DE102018106343B4 - Intermediate element for heat dissipation devices and heat dissipation device - Google Patents

Abstract

An intermediate element for heat dissipation devices, comprising: a plate-shaped intermediate element body which has a first side, a second side, a plurality of perforations and a groove structure group, in particular a channel structure, the groove structure group being arranged either on the first or the second side, wherein the perforations pass through the intermediate element body and are continuously connected to the first and second sides, the groove structure group having a plurality of projections, the projections being spaced from one another and arranged in an array, with a plurality of channels being provided between the projections.

Description

Field of invention

The present invention relates to an intermediate element for heat dissipation devices and a heat dissipation device, and in particular an intermediate element for heat dissipation devices and a heat dissipation device, in which / with the at least one side or both sides of the upper and lower side of a single intermediate element body for increasing the capillary force with the same surface structure or different surface structures is / are provided.

State of the art

Current vapor-liquid cycle heat dissipation devices for heat dissipation include primarily heat pipes and vapor chambers. When used in a confined space such as B. in mobile devices or smartwatches, the overall structure of the heat pipe or the vapor chamber must therefore be kept flat for the purpose of adapting to the arrangement space of the application area.

In the case of a vapor chamber or a heat pipe, primarily a capillary structure and a working fluid are provided in the interior of the vacuum chamber. The heat transfer takes place by means of a two-phase transformation, i. H. After heating, the working fluid in the vacuum chamber is evaporated and condensed. Therefore, the vapor channel for vaporizing and diffusing and the capillary structure for condensing and returning the working fluid have become a focus for improvement together with the flat design. However, the flat design leads to a reduction in the space of the vacuum chamber and a weakening of the structural strength of the capillary structure and the outer plate. These are the most important tasks that need to be solved.

Copper material is usually used for vapor chambers and heat pipes. Copper has the properties of rapid heat transfer and high ductility. Therefore, copper plates or copper pipes that are flat in shape are easily deformed. If the vapor chamber or the heat pipe has deformed, the vacuum chamber is compressed or collapsed so that the working fluid that has been filled in is no longer able to carry out the heat transfer that takes place by means of a vapor-liquid cycle.

Due to the reduction in the space of the vacuum chamber caused by the flat design, the selection of the capillary structure to be arranged in the vacuum chamber is another problem to be solved Capillary structure is used, replaced. However, flat mesh still needs to be sintered to the outer plate or pipe wall so that the mesh does not warp or slip in the chamber. However, the tightness in the vacuum chamber makes the sintering process of the capillary structure and the chamber more difficult. After sintering, vapor channels may have disappeared.

Furthermore, if a conventional capillary structure produced by sintering or mesh fabric is arranged in a narrow space and deformed by compression, the flow distribution of the capillary structure in the three-dimensional direction (axially and radially) cannot be effectively controlled, and furthermore, gas in the capillary structure cannot escape can, as a result of which the resistance of the gas or the liquid cannot be reduced and thus the vapor-liquid cycle stops, so that the cooling of the heat source in contact and serving for heat transfer or heat dissipation cannot be carried out successfully, which may result from Crashes caused by overheating or a fire occurs in the chips. With the conventional capillary structure produced by sintering or mesh fabric, the heat flow structure for liquid-gas separation cannot be established. In the vapor chamber, due to the opposite flow directions of the vapor and the liquid between the liquid and the gas, bubbling can easily occur, which increases the resistance between the liquid and the gas.

The above shortcomings are those most urgently in need of improvement in current flat heat sinks. The prior art includes, for example US 2011/0 048 341 A1 or the US 2015/0 101 192 A1 .

Object of the invention

In order to eliminate the above disadvantages in the prior art, it is an object of the present invention to provide a flat capillary structure with higher capillary force.

To achieve the above object, the present invention provides an intermediate element for heat dissipation devices, which has an intermediate element body with a first side, a second Side, a plurality of perforations and a groove structure group, wherein the groove structure group is arranged either on the first or the second side, the perforations pass through the intermediate element body and are continuously connected to the first and second sides, the groove structure group having a plurality of projections, the Projections are spaced apart and arranged in an array, wherein a plurality of channels are provided between the projections.

