JP2010153578A - Laminated wiring board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laminated wiring board for stably connecting conductive sections of respective boards between two laminated boards without via through-holes. <P>SOLUTION: The laminated wiring board 10 is formed by stacking first and second substrates 11, 21. The first substrate 11 includes three regions α<SB>1</SB>, β<SB>1</SB>, γ<SB>1</SB>with two slits as boundaries. The slits are provided mutually at an interval. One edge of the second substrate 21 is inserted into the slit of the first substrate 11. The first and second substrates 11, 21 cross and overlap with the slit as a boundary. At least one conductive section, which is provided on a surface opposite to the second substrate 21 of the first substrate 11, is connected to at least one conductive section provided on a surface opposite to the first substrate 11 of the second substrate 21. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laminated wiring board formed by laminating two substrates having conductive portions, and more particularly to a laminated wiring board that is thin and excellent in flexibility even when laminated.

  Conventionally, in a multilayer wiring board formed by laminating a plurality of wiring boards, a through hole penetrating the board is provided, and the wiring boards are connected to each other through the through hole.

Further, a non-contact type data receiving / transmitting body (non-contact type IC card or the like) called RFID (Radio Frequency Identification) is called an inlet in which an antenna is formed on a base material and an IC chip is mounted. It is produced by sticking to other base materials.
In such a non-contact type data transmission / reception body, for example, a plurality of antenna patterns are generally wound in a loop shape or a spiral shape for communication in an inlet made of a base material such as paper or film. It is known that an IC chip is mounted by crossing a jumper wiring between the contact points at both ends of the antenna pattern via an insulating layer provided across the antenna pattern (see, for example, Patent Document 1). . Here, the insulating layer is provided in order to prevent a short circuit between the antenna pattern and the jumper wiring.

  Also, in the non-contact type data receiving / transmitting body, in order to prevent a short circuit between the antenna pattern and the jumper wiring, an insulating layer is not provided across the antenna pattern, but through a through hole provided in the base material. It is known that a jumper wiring connected to a through hole is provided on the surface of the substrate opposite to the surface on which the antenna pattern is formed (see, for example, Patent Document 2).

Further, the communication circuit holder includes a base material having three regions connected to each other, an antenna pattern arranged in the first region, and a jumper wiring arranged in the third region. Disclosed is one in which both ends of an antenna pattern and both ends of a jumper wiring are electrically connected when the three regions are overlapped by bending (for example, Patent Documents) 3).
JP 2002-074310 A JP 2003-006589 A JP 2005-241011 A

  However, the conventional laminated wiring board has a problem that it is difficult to ensure conduction between the wiring boards because a plurality of wiring boards are laminated through the through holes. Moreover, in order to manufacture a multilayer wiring board, since it is necessary to form a through hole, there existed a problem that there were many manufacturing processes and manufacturing cost was high.

In addition, the non-contact type data receiver / transmitter disclosed in Patent Document 1 has many manufacturing processes because an insulating layer is provided across the antenna pattern and a jumper wiring is provided on the insulating layer. There was a problem that the manufacturing cost was high.
Moreover, since the antenna pattern and the jumper wiring are connected to each other through the through hole in the non-contact type data receiver / transmitter disclosed in Patent Document 2, it is difficult to ensure the continuity between the antenna pattern and the jumper wiring. was there. Further, in order to manufacture this non-contact type data transmitting / receiving body, it is necessary to form a through hole, so that there are many manufacturing processes and a high manufacturing cost.

  Furthermore, the circuit holder for communication disclosed in Patent Document 3 was overlapped in order to ensure electrical continuity between the antenna pattern in the first region and the jumper wiring in the third region after the base material was bent. The base material needs to be pressure-bonded, and the continuity may not be sufficiently secured depending on the force applied during pressure-bonding.

  The present invention has been made in view of the above circumstances, and is capable of stably connecting a conductive portion of each substrate between two stacked substrates without through a through hole. An object is to provide a substrate.

  The laminated wiring board of the present invention is a laminated wiring board in which a first substrate and a second substrate are laminated at least partially, and the first substrate extends inward from one end. Three or more regions having at least two slits as boundaries, and the two or more slits are spaced apart from each other, and the two or more slits of the first substrate are provided on the second substrate. One end is inserted, the first substrate and the second substrate are crossed and overlapped with the two or more slits as a boundary, and provided on the surface of the first substrate facing the second substrate At least one conductive portion and at least one conductive portion provided on a surface of the second substrate facing the first substrate are connected.

According to the multilayer wiring board of the present invention, the first board and the second board are laminated at least partially, and the first board extends inward from one end. Three or more regions having two or more slits as boundaries, and the two or more slits are provided to be spaced apart from each other, and the two or more slits of the first substrate are provided with the second slit. One end of the substrate is inserted, and the first substrate and the second substrate are overlapped and overlapped with the two or more slits as a boundary, and provided on the surface of the first substrate facing the second substrate Since the at least one conductive portion formed and the at least one conductive portion provided on the surface of the second substrate facing the first substrate are connected to each other, the through-hole is interposed as in the conventional multilayer wiring substrate. The first group stacked without Between one end of the second substrate and one end of the second substrate, a connecting portion of the conductive portion provided on one surface of the first substrate and a connecting portion of the conductive portion provided on the other surface of the second substrate Since the contact is made on the same surface, the conductive portion of the first substrate and the conductive portion of the second substrate can be electrically connected, and the connection portion of the conductive portion provided on the other surface of the first substrate, Since the connecting portion of the conductive portion provided on one surface of the second substrate abuts on the same surface, the conductive portion of the first substrate and the conductive portion of the second substrate can be electrically connected. In addition, one end of the first substrate intersects with one end of the second substrate with the slit as a boundary, and one surface of the first substrate overlaps the other surface of the second substrate in the first region, and the second region Since the other surface of the first substrate and the one surface of the second substrate overlap each other, the connection is stable between the connection portion of the conductive portion of the first substrate and the connection portion of the conductive portion of the second substrate. Misalignment can be prevented.
Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced.
Furthermore, since the laminated wiring board of the present invention is not provided with a through hole, even if two boards are laminated, they are thin and excellent in flexibility.

