JP2010147051A - 半導体集積回路装置および半導体集積回路装置の製造方法 - Google Patents

半導体集積回路装置および半導体集積回路装置の製造方法 Download PDF

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JP2010147051A
JP2010147051A JP2008319355A JP2008319355A JP2010147051A JP 2010147051 A JP2010147051 A JP 2010147051A JP 2008319355 A JP2008319355 A JP 2008319355A JP 2008319355 A JP2008319355 A JP 2008319355A JP 2010147051 A JP2010147051 A JP 2010147051A
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film
integrated circuit
semiconductor integrated
circuit device
item
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JP2010147051A5 (enExample
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Hiroshi Tsukamoto
博 塚本
Hiromi Abe
宏美 阿部
Katsunari Iwama
克成 岩間
Akira Yajima
明 矢島
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Renesas Technology Corp
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Renesas Technology Corp
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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115596A (ja) * 2013-12-13 2015-06-22 チップモス テクノロジーズ インコーポレイテッドＣｈｉｐｍｏｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｉｎｃ． 半導体構造およびその製造方法
JP2016152328A (ja) * 2015-02-18 2016-08-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法

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Publication number Priority date Publication date Assignee Title
JP2003152014A (ja) * 2001-11-09 2003-05-23 Shinko Electric Ind Co Ltd 半導体装置の製造方法及び半導体装置
JP2008283024A (ja) * 2007-05-11 2008-11-20 Spansion Llc 半導体装置及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003152014A (ja) * 2001-11-09 2003-05-23 Shinko Electric Ind Co Ltd 半導体装置の製造方法及び半導体装置
JP2008283024A (ja) * 2007-05-11 2008-11-20 Spansion Llc 半導体装置及びその製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015115596A (ja) * 2013-12-13 2015-06-22 チップモス テクノロジーズ インコーポレイテッドＣｈｉｐｍｏｓ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｉｎｃ． 半導体構造およびその製造方法
JP2016152328A (ja) * 2015-02-18 2016-08-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
EP3067923A1 (en) * 2015-02-18 2016-09-14 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same
US10586777B2 (en) 2015-02-18 2020-03-10 Renesas Electronics Corporation Semiconductor device and method of manufacturing the same

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