JP2010129747A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010129747A5 JP2010129747A5 JP2008302248A JP2008302248A JP2010129747A5 JP 2010129747 A5 JP2010129747 A5 JP 2010129747A5 JP 2008302248 A JP2008302248 A JP 2008302248A JP 2008302248 A JP2008302248 A JP 2008302248A JP 2010129747 A5 JP2010129747 A5 JP 2010129747A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounted component
- moving
- substrate
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (6)
前記第１の搭載予定位置の上方に移動してきた前記第１の被搭載部品を下降させて前記第１の搭載予定位置に搭載する第１の部品下降工程と
を備え、
水平方向に移動自在なヘッドユニットが備える上下方向に昇降自在な第１のヘッドにより前記第１の被搭載部品を基板から上方に離間させた状態で前記ヘッドユニットを移動させることで前記第１の被搭載部品を前記第１の搭載予定位置の上方にまで移動させて前記第１の部品移動工程を実行するのに続けて、前記第１のヘッドを下降させることで前記第１の被搭載部品を前記第１の搭載予定位置に搭載して前記第１の部品下降工程を実行する部品実装方法において、
前記第１の部品下降工程での前記第１の被搭載部品の搭載が完了した後に、前記ヘッドユニットが備える上下方向に昇降自在な第２のヘッドが保持する第２の被搭載部品を前記基板から上方に離間させた状態で前記ヘッドユニットを移動させることで、前記第２の被搭載部品を前記基板に搭載する第２の搭載予定位置の上方にまで移動させる第２の部品移動工程と、
前記第２のヘッドを下降させることで前記第２の搭載予定位置の上方に移動してきた前記第２の被搭載部品を下降させて前記第２の搭載予定位置に搭載する第２の部品下降工程と
をさらに備え、
前記第１の部品移動工程では、当該第１の部品移動工程で前記第１の被搭載部品が移動する第１の経路の下方に存在する搭載済みの部品の高さに基いて、前記第１の被搭載部品の前記基板からの離間距離を調整し、
前記第２の部品移動工程では、当該第２の部品移動工程で前記第２の被搭載部品が移動する第２の経路の下方に存在する搭載済みの部品の高さに基いて、前記第２の被搭載部品の前記基板からの離間距離を調整し、
前記第１の部品移動工程では、前記第２のヘッドにより前記第２の被搭載部品を前記基板から上方に離間させた状態で、前記ヘッドユニットの移動に伴って前記第２の被搭載部品を移動させるとともに、当該第１の部品移動工程で前記第２の被搭載部品が移動する経路の下方に存在する搭載済みの部品の高さに基いて、前記第２の被搭載部品の前記基板からの離間距離を調整することを特徴とする部品実装方法。 A first component moving step of moving the first mounted component to a position above a first planned mounting position for mounting the first mounted component on the substrate in a state where the first mounted component is spaced upward from the substrate;
A first component lowering step of lowering the first mounted component that has moved above the first planned mounting position and mounting the first mounted component at the first planned mounting position;
The first unit is moved by moving the head unit in a state where the first mounted component is separated from the substrate upward by a first head which is movable up and down in a vertical direction provided in a head unit movable in the horizontal direction. The first mounted component is moved downward by moving the mounted component up to above the first planned mounting position and then performing the first component moving step. In the component mounting method of performing the first component lowering step by mounting the first mounting scheduled position on the first mounting position,
After the mounting of the first mounted component in the first component lowering step is completed, a second mounted component held by a second head that is movable up and down in the head unit is provided on the substrate. A second component moving step for moving the second mounted component to a position above the second planned mounting position for moving the second mounted component by moving the head unit in a state of being separated upward from
A second component lowering step of lowering the second head and lowering the second mounted component that has moved above the second planned mounting position and mounting the second mounted component at the second planned mounting position. When
Further comprising
In the first component moving step, the first component moving step is based on the height of the mounted component that exists below the first path along which the first mounted component moves in the first component moving step. Adjusting the separation distance of the mounted component from the substrate ,
In the second component moving step, the second component moving step is based on the height of the mounted component existing below the second path along which the second mounted component moves in the second component moving step. Adjusting the separation distance of the mounted component from the substrate,
In the first component moving step, the second mounted component is moved with the movement of the head unit in a state where the second mounted component is separated upward from the substrate by the second head. And moving the second mounted component from the substrate of the second mounted component based on the height of the mounted component existing below the path along which the second mounted component moves in the first component moving step. A component mounting method characterized by adjusting a separation distance .