The best mode of the multilayer wiring board of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment FIG. 1 is a schematic exploded perspective view showing a first embodiment of the multilayer wiring board of the present invention. 2A and 2B are schematic views showing a first embodiment of the multilayer wiring board of the present invention, wherein FIG. 2A is a perspective view, and FIG. 2B is a cross-sectional view taken along line AA of FIG.
The laminated wiring board 10 of this embodiment includes a first substrate 11 having a first conductive portion 12, a second conductive portion 13, and a third conductive portion 14, a first conductive portion 22, a second conductive portion 23, and a third conductive portion. The second substrate 21 having the portion 24 is schematically configured.

The first substrate 11 has two slits 15 and 16 that are substantially equidistant along the longitudinal direction, with one end 11c of the first substrate 11 as a base end and extending to the inside (near the center of the first substrate 11). Is provided.
The two slits 15 and 16 are linear cuts provided in the first substrate 11, and the first substrate 11 is a first region provided in order with the two slits 15 and 16 as a boundary. α ₁ , second region β ₁ and third region γ ₁ , first region α ₁ and second region β ₁ are in contact with slit 15, and second region β ₁ and third region γ ₁ are slit 16. It touches at.
The first region α ₁ , the second region β _1, and the third region γ ₁ are bent in the longitudinal direction of the first substrate 11 with the two slits 15 and 16 as a boundary.

Further, on one surface 11a of the first substrate 11, along the longitudinal direction, the other end 11d of the first substrate 11 as a base end, the first conductive portion 12 is provided extending to the first region alpha ₁ ing. The connecting portion 12a of the first conductive section 12 is disposed in a central portion of the first region alpha _1.
On the other surface 11b of the first substrate 11, along the longitudinal direction, the other end 11d of the first substrate 11 as a base end, the second conductive portion 13 that extends to a second region beta ₁ is provided ing. The connecting portion 13a of the second conductive section 13 is disposed in a central portion of the second region beta _1.
Further, on one surface 11a of the first substrate 11, along the longitudinal direction, the other end 11d of the first substrate 11 as a base end, the third conductive portion 14 that extends to the third region gamma ₁ is provided ing. The connecting portion 14a of the third conductive section 14 is disposed in a central portion of the third region gamma _1.
That is, in the first substrate 11, the first conductive portion 12, the second conductive portion 13, and the third conductive portion 14 are provided at positions that do not overlap each other.

On the other hand, on the other surface 21b of the second substrate 21, one of the regions obtained by dividing the second substrate 21 into almost equal parts (region on one long side of the second substrate 21) is along the longitudinal direction. A first conductive portion 22 is provided that has the other end 21d of the second substrate 21 as a base end and extends to the one end 21c side (near one end portion of the second substrate 21). Further, the connection portion 22 a of the first conductive portion 22 is disposed at one end portion of the second substrate 21.
In addition, in one surface 21a of the second substrate 21, one of the regions obtained by dividing the second substrate 21 into almost equal parts (region of the central portion of the second substrate 21) has a second substrate along the longitudinal direction. A second conductive portion 23 is provided that has the other end 21d of 21 as a base end and extends to the one end 21c side (near one end portion of the second substrate 21). Further, the connection portion 23 a of the second conductive portion 23 is disposed at one end portion of the second substrate 21.
Further, on the other surface 21b of the second substrate 21, one of the regions obtained by dividing the second substrate 21 into almost equal parts (region on the other long side of the second substrate 21) is arranged along the longitudinal direction. A third conductive portion 24 is provided that has the other end 21d of the second substrate 21 as a base end and extends to the one end 21c side (near one end portion of the second substrate 21). Further, the connection portion 24 a of the third conductive portion 24 is disposed at one end portion of the second substrate 21.
That is, in the second substrate 21, the first conductive portion 22, the second conductive portion 23, and the third conductive portion 24 are provided at positions that do not overlap each other.

Using the first substrate 11 and the second substrate 21 as constituent members, one end of the second substrate 21 (the end on the one end 21c side) is inserted into the slits 15 and 16 of the first substrate 11, and the first substrate and one surface 11a of the first region alpha ₁ in 11, are superimposed and the other surface 21b of the second substrate 21, and the connecting portion 12a of the first conductive section 12 of the first substrate 11, second substrate 21 The connection part 24a of the third conductive part 24 is connected.
Further, the slits 15 and 16 of the first substrate 11, by the end of the second substrate 21 (an end portion of the one end 21c side) is inserted, the second region beta ₁ on the other surface 11b of the first substrate 11 And one surface 21a of the second substrate 21 is overlapped, and the connection portion 13a of the second conductive portion 13 of the first substrate 11 and the connection portion 23a of the second conductive portion 23 of the second substrate 21 are connected. The
Furthermore, one surface 11 a of the third region γ ₁ in the first substrate 11 is inserted into the slits 15, 16 of the first substrate 11 by inserting one end portion (end portion on the one end 21 c side) of the second substrate 21. And the other surface 21b of the second substrate 21 are overlapped, and the connection portion 14a of the third conductive portion 14 of the first substrate 11 and the connection portion 22a of the first conductive portion 22 of the second substrate 21 are connected. The
Thereby, the laminated wiring board 10 in which the first substrate 11 and the second substrate 21 are laminated at the respective one end portions is configured.

Further, as shown in FIG. 2, in the first region α ₂ where the first substrate 11 and the second substrate 21 overlap, the connection portion 12 a of the first conductive portion 12 of the first substrate 11 and the second substrate 21. The connection part 24a of the third conductive part 24 is connected. In addition, in the second region β ₂ where the first substrate 11 and the second substrate 21 overlap, the connection portion 13 a of the second conductive portion 13 of the first substrate 11 and the second conductive portion 23 of the second substrate 21. The connection part 23a is connected. Further, in the third region γ ₂ where the first substrate 11 and the second substrate 21 overlap each other, the connection portion 14 a of the third conductive portion 14 of the first substrate 11 and the first conductive portion 22 of the second substrate 21. The connection part 22a is connected.

