JP2010153574A - Multilayer wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multilayer wiring substrate in which two stacked substrates can have their conductive portions stably connected to each other not through a through hole. <P>SOLUTION: The multilayer wiring substrate 10 is formed by stacking a first substrate 11 and a second substrate 21, and those two substrates each have three regions bordering on one another across two slits, which are provided mutually at intervals. Two slits provided to the second substrate 21 are inserted into two slits provided to the first substrate 11, the first substrate 11 and second substrate 21 are crossed and put one over the other bordering on each other across the slits, and at least one conductive portion provided on a surface of the first substrate 11 which faces the second substrate 21 and at lest one conductive portion provided to a surface of the second substrate 21 which faces the first substrate 11 are connected to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a laminated wiring board formed by laminating two substrates having conductive portions, and more particularly to a laminated wiring board that is thin and excellent in flexibility even when laminated.

  Conventionally, in a multilayer wiring board formed by laminating a plurality of wiring boards, a through hole penetrating the board is provided, and the wiring boards are connected to each other through the through hole.

Further, a non-contact type data receiving / transmitting body (non-contact type IC card or the like) called RFID (Radio Frequency Identification) is called an inlet in which an antenna is formed on a base material and an IC chip is mounted. It is produced by sticking to other base materials.
In such a non-contact type data transmission / reception body, for example, a plurality of antenna patterns are generally wound in a loop shape or a spiral shape for communication in an inlet made of a base material such as paper or film. It is known that an IC chip is mounted by crossing a jumper wiring between the contact points at both ends of the antenna pattern via an insulating layer provided across the antenna pattern (see, for example, Patent Document 1). . Here, the insulating layer is provided in order to prevent a short circuit between the antenna pattern and the jumper wiring.

  Also, in the non-contact type data receiving / transmitting body, in order to prevent a short circuit between the antenna pattern and the jumper wiring, an insulating layer is not provided across the antenna pattern, but through a through hole provided in the base material. It is known that a jumper wiring connected to a through hole is provided on the surface of the substrate opposite to the surface on which the antenna pattern is formed (see, for example, Patent Document 2).

Further, the communication circuit holder includes a base material having three regions connected to each other, an antenna pattern arranged in the first region, and a jumper wiring arranged in the third region. Disclosed is one in which both ends of an antenna pattern and both ends of a jumper wiring are electrically connected when the three regions are overlapped by bending (for example, Patent Documents) 3).
JP 2002-074310 A JP 2003-006589 A JP 2005-241011 A

  However, the conventional laminated wiring board has a problem that it is difficult to ensure conduction between the wiring boards because a plurality of wiring boards are laminated through the through holes. Moreover, in order to manufacture a multilayer wiring board, since it is necessary to form a through hole, there existed a problem that there were many manufacturing processes and manufacturing cost was high.

In addition, the non-contact type data receiver / transmitter disclosed in Patent Document 1 has many manufacturing processes because an insulating layer is provided across the antenna pattern and a jumper wiring is provided on the insulating layer. There was a problem that the manufacturing cost was high.
Moreover, since the antenna pattern and the jumper wiring are connected to each other through the through hole in the non-contact type data receiver / transmitter disclosed in Patent Document 2, it is difficult to ensure the continuity between the antenna pattern and the jumper wiring. was there. Further, in order to manufacture this non-contact type data transmitting / receiving body, it is necessary to form a through hole, so that there are many manufacturing processes and a high manufacturing cost.

  Furthermore, the circuit holder for communication disclosed in Patent Document 3 was overlapped in order to ensure electrical continuity between the antenna pattern in the first region and the jumper wiring in the third region after the base material was bent. The base material needs to be pressure-bonded, and the continuity may not be sufficiently secured depending on the force applied during pressure-bonding.

  The present invention has been made in view of the above circumstances, and is capable of stably connecting a conductive portion of each substrate between two stacked substrates without through a through hole. An object is to provide a substrate.

  The multilayer wiring board of the present invention is a multilayer wiring board in which two substrates are laminated at least in part, and each of the two substrates has two or more extending from one end toward the inside. There are three or more regions with a slit as a boundary, and the two or more slits are provided at a distance from each other, and each of the two or more slits provided on one of the two substrates is provided. Each of the two or more slits provided on the other of the two substrates is inserted, and the two substrates are crossed and overlapped with each other with the two or more slits as a boundary. In one of the substrates, at least one conductive portion provided on a surface facing the other of the two substrates, and in one of the two substrates, one of the two substrates. At least one conductive portion provided on the opposing surfaces is characterized in that it is connected to.

According to the multilayer wiring board of the present invention, the two substrates are laminated wiring boards that are laminated at least partially, and each of the two substrates extends from one end toward the inside. Three or more regions having the above slit as a boundary, the two or more slits are provided at intervals, and the two or more slits provided on one of the two substrates Each of the two or more slits provided on the other of the two substrates is inserted into each of the two substrates, and the two substrates are crossed and overlapped with the two or more slits as a boundary. In one of the two substrates, at least one conductive portion provided on a surface facing the other of the two substrates, and in the other of the two substrates, the second substrate Since at least one conductive portion provided on the surface facing one of the two is connected, one end portion of the first substrate and the second substrate are stacked without through holes as in the conventional multilayer wiring substrate. Between one end portion of the first substrate and the connection portion of the conductive portion provided on one surface of the first substrate and the connection portion of the conductive portion provided on the other surface of the second substrate abut on the same surface. Since the connecting portion of the conductive portion provided on the other surface of the first substrate and the connecting portion of the conductive portion provided on the one surface of the second substrate abut on the same surface, the conductive portion of the first substrate And the conductive part of the second substrate can be electrically connected. In addition, one end of the first substrate intersects with one end of the second substrate with the slit as a boundary, and one surface of the first substrate overlaps the other surface of the second substrate in the first region, and the second region Since the other surface of the first substrate and the one surface of the second substrate overlap each other, the connection is stable between the connection portion of the conductive portion of the first substrate and the connection portion of the conductive portion of the second substrate. Misalignment can be prevented.
Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced.
Furthermore, since the laminated wiring board of the present invention is not provided with a through hole, even if two boards are laminated, they are thin and excellent in flexibility.

The best mode of the multilayer wiring board of the present invention will be described.
This embodiment is specifically described for better understanding of the gist of the invention, and does not limit the present invention unless otherwise specified.

(1) First Embodiment FIG. 1 is a schematic exploded perspective view showing a first embodiment of the multilayer wiring board of the present invention. 2A and 2B are schematic views showing a first embodiment of the multilayer wiring board of the present invention, wherein FIG. 2A is a perspective view, and FIG. 2B is a cross-sectional view taken along line AA of FIG.
The laminated wiring board 10 of this embodiment includes a first substrate 11 having a first conductive portion 12, a second conductive portion 13, and a third conductive portion 14, a first conductive portion 22, a second conductive portion 23, and a third conductive portion. The second substrate 21 having the portion 24 is schematically configured.

The first substrate 11 has two slits 15 and 16 that are substantially equidistant along the longitudinal direction, with one end 11c of the first substrate 11 as a base end and extending to the inside (near the center of the first substrate 11). Is provided.
The two slits 15 and 16 are linear cuts provided in the first substrate 11, and the first substrate 11 is a first region provided in order with the two slits 15 and 16 as a boundary. α ₁ , second region β ₁ and third region γ ₁ , first region α ₁ and second region β ₁ are in contact with slit 15, and second region β ₁ and third region γ ₁ are slit 16. It touches at.
The first region α ₁ , the second region β _1, and the third region γ ₁ are bent in the longitudinal direction of the first substrate 11 with the two slits 15 and 16 as a boundary.

Further, on one surface 11a of the first substrate 11, along the longitudinal direction, the other end 11d of the first substrate 11 as a base end, the first conductive portion 12 is provided extending to the first region alpha ₁ ing. The connecting portion 12a of the first conductive section 12 is disposed in a central portion of the first region alpha _1.
On the other surface 11b of the first substrate 11, along the longitudinal direction, the other end 11d of the first substrate 11 as a base end, the second conductive portion 13 that extends to a second region beta ₁ is provided ing. The connecting portion 13a of the second conductive section 13 is disposed in a central portion of the second region beta _1.
Further, on one surface 11a of the first substrate 11, along the longitudinal direction, the other end 11d of the first substrate 11 as a base end, the third conductive portion 14 that extends to the third region gamma ₁ is provided ing. The connecting portion 14a of the third conductive section 14 is disposed in a central portion of the third region gamma _1.
That is, in the first substrate 11, the first conductive portion 12, the second conductive portion 13, and the third conductive portion 14 are provided at positions that do not overlap each other.