The present invention is based on the object of providing a heat dissipation device comprising an intermediate element body, a first plate body and a second plate body which overcomes the above-mentioned disadvantages from the prior art.

The intermediate element body comprises a first side, a second side, a plurality of perforations and a groove structure group, the groove structure group being arranged on either the first or the second side, the perforations passing through the intermediate element body and being continuously connected to the first and second sides, wherein the groove structure group has a plurality of projections, the projections being spaced apart from one another and arranged in an array, with a plurality of channels being provided between the projections.

The first plate body has a first surface and a second surface, the second plate body having a third surface and a fourth surface, the first and third surfaces exactly covering one another and together defining a sealed chamber, the intermediate element body in the sealed chamber is arranged, wherein the tight chamber is filled with a working fluid.

In the present invention, a single flat intermediate element body is provided in which the perforations or the groove structure group are arranged either offset or not offset on either the upper or lower side, so that a composite capillary structure through the intermediate element body, which caused one by means of the vaporous and liquid working fluid Vapor-liquid cycle allows, and also a heat dissipation device, through which the capillary structure and the support structure are united with one another in one piece, are provided.

• 1 eine perspektivische Ansicht eines ersten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 2 eine Draufsicht des ersten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 3 eine perspektivische Ansicht eines zweiten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 4 eine perspektivische Ansicht des zweiten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 5 eine perspektivische Ansicht eines dritten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 6 eine perspektivische Ansicht des dritten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 7 eine perspektivische Ansicht eines vierten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 8 eine perspektivische Ansicht des vierten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 8a eine perspektivische Ansicht des vierten Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 9 eine Schnittansicht des ersten Ausführungsbeispiels der erfindungsgemäßen Wärmeableiteinrichtung;
• 10a eine Schnittansicht des zweiten Ausführungsbeispiels der erfindungsgemäßen Wärmeableiteinrichtung;
• 10b eine Schnittansicht des zweiten Ausführungsbeispiels der erfindungsgemäßen Wärmeableiteinrichtung;
• 11a eine schematische Ansicht der Mikrostruktur des zweiten Plattenkörpers der erfindungsgemäßen Wärmeableiteinrichtung;
• 11b eine schematische Ansicht der Mikrostruktur des zweiten Plattenkörpers der erfindungsgemäßen Wärmeableiteinrichtung;
• 11c eine schematische Ansicht der Mikrostruktur des zweiten Plattenkörpers der erfindungsgemäßen Wärmeableiteinrichtung;
• 11d eine schematische Ansicht der Mikrostruktur des zweiten Plattenkörpers der erfindungsgemäßen Wärmeableiteinrichtung;
• 12a eine perspektivische Ansicht des fünften Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen;
• 12b eine perspektivische Ansicht des fünften Ausführungsbeispiels des erfindungsgemäßen Zwischenelements für Wärmeableiteinrichtungen.

The invention is described in more detail below with reference to the figures in a schematic representation. It shows:

• 1 a perspective view of a first embodiment of the intermediate element according to the invention for heat dissipation devices;
• 2 a plan view of the first embodiment of the intermediate element according to the invention for heat dissipation devices;
• 3 a perspective view of a second embodiment of the intermediate element according to the invention for heat dissipation devices;
• 4th a perspective view of the second embodiment of the intermediate element according to the invention for heat dissipation devices;
• 5 a perspective view of a third embodiment of the intermediate element according to the invention for heat dissipation devices;
• 6th a perspective view of the third embodiment of the intermediate element according to the invention for heat dissipation devices;
• 7th a perspective view of a fourth embodiment of the intermediate element according to the invention for heat dissipation devices;
• 8th a perspective view of the fourth embodiment of the intermediate element according to the invention for heat dissipation devices;
• 8a a perspective view of the fourth embodiment of the intermediate element according to the invention for heat dissipation devices;
• 9 a sectional view of the first embodiment of the heat dissipating device according to the invention;
• 10a a sectional view of the second embodiment of the heat dissipation device according to the invention;
• 10b a sectional view of the second embodiment of the heat dissipation device according to the invention;
• 11a a schematic view of the microstructure of the second plate body of the heat dissipating device according to the invention;
• 11b a schematic view of the microstructure of the second plate body of the heat dissipating device according to the invention;
• 11c a schematic view of the microstructure of the second plate body of the heat dissipating device according to the invention;
• 11d a schematic view of the microstructure of the second plate body of the heat dissipating device according to the invention;
• 12a a perspective view of the fifth embodiment of the intermediate element according to the invention for heat dissipation devices;
• 12b a perspective view of the fifth embodiment of the intermediate element according to the invention for heat dissipation devices.

