member 52 is joined. The junction part 53 corresponds to the junction region 52a (region shown with diagonal line) of the board member 52 shown in FIG. The joining area 52a becomes an area within the range of the predetermined distance d from the edge portion 52b of the plate member 52.

The capillary member 5 is provided inside the container 51. The capillary member 5 includes one or a plurality of mesh members 8 as described above. The thickness of the capillary member 5 can be set to about the thickness of the internal space of the container 51 (it may be slightly larger or smaller than the thickness of the internal space).

[Manufacturing Method of Heat Transport Device 110]

It is a figure which shows the manufacturing method of a heat transportation device.

As shown to FIG. 17 (A), the board member 52 is prepared first. And the board member 52 is bent in the outline center of the board member 52.

When the plate member 52 is bent to a predetermined angle, as shown in FIG. 17B, the capillary member 5 is inserted between the bent plate members 52. The capillary member 5 may be disposed at a predetermined position on the plate member 52 before the bending of the plate member 52 starts.

When the capillary member 5 is inserted between the plate members 52, as shown in FIG. 17C, the plate member 52 is further bent to sandwich the capillary member 5. And since the joining part 53 (bonding area | region 52a) of the curved board member 52 is joined by diffusion bonding, the capillary member 5 is the upper board part 52c of the board member 52, and the lower board part 52d. Is bonded by diffusion bonding.

In the case of this heat transportation device 110, since the container 51 is formed by one plate member 52, the number of parts can be reduced and the cost can be reduced. In addition, when the container 51 is formed from two or more members, it is necessary to match the position of these members, but in this embodiment, it is not necessary to match the position of a member. Therefore, the heat transportation device 110 can be easily manufactured.

[Modification]

FIG. 18: is a figure for demonstrating the modification of the said heat transportation device 110, and is a developed view of a plate member.

As shown in FIG. 18, the plate member 52 has a groove 54 at the center of the plate member 52 along the longitudinal direction (Y-axis direction). The groove 54 is formed by, for example, pressing or etching, but the method of forming the groove 54 is not particularly limited.

By providing the groove 54 in the plate member 52, the plate member 52 can be easily bent. Thereby, the heat transportation device 110 can be manufactured more easily. Moreover, although the board member 52 showed the structure which bends in the longitudinal direction (with Y-axis as an axis), you may make it bend by the short side (width direction) (with the X-axis as an axis).

<7th embodiment>

Next, a seventh embodiment of the present invention will be described. In addition, in 7th Embodiment, it demonstrates centering around a different point from 6th Embodiment mentioned above.

19 is a perspective view illustrating a heat transportation device according to a seventh embodiment. 20 is a cross-sectional view taken along the line A-A shown in FIG. 19. 21 is a developed view of a plate member constituting the container of the heat transportation device.

As shown to FIG. 19 and FIG. 20, the heat transportation device 120 is equipped with the container 61 which has a rectangular thin plate shape long in one direction (Y-axis direction).

This container 61 is formed with the plate member 62 shown in FIG. 21 folded back from the center. The plate member 62 is provided with two openings 65 in the center of the plate member 62 along the longitudinal direction of the plate member 62. As the opening 65 is provided in this way, the plate on the left side and the plate on the right side of the plate member 62 have a shape that is connected in three regions 66.

The container 61 is joined to the side portions 61c and 61d in the direction along the longitudinal direction (Y axis direction) and the side portions 61e and 61f in the direction along the short side direction (x axis direction). Have In this joining portion 63, the upper plate and the lower plate are joined by diffusion bonding, and the container 61 is formed. The junction part 63 is corresponded to the junction area | region 62a, 62b shown with the diagonal line of the board member 62 shown in FIG.

As a result of joining the upper plate and the lower plate in this manner, three protrusions 64 protruding from the side portion 61c are formed.

In the heat transportation device 120, since the opening 65 is provided in the plate member 62, the plate member 62 can be easily bent. Thereby, the heat transportation device 120 can be manufactured more easily.