On the other hand, the second substrate 21 has two slits 25 and 26 extending in the longitudinal direction from the end 21c of the second substrate 21 to the inner side (near the center of the first substrate 21). It is provided at equal intervals.
The two slits 25 and 26 are linear cuts provided in the second substrate 21, and the second substrate 21 is a first region provided in order with the two slits 25 and 26 as a boundary. δ ₁ , second region ε ₁ and third region ζ ₁ , first region δ ₁ and second region ε ₁ are in contact with slit 25, and second region ε ₁ and third region ζ ₁ are slit 26. It touches at.
Further, the first region δ ₁ , the second region ε ₁ and the third region ζ ₁ are bent in the longitudinal direction of the second substrate 21 with the two slits 25 and 26 as a boundary.

On the other surface 21b of the second substrate 21, along the longitudinal direction, the other end 21d of the second substrate 21 as a base end, the first conductive portion 22 extending to the first region [delta] ₁ is provided ing. The connecting portions 22a of the first conductive section 22 is disposed in a central portion of the first region [delta] _1.
Further, on one surface 21a of the second substrate 21, along the longitudinal direction, the other end 21d of the second substrate 21 as a base end, the second conductive portion 23 that extends to a second region epsilon ₁ is provided ing. The connecting portion 23a of the second conductive section 23 is disposed in a central portion of the second region epsilon _1.
Further, the other surface 21b of the second substrate 21 is provided with a third conductive portion 24 extending in the longitudinal direction to the third region ζ ₁ with the other end 21d of the second substrate 21 as a base end. ing. The connecting portion 24a of the third conductive portion 24 is disposed in the central portion of the third region zeta _1.
That is, in the second substrate 21, the first conductive portion 22, the second conductive portion 23, and the third conductive portion 24 are provided at positions that do not overlap each other.

Using the first substrate 11 and the second substrate 21 as constituent members, the slits 25 and 26 of the second substrate 21 are inserted into the slits 15 and 16 of the first substrate 11, respectively. the each end of each end and slits 35 and 36 abut, and the one surface 11a of the first region alpha ₁ in the first substrate 11, a third region zeta ₁ on the other surface 21b of the second substrate 21 The connection part 12a of the 1st electroconductive part 12 of the 1st board | substrate 11 and the connection part 24a of the 3rd electroconductive part 24 of the 2nd board | substrate 21 are connected so that it may overlap.
Further, the slits 25 and 26 of the second substrate 21 are inserted into the slits 15 and 16 of the first substrate 11, respectively, and the ends of the slits 35 and 36 and the ends of the slits 35 and 36 are in contact with each other. It is by the, and the second region beta ₁ on the other surface 11b of the first substrate 11, is brought second region epsilon ₁ of one surface 21a is superimposed in the second substrate 21, the second of the first substrate 11 The connection part 13a of the conductive part 13 and the connection part 23a of the second conductive part 23 of the second substrate 21 are connected.
Further, the slits 25 and 26 of the second substrate 21 are inserted into the slits 15 and 16 of the first substrate 11, respectively, and the ends of the slits 35 and 36 and the ends of the slits 35 and 36 are in contact with each other. As a result, the one surface 11 a of the third region γ ₁ in the first substrate 11 and the other surface 21 b of the first region δ ₁ in the second substrate 21 are overlapped, and the third surface of the first substrate 11 is overlapped. The connection part 14a of the conductive part 14 and the connection part 22a of the first conductive part 22 of the second substrate 21 are connected.
Thereby, the laminated wiring board 10 in which the first substrate 11 and the second substrate 21 are laminated at the respective one end portions is configured.

Further, as shown in FIG. 2, in the first region α ₂ (ζ ₂ ) where the first substrate 11 and the second substrate 21 overlap, the connection portion 12 a of the first conductive portion 12 of the first substrate 11, The connection part 24a of the third conductive part 24 of the second substrate 21 is connected. In addition, in the second region β ₂ (ε ₂ ) where the first substrate 11 and the second substrate 21 overlap, the connection portion 13 a of the second conductive portion 13 of the first substrate 11 and the second region of the second substrate 21. The connection part 23a of the conductive part 23 is connected. Furthermore, in the third region γ ₂ (δ ₂ ) where the first substrate 11 and the second substrate 21 overlap, the connection portion 14 a of the third conductive portion 14 of the first substrate 11 and the first of the second substrate 21. A connecting portion 22a of the conductive portion 22 is connected.

Moreover, the connection part 12a of the 1st conductive part 12 of the 1st board | substrate 11 and the connection part 24a of the 3rd conductive part 24 of the 2nd board | substrate 21 are connected through the adhesive agent. Moreover, the connection part 13a of the 2nd conductive part 13 of the 1st board | substrate 11 and the connection part 23a of the 2nd conductive part 23 of the 2nd board | substrate 21 are connected via the adhesive agent. Further, the connection part 14a of the third conductive part 14 of the first substrate 11 and the connection part 22a of the first conductive part 22 of the second substrate 21 are connected via an adhesive.
The adhesive is not particularly limited as long as it is an adhesive generally used for bonding a wiring board or the like, but is not limited to anisotropic conductive adhesive film (ACF), non-conductive film (Non-conductive film, NCF). ), Anisotropic conductive paste (ACP), non-conductive particle paste (NCP), and the like.

  The means for laminating and fixing the first substrate 11 and the second substrate 21 (hereinafter abbreviated as “fixing means”) is not particularly limited, but the first substrate 11 and the second substrate 21 are sandwiched together. For example, an adhesive for bonding the first substrate 11 and the second substrate 21, and a resin layer provided on the surface of the first substrate 11 and / or the second substrate 21.

When an adhesive is used as the fixing means, first region alpha ₁ on one surface 11a of the first substrate 11, and / or, in the third region zeta ₁ on the other surface 21b of the second substrate 21, the adhesive is provided is, the second region beta ₁ on the other surface 11b of the first substrate 11, and / or, in the second region epsilon ₁ of the one surface 21a of the second substrate 21, both of the adhesive is provided, the first substrate 11 An adhesive is provided on one surface 11 a of the third region γ ₁ and / or the other surface 21 b of the first region δ ₁ of the second substrate 21.

Although it does not specifically limit as such an adhesive agent, The non-peeling pressure sensitive adhesive which cannot be peeled easily or cannot be peeled after sticking is used suitably.
As such a non-peelable pressure-sensitive adhesive, those conventionally used as conventional pressure-sensitive adhesives are used, and among them, an adhesive having a peeling force of 220 gf / 25 mm or more can be mentioned. Examples of such a non-peelable pressure-sensitive adhesive include natural rubber latex obtained by graft copolymerization of styrene and methyl methacrylate with natural rubber. This natural rubber latex is a suitable adhesive for the laminated wiring board 10 in terms of blocking resistance, heat resistance, wear resistance, and the like.

When using the resin layer as the fixing means, first region alpha ₁ on one surface 11a of the first substrate 11, and / or, in the third region zeta ₁ on the other surface 21b of the second substrate 21, the resin layer is provided is, the second region beta ₁ on the other surface 11b of the first substrate 11, and / or, in the second region epsilon ₁ of the one surface 21a of the second substrate 21, both of the resin layer is provided, the first substrate 11 A resin layer is provided on one surface 11 a of the third region γ ₁ and / or the other surface 21 b of the first region δ ₁ of the second substrate 21. Then, the resin layer is melted by heating, and the first substrate 11 and the second substrate 21 are fused.
As the resin for forming such a resin layer, a thermoplastic resin is used. Among these, a thermoplastic resin having a relatively low melting point is preferable.

  As the first base material 11 and the second base material 21, at least in the surface layer portion, a woven fabric, a non-woven fabric, a mat, paper or the like made of inorganic fibers such as glass fiber and alumina fiber, or a combination thereof, polyester fiber, Woven fabrics, nonwoven fabrics, mats, papers, etc. made of organic fibers such as polyamide fibers, or combinations thereof, covering members formed by impregnating them with resin varnish, polyamide resin base materials, polyester resin bases Material, polyolefin resin substrate, polyimide resin substrate, ethylene-vinyl alcohol copolymer substrate, polyvinyl alcohol resin substrate, polyvinyl chloride resin substrate, polyvinylidene chloride resin substrate, polystyrene resin Base material, polycarbonate resin base material, acrylonitrile butadiene styrene copolymer resin base material Plastic base materials such as polyethersulfone resin base materials, (glass) epoxy resin base materials, or mat processing, corona discharge processing, plasma processing, ultraviolet irradiation processing, electron beam irradiation processing, flame plasma processing, ozone processing. Or it selects from well-known things, such as what gave surface treatments, such as various easily bonding processes, and is used.