前記第１の搭載予定位置の上方に移動してきた前記第１の被搭載部品を下降させて前記第１の搭載予定位置に搭載する第１の部品下降工程と
を備え、
水平方向に移動自在なヘッドユニットが備える上下方向に昇降自在な第１のヘッドにより前記第１の被搭載部品を基板から上方に離間させた状態で前記ヘッドユニットを移動させることで前記第１の被搭載部品を前記第１の搭載予定位置の上方にまで移動させて前記第１の部品移動工程を実行するのに続けて、前記第１のヘッドを下降させることで前記第１の被搭載部品を前記第１の搭載予定位置に搭載して前記第１の部品下降工程を実行する部品実装方法において、
前記第１の部品下降工程での前記第１の被搭載部品の搭載が完了した後に、前記ヘッドユニットが備える上下方向に昇降自在な第２のヘッドが保持する第２の被搭載部品を前記基板から上方に離間させた状態で前記ヘッドユニットを移動させることで、前記第２の被搭載部品を前記基板に搭載する第２の搭載予定位置の上方にまで移動させる第２の部品移動工程と、
前記第２のヘッドを下降させることで前記第２の搭載予定位置の上方に移動してきた前記第２の被搭載部品を下降させて前記第２の搭載予定位置に搭載する第２の部品下降工程と
をさらに備え、
前記第１の部品移動工程では、当該第１の部品移動工程で前記第１の被搭載部品が移動する第１の経路の下方に存在する搭載済みの部品の高さに基いて、前記第１の被搭載部品の前記基板からの離間距離を調整し、
前記第２の部品移動工程では、当該第２の部品移動工程で前記第２の被搭載部品が移動する第２の経路の下方に存在する搭載済みの部品の高さに基いて、前記第２の被搭載部品の前記基板からの離間距離を調整し、
前記第１の部品移動工程では、前記第２のヘッドにより前記第２の被搭載部品を前記基板から上方に離間させた状態で、前記ヘッドユニットの移動に伴って前記第２の被搭載部品を移動させ、
前記第１の部品移動工程では、当該第１の部品移動工程で前記第２の被搭載部品が移動する経路の下方に存在する搭載済みの部品の高さに基くこと無く、前記基板に実装済みの部品の高さとの干渉が発生しないと判断できる離間距離だけ前記第２の被搭載部品を前記基板から離間させ、
前記第２の部品移動工程では、前記基板からの離間距離が、前記第１の部品移動工程での離間距離から、当該第２の部品下降工程で前記第２の搭載予定位置の上方から当該第２の搭載予定位置にまで前記第２の被搭載部品を下降させる距離となるまで、前記第２の被搭載部品を下降させながら、前記第２の搭載予定位置の上方にまで移動させることを特徴とする部品実装方法。 A first component moving step of moving the first mounted component to a position above a first planned mounting position for mounting the first mounted component on the substrate in a state where the first mounted component is spaced upward from the substrate;
A first component lowering step of lowering the first mounted component that has moved above the first planned mounting position and mounting the first mounted component at the first planned mounting position;
The first unit is moved by moving the head unit in a state where the first mounted component is separated from the substrate upward by a first head which is movable up and down in a vertical direction provided in a head unit movable in the horizontal direction. The first mounted component is moved downward by moving the mounted component up to above the first planned mounting position and then performing the first component moving step. In the component mounting method of performing the first component lowering step by mounting the first mounting scheduled position on the first mounting position,
After the mounting of the first mounted component in the first component lowering step is completed, a second mounted component held by a second head that is movable up and down in the head unit is provided on the substrate. A second component moving step for moving the second mounted component to a position above the second planned mounting position for moving the second mounted component by moving the head unit in a state of being separated upward from
A second component lowering step of lowering the second head and lowering the second mounted component that has moved above the second planned mounting position and mounting the second mounted component at the second planned mounting position. When
Further comprising
In the first component moving step, the first component moving step is based on the height of the mounted component that exists below the first path along which the first mounted component moves in the first component moving step. Adjusting the separation distance of the mounted component from the substrate ,
In the second component moving step, the second component moving step is based on the height of the mounted component existing below the second path along which the second mounted component moves in the second component moving step. Adjusting the separation distance of the mounted component from the substrate,
In the first component moving step, the second mounted component is moved with the movement of the head unit in a state where the second mounted component is separated upward from the substrate by the second head. Move
In the first component moving step, the first component moving step has been mounted on the substrate without being based on the height of the mounted component existing below the path along which the second mounted component moves. Separating the second mounted component from the substrate by a separation distance at which it can be determined that no interference with the height of the component occurs.