In the region 66 between the opening 65 and the edge 62c of the plate member 62 and the region 66 between the two openings 65, grooves formed by press working are provided, for example. You may be. Thereby, the board member 62 can be bent more easily.

<Eighth embodiment>

[Configuration of Heat Transport Device]

It is a figure for demonstrating the manufacturing method of the heat transportation device which concerns on 8th Embodiment of this invention. The heat transportation device 800 according to the present embodiment has a capillary member 805 whose thickness is t ₁ in place of the capillary member 5 in the heat transportation device 200 according to the second embodiment. will be.

The capillary member 805 includes a first mesh member 860, a second mesh member 870 laminated on the first mesh member 860, and a junction laminated on the second mesh member 870. And a dragon mesh member 850. In the heat transportation device 800 according to the present embodiment, the gaseous working fluid mainly moves through the first mesh member 860, and the liquid working fluid mainly passes through the second mesh member 870. Move.

When the spring constant of the second mesh member 870 and the spring constant of the joining mesh member 850 are compared, the spring constant of the second mesh member 870 is larger. The spring constant of the first mesh member 860 is also set larger than the spring constant of the joining mesh member 850. The spring constant of the first mesh member 860 and the spring constant of the second mesh member 870 may be the same or different. However, when the spring constants of the first mesh member 860 and the second mesh member 870 are different, the difference is the spring constant of the second mesh member 870 and the joining mesh member 850. It's small compared to the car. In this embodiment, the spring constant of the 1st mesh member 860 and the spring constant of the 2nd mesh member 870 shall be made substantially equivalent.

Here, the spring constant will be described. The spring constant described in description of this embodiment is a spring constant regarding the thickness direction of each mesh member. Fig. 23 shows the stresses and their stresses when stress is applied to the joining mesh member 850 having different spring constants, the first mesh member 860 and the second mesh member 870 in the thickness direction. It is a typical graph which shows the relationship with the deformation | transformation amount (the amount which is crushed) in the thickness direction by this.

In the graph shown in FIG. 23, the relationship between the stress and deformation amount with respect to the joining mesh member 850 with a small spring constant is shown with the broken line. On the other hand, the relationship between the stress and the deformation amount with respect to the 1st mesh member 860 and the 2nd mesh member 870 which has a large spring constant is shown by the solid line. As shown in the graph as “difference in deformation amount”, when the same stress σ is applied to the joining mesh member 850, the first mesh member 860, and the second mesh member 870. Is larger in the deformation amount of the joining mesh member 850. In other words, the joining mesh member 850 having a smaller spring constant is easier to deform than the first mesh member 860 and the second mesh member 870 having a large spring constant.

The spring constant and the shape of the mesh member will be described. In the mesh member which is woven of a plurality of fine metal wires, the spring constant is larger in the thickness (diameter) of the fine metal wire is larger when the mesh size of the fine metal wire is the same. When the metal thin wires have the same diameter, the smaller the mesh is, the larger the spring constant is. In this way, by appropriately setting the size and diameter of the mesh of the fine metal wire to be woven, a mesh member having a desired spring constant can be obtained. In addition, the spring constant of a mesh member may be set suitably by setting the material of the metal fine wire used etc. suitably.

In the present embodiment, the mesh member 850 for joining having a small spring constant has a metal mesh wire mesh of which the size of the mesh metal wire is woven as the first mesh member 860 and the second mesh member 870. Smaller than However, in the joining mesh member 850, a metal fine wire having a diameter smaller than the metal fine wire used for the first mesh member 860 and the second mesh member 870 is used. Thereby, the spring constant of the joining mesh member 850 is set smaller than the 1st mesh member 860 and the 2nd mesh member 870.

[Manufacturing Method of Heat Transport Device 800]

As shown in FIG. 24A, the first mesh member 860 of the capillary member 805 is mounted on the inner surface 11 of the lower plate member 1. In addition, the upper plate member 203 is placed on the joining mesh member 850 of the capillary member 805. Between the lower plate member 1 and the upper plate member 203, a pressing amount G is provided.