The first conductive portion 12 and the third conductive portion 14 are formed on one surface 11a of the first base material 11 by screen printing in a predetermined pattern using a polymer type conductive ink. A predetermined pattern is formed by ink jet printing using, and then fired, or a conductive foil is etched into a predetermined pattern, or a predetermined pattern is formed by metal plating. .
Further, the second conductive portion 13 is formed on the other surface 11 b of the first base material 11 in the same manner as the first conductive portion 12.
The first conductive portion 22 and the third conductive portion 24 are formed on the other surface 21 b of the second base material 21 in the same manner as the first conductive portion 12.
Further, the second conductive portion 23 is formed on the one surface 21 a of the second base material 21 in the same manner as the first conductive portion 12.

  Examples of polymer-type conductive inks are those in which conductive fine particles such as silver powder, gold powder, platinum powder, aluminum powder, palladium powder, rhodium powder, carbon powder (carbon black, carbon nanotube, etc.) are blended in the resin composition Is used.

If a thermosetting resin is used as the resin composition, the polymer-type conductive ink is 200 ° C. or less, for example, about 100 to 150 ° C., the first conductive portion 12, the second conductive portion 13, the third conductive portion 14, the first It becomes the thermosetting type which can form the coating film which makes the electroconductive part 22, the 2nd electroconductive part 23, and the 3rd electroconductive part 24. FIG. The path of the coating film forming the first conductive part 12, the second conductive part 13, the third conductive part 14, the first conductive part 22, the second conductive part 23, and the third conductive part 24 forms a coating film. The conductive fine particles are formed by contacting each other, and the resistance value of this coating film is on the order of 10 ⁻⁵ Ω · cm.
Further, as the polymer type conductive ink in the present invention, known ones such as a photocuring type, a penetrating drying type, and a solvent volatilization type are used in addition to the thermosetting type.

  The photocurable polymer type conductive ink contains a photocurable resin in the resin composition and has a short curing time, so that the production efficiency can be improved. Examples of the photo-curing polymer type conductive ink include, for example, a thermoplastic resin alone, or a blend resin composition of a thermoplastic resin and a crosslinkable resin (particularly, a crosslinkable resin composed of polyester and isocyanate) and 60 fine conductive particles. More than 10% by mass and 10% by mass or more of a polyester resin, that is, a solvent volatile type or a crosslinked / thermoplastic combined type (however, the thermoplastic type is 50% by mass or more), thermoplastic A resin resin or a blend resin composition of a thermoplastic resin and a crosslinkable resin (especially a crosslinkable resin composed of polyester and isocyanate) is blended with 10% by mass or more of a polyester resin, that is, a crosslinkable type or a crosslinked / crosslinked resin. A thermoplastic combination type is preferably used.

  Examples of the solvent volatile conductive ink include those in which 50 to 80% by mass of metal nanoparticles having an average particle diameter of 1 to 10 nm are blended in a volatile solvent, or those in which 10 to 50% by mass of a pyrolytic metal salt is blended. Is used.

Moreover, as conductive foil which makes the 1st conductive part 12, the 2nd conductive part 13, the 3rd conductive part 14, the 1st conductive part 22, the 2nd conductive part 23, and the 3rd conductive part 24, copper foil, silver foil, Gold foil, platinum foil, aluminum foil, etc. are mentioned.
Furthermore, as the metal plating forming the first conductive portion 12, the second conductive portion 13, the third conductive portion 14, the first conductive portion 22, the second conductive portion 23, and the third conductive portion 24, copper plating, silver plating, Examples thereof include gold plating and platinum plating.

According to the laminated wiring board 10, the slits 25 and 26 of the second substrate 21 are inserted into the slits 15 and 16 of the first substrate 11, respectively. 26, the ends of the first substrate 11 are in contact with each other, and one end of the first substrate 11 (the end on the one end 11c side) and one end of the second substrate 21 intersect and overlap each other with the slits 15, 16, 25, 26 as boundaries. has been combined, the first connecting portion 12a of the conductive portion 12, the third region zeta ₁ on the other surface 21b of the second substrate 21 provided in the first region alpha ₁ on one surface 11a of the first substrate 11 a connecting portion 24a of the third conductive portion 24 provided is abutting on the same plane, the connecting portion of the second conductive portion 13 provided on the second region beta ₁ on the other surface 11b of the first substrate 11 13a and the second substrate 21 Second region ε connection portion 23a of the second conductive portion 23 provided on one surface 21a of _one is in contact on the same plane, further, a third region gamma ₁ of the one surface 11a of the first substrate 11 that contact on the same plane third connection portion 14a of the conductive portion 14, connecting portions 22a of the first conductive portion 22 provided on the first region [delta] ₁ of the other surface 21b of the second substrate 21 provided in As a result, the first conductivity of the first substrate 11 is not changed between the one end portion of the first substrate 11 and the one end portion of the second substrate 21 without through holes as in the conventional multilayer wiring substrate. Part 12 and third conductive part 24 of second substrate 21 are electrically connected, second conductive part 13 of first substrate 11 and second conductive part 23 of second substrate 21 are electrically connected, and The third conductive portion 14 of the first substrate 11 and the first conductive portion 22 of the second substrate 21 are electrically connected. Can. Further, one end of the first substrate 11 intersects with one end of the second substrate 21 with the slits 15, 16, 25, 26 as boundaries, and one end of the first substrate 11 in the first region α ₂ (ζ ₂ ). The surface 11a and the other surface 21b of the second substrate 21 overlap, and in the second region β ₂ (ε ₂ ), the other surface 11b of the first substrate 11 and one surface 21a of the second substrate 21 overlap, Since one surface 11a of the first substrate 11 and the other surface 21b of the second substrate 21 overlap in the three regions γ ₂ (δ ₂ ), for example, the one surface 11a of the first substrate 11 and the second surface 21b are simply Compared with the case where one surface 21 a of the substrate 21 is overlapped, the first connection portion 12 a of the first conductive portion 12 of the first substrate 11 and the connection portion 24 a of the third conductive portion 24 of the second substrate 21, the first The connecting portion 13a of the second conductive portion 13 of the substrate 11 and the second Between the connection part 23 a of the second conductive part 23 of the plate 21 and between the connection part 14 a of the third conductive part 14 of the first substrate 11 and the connection part 22 a of the first conductive part 22 of the second substrate 21. , The connection is stable, and displacement can be prevented.

Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced. Furthermore, since the laminated wiring board 10 is not provided with a through hole, even if two boards are laminated, it is thin and excellent in flexibility.
In addition, in the first region α ₂ (ζ ₂ ) where the first substrate 11 and the second substrate 21 overlap, the connection portion 12 a of the first conductive portion 12 of the first substrate 11 and the third region of the second substrate 21. In the second region β ₂ (ε ₂ ) where the connection portion 24 a of the conductive portion 24 is connected and the first substrate 11 and the second substrate 21 overlap, the connection portion 13 a of the second conductive portion 13 of the first substrate 11. And the connection portion 23a of the second conductive portion 23 of the second substrate 21 is connected, and in the third region γ ₂ (δ ₂ ) where the first substrate 11 and the second substrate 21 overlap each other, the first substrate 11, the connecting portion 14 a of the third conductive portion 14 and the connecting portion 22 a of the first conductive portion 22 of the second substrate 21 are connected. Can be prevented.

  In this embodiment, the first substrate 11 is a multilayer wiring board in which the first conductive portion 12 and the third conductive portion 14 are provided on one surface 11a, and the second conductive portion 13 is provided on the other surface 11b. However, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, two or more conductive portions are provided on one surface of the first region of the first substrate, or two on the other surface of the second region of the first substrate. The above conductive parts may be provided, or two or more conductive parts may be provided on one surface of the third region of the first substrate. Correspondingly, two or more conductive portions may be provided on one surface of the second substrate, or four or more conductive portions may be provided on the other surface of the second substrate. .

Moreover, in this embodiment, although the laminated wiring board 10 provided with the 1st electroconductive part 12, the 2nd electroconductive part 13, and the 3rd electroconductive part 14 along the longitudinal direction of the 1st board | substrate 11 was illustrated, this invention The laminated wiring board is not limited to this. In the multilayer wiring board of the present invention, the conductive portion provided on one surface and the other surface of the first substrate may not extend along the longitudinal direction of the first substrate.
Moreover, in this embodiment, although the laminated wiring board 10 provided with the 1st conductive part 22, the 2nd conductive part 23, and the 3rd conductive part 24 along the longitudinal direction of the 2nd board | substrate 21 was illustrated, this invention is shown. The laminated wiring board is not limited to this. In the multilayer wiring board of the present invention, the conductive portion provided on one surface and the other surface of the second substrate may not extend along the longitudinal direction of the second substrate.

