JP2010157777A - 回路装置およびその製造方法 - Google Patents
回路装置およびその製造方法 Download PDFInfo
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Abstract
【解決手段】回路装置10は、配線基板20、第1の回路素子30および第2の回路素子40を備える。配線基板20は、絶縁樹脂層22、絶縁樹脂層22のL1面に設けられた配線層50、絶縁樹脂層22のL1面に設けられた配線層50を有する。配線層50は、第1の回路素子30が接続される第1の接続部52および配線部54を含む。第1の接続部52の膜厚は、配線部54の膜厚に比べて薄膜化されている。また、配線部54は、第1の接続部52を構成する金属よりイオン化傾向が小さい金属56で被覆されている。
【選択図】図1
Description
図2〜図4は、実施の形態に係る回路装置の製造方法を示す工程断面図である。
Claims (6)
- 基板と、
前記基板の一方の面に設けられた接続部及び配線部と、
前記接続部に搭載された回路素子と、
を備え、
前記接続部の膜厚が前記配線部の膜厚より薄いことを特徴とする回路装置。 - 前記配線部が、前記接続部を構成する金属よりイオン化傾向が小さい金属で被覆されていることを特徴とする請求項1に記載の回路装置。
- 前記接続部を構成する金属が銅であり、前記配線部に被覆される金属が金であることを特徴とする請求項1または2に記載の回路装置。
- 前記回路素子が前記接続部にフリップチップ接続されていることを特徴とする請求項1〜3のうちいずれか1項に記載の回路装置。
- 基板の一方の面に接続部及び配線部を形成する工程と、
前記接続部を構成する金属に比べてイオン化傾向が小さい金属で前記配線部を被覆する工程と、
前記接続部にOSP処理を施すことにより、前記接続部の表面にプレフラックス膜を形成する工程と、
前記接続部に回路素子を実装する工程と、
を備えることを特徴とする回路装置の製造方法。 - 前記接続部を構成する金属が銅であり、前記配線部に被覆される金属が金であることを特徴とする請求項5に記載の回路装置の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2010095098A JP5121875B2 (ja) | 2010-04-16 | 2010-04-16 | 回路装置 |
Applications Claiming Priority (1)
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JP2010095098A JP5121875B2 (ja) | 2010-04-16 | 2010-04-16 | 回路装置 |
Related Parent Applications (1)
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JP2007146244A Division JP4588046B2 (ja) | 2007-05-31 | 2007-05-31 | 回路装置およびその製造方法 |
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JP2010157777A true JP2010157777A (ja) | 2010-07-15 |
JP5121875B2 JP5121875B2 (ja) | 2013-01-16 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010095098A Expired - Fee Related JP5121875B2 (ja) | 2010-04-16 | 2010-04-16 | 回路装置 |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237338A (ja) * | 2000-02-21 | 2001-08-31 | Nippon Circuit Kogyo Kk | フリップチップボールグリッドアレイ基板及びその製造法 |
JP2003197856A (ja) * | 2001-12-28 | 2003-07-11 | Oki Electric Ind Co Ltd | 半導体装置 |
JP2005123223A (ja) * | 2003-10-14 | 2005-05-12 | Hitachi Cable Ltd | 配線板及び半導体装置、ならびに配線板の製造方法 |
-
2010
- 2010-04-16 JP JP2010095098A patent/JP5121875B2/ja not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001237338A (ja) * | 2000-02-21 | 2001-08-31 | Nippon Circuit Kogyo Kk | フリップチップボールグリッドアレイ基板及びその製造法 |
JP2003197856A (ja) * | 2001-12-28 | 2003-07-11 | Oki Electric Ind Co Ltd | 半導体装置 |
JP2005123223A (ja) * | 2003-10-14 | 2005-05-12 | Hitachi Cable Ltd | 配線板及び半導体装置、ならびに配線板の製造方法 |
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JP5121875B2 (ja) | 2013-01-16 |
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