Detailed description of the exemplary embodiments

In order to enable a complete understanding of the structural and functional features of the present invention, preferred exemplary embodiments are described in detail below with reference to the accompanying drawings. It goes without saying that the figures shown are only schematic representations with regard to the technical features of the present invention and that the exact relative dimensions and proportions of all technical features are not restricted.

the 1 and 2 each show a perspective view and a plan view of the first exemplary embodiment of the intermediate element according to the invention for heat dissipating devices. According to the figures, the intermediate element according to the invention for heat dissipation devices comprises an intermediate element body 1 .

Here, the intermediate element body 1 a first page 11 , a second page 12th , multiple perforations 13th and a groove structure group 14th on, the groove structure group 14th either on the first page 11 or on the second page 12th or can be arranged on both sides, the groove structure group in the present exemplary embodiment 14th on the first page 11 is arranged, the perforations 13th through the intermediate element body 1 go through it and with the first and second side 11 , 12th are continuously connected, the groove structure group 14th and the perforations 14th are arranged either offset or not offset, these two being offset in the present exemplary embodiment, but without being limited thereto.

Here, the groove structure group 14th several grooves 141 on, with the grooves 141 spaced apart and from the first side 11 towards the second side 12th are formed by depressions, the perforations 13th and the grooves 141 may be arranged either in a horizontally staggered arrangement or in a vertically overlapping arrangement. In the present exemplary embodiment, these are arranged horizontally offset, but without being restricted thereto. The perforations 13th are located in the areas between each two grooves 141 . At least one connection channel 141a is between the grooves 141 provided, the two ends of the connecting channel 141a with the grooves 141 are connected, the grooves 141 are continuously connected to one another in the horizontal direction and vertical direction.

the 3 and 4th show perspective views of the second embodiment of the intermediate element according to the invention for heat dissipation devices from two sides. According to the figures, the present exemplary embodiment differs from the first exemplary embodiment in that the groove structure group 14th several protrusions 142 having, the projections 142 are spaced apart and arranged in an array, with multiple channels 143 between the protrusions 142 are provided, the perforations 13th and the protrusions 142 are arranged either horizontally offset or not horizontally offset from one another (or these two can be arranged vertically overlapping). In the present exemplary embodiment, these two are arranged offset, but without being restricted thereto. The channels 143 are on the first page 11 either along the vertical direction or the horizontal direction or simultaneously the vertical and horizontal directions of the intermediate element body 1 staggered.

the 5 and 6th show perspective views of the third embodiment of the intermediate element according to the invention for heat dissipation devices from two sides. According to the figures, the present exemplary embodiment differs from the second exemplary embodiment in that the intermediate element body 1 a first area 1a , a second area 1b and a third area 1c are defined, the two ends of the first region 1a with the second and third area 1b , 1c are connected, the distances between the channels 143 at the projections 142 of the first area 1a (closer to each other) smaller than the distances between the channels 143 at the projections 142 of the second and third area 1b , 1c (more loosely to each other), the diameter of the in the first area 1a provided perforations 13th smaller than the diameter of the second and third area 1b , 1c provided perforations 13th are, the first area 1a is an evaporation zone and the second and third areas 1b , 1c Condensation zones are, the volumes of the in the first area 1a provided projections 142 smaller than the volume of the second and third area 1b , 1c provided projections 142 are, where the distances between the widths of the in the first area 1a provided channels 143 (arranged closer to one another) smaller than the spacing of the widths of the second and third areas 1b , 1c provided channels 143 (more loosely to each other), the diameter of the in the first area 1a provided perforations 13th smaller than the diameter of the second and third area 1b , 1c provided perforations 13th are.