As shown in FIG. 24B, the pressure P is applied from the upper plate member 203 side, and the lower plate member 1 and the upper plate member 203 are diffusion bonded. At this time, the capillary member 805, the lower plate member 1, and the upper plate member 203 are each diffusion-bonded by the pressures P ′ and P ″ from the capillary member 805 compressed by the amount G that is pressed and crushed. do.

The diffusion bonding of the capillary member 805 and the upper plate member 203 in the diffusion bonding step shown in FIG. 24B will be described in detail. FIG. 25 is an enlarged view of the upper plate member 203, the joining mesh member 850, and the second mesh member 870 illustrated in FIG. 24. FIG. 26 is an enlarged view showing the diffusion bonding between the capillary member 895 and the upper plate member 203 as a comparative example. In the capillary member 895, the joining mesh member 850 is not laminated on the second mesh member 870. Thus, in FIG. 26, the upper plate member 203 and the second mesh member 870 are enlarged. In the following description, the second mesh member 870 of the capillary member 895 will be described as the second mesh member 870 '.

FIG. 25 shows a plurality of fine metal wires 855 woven as the bonding mesh member 850 and a plurality of fine metal wires 875 (875a and 875b) woven as the second mesh member 870. The fine metal wires 855 and 875 are woven in the X direction shown in FIG. 25. Similarly, also in FIG. 26, a plurality of fine metal wires 875 '(875a' and 875b ') are woven as the second mesh member 870'. In FIGS. 25 and 26, the fine metal wires woven into the fine metal wires 855, 875, and 875 ′ in a direction different from the X direction are omitted.

In FIG. 25A, the bonding mesh member 850 and the second mesh member 870 before diffusion bonding to the upper plate member 203 are illustrated. As illustrated in FIG. 25A, each of the fine metal wires 855 and 875 to be woven is placed at a dimensional tolerance at a position in the thickness direction (Z direction shown in FIG. 25) of the heat transportation device 800. There is a deviation. Similarly, the fine metal wires 875 'of the second mesh member 870' also have variations due to dimensional tolerances.

When the second mesh member 870 'having the aforementioned deviation is diffusion-bonded with the upper plate member 203, as shown in Fig. 26A, the thin metal wire 875a' is formed with the upper plate member 203. Although diffusion bonded, the metal thin wire 875b 'is not diffusion bonded with the upper plate member 203. In this state, the diffusion bonding of the capillary member 895 and the upper plate member 203 is not sufficient.

In the case where the pressure is increased in the diffusion bonding step in order to diffuse-bond the metal thin wire 875b 'to the upper plate member 203, as shown in FIG. 875b '), it deforms greatly. If such a difference in the amount of deformation of the fine metal wires 875a 'and 875b' occurs, there is a possibility that a function relating to the performance of heat transport, such as generating a capillary force in the working fluid in the liquid state, may not be sufficiently exhibited.

On the other hand, when the capillary member 805 according to the present embodiment having the joining mesh member 850 is diffusion-bonded with the upper plate member 203, as shown in FIG. 25B, the joining mesh member ( 850 and the second mesh member 870 are diffusion bonded to the top member 203. The joining mesh member 850 having a small spring constant is sufficiently deformed in the diffusion bonding step and sufficiently diffusion bonded to the upper plate member 203. In the second mesh member 870 having a large spring constant and difficult to deform, the fine metal wire 875a is diffusion-bonded with the upper plate member 203. The thin metal wire 875b is not diffusion-bonded with the upper plate member 203 but is diffusion-bonded with the metal thin wire 855.