In the second component moving step, the separation distance from the substrate is changed from the separation distance in the first component moving step to the second mounting position from above the second planned mounting position in the second component lowering step. The second mounted component is moved down to the upper position of the second mounting position while lowering the second mounted component until the distance to lower the second mounted component to the second mounting position is reached. Component mounting method.
前記第１の部品移動工程では、前記第１の経路の下方に存在する搭載済み部品の高さに基いて求められた前記第１の下降ストローク距離以上の離間距離で前記基板から離間させた状態で前記第１の被搭載部品を移動させて、前記第１の搭載予定位置の上方であって前記第１の下降ストローク距離だけ前記基板から離間した位置に前記第１の被搭載部品を位置させる請求項１または２に記載の部品実装方法。 In the first component lowering step, when a distance for lowering the first mounted component from above the first planned mounting position to the first mounting planned position is a first downward stroke distance,
In the first component moving step, the substrate is separated from the substrate by a separation distance equal to or greater than the first descending stroke distance obtained based on the height of the mounted component existing below the first path. Then, the first mounted component is moved to position the first mounted component at a position above the first planned mounting position and separated from the substrate by the first downward stroke distance. The component mounting method according to claim 1 or 2 .
前記第２の部品移動工程では、前記第２の経路の下方に存在する搭載済み部品の高さに基いて求められた前記第２の下降ストローク距離以上の離間距離で前記基板から離間させた状態で前記第２の被搭載部品を移動させて、前記第２の搭載予定位置の上方であって前記第２の下降ストローク距離だけ前記基板から離間した位置に前記第２の被搭載部品を位置させる請求項１ないし３のいずれか一項に記載の部品実装方法。 In the second component lowering step, when a distance for lowering the second mounted component from above the second planned mounting position to the second planned mounting position is a second descending stroke distance,
In the second component moving step, the substrate is separated from the substrate by a separation distance equal to or greater than the second descending stroke distance obtained based on the height of the mounted component existing below the second path. Then, the second mounted component is moved to position the second mounted component above the second planned mounting position and at a position separated from the substrate by the second downward stroke distance. The component mounting method according to any one of claims 1 to 3 .