Moreover, the connection part 12a of the 1st conductive part 12 of the 1st board | substrate 11 and the connection part 24a of the 3rd conductive part 24 of the 2nd board | substrate 21 are connected through the adhesive agent. Moreover, the connection part 13a of the 2nd conductive part 13 of the 1st board | substrate 11 and the connection part 23a of the 2nd conductive part 23 of the 2nd board | substrate 21 are connected via the adhesive agent. Further, the connection part 14a of the third conductive part 14 of the first substrate 11 and the connection part 22a of the first conductive part 22 of the second substrate 21 are connected via an adhesive.
The adhesive is not particularly limited as long as it is an adhesive generally used for bonding a wiring board or the like, but is not limited to anisotropic conductive adhesive film (ACF), non-conductive film (Non-conductive film, NCF). ), Anisotropic conductive paste (ACP), non-conductive particle paste (NCP), and the like.

  The means for laminating and fixing the first substrate 11 and the second substrate 21 (hereinafter abbreviated as “fixing means”) is not particularly limited, but the first substrate 11 and the second substrate 21 are sandwiched together. For example, an adhesive for bonding the first substrate 11 and the second substrate 21, and a resin layer provided on the surface of the first substrate 11 and / or the second substrate 21.

When an adhesive is used as the fixing means, first region alpha ₁ on one surface 11a of the first substrate 11, and / or, on the other surface 21b of the second substrate 21 facing the first region alpha _1, adhesive is provided, the second region beta ₁ on the other surface 11b of the first substrate 11, and / or on one surface 21a of the second substrate 21 facing the second region beta _1, both the adhesive is provided, third region gamma ₁ of the one surface 11a of the first substrate 11, and / or, on the other surface 21b of the second substrate 21 facing the third region gamma _1, the adhesive is provided.

Although it does not specifically limit as such an adhesive agent, The non-peeling pressure sensitive adhesive which cannot be peeled easily or cannot be peeled after sticking is used suitably.
As such a non-peelable pressure-sensitive adhesive, those conventionally used as conventional pressure-sensitive adhesives are used, and among them, an adhesive having a peeling force of 220 gf / 25 mm or more can be mentioned. Examples of such a non-peelable pressure-sensitive adhesive include natural rubber latex obtained by graft copolymerization of styrene and methyl methacrylate with natural rubber. This natural rubber latex is a suitable adhesive for the laminated wiring board 10 in terms of blocking resistance, heat resistance, wear resistance, and the like.

When using the resin layer as the fixing means, first region alpha ₁ on one surface 11a of the first substrate 11, and / or, on the other surface 21b of the second substrate 21 facing the first region alpha _1, the resin layer is provided, the second region beta ₁ on the other surface 11b of the first substrate 11, and / or on one surface 21a of the second substrate 21 facing the second region beta _1, both the resin layer is provided, third region gamma ₁ of the one surface 11a of the first substrate 11, and / or, on the other surface 21b of the second substrate 21 facing the third region gamma _1, the resin layer is provided. Then, the resin layer is melted by heating, and the first substrate 11 and the second substrate 21 are fused.
As the resin for forming such a resin layer, a thermoplastic resin is used. Among these, a thermoplastic resin having a relatively low melting point is preferable.

  As the first base material 11 and the second base material 21, at least in the surface layer portion, a woven fabric, a non-woven fabric, a mat, paper or the like made of inorganic fibers such as glass fiber and alumina fiber, or a combination thereof, polyester fiber, Woven fabrics, nonwoven fabrics, mats, papers, etc. made of organic fibers such as polyamide fibers, or combinations thereof, covering members formed by impregnating them with resin varnish, polyamide resin base materials, polyester resin bases Material, polyolefin resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin Base material, polycarbonate resin base material, acrylonitrile butadiene styrene copolymer resin base material Plastic base materials such as polyethersulfone resin base materials, (glass) epoxy resin base materials, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing. Or it selects from well-known things, such as what gave surface treatments, such as various easily bonding processes, and is used.

The first conductive portion 12 and the third conductive portion 14 are formed on one surface 11a of the first base material 11 by screen printing in a predetermined pattern using a polymer type conductive ink. A predetermined pattern is formed by ink jet printing using, and then fired, or a conductive foil is etched into a predetermined pattern, or a predetermined pattern is formed by metal plating. .
The second conductive portion 13 is formed on the other surface 11 b of the first base material 11 in the same manner as the first conductive portion 12 and the third conductive portion 14.
The first conductive portion 22 and the third conductive portion 24 are formed on the other surface 21 b of the second base material 21 in the same manner as the first conductive portion 12 and the third conductive portion 14.
Further, the second conductive portion 23 is formed on the one surface 21 a of the second base material 21 in the same manner as the first conductive portion 12 and the third conductive portion 14.

  Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is used.

If a thermosetting resin is used as the resin composition, the polymer-type conductive ink is 200 ° C. or less, for example, about 100 to 150 ° C., the first conductive portion 12, the second conductive portion 13, the third conductive portion 14, the first It becomes the thermosetting type which can form the coating film which makes the electroconductive part 22, the 2nd electroconductive part 23, and the 3rd electroconductive part 24. FIG. The path of the coating film forming the first conductive part 12, the second conductive part 13, the third conductive part 14, the first conductive part 22, the second conductive part 23, and the third conductive part 24 forms a coating film. The conductive fine particles are formed by contacting each other, and the resistance value of this coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

  The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone, or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 fine conductive particles. More than 10% by mass and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), thermoplastic A resin resin or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinkable type or a crosslinked / crosslinked resin. A thermoplastic combination type is preferably used.

  Examples of the solvent volatile conductive ink include those in which 50 to 80% by mass of metal nanoparticles having an average particle diameter of 1 to 10 nm are blended in a volatile solvent, or those in which 10 to 50% by mass of a pyrolytic metal salt is blended. Is used.