As described above, in the present embodiment, the joining mesh member 850 having a small spring constant is sufficiently compressed in the diffusion bonding step, and is sufficiently diffusion bonded to the upper plate member 203 by the stress. In addition, the bonding mesh member 850 can absorb the variation in the amount of deformation due to the dimensional tolerance of the second mesh member 870. Therefore, as shown in FIG. 25B, the metal thin wire 875a diffusion-bonded to the upper plate member 203 can be prevented from being greatly deformed compared to the metal thin wire 875b. Thereby, while the 2nd mesh member 870 is fully bonded to the upper board member 203, it can fully exhibit the function regarding the performance of heat transfer mentioned above. For example, when making the heat transportation device 800 correspond to high heat flux density, the effect becomes large in this embodiment.

In this embodiment, the dimension tolerance of the 2nd mesh member 870 was demonstrated. However, for example, variations in the deformation amount of the second mesh member 870 due to variations in the thickness of the upper plate member 203 and the height of the side wall portion 203b (t ₃ shown in FIG. 22) and the like. It is also thought to occur. Also in these cases, the variation of the deformation amount of the second mesh member 870 is absorbed by the joining mesh member 850.

FIG. 27: (A) and (B) are typical diagrams which respectively show the mesh members from which the metal thin wire | line is woven. 27A and 27B, mesh members M and N, in which the same thin metal wires are woven in the same mesh size, are respectively shown. The mesh member M shown in FIG. 27A is formed such that its thickness m is almost three times the diameter r of the fine metal wire. The mesh member N shown in FIG. 27B is formed such that its thickness n is almost twice the diameter r of the fine metal wire. That is, since the mesh member N is woven more tightly than the mesh member M in the thickness direction (Z direction shown in FIG. 27) of the mesh member M, the mesh member N is the mesh member ( The spring constant is larger than M). In this manner, the spring constant may be appropriately set by the manner in which the fine metal wires are woven.

In the capillary member 805 of the present embodiment, mesh members are stacked. However, as described in the first embodiment, as long as the capillary force is applied to the working fluid and has a predetermined elasticity, any one may be used. As such a thing, what was mentioned above, the thing formed in the shape of a foot, the lattice shape, the groove | channel, etc. by the etching technique is mentioned, for example. As the capillary member, one having a sintered structure of metal powder may be used. In this case, when the member which spring constant is small and it is easy to deform is arrange | positioned at the side joined to the upper plate member of a capillary member, the effect similar to this embodiment can be acquired. In addition, what was heard above can be used also as a capillary member in each embodiment of this invention.

[Modification]

28 is a diagram illustrating a modification of the capillary member 805. In this capillary member 805, the joining mesh member 840 is laminated on the side opposite to the side on which the second mesh member 870 of the first mesh member 860 is laminated. The spring constant of the joining mesh member 840 is smaller than the spring constant of the first mesh member 860. That is, the bonding mesh member 840 is easy to deform compared with the first mesh member 860.

The capillary member 805 is diffusion-bonded to the upper plate member 203 and the lower plate member 1, respectively, to reinforce the internal space of the container 204 of the heat transportation device 800. At this time, the joining mesh member 840 and the lower plate member 1 laminated on the first mesh member 860 are diffusion-bonded, whereby the capillary member 805 and the lower plate member 1 are sufficiently diffusion-bonded.

The first mesh member 860 is a member that serves as a flow path for the working fluid in the gas phase. Therefore, if the first mesh member 860 is greatly deformed in the diffusion bonding step, there is a possibility that the flow path resistance when the working fluid in the gas phase moves increases. In addition, since the first mesh member 860 is greatly deformed, the pressure loss when the working fluid circulates in the container 204 of the heat transportation device 800 may increase. However, by using the first mesh member 860 having a large spring constant and hardly deforming, it is possible to prevent the above problem from occurring.

<Ninth Embodiment>

It is a figure for demonstrating the heat transportation device which concerns on 9th Embodiment of this invention. The heat transportation device 900 according to the present embodiment includes an injection hole described below in the inner surface 11 of the lower plate member 1 in the heat transportation device 100 according to the first embodiment. 900a and an injection path 900b are formed.