前記ヘッドユニットにより上下方向に昇降自在に支持されており、被搭載部品を保持可能な第１のヘッドと、 A first head supported by the head unit so as to be vertically movable and capable of holding a mounted component;
前記ヘッドユニットにより上下方向に昇降自在に支持されており、被搭載部品を保持可能な第２のヘッドと、 A second head supported by the head unit so as to be vertically movable and capable of holding a mounted component;
前記第１のヘッド、前記第２のヘッドおよび前記ヘッドユニットの駆動を制御する駆動制御手段と Drive control means for controlling the drive of the first head, the second head, and the head unit;
を備え、With
前記駆動制御手段は、 The drive control means includes
前記第１のヘッドにより第１の被搭載部品を基板から上方に離間させた状態で前記ヘッドユニットを移動させることで、前記第１の被搭載部品を前記基板に搭載する第１の搭載予定位置の上方にまで移動させる第１の部品移動動作と、 A first planned mounting position for mounting the first mounted component on the substrate by moving the head unit with the first mounted component spaced apart from the substrate by the first head. A first component moving operation for moving the upper part of
前記第１のヘッドを下降させることで、前記第１の搭載予定位置の上方に移動してきた前記第１の被搭載部品を下降させて前記第１の搭載予定位置に搭載する第１の部品下降動作と、 Lowering the first head lowers the first component to be mounted that has moved above the first planned mounting position and mounts the first mounted component at the first planned mounting position. Operation and
前記第１の部品下降動作での前記第１の被搭載部品の搭載が完了した後に、前記第２のヘッドが保持する第２の被搭載部品を前記基板から上方に離間させた状態で前記ヘッドユニットを移動させることで、前記第２の被搭載部品を前記基板に搭載する第２の搭載予定位置の上方にまで移動させる第２の部品移動動作と、 After the mounting of the first mounted component in the first component lowering operation is completed, the head in a state where the second mounted component held by the second head is separated upward from the substrate. A second component moving operation for moving the second mounted component to a position above the second planned mounting position for mounting the second mounted component on the substrate by moving the unit;
前記第２のヘッドを下降させることで前記第２の搭載予定位置の上方に移動してきた前記第２の被搭載部品を下降させて前記第２の搭載予定位置に搭載する第２の部品下降動作と The second component lowering operation of lowering the second head and lowering the second mounted component that has moved above the second planned mounting position to mount it on the second planned mounting position When
を実行し、Run
前記第１の部品移動動作では、当該第１の部品移動動作で前記第１の被搭載部品が移動する第１の経路の下方に存在する搭載済みの部品の高さに基いて、前記第１の被搭載部品の前記基板からの離間距離を調整し、 In the first component moving operation, the first component moving operation is performed based on the height of a mounted component existing below the first path along which the first mounted component moves. Adjusting the separation distance of the mounted component from the substrate,
前記第２の部品移動動作では、当該第２の部品移動動作で前記第２の被搭載部品が移動する第２の経路の下方に存在する搭載済みの部品の高さに基いて、前記第２の被搭載部品の前記基板からの離間距離を調整し、 In the second component moving operation, the second component moving operation is performed based on the height of a mounted component existing below the second path along which the second mounted component moves. Adjusting the separation distance of the mounted component from the substrate,
前記第１の部品移動動作では、前記第２のヘッドにより前記第２の被搭載部品を前記基板から上方に離間させた状態で、前記ヘッドユニットの移動に伴って前記第２の被搭載部品を移動させるとともに、当該第１の部品移動動作で前記第２の被搭載部品が移動する経路の下方に存在する搭載済みの部品の高さに基いて、前記第２の被搭載部品の前記基板からの離間距離を調整することを特徴とする部品実装装置。 In the first component moving operation, the second mounted component is moved along with the movement of the head unit in a state where the second mounted component is separated upward from the substrate by the second head. And moving the second mounted component from the substrate of the second mounted component based on the height of the mounted component existing below the path along which the second mounted component moves in the first component moving operation. A component mounting apparatus that adjusts the separation distance of the components.