Moreover, as conductive foil which makes the 1st conductive part 12, the 2nd conductive part 13, the 3rd conductive part 14, the 1st conductive part 22, the 2nd conductive part 23, and the 3rd conductive part 24, copper foil, silver foil, Gold foil, platinum foil, aluminum foil, etc. are mentioned.
Furthermore, as the metal plating forming the first conductive portion 12, the second conductive portion 13, the third conductive portion 14, the first conductive portion 22, the second conductive portion 23, and the third conductive portion 24, copper plating, silver plating, Examples thereof include gold plating and platinum plating.

According to this laminated wiring board 10, one end of the second substrate 21 is inserted into the slits 15 and 16 of the first substrate 11, and one end (one end 11c) of the first substrate 11 is formed with the slits 15 and 16 as a boundary. end on a side) and has been superimposed are cross one end portion of the second substrate 21, the connection portion of the first conductive portion 12 provided in the first region alpha ₁ on one surface 11a of the first substrate 11 12a and a connection portion 24a of the third conductive portion 24 provided on the other surface 21b of the second substrate 21 are in contact on the same plane, the second region beta ₁ on the other surface 11b of the first substrate 11 The connection portion 13a of the second conductive portion 13 provided on the second surface and the connection portion 23a of the second conductive portion 23 provided on the one surface 21a of the second substrate 21 are brought into contact with each other on the same surface. the provided third region gamma ₁ of the one surface 11a of the substrate 11 Since the connecting portion 14a of the conductive portion 14 and the connecting portion 22a of the first conductive portion 22 provided on the other surface 21b of the second substrate 21 are in contact with each other on the same surface, like a conventional multilayer wiring board The first conductive portion 12 of the first substrate 11 and the third conductive portion of the second substrate 21 between one end portion of the stacked first substrate 11 and one end portion of the second substrate 21 without through a through hole. 24 is electrically connected, and the second conductive portion 13 of the first substrate 11 and the second conductive portion 23 of the second substrate 21 are electrically connected. The first conductive portions 22 of the two substrates 21 can be electrically connected. Moreover, one end part of the 1st board | substrate 11 and the one end part of the 2nd board | substrate 21 cross | intersect with the slits 15 and 16 as a boundary, One surface 11a of the 1st board | substrate 11 and the 2nd board | substrate 21 in 1st area | region (alpha) ₂ are crossed. overlap the other surface 21b, in the second region beta ₂ on one surface 21a overlap the other surface 11b and the second substrate 21 of the first substrate 11, further, in the third region gamma ₂ one of the first substrate 11 Since the surface 11a and the other surface 21b of the second substrate 21 overlap each other, for example, than when the one surface 11a of the first substrate 11 and the one surface 21a of the second substrate 21 are overlapped, Between the connection part 12a of the first conductive part 12 of the first substrate 11 and the connection part 24a of the third conductive part 24 of the second substrate 21, the connection part 13a of the second conductive part 13 of the first substrate 11 and the second substrate 21 of the connecting portion 23a of the second conductive portion 23 , And at between the connection portion 14a of the third conductive portion 14 of the first substrate 11 and the connecting portion 22a of the first conductive section 22 of the second substrate 21, the connection is stable, it can prevent displacement.

Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced. Furthermore, since the laminated wiring board 10 is not provided with a through hole, even if two boards are laminated, it is thin and excellent in flexibility.
In addition, in the first region α ₂ where the first substrate 11 and the second substrate 21 overlap, the connection portion 12 a of the first conductive portion 12 of the first substrate 11 and the third conductive portion 24 of the second substrate 21. In the second region β ₂ in which the connection portion 24 a is connected and the first substrate 11 and the second substrate 21 overlap, the connection portion 13 a of the second conductive portion 13 of the first substrate 11 and the second region 21 of the second substrate 21. In the third region γ ₂ where the connection part 23a of the second conductive part 23 is connected and the first substrate 11 and the second substrate 21 overlap, the connection part 14a of the third conductive part 14 of the first substrate 11 and Since the connection part 22a of the first conductive part 22 of the second substrate 21 is connected, even if the laminated wiring board 10 is bent, it is possible to prevent peeling at these connection parts.

  In this embodiment, the first substrate 11 is a multilayer wiring board in which the first conductive portion 12 and the third conductive portion 14 are provided on one surface 11a, and the second conductive portion 13 is provided on the other surface 11b. However, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, two or more conductive portions are provided on one surface of the first region of the first substrate, or two on the other surface of the second region of the first substrate. The above conductive parts may be provided, or two or more conductive parts may be provided on one surface of the third region of the first substrate. Correspondingly, two or more conductive portions may be provided on one surface of the second substrate, or four or more conductive portions may be provided on the other surface of the second substrate. .

Moreover, in this embodiment, although the laminated wiring board 10 provided with the 1st electroconductive part 12, the 2nd electroconductive part 13, and the 3rd electroconductive part 14 along the longitudinal direction of the 1st board | substrate 11 was illustrated, this invention The laminated wiring board is not limited to this. In the multilayer wiring board of the present invention, the conductive portion provided on one surface and the other surface of the first substrate may not extend along the longitudinal direction of the first substrate.
Moreover, in this embodiment, although the laminated wiring board 10 provided with the 1st conductive part 22, the 2nd conductive part 23, and the 3rd conductive part 24 along the longitudinal direction of the 2nd board | substrate 21 was illustrated, this invention is shown. The laminated wiring board is not limited to this. In the multilayer wiring board of the present invention, the conductive portion provided on one surface and the other surface of the second substrate may not extend along the longitudinal direction of the second substrate.

Further, in this embodiment, the multilayer wiring substrate 10 in which the slits 15 and 16 extending to the vicinity of the central portion of the first substrate 11 are provided at substantially equal intervals with the one end 11c of the first substrate 11 as the base end is illustrated. However, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the length and interval of the slits are appropriately adjusted according to the position of the connecting portion of the conductive portion provided on each substrate.
Further, in this embodiment, the first substrate 11 having only the first conductive portion 12, the second conductive portion 13, and the third conductive portion 14, the first conductive portion 22, the second conductive portion 23, and the third conductive portion 24. Although the laminated wiring board 10 provided with the second board 21 having only the above is illustrated, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the first substrate and / or the second substrate may include an electronic component such as an IC chip, various display elements, various light receiving elements, and the like.

