JP2010129747A5 - - Google Patents

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Publication number
JP2010129747A5
JP2010129747A5 JP2008302248A JP2008302248A JP2010129747A5 JP 2010129747 A5 JP2010129747 A5 JP 2010129747A5 JP 2008302248 A JP2008302248 A JP 2008302248A JP 2008302248 A JP2008302248 A JP 2008302248A JP 2010129747 A5 JP2010129747 A5 JP 2010129747A5
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JP
Japan
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component
mounted component
moving
substrate
head
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JP2008302248A
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Japanese (ja)
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JP2010129747A (ja
JP4812827B2 (ja
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Publication of JP2010129747A5 publication Critical patent/JP2010129747A5/ja
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JP2008302248A 2008-11-27 2008-11-27 部品実装方法、部品実装装置 Active JP4812827B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008302248A JP4812827B2 (ja) 2008-11-27 2008-11-27 部品実装方法、部品実装装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008302248A JP4812827B2 (ja) 2008-11-27 2008-11-27 部品実装方法、部品実装装置

Publications (3)

Publication Number Publication Date
JP2010129747A JP2010129747A (ja) 2010-06-10
JP2010129747A5 true JP2010129747A5 (https=) 2011-06-23
JP4812827B2 JP4812827B2 (ja) 2011-11-09

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Family Applications (1)

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JP2008302248A Active JP4812827B2 (ja) 2008-11-27 2008-11-27 部品実装方法、部品実装装置

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JP (1) JP4812827B2 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5750574B2 (ja) * 2012-01-23 2015-07-22 パナソニックＩｐマネジメント株式会社 部品実装装置及び部品実装装置における作業手段の移動制御方法
WO2014141427A1 (ja) * 2013-03-14 2014-09-18 富士機械製造株式会社 実装設定方法及び実装設定装置
JP7804896B2 (ja) * 2020-05-26 2026-01-23 パナソニックＩｐマネジメント株式会社 部品装着装置および部品装着方法ならびに管理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0716834B2 (ja) * 1988-08-23 1995-03-01 松下電工株式会社 部品装着方法
JP2007012929A (ja) * 2005-06-30 2007-01-18 Yamaha Motor Co Ltd 表面実装機の干渉チェック方法、干渉チェック装置、同装置を備えた表面実装機、及び実装システム
JP2006279076A (ja) * 2006-07-07 2006-10-12 Matsushita Electric Ind Co Ltd 電子部品実装方法

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