  Further, in this embodiment, the multilayer wiring substrate 10 in which the slits 15 and 16 extending to the vicinity of the central portion of the first substrate 11 are provided at substantially equal intervals with the one end 11c of the first substrate 11 as the base end is illustrated. However, the multilayer wiring board of the present invention is not limited to this. Moreover, in this embodiment, the laminated wiring board 10 in which the slits 25 and 26 extending from the one end 21c of the second substrate 21 to the vicinity of the central portion of the second substrate 21 are provided at substantially equal intervals is illustrated. However, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the length and interval of the slits are appropriately adjusted according to the position of the connecting portion of the conductive portion provided on each substrate.

  Further, in this embodiment, the first substrate 11 having only the first conductive portion 12, the second conductive portion 13, and the third conductive portion 14, the first conductive portion 22, the second conductive portion 23, and the third conductive portion 24. Although the laminated wiring board 10 provided with the second board 21 having only the above is illustrated, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the first substrate and / or the second substrate may be provided with electronic components such as an IC chip, various display elements, various light receiving elements and the like.

(2) Second Embodiment FIG. 3 is a schematic exploded perspective view showing a second embodiment of the multilayer wiring board of the present invention.
The laminated wiring board 30 of this embodiment includes a first substrate 31 having a first conductive portion 32, a second conductive portion 33, and a third conductive portion 34, a first conductive portion 42, a second conductive portion 43, and a third conductive portion. A second substrate 41 having a portion 44 is schematically configured.
The first substrate 31 has two slits 35 and 36 extending substantially inwardly along the longitudinal direction, with one end 31c of the first substrate 31 as a base end and extending to the inside (near the center of the first substrate 31). Is provided.
The slits 35 and 36 are groove-shaped cuts having a rectangular shape in plan view, and the first substrate 31 has a first region α ₃ and a second region provided in order with the slits 35 and 36 as a boundary. β ₃ and third region γ ₃ , first region α ₃ and second region β ₃ are separated by slit 35, and second region β ₃ and third region γ ₃ are separated by slit 36. Yes.
The first region α ₃ , the second region β _3, and the third region γ ₃ are bent in the longitudinal direction of the first substrate 31 with the two slits 35 and 36 as a boundary.

Further, on one surface 31a of the first substrate 31, along the longitudinal direction, the other end 31d of the first substrate 31 as a base end, the first conductive portion 32 that extends to a first region alpha ₃ is provided ing. The connecting portion 32a of the first conductive section 32 is disposed in a central portion of the first region alpha _3.
On the other surface of the first substrate 31, along the longitudinal direction, the other end 31d of the first substrate 31 as a base end, and the second conductive portion 33 is provided extending to the second region beta ₃ Yes. The connecting portion 33a of the second conductive portion 33 is disposed in a central portion of the second region beta _3.
Further, on one surface 31a of the first substrate 31, along the longitudinal direction, the other end 31d of the first substrate 31 as a base end, the third conductive portion 34 that extends to the third region gamma ₃ is provided ing. The connecting portion 34a of the third conductive portion 34 is disposed in a central portion of the third region gamma _3.

In the second substrate 41, two slits 45 and 46 extending from the end 41c of the second substrate 41 to the inner side (near the center of the second substrate 41) are arranged at substantially equal intervals along the longitudinal direction. Is provided.
The slits 45 and 46 are groove-shaped cuts having a rectangular shape in plan view, and the second substrate 41 has a first region δ ₃ and a second region provided in order with the slits 45 and 46 as a boundary. ε ₃ and the third region ζ ₃ , the first region δ ₃ and the second region ε ₃ are separated by the slit 45, and the second region ε ₃ and the third region ζ ₃ are separated by the slit 46. Yes.
Further, the first region δ ₃ , the second region ε ₃ and the third region ζ ₃ are bent in the longitudinal direction of the second substrate 41 with the two slits 45 and 46 as a boundary.

On the other surface of the second substrate 41, along the longitudinal direction, the other end 41d of the second substrate 41 as a base end, and the first conductive portion 42 is provided extending to the first region [delta] ₃ Yes. The connecting portion 42a of the first conductive section 42 is disposed in a central portion of the first region [delta] _3.
Further, on one surface 41a of the second substrate 41, along the longitudinal direction, the other end 41d of the second substrate 41 as a base end, the second conductive portion 43 extending to the second region epsilon ₃ is provided ing. The connecting portion 43a of the second conductive section 43 is disposed in a central portion of the second region epsilon _3.
Further, on the other surface of the second substrate 41, along the longitudinal direction, the other end 41d of the second substrate 41 as a base end, and a third conductive portion 44 is provided extending to a third region zeta ₃ Yes. The connecting portion 44a of the third conductive portion 44 is disposed in a central portion of the third region zeta _3.

The first substrate 31 and the second substrate 41 are used as constituent members, and the slits 45 and 46 of the second substrate 41 are inserted into the slits 35 and 36 of the first substrate 31, respectively. by terminal end and slits 45, 46 are abutting, superimposed and one surface 31a of the first region alpha ₃ of the first substrate 31, a third region zeta ₃ on the other surface of the second substrate 41 Thus, the connection portion 32a of the first conductive portion 32 of the first substrate 31 and the connection portion 44a of the third conductive portion 44 of the second substrate 41 are connected.
Further, the slits 45 and 46 of the second substrate 41 are inserted into the slits 35 and 36 of the first substrate 31, respectively, and the ends of the slits 35 and 36 and the ends of the slits 45 and 46 are brought into contact with each other. The other surface of the second region β _{3 on} the first substrate 31 and the one surface 41 a of the second region ε _{3 on} the second substrate 41 are overlapped to connect the second conductive portion 33 of the first substrate 31. The connection portion 43a of the second conductive portion 43 of the second substrate 41 is connected to the portion 33a.
Further, the slits 45 and 46 of the second substrate 41 are inserted into the slits 35 and 36 of the first substrate 31, respectively, and the ends of the slits 35 and 36 and the ends of the slits 45 and 46 are brought into contact with each other. The first surface 31 a of the third region γ _{3 on} the first substrate 31 and the other surface of the third region δ _{3 on} the second substrate 41 are overlapped to connect the third conductive portion 34 of the first substrate 31. The connection part 42 a of the first conductive part 42 of the second substrate 41 is connected to the part 34 a.
As a result, a laminated wiring board 30 is formed in which the first substrate 31 and the second substrate 41 are laminated in part.

As the 1st board | substrate 31 and the 2nd board | substrate 41, the thing similar to the above-mentioned 1st embodiment is used.
The first conductive part 32, the second conductive part 33, the third conductive part 34, the first conductive part 42, the second conductive part 43, and the third conductive part 44 are the same as those in the first embodiment described above. Used.

According to this laminated wiring board 30, the slits 35 and 36 of the first substrate 31 are groove-shaped having a rectangular shape in plan view, and the slits 45 and 46 of the second substrate 41 are groove-shaped having a rectangular shape in plan view. Thus, the slits 45 and 46 of the second substrate 41 are inserted into the slits 35 and 36 of the first substrate 31, respectively, so that the ends of the slits 35 and 36 and the ends of the slits 35 and 36 are in contact with each other. The first substrate 31 and the second substrate 41 are less bent at the slits 35, 36, 45, and 46 than the laminated wiring substrate 10, and the connection portion 32 a of the first conductive portion 32 of the first substrate 31. Between the connection part 44a of the second conductive part 43 of the first substrate 31 and the connection part 43a of the second conductive part 43 of the second substrate 41, And the second Between the connecting portion 34a of the third conductive portion 34 of the substrate 31 and the connecting portion 42a of the first conductive portion 42 of the second substrate 41, it becomes difficult for a force to act in the direction separating the contact between the two, and the connection is stable. As a result, misalignment can be prevented.
In addition, the multilayer wiring board 30 has the same effect as the above-described multilayer wiring board 10.

(3) Third Embodiment FIG. 4 is a schematic exploded perspective view showing a third embodiment of the multilayer wiring board of the present invention.
The laminated wiring board 50 of this embodiment includes a first substrate 51 having a first conductive portion 52, a second conductive portion 53, and a third conductive portion 54, a first conductive portion 62, a second conductive portion 63, and a third conductive portion. A second substrate 61 having a portion 64 is schematically configured.
In the first substrate 51, two slits 55 and 56 extending from the one end 51c of the first substrate 51 to the inner side (near the central portion of the first substrate 51) are arranged at almost equal intervals along the longitudinal direction. Is provided.
The slits 55 and 56 are groove-shaped cuts having a triangular shape in plan view, and the first substrate 51 has a first area α ₄ and a second area provided in order with the slits 55 and 56 as a boundary. β ₄ and the third region γ ₄ , the first region α ₄ and the second region β ₄ are separated by the slit 55, and the second region β ₄ and the third region γ ₄ are separated by the slit 56. Yes. The slits 55 and 56 have a shape in which a triangular bottom surface is arranged at one end 51 c of the first substrate 51 and a triangular vertex is arranged inside the first substrate 51.
The first region α ₄ , the second region β _4, and the third region γ ₄ are bent in the longitudinal direction of the first substrate 51 with the two slits 55 and 56 as a boundary.