the 7th , 8th and 8a show perspective views of the fourth embodiment of the intermediate element according to the invention for heat dissipation devices from two sides. According to the figures, the present exemplary embodiment differs from the first exemplary embodiment in that both the first and the second side 11 , 12th of the intermediate element body 1 with a groove structure group 14th are provided, the groove structure group 14th either from several grooves 141 or from several projections 142 or a combination of grooves 141 and protrusions 142 can exist. In the present exemplary embodiment, the groove structure group consists of several projections 142 but not limited to it. In another modified embodiment, the combinations of the protrusions are 142 and the perforations 13th randomly arranged, unruled combinations, with the protrusions 142 who have favourited perforations 13th and the shapes of the protrusions 142 are also hardly subject to restrictions (as shown in FIG. 8a).

The cross-sections of the grooves 141 or the protrusions 142 in the above embodiments are either circular, oval, square, diamond-shaped or triangular, but are not limited to these, the cross-sectional shape extending along the horizontal direction of the first or second side 11 , 12th of the intermediate element body 1 extending cross-sectional shape relates. The intermediate element body 1 consists of either pure titanium, titanium alloy, copper, aluminum, stainless steel, ceramic, aluminum alloy or copper alloy.

9 shows a sectional view of the first embodiment of the heat dissipating device according to the invention. According to the figure, the heat dissipation device comprises an intermediate element body 1 , a first plate body 2 and a second plate body 3 .

Here, the intermediate element body 1 a first page 11 , a second page 12th , multiple perforations 13th and a groove structure group 14th on, the groove structure group 14th either on the first or the second page 11 , 12th is arranged, the perforations 13th through the intermediate element body 1 go through it and with the first and second side 11 , 12th are continuously connected, the groove structure group 14th and the perforations 13th are arranged either offset or not offset or vertically overlapping.

The first plate body 2 has a first surface 21 and a second surface 22nd on, the second plate body 3 a third surface 31 and a fourth surface 32 having the first and third surfaces 21 , 31 cover each other exactly and together form a tight chamber 33 define, the intermediate element body 1 in the tight chamber 33 is arranged, the sealed chamber 33 with a working fluid 4th is filled.

In the present exemplary embodiment, there is the groove structure group 14th of the intermediate element body 1 optionally either from several grooves 141 or from several projections 142 , where the groove structure group 14th optionally either on the first or second page 11 , 12th can be arranged, or the groove structure group 14th can be on the first and second side at the same time 11 , 12th be arranged. In the present exemplary embodiment, the groove structure group is 14th only on the second page 12th arranged, the groove structure group 14th from several protrusions 142 exists, but the invention is not limited thereto. The first surface 21 of the first plate body 2 has several protruding sections 211 on, being those with the previous paragraphs 211 corresponding points of the second surface 22nd are formed by depressions, the protruding portions 211 corresponding on the second page 12th of the intermediate element body 1 abut, the third surface 31 of the second plate body 3 corresponding on the first page 11 of the intermediate element body 1 is present.

the 10a and 10b show sectional views of the second exemplary embodiment of the heat dissipating device according to the invention. According to the figure, the present exemplary embodiment differs from the first exemplary embodiment in that the protruding sections 211 of the previous sections 211 having the first plate body 2 corresponding on the first page 11 of the intermediate element body 1 abut, the third surface 31 of the second plate body 3 corresponding on the second page 12th of the intermediate element body 1 is present.

In the first and second exemplary embodiments, the heat dissipation device has the second surface 22nd of the first plate body 2 defined as a condensation surface producing a condensation effect, wherein at least a region of the first surface 21 as a condensation zone 21a is defined, the fourth surface 32 of the second plate body 3 may be defined as a heat absorbing heat absorbing surface, wherein at least a portion of the third surface 31 as Evaporation zone 31a is defined. In the present embodiment, the condensation zone 21a and the evaporation zone 31a Correspondingly arranged above and below. The intermediate element body 1 and the first and second plate bodies 2 , 3 consist of either pure titanium, titanium alloy, copper, aluminum, stainless steel or ceramic or a combination of two or more of the above-mentioned materials.