The injection port 900a and the injection path 900b are formed for injecting a working fluid into the container 4 in the manufacturing process of the heat transportation device 900. The injection hole 900a and the injection path 900b are end portions in the longitudinal direction (the X direction shown in FIG. 29) of the lower plate member 1, and are in the region diffusion-bonded with the frame member 2 on the inner surface 11. Is formed.

30 is an enlarged plan view of the injection hole 900a and the injection path 900b. The injection port 900a is formed to penetrate the lower plate member 1. The injection path 900b is a groove formed on the inner surface 11 so as to communicate with the injection port 900a, and communicates with the inside of the container 4 at the end opposite to the side where the injection port 900a is provided. As shown in FIG. 30, the injection path 900b is formed in L shape, for example.

The injection passage 900b may be formed by, for example, end mill processing, laser processing, press processing, or fine processing such as photolithography and half etching in semiconductor manufacturing. According to the press working, there is a feature that burrs do not come out. In the case of laser processing and end mill processing, a mold is unnecessary and a free-shaped groove can be formed.

The injection port 900a and the injection path 900b are sealed by, for example, caulking after the working fluid is injected into the container 4 in the manufacturing process of the heat transportation device 900.

<10th embodiment>

It is a figure for demonstrating the heat transportation device which concerns on 10th Embodiment of this invention. In the heat transportation device 900 shown in FIG. 29, injection holes 900a and 900b are formed in the lower plate member 1. In the heat transportation device 910 according to the present embodiment, as shown in FIG. 30, an injection hole 910a is formed in the upper plate member 3, and a groove that becomes the injection path 910b in the frame member 2 is formed. Formed.

The injection port 910a is formed to penetrate the upper plate member 3 at an end portion in the longitudinal direction (the X direction shown in FIG. 30) of the upper plate member 3. The injection passage 910b is formed in the region where the frame member 2 is diffusion-bonded with the upper plate member 3. The injection path 910b is formed to communicate with the injection port 910a, and an end portion on the opposite side of the side communicating with the injection port 910a of the injection path 910b communicates with the inside of the container 4. In the present embodiment, the injection hole 910a is formed in the upper plate member 3, but the injection hole 910a is formed in the lower plate member 1, and the injection passage 910b is formed in the frame member 2 by the lower plate member 1. It may be formed in the region to be diffusion bonded with.

If the injection path 910b is formed in the frame member 2 by, for example, pressing, convexity is formed on the surface of the frame member 2 on the side opposite to the side where the injection path 910b is formed. It becomes. In that case, the frame member 2 and the lower plate member 1 cannot be joined. Therefore, in the present embodiment, the injection passage 910b may be formed by laser processing or end mill processing.

In each embodiment of the present invention described above, wire discharge machining (wire cut) may be used for processing or cutting the upper plate member, the lower plate member, the frame member, or the capillary member. Wire discharge processing is a processing method which processes a member by applying a voltage to wires, such as brass, tungsten, or molybdenum, and generating a discharge between the member and the wire which are to be processed, for example. By the use of wire discharge machining, fine machining with high precision is realized. In addition, the machining time of the member can be shortened.

This invention is not limited only to embodiment mentioned above, It can variously change in the range which does not deviate from the summary of this invention.

For example, you may use the batch process in 5th Embodiment for the manufacturing method of the heat transportation device in 1st, 2nd, 3rd, and 4th Embodiment. When the shape of the jig | tool part 00 used in 5th Embodiment is made into the shape corresponding to the lower board member and the upper board member, the arrangement | positioning process in another embodiment is attained.