Further, on one surface 51a of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, the first conductive part 52 extending to the first region alpha ₄ provided ing. The connecting portion 52a of the first conductive section 52 is disposed in a central portion of the first region alpha _4.
On the other surface of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, and the second conductive portion 53 is provided extending to the second region beta ₄ Yes. The connecting portion 53a of the second conductive section 53 is disposed in a central portion of the second region beta _4.
Further, on one surface 51a of the first substrate 51, along the longitudinal direction, the other end 51d of the first substrate 51 as a base end, the third conductive portion 54 that extends to the third region gamma ₄ is provided ing. The connecting portion 54a of the third conductive portion 54 is disposed in the central portion of the third region gamma _4.

In the second substrate 61, two slits 65 and 66 extending from the one end 61c of the second substrate 61 to the inner side (near the central portion of the second substrate 61) are arranged at substantially equal intervals along the longitudinal direction. Is provided.
The slits 65 and 66 are groove-shaped cuts having a rectangular shape in plan view, and the second substrate 61 has a first area δ ₄ and a second area provided in order with the slits 65 and 66 as a boundary. has epsilon ₄ and a third region zeta _4, a first region [delta] ₄ and the second region epsilon ₄ separated by a slit 65, a second region epsilon ₄ third region zeta ₄ spaced apart at slit 66 Yes.
The first region δ ₄ , the second region ε ₄ and the third region ζ ₄ are bent in the longitudinal direction of the second substrate 61 with the two slits 65 and 66 as a boundary.

On the other surface of the second substrate 61, along the longitudinal direction, the other end 61d of the second substrate 61 as a base end, and the first conductive portion 62 is provided extending to the first region [delta] ₄ Yes. The connecting portion 62a of the first conductive section 62 is disposed in a central portion of the first region [delta] _4.
Further, on one surface 61a of the second substrate 61, along the longitudinal direction, the other end 61d of the second substrate 61 as a base end, the second conductive portion 63 that extends to a second region epsilon ₄ is provided ing. The connecting portion 63a of the second conductive section 63 is disposed in a central portion of the second region epsilon _4.
Further, the other surface of the second substrate 61 is provided with a third conductive portion 64 extending in the longitudinal direction to the third region ζ ₄ with the other end 61d of the second substrate 61 as a base end. Yes. The connecting portion 64a of the third conductive section 64 is disposed in a central portion of the third region zeta _4.

Using the first substrate 51 and the second substrate 61 as components, the slits 65 and 66 of the second substrate 61 are inserted into the slits 55 and 56 of the first substrate 51, respectively. by terminal end and slits 65 and 66 are abutting, superimposed and one surface 51a of the first region alpha ₄ in the first substrate 51, a third other surface areas zeta ₄ in the second substrate 61 Thus, the connection part 52a of the first conductive part 52 of the first substrate 51 and the connection part 64a of the third conductive part 64 of the second substrate 61 are connected.
Further, the slits 65 and 66 of the second substrate 61 are inserted into the slits 55 and 56 of the first substrate 51, respectively, and the ends of the slits 55 and 56 and the ends of the slits 65 and 66 are brought into contact with each other. The other surface of the second region β _{4 on} the first substrate 51 and the one surface 61 a of the second region ε _{4 on} the second substrate 61 are overlapped to connect the second conductive portion 53 of the first substrate 51. The part 53a and the connection part 63a of the second conductive part 63 of the second substrate 61 are connected.
Further, the slits 65 and 66 of the second substrate 61 are inserted into the slits 55 and 56 of the first substrate 51, respectively, and the ends of the slits 55 and 56 and the ends of the slits 65 and 66 are brought into contact with each other. The first surface 51 a of the third region γ _{4 on} the first substrate 51 and the other surface of the third region δ _{4 on} the second substrate 61 are overlapped to connect the third conductive portion 54 of the first substrate 51. The connection portion 62a of the first conductive portion 62 of the second substrate 61 is connected to the portion 54a.
As a result, a laminated wiring substrate 50 is formed in which the first substrate 51 and the second substrate 61 are laminated in part.

As the 1st board | substrate 51 and the 2nd board | substrate 61, the thing similar to the above-mentioned 1st embodiment is used.
The first conductive portion 52, the second conductive portion 53, the third conductive portion 54, the first conductive portion 62, the second conductive portion 63, and the third conductive portion 64 are the same as those in the first embodiment described above. Used.

According to this laminated wiring board 50, the slits 55 and 56 of the first substrate 51 are groove-shaped in a plan view, and the slits 65 and 66 of the second substrate 61 are groove-shaped in a plan view. Therefore, the slits 65 and 66 of the second substrate 61 are inserted into the slits 55 and 56 of the first substrate 51, respectively, and the ends of the slits 55 and 56 and the ends of the slits 65 and 66 are in contact with each other. Further, in the slits 55, 56, 65 and 66, the first substrate 51 and the second substrate 61 are less bent than the laminated wiring substrate 10, and the connection portion 52 a of the first conductive portion 52 of the first substrate 51 Between the connection portions 64a of the third conductive portion 64 of the second substrate 61, between the connection portions 53a of the second conductive portion 53 of the first substrate 51 and the connection portions 63a of the second conductive portion 63 of the second substrate 61, and ,first Between the connecting portion 54a of the third conductive portion 54 of the plate 51 and the connecting portion 62a of the first conductive portion 62 of the second substrate 61, it becomes difficult for a force to act in the direction separating the contact between the two, and the connection is stable. As a result, misalignment can be prevented.
In addition, this multilayer wiring board 50 has the same effect as the above-described multilayer wiring board 10.

(4) Fourth Embodiment FIG. 5 is a schematic exploded perspective view showing a fourth embodiment of the multilayer wiring board of the present invention. 6A and 6B are schematic views showing a fourth embodiment of the multilayer wiring board of the present invention, in which FIG. 6A is a perspective view and FIG. 6B is a cross-sectional view taken along line BB in FIG.
The laminated wiring board 70 of this embodiment includes a first substrate 71 having a first conductive portion 72, a second conductive portion 73, a third conductive portion 74, and a fourth conductive portion 75, a first conductive portion 82, and a second conductive portion. A second substrate 81 having a portion 83, a third conductive portion 84 and a fourth conductive portion 85 is schematically configured.

The first substrate 71 has substantially three slits 76, 77, 78 extending along the longitudinal direction from the one end 71 c of the first substrate 71 to the inside (near the center of the first substrate 71). It is provided at equal intervals.
The three slits 76, 77, 78 are linear cuts provided in the first substrate 71, and the first substrate 71 is provided in order with the three slits 76, 77, 78 as a boundary. The first region α ₅ , the second region β ₅ , the third region γ _5, and the fourth region δ ₅ , the first region α ₅ and the second region β ₅ are in contact with each other through the slit 76, and the second region β ₅ and the third region γ ₅ are in contact with each other at the slit 77, and the third region γ ₅ and the fourth region δ ₅ are in contact with each other at the slit 78.
The first region α ₅ , the second region β ₅ , the third region γ _5, and the fourth region δ ₅ are bent in the longitudinal direction of the first substrate 71 with the three slits 76, 77, 78 as boundaries. It has become.

On the other surface 71b of the first substrate 71, along the longitudinal direction, the other end 71d of the first substrate 71 as a base end, the first conductive portion 72 is provided extending to the first region alpha ₅ ing. The connecting portion 72a of the first conductive section 72 is disposed on the other end 71d side of the first substrate 71 in the first region alpha _5.
Further, on one surface 71a of the first substrate 71, along the longitudinal direction, the other end 71d of the first substrate 71 as a base end, the second conductive portion 73 extending to the second region beta ₅ is provided ing. The connecting portion 53a of the second conductive section 73 is disposed at the other end 71d side of the first substrate 71 in the second region beta _5.
On the other surface 71b of the first substrate 71, along the longitudinal direction, the other end 71d of the first substrate 71 as a base end, the third conductive portion 74 that extends to the third region gamma ₅ is provided ing. The connecting portion 74a of the third conductive section 74 is disposed at the other end 71d side of the first substrate 71 in the third region gamma _5.
Further, on one surface 71a of the first substrate 71, along the longitudinal direction, the other end 71d of the first substrate 71 as a base end, the fourth conductive portion 75 is provided extending to the fourth region [delta] ₅ ing. The connecting portion 75a of the fourth conductive portion 75 is disposed on the other end 71d side of the first substrate 71 in the fourth region [delta] _5.
That is, in the first substrate 71, the first conductive portion 72, the second conductive portion 73, the third conductive portion 74, and the fourth conductive portion 75 are provided at positions that do not overlap each other.