10b Fig. 10 shows another variation of the present embodiment. This is made up of several projections 142 existing groove structure group 14th on the first page 11 arranged, the surface of the groove structure group 14th with a nanostructure layer 144 is provided, wherein the nanostructure layer 144 a nanowhisker layer, nano-carbide layer or nano-oxide layer, wherein the nano-oxide layer is a layer of either copper oxide, titanium oxide or aluminum oxide, the groove structure group being 14th corresponding on the third surface 31 of the second plate body 3 is present. Through the nanostructured layer 144 the entire backflow in the capillaries or the entire water absorption capacity can be improved.

According to the 11a , 11b , 11c and 11d is the third surface 31 of the second plate body 3 provided with a microstructure 34 in the heat dissipation device in the first and second exemplary embodiment, the microstructure 34 being composed of several grooves (as in 11a shown), consisting of a rough surface consisting of several recesses and protrusions (as in 11b shown), from a sintered powder layer (as in 11c shown), from a cladding layer (as in 11d shown) or a combination of two or more of the composite structures, but not limited thereto. The water content can be increased by the microstructure 34 in order to improve the efficiency of the vapor-liquid cycle. The plating layer is either hydrophobic or hydrophilic. Of course, the first surface 21 of the first plate body 2 also with a microstructure like that of the second plate body 3 has been described.

In the present embodiment, microgrooves are provided. In the present exemplary embodiment, the middle area is the third surface 31 of the second plate body 3 as an evaporation zone 23 defined, one or both of which is that of the evaporation zone 23 opposite left and right ends of the third surface 31 of the second plate body 3 as condensation ends 24 , 25th is / are defined. Of course, the left end can also be used as an evaporation zone 23 and the right end also as the condensation end 24 be defined, but the invention is not limited thereto.

In the present exemplary embodiment, the distances between are at the evaporation zone 23 provided micro-grooves 341 smaller, so that they result in a denser arrangement, with the distances between the at the end of the condensation 24 , 25th provided micro grooves 341 are larger, so that a loose arrangement results with them.

When the second plate body 2 is provided with a plating layer, becomes a hydrophilic coating for the evaporation zone 23 and a hydrophobic coating for the condensation end 24 , 25th used.

The above microstructure 34 (plating layer or micro-grooves) allows the water absorption and the moisture content of the evaporation zone 23 must be increased to avoid dry burn. When the micro grooves 341 are in the direction of the two condensation ends 24 , 25th extend, the distances between the microgrooves 341 are larger, that is, there is a loose arrangement. This can reduce the pressure resistance at the condensation ends 24 , 25th can be reduced and the diffusion efficiency of condensation can be increased.

the 12a and 12b show perspective views of the fifth embodiment of the intermediate element according to the invention for heat dissipation devices. According to the figures, the present exemplary embodiment differs from the first exemplary embodiment in that the perforations have multiple connecting channels 131 in the horizontal direction, with the connecting channels 131 extend horizontally in either a linear, curved or irregular manner, thereby connecting two adjacent perforations, the connecting channels 131 optionally either on the first or on the second page 11 , 12th or at the same time on the first and second page 11 , 12th are arranged. In the present exemplary embodiment, they are on the second page 12th arranged, but the invention is not limited to this (as in 12a shown). Or they are between the first and second page 11 , 12th of the intermediate element body 1 arranged (as in 12b shown). Through the connecting channels 131 can use the perforations 13th also be continuously connected to one another in the horizontal directions. I. E. when the working fluid 4th is converted into the vapor state, it can spread both in the vertical direction and in the horizontal direction.

In the invention is a groove structure group 14th on one side or on two sides of the intermediate element body 1 arranged with the perforations 13th through the intermediate element body 1 go through it, the working fluid 4th by means of the groove structure group 14th is returned, the perforations 13th as vapor channels for evaporation of the working fluid 4th be used. Through the plate-shaped intermediate element body 1 the problem of difficult placement of the sealed chamber inside the flat-held heat sink can be solved. Since the intermediate element body 1 is plate-shaped and does not warp easily, the intermediate element body 1 can be used without sintering.