前記ヘッドユニットにより上下方向に昇降自在に支持されており、被搭載部品を保持可能な第１のヘッドと、
前記ヘッドユニットにより上下方向に昇降自在に支持されており、被搭載部品を保持可能な第２のヘッドと、
前記第１のヘッド、前記第２のヘッドおよび前記ヘッドユニットの駆動を制御する駆動制御手段と
を備え、
前記駆動制御手段は、
前記第１のヘッドにより第１の被搭載部品を基板から上方に離間させた状態で前記ヘッドユニットを移動させることで、前記第１の被搭載部品を前記基板に搭載する第１の搭載予定位置の上方にまで移動させる第１の部品移動動作と、
前記第１のヘッドを下降させることで、前記第１の搭載予定位置の上方に移動してきた前記第１の被搭載部品を下降させて前記第１の搭載予定位置に搭載する第１の部品下降動作と、
前記第１の部品下降動作での前記第１の被搭載部品の搭載が完了した後に、前記第２のヘッドが保持する第２の被搭載部品を前記基板から上方に離間させた状態で前記ヘッドユニットを移動させることで、前記第２の被搭載部品を前記基板に搭載する第２の搭載予定位置の上方にまで移動させる第２の部品移動動作と、
前記第２のヘッドを下降させることで前記第２の搭載予定位置の上方に移動してきた前記第２の被搭載部品を下降させて前記第２の搭載予定位置に搭載する第２の部品下降動作と
を実行し、
前記第１の部品移動動作では、当該第１の部品移動動作で前記第１の被搭載部品が移動する第１の経路の下方に存在する搭載済みの部品の高さに基いて、前記第１の被搭載部品の前記基板からの離間距離を調整し、
前記第２の部品移動動作では、当該第２の部品移動動作で前記第２の被搭載部品が移動する第２の経路の下方に存在する搭載済みの部品の高さに基いて、前記第２の被搭載部品の前記基板からの離間距離を調整し、
前記第１の部品移動動作では、前記第２のヘッドにより前記第２の被搭載部品を前記基板から上方に離間させた状態で、前記ヘッドユニットの移動に伴って前記第２の被搭載部品を移動させ、
前記第１の部品移動動作では、当該第１の部品移動動作で前記第２の被搭載部品が移動する経路の下方に存在する搭載済みの部品の高さに基くこと無く、前記基板に実装済みの部品の高さとの干渉が発生しないと判断できる離間距離だけ前記第２の被搭載部品を前記基板から離間させ、
前記第２の部品移動動作では、前記基板からの離間距離が、前記第１の部品移動動作での離間距離から、当該第２の部品下降動作で前記第２の搭載予定位置の上方から当該第２の搭載予定位置にまで前記第２の被搭載部品を下降させる距離となるまで、前記第２の被搭載部品を下降させながら、前記第２の搭載予定位置の上方にまで移動させることを特徴とする部品実装装置。 A head unit that can move horizontally,
A first head supported by the head unit so as to be vertically movable and capable of holding a mounted component;
A second head supported by the head unit so as to be vertically movable and capable of holding a mounted component;
Drive control means for controlling the drive of the first head, the second head, and the head unit;
With
The drive control means includes
A first planned mounting position for mounting the first mounted component on the substrate by moving the head unit with the first mounted component spaced apart from the substrate by the first head. A first component moving operation for moving the upper part of
Lowering the first head lowers the first component to be mounted that has moved above the first planned mounting position and mounts the first mounted component at the first planned mounting position. Operation and
After the mounting of the first mounted component in the first component lowering operation is completed, the head in a state where the second mounted component held by the second head is separated upward from the substrate. A second component moving operation for moving the second mounted component to a position above a second planned mounting position for mounting the second mounted component on the substrate by moving the unit;
The second component lowering operation of lowering the second head and lowering the second mounted component that has moved above the second planned mounting position to mount it on the second planned mounting position When
Run
In the first component moving operation, the first component moving operation is performed based on the height of a mounted component existing below the first path along which the first mounted component moves. Adjusting the separation distance of the mounted component from the substrate,
In the second component moving operation, the second component moving operation is performed based on the height of a mounted component existing below the second path along which the second mounted component moves. Adjusting the separation distance of the mounted component from the substrate,
In the first component moving operation, the second mounted component is moved along with the movement of the head unit in a state where the second mounted component is separated upward from the substrate by the second head. Move
In the first component moving operation, the first component moving operation is already mounted on the substrate without being based on the height of the mounted component existing below the path along which the second mounted component moves. Separating the second mounted component from the substrate by a separation distance at which it can be determined that no interference with the height of the component occurs.