The second substrate 81 has substantially three slits 86, 87, 88 extending inward (near the central portion of the second substrate 81) along the longitudinal direction with the end 81c of the second substrate 81 as a base end. It is provided at equal intervals.
The three slits 86, 87, 88 are linear cuts provided in the second substrate 81, and the second substrate 81 is provided in order with the three slits 86, 87, 88 as boundaries. the first region epsilon _{5 were,} the second region zeta _5, has a third region eta ₅ and the fourth region theta _5, the first region epsilon ₅ second region zeta ₅ contact with the slit 86, the second region zeta ₅ and the third region η ₅ are in contact with each other through the slit 87, and the third region η ₅ and the fourth region θ ₅ are in contact with each other through the slit 88.
The first region ε ₅ , the second region ζ ₅ , the third region η _5, and the fourth region θ ₅ are bent in the longitudinal direction of the second substrate 81 with the three slits 86, 87, 88 as boundaries. It has become.

On the other surface 81b of the second substrate 81, along the longitudinal direction, the other end 81d of the second substrate 81 as a base end, the first conductive portion 82 that extends to a first region epsilon ₅ is provided ing. The connecting portion 82a of the first conductive section 82 is disposed on the other end 81d side of the first substrate 81 in the first region epsilon _5.
Further, on one surface 81a of the second substrate 81, along the longitudinal direction, the other end 81d of the second substrate 81 as a base end, the second conductive portion 83 is provided extending to the second region zeta ₅ ing. The connecting portion 83a of the second conductive section 83 is disposed at the other end 81d side of the second substrate 81 in the second region zeta _5.
On the other surface 81b of the second substrate 81, along the longitudinal direction, the other end 81d of the second substrate 81 as a base end, the third conductive portion 84 that extends to the third region eta ₅ is provided ing. The connecting portion 84a of the third conductive portion 84 is disposed on the other end 81d side of the second substrate 81 in the third region eta _5.
Further, on one surface 81a of the second substrate 81, along the longitudinal direction, the other end 81d of the second substrate 81 as a base end, the fourth conductive portion 85 is provided extending to the fourth region theta ₅ ing. The connecting portion 85a of the fourth conductive portion 85 is disposed on the other end 81d side of the second substrate 81 in the fourth region theta _5.
That is, in the second substrate 81, the first conductive portion 82, the second conductive portion 83, the third conductive portion 84, and the fourth conductive portion 85 are provided at positions that do not overlap each other.

Using the first substrate 71 and the second substrate 81 as constituent members, the slits 86, 87, 88 of the second substrate 81 are inserted into the slits 76, 77, 78 of the first substrate 71, respectively. The respective ends of 76, 77, and 78 are brought into contact with the respective ends of the slits 86, 87, and 88, the other surface 71 b of the first region α ₅ in the first substrate 71, and one surface of the second substrate 81. 81a is overlapped, and the connection portion 72a of the first conductive portion 72 of the first substrate 71 and the connection portion 85a of the fourth conductive portion 85 of the second substrate 81 are connected.
Further, the slits 86, 87, 88 of the second substrate 81 are inserted into the slits 76, 77, 78 of the first substrate 71, respectively, and the ends of the slits 76, 77, 78 and the slits 86, 87, 78 are inserted. by each end 88 is abutting, while the surface 71a of the second region beta ₅ in the first substrate 71, are allowed other surface 81b is superimposed in the second substrate 81, the first substrate 71 The connection part 73a of the second conductive part 73 and the connection part 84a of the third conductive part 84 of the second substrate 81 are connected.
Further, the slits 86, 87, 88 of the second substrate 81 are inserted into the slits 76, 77, 78 of the first substrate 71, respectively, and the ends of the slits 76, 77, 78 and the slits 86, 87, 78 are inserted. by each end 88 is abutting, and the other surface 71b of the third region gamma ₅ in the first substrate 71 and one surface 81a is superimposed in the second substrate 81, the first substrate 71 The connection part 74a of the third conductive part 74 and the connection part 83a of the second conductive part 83 of the second substrate 81 are connected.
Further, the slits 86, 87, 88 of the second substrate 81 are inserted into the slits 76, 77, 78 of the first substrate 71, respectively, and the ends of the slits 76, 77, 78 and the slits 86, 87, 78 are inserted. by each end 88 is abutting, while the surface 71a of the fourth region [delta] ₅ in the first substrate 71, are allowed other surface 81b is superimposed in the second substrate 81, the first substrate 71 The connection part 75a of the fourth conductive part 75 and the connection part 82a of the first conductive part 82 of the second substrate 81 are connected.
As a result, a laminated wiring board 70 in which the first substrate 71 and the second substrate 81 are laminated at the respective one end portions is configured.

Further, as shown in FIG. 6, in the first region α ₆ (θ ₆ ) where the first substrate 71 and the second substrate 81 overlap, the connection portion 72 a of the first conductive portion 72 of the first substrate 71, The connection portion 85a of the fourth conductive portion 85 of the second substrate 81 is connected. In addition, in the second region β ₆ (η ₆ ) where the first substrate 71 and the second substrate 81 overlap, the connection portion 73 a of the second conductive portion 73 of the first substrate 71 and the third region of the second substrate 81. A connecting portion 84a of the conductive portion 84 is connected. In addition, in the third region γ ₆ (γ ₆ ) where the first substrate 71 and the second substrate 81 overlap, the connection portion 74 a of the third conductive portion 74 of the first substrate 71 and the second region of the second substrate 81. The connection part 83a of the conductive part 83 is connected. Furthermore, in the first region δ ₆ (ε ₆ ) where the first substrate 71 and the second substrate 81 overlap, the connection portion 75a of the fourth conductive portion 75 of the first substrate 71 and the first substrate 81 A connecting portion 82a of the conductive portion 82 is connected.

Moreover, the connection part 72a of the electroconductive part 72 of the 1st board | substrate 71 and the connection part 85a of the 4th electroconductive part 85 of the 2nd board | substrate 81 are connected through the adhesive agent. Moreover, the connection part 73a of the 2nd conductive part 73 of the 1st board | substrate 71 and the connection part 84a of the 3rd conductive part 84 of the 2nd board | substrate 81 are connected through the adhesive agent. Moreover, the connection part 74a of the 3rd electroconductive part 74 of the 1st board | substrate 71 and the connection part 83a of the 2nd electroconductive part 83 of the 2nd board | substrate 81 are connected through the adhesive agent. Furthermore, the connection part 75a of the 4th electroconductive part 75 of the 1st board | substrate 71 and the connection part 82a of the 1st electroconductive part 82 of the 2nd board | substrate 81 are connected through the adhesive agent.
As the adhesive, the same adhesive as in the first embodiment described above is used.

The means for laminating and fixing the first substrate 71 and the second substrate 81 is not particularly limited, but mechanical means such as sandwiching the first substrate 71 and the second substrate 81 together, the first substrate 71 and the second substrate 81 Examples thereof include an adhesive for bonding the two substrates 81, a resin layer provided on the surface of the first substrate 71 and / or the second substrate 81, and the like.
As the adhesive and the resin layer, the same ones as in the first embodiment described above are used.

As the 1st board | substrate 71 and the 2nd board | substrate 81, the thing similar to the above-mentioned 1st embodiment is used.
As the first conductive part 72, the second conductive part 73, the third conductive part 74, the fourth conductive part 75, the first conductive part 82, the second conductive part 83, the third conductive part 84 and the fourth conductive part 85, The thing similar to the above-mentioned 1st embodiment is used.