(2) Second Embodiment FIG. 3 is a schematic perspective view showing a second embodiment of the first substrate constituting the multilayer wiring board of the present invention.
The first substrate 31 of this embodiment has two slits 35 and 36 extending from the end 31c of the first substrate 31 to the inner side (near the center of the first substrate 31) along the longitudinal direction. They are provided at approximately equal intervals.
The slits 35 and 36 are groove-shaped cuts having a rectangular shape in plan view, and the first substrate 31 has a first region α ₃ and a second region provided in order with the slits 35 and 36 as a boundary. β ₃ and third region γ ₃ , first region α ₃ and second region β ₃ are separated by slit 35, and second region β ₃ and third region γ ₃ are separated by slit 36. Yes.
The first region α ₃ , the second region β _3, and the third region γ ₃ are bent in the longitudinal direction of the first substrate 31 with the two slits 35 and 36 as a boundary.

Further, on one surface 31a of the first substrate 31, along the longitudinal direction, the other end 31d of the first substrate 31 as a base end, the first conductive portion 32 that extends to a first region alpha ₃ is provided ing. The connecting portion 32a of the first conductive section 32 is disposed in a central portion of the first region alpha _3.
On the other surface of the first substrate 31, along the longitudinal direction, the other end 31d of the first substrate 31 as a base end, and the second conductive portion 33 is provided extending to the second region beta ₃ Yes. The connecting portion 33a of the second conductive portion 33 is disposed in a central portion of the second region beta _3.
Further, on one surface 31a of the first substrate 31, along the longitudinal direction, the other end 31d of the first substrate 31 as a base end, the third conductive portion 34 that extends to the third region gamma ₃ is provided ing. The connecting portion 34a of the third conductive portion 34 is disposed in a central portion of the third region gamma _3.

As the 1st board | substrate 31, the thing similar to the above-mentioned 1st embodiment is used.
As the 1st electroconductive part 32, the 2nd electroconductive part 33, and the 3rd electroconductive part 34, the thing similar to the above-mentioned 1st embodiment is used.

According to such a laminated wiring board using the first substrate 31, the slits 35, 36 of the first substrate 31 are in a groove shape having a rectangular shape in plan view. When one end of the second substrate 21 is inserted, the first substrate 31 and the second substrate 21 are less bent in the slits 35 and 36 than the laminated wiring substrate 10, and the first substrate 31 Between the connection part 32 a of the conductive part 32 and the connection part 24 a of the third conductive part 24 of the second substrate 21, the connection part 33 a of the second conductive part 33 of the first substrate 31 and the second conductive part 23 of the second substrate 21. Between the connection portions 23a of the first substrate 31 and between the connection portions 34a of the third conductive portion 34 of the first substrate 31 and the connection portions 22a of the first conductive portion 22 of the second substrate 21. Force is difficult to act on, the connection is stable, not positioned It can be prevented.
Further, the multilayer wiring board using the first substrate 31 has the same effect as the above-described multilayer wiring board 10.

(3) Third Embodiment FIG. 4 is a schematic perspective view showing a third embodiment of the first substrate constituting the multilayer wiring board of the present invention.
The first substrate 41 of this embodiment has two slits 45 and 46 extending inward (near the central portion of the first substrate 41) along the longitudinal direction with the one end 41c of the first substrate 41 as a base end. They are provided at approximately equal intervals.
The slits 45 and 46 are groove-shaped cuts having a triangular shape in plan view, and the first substrate 41 has a first region α ₄ and a second region provided in order with the slits 45 and 46 as a boundary. β ₄ and the third region γ ₄ , the first region α ₄ and the second region β ₄ are separated by the slit 45, and the second region β ₄ and the third region γ ₄ are separated by the slit 46. Yes. The slits 45 and 46 have a shape in which a triangular bottom surface is arranged at one end 41 c of the first substrate 41 and a triangular vertex is arranged inside the first substrate 41.
The first region α ₄ , the second region β _4, and the third region γ ₄ are bent in the longitudinal direction of the first substrate 41 with the two slits 45 and 46 as a boundary.

Further, on one surface 41a of the first substrate 41, along the longitudinal direction, the other end 41d of the first substrate 41 as a base end, the first conductive portion 42 that extends to a first region alpha ₄ is provided ing. The connecting portion 42a of the first conductive section 42 is disposed in a central portion of the first region alpha _4.
On the other surface of the first substrate 41, along the longitudinal direction, the other end 41d of the first substrate 41 as a base end, and the second conductive portion 43 is provided extending to the second region beta ₄ Yes. The connecting portion 43a of the second conductive section 43 is disposed in a central portion of the second region beta _4.
Further, on one surface 41a of the first substrate 41, along the longitudinal direction, the other end 41d of the first substrate 41 as a base end, a third conductive portion 44 that extends to the third region gamma ₄ provided ing. The connecting portion 44a of the third conductive portion 44 is disposed in a central portion of the third region gamma _4.

As the 1st board | substrate 41, the thing similar to the above-mentioned 1st embodiment is used.
As the 1st electroconductive part 42, the 2nd electroconductive part 43, and the 3rd electroconductive part 44, the thing similar to the above-mentioned 1st embodiment is used.

According to such a multilayer wiring board using the first substrate 41, the slits 45 and 46 of the first substrate 41 have a groove shape that forms a triangular shape in plan view. When one end of the second substrate 21 is inserted, the first substrate 41 and the second substrate 21 are less bent at the slits 45 and 46 than the laminated wiring substrate 10, and the first substrate 41 Between the connection part 42 a of the conductive part 42 and the connection part 24 a of the third conductive part 24 of the second substrate 21, the connection part 43 a of the second conductive part 43 of the first substrate 41 and the second conductive part 23 of the second substrate 21. Between the connection portions 23a of the first substrate 41 and between the connection portions 44a of the third conductive portion 44 of the first substrate 41 and the connection portions 22a of the first conductive portion 22 of the second substrate 21. Force is difficult to act on, the connection is stable, not positioned It can be prevented.
Further, the multilayer wiring board using the first substrate 41 has the same effect as the above-described multilayer wiring board 10.