Due to the composite structure of the intermediate element body 1 In the case of the substrate having a single layer, the advantageous effects of providing gas circulation channels and providing the capillary structure serving for liquid reflux can be achieved at the same time. The invention can solve the problem that when using materials that are not easy to process, such as titanium, a special capillary structure such as mesh fabric is not easy to produce. Due to the capillary structure that is produced quickly, the problem of material selection can be eliminated and, furthermore, production hours can be saved and thus the production costs can be reduced considerably.

Furthermore, the intermediate element body 1 can also be used as a support element, which enables the sealed chamber, which is kept flat, to further preserve its integrity and thus does not deform it, so that the advantageous effect of the vapor-liquid cycle is not lost.

With the capillary structure according to the invention, axial and radial three-dimensional channels for the vapor-liquid cycle can also be generated through a single plate-shaped body, these channels not being limited to an arrangement in a narrow space, whereby the working fluid flow in a three-dimensional space and more smoothly and uninterrupted vapor-liquid cycle can be guaranteed. In addition, with the capillary structure according to the invention, the liquid can pass through the channels 143 be transported, being on the on the surface of the perforations 13th provided crescent-shaped membrane generates steam and passes through the sealed chamber 33 is spread to thereby form a heat transfer structure for liquid-gas separation.

List of reference symbols

1

Intermediate element body

11

first page

12th

second page

13th

perforation

131

Connection channel

14th

Groove structure group

141

Groove

141a

Connection channel

142

head Start

143

channel

144

Nanostructural layer

1a

first area

1b

second area

1c

third area

2

first plate body

21

first surface

21a

Condensation zone

211

previous section

22nd

second surface

23

Evaporation zone

24

End of condensation

25th

End of condensation

3

second plate body

31

third surface

31a

Evaporation zone

32

fourth surface

33

tight chamber

4th

Working fluid

Claims (22)