According to this laminated wiring board 70, the slits 86, 87, 88 of the second substrate 61 are inserted into the slits 76, 77, 78 of the first substrate 71, respectively. The end and the respective ends of the slits 86, 87, 88 are brought into contact with each other, and one end (the end on the one end 71 c side) of the first substrate 71 and the one end portion of the second substrate 81 (an end portion of the one end 81c side) is superimposed to intersect the connection of the first conductive portion 72 provided in the first region alpha ₅ in the other surface 71b of the first substrate 81 and parts 72a, one of the connecting portion 85a of the fourth conductive portion 85 provided on the surface 81a is abutting on the same surface, one surface of the second region beta ₅ in the first substrate 71 of the second substrate 81 Second conductive portion 7 provided at 71a Of a connecting portion 73a, connecting portions 84a of the third conductive portion 84 provided on the other surface 81b of the second substrate 81 are in contact on the same plane, the other of the third region gamma ₅ in the first substrate 71 The connection portion 74a of the third conductive portion 74 provided on the surface 71b and the connection portion 83a of the second conductive portion 83 provided on one surface 81a of the second substrate 81 are brought into contact with each other on the same surface, a connecting portion 75a of the fourth conductive portion 75 provided on the fourth region δ one surface 71a of the ₅ in the first substrate 71, the connection of the first conductive portion 82 provided on the other surface 81b of the second substrate 81 Since the part 82a is brought into contact with the same surface, it is not necessary to pass through a through hole as in the conventional laminated wiring board, but between one end of the laminated first board 71 and one end of the second board 81. The first conductive portion 72 of the first substrate 71 and the fourth conductive portion 85 of the second substrate 81 are The second conductive portion 73 of the first substrate 71 and the third conductive portion 84 of the second substrate 81 are electrically connected, and the third conductive portion 74 of the first substrate 71 and the second substrate 81 are electrically connected. The second conductive portion 83 can be electrically connected, and further, the fourth conductive portion 75 of the first substrate 71 and the first conductive portion 82 of the second substrate 81 can be electrically connected. Further, with the slits 76, 77, 78, 86, 87, 88 as boundaries, one end of the first substrate 71 intersects with one end of the second substrate 81, and the first substrate in the first region α ₆ (θ ₆ ). 71, the other surface 71b of the second substrate 81 and one surface 81a of the second substrate 81 overlap, and in the second region β ₆ (η ₆ ), one surface 71a of the first substrate 71 and the other surface 81b of the second substrate 81 overlap. In the third region γ ₆ (γ ₆ ), the other surface 71b of the first substrate 71 and the one surface 81a of the second substrate 81 overlap each other. Further, in the fourth region δ ₆ (ε ₆ ), the first substrate 71 Since one surface 71a and the other surface 81b of the second substrate 81 overlap each other, for example, simply when one surface 71a of the first substrate 71 and one surface 81a of the second substrate 81 are overlapped. The first conductive portion 7 of the first substrate 71 Between the connecting portion 72a of the second substrate 81 and the connecting portion 85a of the fourth conductive portion 85 of the second substrate 81, and the connecting portion 73a of the second conductive portion 73 of the first substrate 71 and the third conductive portion 84 of the second substrate 81. 84a, between the connecting portion 74a of the third conductive portion 74 of the first substrate 71 and the connecting portion 83a of the second conductive portion 83 of the second substrate 81, and the connection of the fourth conductive portion 75 of the first substrate 71. Connection between the part 75a and the connection part 82a of the first conductive part 82 of the second substrate 81 is stable, and displacement can be prevented.

Moreover, since it is not necessary to form a through hole, the manufacturing process can be simplified and the manufacturing cost can be reduced. Furthermore, since the laminated wiring board 70 is not provided with a through hole, even if two boards are laminated, it is thin and excellent in flexibility.
In addition, in the first region α ₆ (θ ₆ ) where the first substrate 71 and the second substrate 81 overlap, the connection portion 72 a of the first conductive portion 72 of the first substrate 71 and the fourth of the second substrate 81. In the second region β ₆ (η ₆ ) where the connection portion 85 a of the conductive portion 85 is connected and the first substrate 71 and the second substrate 81 overlap, the connection portion 73 a of the second conductive portion 73 of the first substrate 71. And the connecting portion 84a of the third conductive portion 84 of the second substrate 81 is connected, and in the third region γ ₆ (γ ₆ ) where the first substrate 71 and the second substrate 81 overlap, The connection region 74a of the third conductive portion 74 and the connection portion 83a of the second conductive portion 83 of the second substrate 81 are connected, and the fourth region δ ₆ (the first substrate 71 and the second substrate 81 overlap each other). in epsilon ₆₎ within a fourth conductive portion 75 of the connecting portion 75a of the first substrate 71 , The connection portions 82a of the first conductive section 82 of the second substrate 81 are connected, even if bending the multilayer wiring board 70, it is possible to prevent the peeling at these connections.

  In this embodiment, the first substrate 71 is provided with the second conductive portion 73 and the fourth conductive portion 75 on one surface 71a, and the first conductive portion 72 and the third conductive portion 74 on the other surface 71b. Although the provided laminated wiring board 70 is illustrated, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, two or more conductive portions are provided on one surface of the first region of the first substrate, or two on the other surface of the second region of the first substrate. The above conductive portions are provided, or two or more conductive portions are provided on one surface of the third region of the first substrate, or two are provided on one surface of the fourth region of the first substrate. The above conductive part may be provided. Correspondingly, four or more conductive portions may be provided on one surface of the second substrate, or four or more conductive portions may be provided on the other surface of the second substrate. .

In this embodiment, the laminated wiring board 70 provided with the first conductive portion 72, the second conductive portion 73, the third conductive portion 74, and the fourth conductive portion 75 is provided along the longitudinal direction of the first substrate 71. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the conductive portion provided on one surface and the other surface of the first substrate may not extend along the longitudinal direction of the first substrate.
In this embodiment, the laminated wiring board 70 provided with the first conductive portion 82, the second conductive portion 83, the third conductive portion 84, and the fourth conductive portion 85 is provided along the longitudinal direction of the second substrate 81. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board according to the present invention, the conductive portions provided on one surface and the other surface of the second substrate may not extend along the longitudinal direction of the second plate.

  In this embodiment, the laminated wiring board 70 is provided with slits 76, 77, 78 provided at substantially equal intervals, with the one end 71 c of the first substrate 71 as the base end and extending to the vicinity of the center of the first substrate 71. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In this embodiment, the laminated wiring board 70 is provided with slits 86, 87, 88 provided at substantially equal intervals, with one end 81 c of the second substrate 81 as the base end and extending to the vicinity of the center of the second substrate 81. Although illustrated, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the length and interval of the slits are appropriately adjusted according to the position of the connecting portion of the conductive portion provided on each substrate.

  Furthermore, in this embodiment, the first substrate 71 having only the first conductive portion 72, the second conductive portion 73, the third conductive portion 74, and the fourth conductive portion 75, the first conductive portion 82, and the second conductive portion 83. Although the laminated wiring board 70 provided with the second substrate 81 having only the third conductive portion 84 and the fourth conductive portion 85 is exemplified, the laminated wiring substrate of the present invention is not limited to this. In the multilayer wiring board of the present invention, the first substrate and / or the second substrate may be provided with electronic components such as an IC chip, various display elements, various light receiving elements and the like.

  Moreover, in 1st-3rd embodiment, the case where the 1st base material and the 2nd base material have three area | regions which make two slits a boundary is illustrated, and in 4th embodiment, the 1st base material Although the case where the second substrate has four regions having three slits as a boundary is exemplified, the laminated wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the first substrate and the second base material may have five or more regions having four or more slits as a boundary.

(5) Fifth Embodiment FIG. 7 is a schematic exploded perspective view showing a fifth embodiment of the multilayer wiring board of the present invention.
The laminated wiring board 90 of this embodiment includes a first substrate 91 having a first conductive portion 92, a second conductive portion 93, and a third conductive portion 94, a first conductive portion 102, a second conductive portion 103, and a third conductive portion. And a second substrate 101 having a portion 104.
The first substrate 91 includes two portions extending in the center of the first substrate 91 along the longitudinal direction, with one end 91c of the first substrate 91 as a base end and extending to the inside (near the center of the first substrate 91). Slits 95 and 96 are provided at substantially equal intervals.
The two slits 95 and 96 are linear cuts provided in the first substrate 91, and the first substrate 91 is a first region provided in order with the two slits 95 and 96 as a boundary. α ₇ , second region β ₇ and third region γ ₇ , first region α ₇ and second region β ₇ are in contact with slit 95, and second region β ₇ and third region γ ₇ are slit 96. It touches at.
The first region α ₇ , the second region β _7, and the third region γ ₇ are bent in the longitudinal direction of the first substrate 91 with the two slits 95 and 96 as a boundary.

Further, on one surface 91a of the first substrate 91, along the longitudinal direction, the other end 91d of the first substrate 91 as a base end, the first conductive portion 92 is provided extending to the first region alpha ₇ ing. The connecting portion 92a of the first conductive section 92 is disposed at one end 91c near the first substrate 91 in the first region alpha ₇ (one end portion of the first substrate 91).
On the other surface of the first substrate 91, along the longitudinal direction, the other end 91d of the first substrate 91 as a base end, and the second conductive portion 93 is provided extending to the second region beta ₇ Yes. The connecting portion 93a of the second conductive section 93 is disposed at one end 91c near the first substrate 91 in the second region beta ₉ (one end of the first substrate 91).
Further, on one surface 91a of the first substrate 91, along the longitudinal direction, the other end 91d of the first substrate 91 as a base end, the third conductive portion 94 is provided extending to the third region gamma ₇ ing. The connecting portion 94a of the third conductive portion 94 is disposed at one end 91c near the first substrate 91 in the third region gamma ₇ (one end portion of the first substrate 91).
That is, in the first substrate 91, the first conductive portion 92, the second conductive portion 93, and the third conductive portion 94 are provided at positions that do not overlap each other.