In the second component movement operation, the separation distance from the substrate is set to be the first separation movement distance from the first component movement operation and the second component lowering operation from above the second planned mounting position. The second mounted component is moved down to the upper position of the second mounting position while lowering the second mounted component until the distance to lower the second mounted component to the second mounting position is reached. A component mounting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008302248A JP4812827B2 (en) | 2008-11-27 | 2008-11-27 | Component mounting method and component mounting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008302248A JP4812827B2 (en) | 2008-11-27 | 2008-11-27 | Component mounting method and component mounting apparatus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010129747A JP2010129747A (en) | 2010-06-10 |
| JP2010129747A5 true JP2010129747A5 (en) | 2011-06-23 |
| JP4812827B2 JP4812827B2 (en) | 2011-11-09 |
Family
ID=42329946
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008302248A Active JP4812827B2 (en) | 2008-11-27 | 2008-11-27 | Component mounting method and component mounting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4812827B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5750574B2 (en) * | 2012-01-23 | 2015-07-22 | パナソニックＩｐマネジメント株式会社 | Component mounting apparatus and method for controlling movement of working means in component mounting apparatus |
| JPWO2014141427A1 (en) * | 2013-03-14 | 2017-02-16 | 富士機械製造株式会社 | Mounting setting method and mounting setting device |
| JP2021190448A (en) * | 2020-05-26 | 2021-12-13 | パナソニックＩｐマネジメント株式会社 | Component mounting device, component mounting method and management device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0716834B2 (en) * | 1988-08-23 | 1995-03-01 | 松下電工株式会社 | Parts mounting method |
| JP2007012929A (en) * | 2005-06-30 | 2007-01-18 | Yamaha Motor Co Ltd | Method for checking interference of surface mounting machine, device for checking interference, surface mounting machine with the device and mounting system |
| JP2006279076A (en) * | 2006-07-07 | 2006-10-12 | Matsushita Electric Ind Co Ltd | Method for mounting electronic component |
-
2008
- 2008-11-27 JP JP2008302248A patent/JP4812827B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN2911641Y (en) | Glass lifter detector | |
| RU2017117430A (en) | Robotic module | |
| JP7317999B2 (en) | planting cup placement device | |
| CN203791783U (en) | Linear soldering tin machine | |
| CN103785915A (en) | Linear tin soldering machine | |
| JP2010129747A5 (en) | ||
| CN104330267A (en) | Automatic anti-pinch detection device of lifter | |
| RU2013154359A (en) | METHOD AND DEVICE FOR MOVING AND POSITIONING THE CAPTURE DEVICE AND ROBOT SUPPORTED BY THE CAPTURE DEVICE | |
| CN104241169A (en) | Sucking and turning device for medium and small size liquid crystal substrates | |
| CN103736623A (en) | Dipping lifting coating equipment and dipping lifting coating method | |
| CN207464619U (en) | Magnetic group separation equipment | |
| CN104440078A (en) | Automatic overturning device | |
| CN207759641U (en) | A kind of pallet feed mechanism and automatic charging machine | |
| JP2015135903A5 (en) | ||
| CN105790140A (en) | Mounting base for electric equipment cabinet | |
| CN203818565U (en) | Winding mold position adjusting device | |
| CN206624903U (en) | A kind of vibration ageing device | |
| CN107919774A (en) | A kind of motor stator rotor together equipment | |
| CN202639194U (en) | Nailing machine with laser positioning function | |
| CN103659813A (en) | Method for controlling movement of mechanism for semiconductor chip absorbing | |
| CN205151337U (en) | Feeding machine | |
| WO2010058922A3 (en) | Height adjustment apparatus | |
| CN203791131U (en) | Dipping-lifting film plating equipment | |
| CN102180033A (en) | An automatic printing height measuring and controlling device exclusively used on servo direct injection device for leather printing | |
| CN205075455U (en) | Half tone fixing device of battery silk screen printing device |