(4) Fourth Embodiment FIG. 5 is a schematic exploded perspective view showing a fourth embodiment of the multilayer wiring board of the present invention. 6A and 6B are schematic views showing a fourth embodiment of the multilayer wiring board of the present invention, in which FIG. 6A is a perspective view and FIG. 6B is a cross-sectional view taken along line BB in FIG.
The laminated wiring board 50 of this embodiment includes a first substrate 51 having a first conductive portion 52, a second conductive portion 53, a third conductive portion 54, and a fourth conductive portion 55, a first conductive portion 62, and a second conductive portion. A second substrate 61 having a portion 63, a third conductive portion 64, and a fourth conductive portion 65 is schematically configured.

The first substrate 51 has substantially three slits 56, 57, 58 extending inward (near the central portion of the first substrate 11) along the longitudinal direction with the one end 51c of the first substrate 51 as a base end. It is provided at equal intervals.
The three slits 56, 57, and 58 are linear cuts provided in the first substrate 51. The first substrate 51 is provided in order with the three slits 56, 57, and 58 as boundaries. the first region alpha _{5 was,} the second region beta _5, has a third region gamma ₅ and the fourth region [delta] _5, the first region alpha ₅ is the second region beta ₅ in contact with the slit 56, the second region beta ₅ and the third region γ ₅ are in contact with each other through the slit 57, and the third region γ ₅ and the fourth region δ ₅ are in contact with each other through the slit 58.
The first region α ₅ , the second region β ₅ , the third region γ _5, and the fourth region δ ₅ are bent in the longitudinal direction of the first substrate 51 with the three slits 56, 57, 58 as boundaries. It has become.

On the other surface 51b of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, the first conductive portion 52 extending to first areas alpha ₅ provided ing. The connecting portion 52a of the first conductive section 52 is disposed in a central portion of the first region alpha _5.
Further, on one surface 51a of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, the second conductive portion 53 extending to the second region beta ₅ is provided ing. The connecting portion 53a of the second conductive section 53 is disposed in a central portion of the second region beta _5.
On the other surface 51b of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, the third conductive portion 54 that extends to the third region gamma ₅ is provided ing. The connecting portion 54a of the third conductive portion 54 is disposed in the central portion of the third region gamma _5.
Further, on one surface 51a of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, the fourth conductive portion 55 is provided extending to the fourth region [delta] ₅ ing. The connecting portion 55a of the fourth conductive portion 55 is disposed in a central portion of the fourth region [delta] _5.
That is, in the first substrate 51, the first conductive portion 52, the second conductive portion 53, the third conductive portion 54, and the fourth conductive portion 55 are provided at positions that do not overlap each other.

On the other hand, on the other surface 61b of the second substrate 61, one of the regions obtained by dividing the second substrate 61 into substantially equal parts (region on one long side of the second substrate 61) is along the longitudinal direction. A first conductive portion 62 is provided that has the other end 61d of the second substrate 61 as a base end and extends to the one end 61c side (near one end portion of the second substrate 61). Further, the connection portion 62 a of the first conductive portion 62 is disposed at one end portion of the second substrate 61.
In addition, on one surface 61a of the second substrate 61, one of the regions obtained by dividing the second substrate 61 into substantially equal parts (region of the central portion of the second substrate 61) has a second substrate along the longitudinal direction. A second conductive portion 63 is provided that has the other end 61d of 61 as a base end and extends to the one end 61c side (near one end portion of the second substrate 61). Further, the connection portion 63 a of the second conductive portion 63 is disposed at one end portion of the second substrate 61.
In addition, on the other surface 61b of the second substrate 61, one of the regions obtained by dividing the second substrate 61 into four substantially equal parts (a central region of the second substrate 61) is arranged along the longitudinal direction with the second substrate 61b. A third conductive portion 64 is provided that has the other end 61d of 61 as a base end and extends to the one end 61c side (near one end portion of the second substrate 61). Further, the connection portion 64 a of the third conductive portion 64 is disposed at one end portion of the second substrate 61.
Further, on one surface 61a of the second substrate 61, one of the regions obtained by dividing the second substrate 61 into almost equal parts (region on the other long side of the second substrate 61) is arranged along the longitudinal direction. A fourth conductive portion 64 is provided that has the other end 61d of the second substrate 61 as a base end and extends to the one end 61c side (near one end portion of the second substrate 61). Further, the connection portion 64 a of the fourth conductive portion 64 is disposed at one end portion of the second substrate 61.
That is, in the second substrate 61, the first conductive portion 62, the second conductive portion 63, the third conductive portion 64, and the fourth conductive portion 65 are provided at positions that do not overlap each other.

Using the first substrate 51 and the second substrate 61 as components, one end of the second substrate 61 (the end on the one end 61c side) is inserted into the slits 56, 57, 58 of the first substrate 51, and the other surface 51b of the first region alpha ₅ in the first substrate 51 and one surface 61a is superimposed in the second substrate 61, and the connecting portion 52a of the first conductive section 52 of the first substrate 51, second substrate The connection part 65a of the fourth conductive part 65 of 61 is connected.
Further, the slits 56, 57 and 58 of the first substrate 51, by the end of the second substrate 61 (an end portion of the one end 61c side) is inserted, one of the second region beta ₅ in the first substrate 51 The surface 51a and the other surface 61b of the second substrate 61 are overlapped, and the connection portion 53a of the second conductive portion 53 of the first substrate 51 and the connection portion 64a of the third conductive portion 64 of the second substrate 61 are formed. Connected.
Further, the other end of the third region γ ₅ in the first substrate 51 is inserted into the slits 56, 57, 58 of the first substrate 51 by inserting one end portion (the end portion on the one end 61 c side) of the second substrate 61. The surface 51b and one surface 61a of the second substrate 61 are overlapped, and the connection portion 54a of the third conductive portion 54 of the first substrate 51 and the connection portion 63a of the second conductive portion 63 of the second substrate 61 are formed. Connected.
Furthermore, one end of the second substrate 61 (the end on the one end 61 c side) is inserted into the slits 56, 57, 58 of the first substrate 51, whereby one of the fourth regions δ ₅ in the first substrate 51 is inserted. The surface 51 a and the other surface 61 b of the second substrate 61 are overlapped, and the connection portion 55 a of the fourth conductive portion 55 of the first substrate 51 and the connection portion 62 a of the first conductive portion 62 of the second substrate 61 are formed. Connected.
Thereby, the laminated wiring board 50 in which the first substrate 51 and the second substrate 61 are laminated at the respective one end portions is configured.