On the other hand, the second substrate 101 has two slits 105 and 106 extending along the longitudinal direction from the one end 101c of the second substrate 101 to the inner side (near the center of the first substrate 101). It is provided at equal intervals.
The two slits 105 and 106 are linear cuts provided in the second substrate 101, and the second substrate 101 is a first region provided in order with the two slits 105 and 106 as a boundary. δ ₇ , second region ε _7, and third region ζ ₇ , first region δ ₇ and second region ε ₇ are in contact with slit 105, and second region ε ₇ and third region ζ ₇ are slit 106. It touches at.
The first region δ ₇ , the second region ε _7, and the third region ζ ₇ are bent in the longitudinal direction of the second substrate 101 with the two slits 105 and 106 as a boundary.

On the other surface of the second substrate 101, along the longitudinal direction, the other end 101d of second substrate 101 as a base end, and the first conductive portion 102 is provided extending to the first region [delta] ₇ Yes. The connecting portion 102a of the first conductive portion 102, is disposed at one end 101c near the second substrate 101 in the first region [delta] ₇ (one end portion of the second substrate 101).
Further, the one surface 101a of the second substrate 101, along the longitudinal direction, the other end 101d of second substrate 101 and the proximal end, the second conductive portion 103 extending to the second region epsilon ₇ is provided ing. The connecting portion 103a of the second conductive portion 103 is disposed at one end 101c near the second substrate 101 in the second region epsilon ₇ (one end portion of the second substrate 101).
Further, on the other surface of the second substrate 101, along the longitudinal direction, the other end 101d of second substrate 101 as a base end, and the third conductive portion 104 is provided which extends to the third region zeta ₇ Yes. Further, the connecting portion 104a of the third conductive portion 104 is disposed in the third region ζ ₇ in the vicinity of one end 101c of the second substrate 101 (one end portion of the second substrate 101).
That is, in the second substrate 101, the first conductive portion 102, the second conductive portion 103, and the third conductive portion 104 are provided at positions that do not overlap each other.

Using the first substrate 91 and the second substrate 101 as constituent members, the slits 105 and 106 of the second substrate 101 are inserted into the slits 95 and 96 of the first substrate 91, respectively. at one end portion and the end portion of the second substrate 101, and the one surface 91a of the first region alpha ₇ in the first substrate 91, they are allowed the other surface of the third region zeta ₇ superimposed in the second substrate 101, The connection portion 92a of the first conductive portion 92 of the first substrate 91 and the connection portion 104a of the third conductive portion 104 of the second substrate 101 are connected.
Further, by inserting the slits 105 and 106 of the second substrate 101 into the slits 95 and 96 of the first substrate 91, respectively, at one end portion of the first substrate 91 and one end portion of the second substrate 101. The other surface of the second region β _{7 on} the first substrate 91 and the one surface 101 a of the second region ε _{7 on} the second substrate 101 are overlapped to connect the second conductive portion 93 of the first substrate 91. The connection portion 103a of the second conductive portion 103 of the second substrate 101 is connected to the portion 93a.
Further, the slits 105 and 106 of the second substrate 101 are inserted into the slits 95 and 96 of the first substrate 91, respectively, so that one end of the first substrate 91 and one end of the second substrate 101 are inserted. The first surface 91 a of the third region γ _{7 on} the first substrate 91 and the other surface of the first region δ _{7 on} the second substrate 101 are overlapped to connect the third conductive portion 94 of the first substrate 91. The portion 94a and the connection portion 102a of the first conductive portion 102 of the second substrate 101 are connected.
In this embodiment, the ends of the slits 95 and 96 and the ends of the slits 105 and 106 are not in contact with each other, and each of the slits 105 and 106 is halfway with respect to each of the slits 95 and 96. Has been inserted.
As a result, a laminated wiring board 90 is formed in which the first substrate 91 and the second substrate 101 are laminated at each one end.

As the 1st board | substrate 91 and the 2nd board | substrate 101, the thing similar to the above-mentioned 1st embodiment is used.
The first conductive portion 92, the second conductive portion 93, the third conductive portion 94, the first conductive portion 102, the second conductive portion 103, and the third conductive portion 104 are the same as those in the first embodiment described above. Used.

  In the multilayer wiring board 90, unlike the first to third embodiments described above, the first conductive portion 92, the second conductive portion 93, and the third conductive portion 94 of the first substrate 91 are connected to one end of the first substrate 91. The first conductive portion 102, the second conductive portion 103, and the third conductive portion 104 of the second substrate 101 are disposed at one end of the second substrate 101, and are slits of the first substrate 91. Although the ends of 95 and 96 are not in contact with the ends of the slits 105 and 106 of the second substrate 101 and the slits 105 and 106 are only partially inserted into the slits 95 and 96, the slits 95 and 96 are not inserted. , 105, 106, at least one end portion of the first substrate 91 and one end portion of the second substrate 101 are crossed and overlapped with each other. Laminate and solidify substrate 101 Until it can the first substrate 91 and the second substrate 101 is temporarily fixed.

  In this embodiment, the first conductive portion 92, the second conductive portion 93, and the third conductive portion 94 of the first substrate 91 are disposed at one end portion of the first substrate 91, and The laminated wiring substrate 90 in which the first conductive portion 102, the second conductive portion 103, and the third conductive portion 104 are disposed at one end of the second substrate 101 is illustrated. However, the laminated wiring substrate of the present invention is limited to this. Not. In the multilayer wiring board of the present invention, one or more of the first conductive portion, the second conductive portion, and the third conductive portion of the first substrate are disposed at one end of the first substrate. Alternatively, one or more of the first conductive portion, the second conductive portion, and the third conductive portion of the second substrate may be disposed at one end of the second substrate.

  In the first to fifth embodiments, the slit has a linear shape, a rectangular shape in plan view, or a triangular shape in plan view. However, the multilayer wiring board of the present invention is not limited to this. In the multilayer wiring board of the present invention, the shape of the slit may be a circular shape in plan view, a semicircular shape in plan view, or an elliptical shape in plan view.

1 is a schematic exploded perspective view showing a first embodiment of a multilayer wiring board of the present invention. It is the schematic which shows 1st embodiment of the multilayer wiring board of this invention, (a) is a perspective view, (b) is sectional drawing which follows the AA line of (a). It is a schematic exploded perspective view which shows 2nd embodiment of the multilayer wiring board of this invention. It is a schematic exploded perspective view which shows 3rd embodiment of the multilayer wiring board of this invention. It is a schematic exploded perspective view which shows 4th embodiment of the laminated wiring board of this invention. It is the schematic which shows 4th embodiment of the laminated wiring board of this invention, (a) is a perspective view, (b) is sectional drawing which follows the BB line of (a). It is a general | schematic disassembled perspective view which shows 5th embodiment of the laminated wiring board of this invention.

Explanation of symbols

10, 30, 50, 70, 90 ... laminated wiring board, 11, 31, 51, 71, 91 ... first substrate, 21, 41, 61, 81, 101 ... second substrate, 12, 22, 32, 42, 52, 62, 72, 82, 92, 102... First conductive part, 12a, 13a, 14a, 22a, 23a, 24a, 32a, 33a, 34a, 42a, 43a, 44a, 52a , 53a, 54a, 55a, 62a, 63a, 64a, 65a, 92a, 93a, 94a, 102a, 103a, 104a,... Connecting part, 13, 23, 33, 43, 53, 63, 73, 83, 93 103, second conductive part, 14, 24, 34, 44, 54, 64, 74, 84, 94, 104 ... third conductive part, 75, 85 ... fourth conductive part, 15, 16, 35, 36, 45, 46, 5 , 56,76,77,78,86,87,88,95,96,105,106 ... slit.

Claims (1)

A laminated wiring board in which two substrates are laminated at least partially,
Each of the two substrates has three or more regions bounded by two or more slits extending inward from one end,
The two or more slits are spaced apart from each other;
Each of the two or more slits provided on the other of the two substrates is inserted into each of the two or more slits provided on one of the two substrates, and the two or more slits are provided. The two substrates are crossed and overlapped with each other as a boundary,
In one of the two substrates, at least one conductive portion provided on a surface facing the other of the two substrates, and in the other of the two substrates, of the two substrates A laminated wiring board, wherein at least one conductive portion provided on a surface facing one side is connected.

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