1: lower plate member
2: frame member
3, 203, 303, 403, 503: top plate member
4, 51, 61, 204, 304, 404: container
5, 805: capillary member
6: first mesh layer
7: second mesh layer
8: mesh member
9: heat source
11: inner surface of the lower plate member
21: opposing surface of the side wall portion
31: inner surface of the upper plate member
52, 62: plate member
100, 110, 120, 200, 300, 400, 500, 800, 900, 910: Heat transport device
203a, 303a, 403a: upper plate part
203b, 303b, 403b: side wall portion
203c, 303c, 403c, 503c: junction
231: opposite side of the joint
313: protrusion
450, 550: heat transportation device unit
600, 700: jig
610, 710: wit
610a: bottom surface
610b: top side
840, 850: mesh member for joining
860: first mesh member
870: second mesh member
900a, 910a: inlet
900b, 910b: Infusion Furnace

Claims (13)

The first and second capillary members for applying capillary force to the working fluid between the first and second plates constituting a container of the heat transportation device for transferring heat using a phase change of the working fluid; The plate, the capillary member and the second plate are laminated,
And diffusion-bonding the first plate and the second plate so that the first plate and the capillary member are diffusion bonded. The method of claim 1,
The thickness of the capillary member is larger than the thickness of the inner space of the container constituted by the first plate and the second plate. 3. The method according to claim 1 or 2,
The capillary member is made of an elastic material,
In the diffusion bonding step, the first plate and the second plate are diffusion bonded to each other while compressing the capillary member. The method of claim 3,
The capillary member,
The first mesh layer,
And a second mesh layer made of a mesh thicker than the mesh included in the first mesh layer, laminated on the first mesh layer. The method of claim 3,
The second plate has a projection,
In the diffusion bonding step, the first plate and the second plate are diffusion-bonded while compressing the capillary member by the protrusions. The method of claim 1,
The heat transportation device has a frame member constituting the side wall of the container,
In the diffusion bonding step, the first plate and the frame member are further diffusion-bonded to the second plate and the frame member so that the first plate and the capillary member are diffusion bonded. The manufacturing method of a heat transportation device. The method of claim 1,
The lamination step includes a unit having the first plate, the capillary member, and the second plate, which are stacked to sandwich the capillary member between the first plate and the second plate. The jig and the unit are laminated so as to fit into the recesses of the jig to have,
In the diffusion bonding step, the first plate and the second plate of the unit are diffusion bonded to each other by applying pressure to the jig and the unit in the stacking direction. . The method of claim 1,
In the lamination step, the plurality of units and the plurality of jig parts are laminated so that the jig parts are respectively laminated between each of the plurality of units each having the first plate, the capillary member, and the second plate,
In the diffusion bonding step, the first plate and the second plate of the plurality of units are diffusion-bonded by applying pressure to the plurality of units and the plurality of jig in the stacking direction. The manufacturing method of a heat transportation device. The method of claim 3,
The capillary member,
A first member having a first spring constant and diffusion bonded to said first plate,
And a second member having a second spring constant greater than said first spring constant and laminated to said first member. The method of claim 9,
The diffusion bonding step includes diffusion bonding the first plate and the second plate such that the first plate and the capillary member are diffusion bonded, and the second plate and the capillary member are diffusion bonded. and,
The capillary member includes a third member, and the third member has a third spring constant that is smaller than the second spring constant, and is laminated on the second member so as to form the second plate. Method of manufacturing a heat transportation device characterized in that the diffusion bonding. A first portion of the plate formed by bending the capillary member that exerts a capillary force on the working fluid by bending a plate for constituting a container of a heat transportation device that transfers heat using a phase change of the working fluid Inserted at the site of and the second site,
And the end portion of the first portion and the end portion of the second portion are diffusion-bonded so that the first portion and the capillary member are diffusion bonded, thereby forming the container. A container having an inner surface,
A working fluid which is accommodated in the container and transports heat by phase change;
A first member having a first spring constant and diffusion-bonded to said inner surface, and a second member having a second spring constant greater than said first spring constant and laminated to said first member, And a capillary member for exerting a capillary force on said working fluid. A container having a sidewall, comprising: a container having a frame member constituting the sidewall, a first plate and a second plate joined to the frame member to sandwich the frame member;
A working fluid for transporting heat by phase change in the vessel,
And a capillary member that applies capillary buoyancy to the working fluid.

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