Further, as shown in FIG. 6, in the first region α ₆ where the first substrate 51 and the second substrate 61 overlap, the connection portion 52 a of the first conductive portion 52 of the first substrate 51 and the second substrate 61. The connection portion 65a of the fourth conductive portion 65 is connected. Further, in the second region β ₆ in which the first substrate 51 and the second substrate 61 overlap, the connection portion 53 a of the second conductive portion 53 of the first substrate 51 and the third conductive portion 64 of the second substrate 61. The connection part 64a is connected. In addition, in the third region γ ₆ where the first substrate 51 and the second substrate 61 overlap, the connection portion 54 a of the third conductive portion 54 of the first substrate 51 and the second conductive portion 63 of the second substrate 61. The connection part 63a is connected. Further, in the first region δ ₆ where the first substrate 51 and the second substrate 61 overlap, the connection portion 55 a of the fourth conductive portion 55 of the first substrate 51 and the first conductive portion 62 of the second substrate 61 are arranged. The connection part 62a is connected.

Further, the connection part 52a of the conductive part 52 of the first substrate 51 and the connection part 65a of the fourth conductive part 65 of the second substrate 61 are connected via an adhesive. Moreover, the connection part 53a of the 2nd conductive part 53 of the 1st board | substrate 51 and the connection part 64a of the 3rd conductive part 64 of the 2nd board | substrate 61 are connected through the adhesive agent. Further, the connection part 54a of the third conductive part 54 of the first substrate 51 and the connection part 63a of the second conductive part 63 of the second substrate 61 are connected via an adhesive. Furthermore, the connection part 55a of the fourth conductive part 55 of the first substrate 51 and the connection part 62a of the first conductive part 62 of the second substrate 61 are connected via an adhesive.
As the adhesive, the same adhesive as in the first embodiment described above is used.

The means for laminating and fixing the first substrate 51 and the second substrate 61 is not particularly limited, but mechanical means such as sandwiching the first substrate 51 and the second substrate 61 together, the first substrate 51 and the second substrate 61 Examples thereof include an adhesive for bonding the two substrates 61, a resin layer provided on the surface of the first substrate 51 and / or the second substrate 61, and the like.
As the adhesive and the resin layer, the same ones as in the first embodiment described above are used.

As the 1st board | substrate 51 and the 2nd board | substrate 61, the thing similar to the above-mentioned 1st embodiment is used.
As the first conductive part 52, the second conductive part 53, the third conductive part 54, the fourth conductive part 55, the first conductive part 62, the second conductive part 63, the third conductive part 64 and the fourth conductive part 65, The thing similar to the above-mentioned 1st embodiment is used.

According to this multilayer wiring substrate 50, one end of the second substrate 61 is inserted into the slits 56, 57, 58 of the first substrate 51, and one end of the first substrate 51 is formed with the slits 56, 57, 58 as boundaries. part (end 51c side of the end portion) and has one end superimposed is the intersection of the second substrate 61, first conductive portion provided on the first region alpha ₅ in the other surface 51b of the first substrate 51 52 and the connecting portion 52a, a connecting portion 65a of the fourth conductive portion 65 provided on one surface 61a of the second substrate 61 are in contact on the same plane, of the second region beta ₅ in the first substrate 51 The connection portion 53a of the second conductive portion 53 provided on one surface 51a and the connection portion 64a of the third conductive portion 64 provided on the other surface 61b of the second substrate 61 are brought into contact with each other on the same surface, provided in the third area gamma ₅ of the other surface 51b of the first substrate 51 The connection portion 54a of the third conductive portion 54 and the connection portion 63a of the second conductive portion 63 provided on one surface 61a of the second substrate 61 are brought into contact with each other on the same surface. four connecting portion 55a of the fourth conductive portion 55 provided on one surface 51a of the region [delta] _5, the connecting portion 62a is on the same surface of the first conductive portion 62 provided on the other surface 61b of the second substrate 61 So that the first substrate 51 is placed between one end portion of the laminated first substrate 51 and one end portion of the second substrate 61 without using a through hole as in the conventional laminated wiring substrate. The first conductive portion 52 and the fourth conductive portion 65 of the second substrate 61 are electrically connected, and the second conductive portion 53 of the first substrate 51 and the third conductive portion 64 of the second substrate 61 are electrically connected. , Electrically connecting the third conductive portion 54 of the first substrate 51 and the second conductive portion 63 of the second substrate 61, Et al, it is possible to connect the fourth conductive portion 55 of the first substrate 51 of the first conductive portion 62 of the second substrate 61 electrically. Further, the slits 56, 57 and 58 as a boundary, one end of the one end portion and the second substrate 61 of the first substrate 51 intersect in a first region alpha ₆ and the other surface 51b of the first substrate 51 second substrate one surface 61a of the 61 overlap, in the second region beta ₆ one surface 51a and the other surface 61b of the second substrate 61 overlap the first substrate 51, in the third region gamma ₆ other of the first substrate 51 one face 61a overlap surface 51b and the second substrate 61, further, since the other surface 61b of the fourth region [delta] ₆ with one surface 51a of the first substrate 51 second substrate 61 overlap each other, simply, For example, compared with the case where one surface 51 a of the first substrate 51 and one surface 61 a of the second substrate 61 are overlapped, the connection portion 52 a of the first conductive portion 52 and the second substrate 61 of the first substrate 51 are overlapped. Connection portion 6 of the fourth conductive portion 65 a between the connection portion 53a of the second conductive portion 53 of the first substrate 51 and the connection portion 64a of the third conductive portion 64 of the second substrate 61, and the connection portion 54a of the third conductive portion 54 of the first substrate 51. And the connection part 63a of the second conductive part 63 of the second substrate 61 and the connection part 55a of the fourth conductive part 55 of the first substrate 51 and the connection part 62a of the first conductive part 62 of the second substrate 61. In the meantime, the connection is stable and misalignment can be prevented.

Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced. Further, since the laminated wiring board 50 is not provided with a through hole, even if two boards are laminated, it is thin and excellent in flexibility.
In addition, in the first region α ₆ where the first substrate 51 and the second substrate 61 overlap, the connection portion 52 a of the first conductive portion 52 of the first substrate 51 and the fourth conductive portion 65 of the second substrate 61. In the second region β ₆ in which the connection portion 65 a is connected and the first substrate 51 and the second substrate 61 overlap, the connection portion 53 a of the second conductive portion 53 of the first substrate 51 and the second region 61 of the second substrate 61. In the third region γ ₆ where the connection part 64 a of the three conductive parts 64 is connected and the first substrate 51 and the second substrate 61 overlap, the connection part 54 a of the third conductive part 54 of the first substrate 51, connected connecting portion 63a of the second conductive portion 63 of the second substrate 61, further, in the fourth region δ ₆ of the first substrate 51 second substrate 61 overlap, the fourth conductive portion of the first substrate 51 55 The connection part 55a and the first conductive part 62 of the second substrate 61 are connected. Since 62a is connected, even if bending the multilayer wiring board 50, it is possible to prevent the peeling at these connections.

  In this embodiment, the first substrate 51 is provided with the second conductive portion 53 and the fourth conductive portion 55 on one surface 51a, and the first conductive portion 52 and the third conductive portion 54 on the other surface 51b. Although the provided laminated wiring board 50 is illustrated, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, two or more conductive portions are provided on one surface of the first region of the first substrate, or two on the other surface of the second region of the first substrate. The above conductive portions are provided, or two or more conductive portions are provided on one surface of the third region of the first substrate, or two are provided on one surface of the fourth region of the first substrate. The above conductive part may be provided. Correspondingly, four or more conductive portions may be provided on one surface of the second substrate, or four or more conductive portions may be provided on the other surface of the second substrate. .

In this embodiment, the laminated wiring board 50 provided with the first conductive portion 52, the second conductive portion 53, the third conductive portion 54, and the fourth conductive portion 55 is provided along the longitudinal direction of the first substrate 51. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the conductive portion provided on one surface and the other surface of the first substrate may not extend along the longitudinal direction of the first substrate.
In this embodiment, the laminated wiring board 50 provided with the first conductive portion 62, the second conductive portion 63, the third conductive portion 64, and the fourth conductive portion 65 is provided along the longitudinal direction of the second substrate 61. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board according to the present invention, the conductive portions provided on one surface and the other surface of the second substrate may not extend along the longitudinal direction of the second plate.

Further, in this embodiment, the multilayer wiring board 50 in which slits 56, 57, 58 extending from the one end 51c of the first substrate 51 to the vicinity of the central portion of the first substrate 51 are provided at substantially equal intervals. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the length and interval of the slits are appropriately adjusted according to the position of the connecting portion of the conductive portion provided on each substrate.
Furthermore, in this embodiment, the first substrate 51 having only the first conductive portion 52, the second conductive portion 53, the third conductive portion 54, and the fourth conductive portion 55, the first conductive portion 62, and the second conductive portion 63. Although the multilayer wiring board 50 including the second substrate 61 having only the third conductive portion 64 and the fourth conductive portion 65 is illustrated, the multilayer wiring substrate of the present invention is not limited to this. In the multilayer wiring board of the present invention, the first substrate and / or the second substrate may include an electronic component such as an IC chip, various display elements, various light receiving elements, and the like.

  Moreover, in 1st-3rd embodiment, the case where a 1st base material has three area | regions which make two boundaries a boundary is illustrated, and in 4th embodiment, a 1st base material has three slits. Although the case of having four regions as boundaries is exemplified, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the first substrate may have five or more regions having four or more slits as a boundary.

  In the first to fourth embodiments, the shape of the slit is linear, rectangular in plan view, or triangular in plan view. However, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the shape of the slit may be a circular shape in plan view, a semicircular shape in plan view, or an elliptical shape in plan view.

1 is a schematic exploded perspective view showing a first embodiment of a multilayer wiring board of the present invention. It is the schematic which shows 1st embodiment of the multilayer wiring board of this invention, (a) is a perspective view, (b) is sectional drawing which follows the AA line of (a). It is a schematic perspective view which shows 2nd embodiment of the 1st board | substrate which comprises the laminated wiring board of this invention. It is a schematic perspective view which shows 3rd embodiment of the 1st board | substrate which comprises the laminated wiring board of this invention. It is a schematic exploded perspective view which shows 4th embodiment of the laminated wiring board of this invention. It is the schematic which shows 4th embodiment of the laminated wiring board of this invention, (a) is a perspective view, (b) is sectional drawing which follows the BB line of (a).

Explanation of symbols

10, 50 ... laminated wiring board, 11, 31, 41, 51 ... first substrate, 21, 61 ... second substrate, 12, 22, 32, 42, 52, 62 ... first Conductive part, 12a, 13a, 14a, 22a, 23a, 24a, 32a, 33a, 34a, 42a, 43a, 44a, 52a, 53a, 54a, 55a, 62a, 63a, 64a, 65a. 23, 33, 43, 53, 63 ... second conductive part, 14, 24, 34, 44, 54, 64 ... third conductive part, 55, 65 ... fourth conductive part, 15, 16 , 35, 36, 45, 46, 56, 57, 58... Slits.

Claims (1)

The first substrate and the second substrate are laminated wiring boards formed by laminating at least a part of each,
The first substrate has three or more regions bounded by two or more slits extending inward from one end,
The two or more slits are spaced apart from each other;
One end of the second substrate is inserted into the two or more slits of the first substrate, and the first substrate and the second substrate are crossed and overlapped with each other with the two or more slits as a boundary. ,
At least one conductive portion provided on a surface of the first substrate facing the second substrate is connected to at least one conductive portion provided on a surface of the second substrate facing the first substrate. A laminated wiring board characterized by that.

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