An intermediate element for heat dissipation devices, comprising: a plate-shaped intermediate element body which has a first side, a second side, a plurality of perforations and a groove structure group, in particular a channel structure, the groove structure group being arranged either on the first or the second side, wherein the perforations pass through the intermediate element body and are continuously connected to the first and second sides, the groove structure group having a plurality of protrusions, the protrusions being spaced from one another and arranged in an array, wherein several channels are provided between the projections. Intermediate element for heat dissipation devices according to Claim 1 , in which the groove structure group has a plurality of grooves, the grooves being spaced apart and formed by depressions from the first side in the direction of the second side, the perforations and the grooves being arranged in a horizontally offset arrangement, with at least one connecting channel between the grooves is provided, wherein the two ends of the connecting channel are connected to the grooves. Intermediate element for heat dissipation devices according to Claim 1 wherein the groove structure group has a plurality of projections, the projections being spaced apart from one another and arranged in an array, with several channels being provided between the projections, the perforations and the projections being arranged horizontally offset from one another. Intermediate element for heat dissipation devices according to Claim 3 in which the channels on the first side are staggered either along the vertical direction or the horizontal direction or at the same time the vertical and horizontal directions of the intermediate element body. Intermediate element for heat dissipation devices according to Claim 3 in which the channels on the first side are staggered either in the vertical direction or the horizontal direction or at the same time in the vertical and horizontal directions. Intermediate element for heat dissipation devices according to Claim 2 wherein the cross-sections of the grooves are either circular, oval, square, diamond-shaped or triangular, the cross-section referring to a cross-section extending along the horizontal direction of the first or second side of the intermediate element body. Intermediate element for heat dissipation devices according to Claim 3 wherein the cross-sections of the projections are either circular, oval, square, diamond-shaped or triangular, the cross-section referring to a cross-section extending along the horizontal direction of the first or second side of the intermediate element body. Intermediate element for heat dissipation devices according to Claim 1 , in which the intermediate element body consists of either pure titanium, titanium alloy, copper, aluminum, stainless steel, ceramic, aluminum alloy or copper alloy. Intermediate element for heat dissipation devices according to Claim 1 wherein the intermediate element body defines a first region, a second region and a third region, the two ends of the first region being connected to the second and third regions, the distances between the channels at the projections of the first region being smaller than the distances between the channels are at the projections of the second and third areas, the diameters of the perforations provided in the first area being smaller than the diameters of the perforations provided in the second and third areas, the first area being an evaporation zone and the second and third areas being condensation zones . Intermediate element for heat dissipation devices according to Claim 9 , in which the volumes of the projections provided in the first area are smaller than the volumes of the projections provided in the second and third areas. Intermediate element for heat dissipation devices according to Claim 1 , in which both the first and the second side of the intermediate element body are provided with a groove structure group. Intermediate element for heat dissipation devices according to Claim 11 , in which the groove structure group consists either of a plurality of grooves, of a plurality of projections or of a combination of spaced apart grooves and projections. Intermediate element for heat dissipation devices according to Claim 1 , in which the perforations have a plurality of connecting channels in the horizontal direction, with two adjacent perforations being horizontally connected to one another by the connecting channels, the connecting channels optionally either on the first or second side or simultaneously on the first and second side or between the first and second Side of the intermediate element body are arranged. Intermediate element for heat dissipation devices according to Claim 1 , in which the surface of the groove structure group is provided with a nanostructure layer, the nanostructure layer being a nanowhisker layer, nano-carbide layer or nano-oxide layer, the nano-oxide layer being a layer made either of copper oxide, titanium oxide or aluminum oxide is. A heat dissipating device comprising: an intermediate element body which has a first side, a second side, a plurality of perforations and a groove, in particular channel, structure group, the groove structure group being arranged either on the first or the second side or on both sides, the Perforations through the Intermediate member bodies pass through and are continuously connected to the first and second sides; a first plate body having a first surface and a second surface; a second plate body having a third surface and a fourth surface, the first and third surfaces precisely covering each other and together defining a sealed chamber, the intermediate element body being disposed in the sealed chamber, the sealed chamber being filled with a working fluid , wherein in the case of the heat dissipation device, at least a region of the third surface is defined as an evaporation zone, one or both of the left and right sides opposite the evaporation zone being defined as condensation ends. Heat dissipation device according to Claim 15 , in which the first surface of the first plate body has a plurality of protruding sections, the locations of the second surface corresponding to the protruding sections being formed by depressions, the protruding sections correspondingly in contact with the first side of the intermediate element body, the third surface of the second plate body corresponding to the second side of the intermediate element body. Heat dissipation device according to Claim 15 , in which the first surface of the first plate body has a plurality of protruding sections, the locations of the second surface corresponding to the protruding sections being formed by depressions, the protruding sections correspondingly in contact with the second side of the intermediate element body, the third surface of the second plate body corresponding to the first side of the intermediate element body. Heat dissipation device according to Claim 15 , wherein the second surface of the first plate body is defined as a condensation surface, wherein at least one condensation zone is defined on the first surface, wherein the fourth surface of the second plate body is defined as a heat absorption surface, wherein at least one evaporation zone is defined on the third surface, wherein the The condensation zone and the evaporation zone are arranged correspondingly above and below. Heat dissipation device according to Claim 15 , in which the intermediate element body and the first and second plate body are made either of pure titanium, titanium alloy, copper, aluminum, stainless steel or ceramic or of a combination of the above-mentioned materials. Heat dissipation device according to Claim 15 , in which the third surface of the second plate body is provided with a microstructure, the microstructure consisting either of several grooves, of a rough surface consisting of several recesses and projections, of a sintered powder layer or of a plating layer, the plating layer being either hydrophobic or hydrophilic is. Heat dissipation device according to Claim 15 , in which the surface of the groove structure group is provided with a nanostructured layer, the nanostructured layer being a nanowhisker layer, nano-carbide layer or nano-oxide layer, the nano-oxide layer being a layer made either of copper oxide, titanium oxide or aluminum oxide is. Heat dissipation device according to Claim 15 , in which the groove structure group rests correspondingly on the third surface of the second plate body.

Images