JP2010120245A - 金属プレート付き樹脂成形品 - Google Patents
金属プレート付き樹脂成形品 Download PDFInfo
- Publication number
- JP2010120245A JP2010120245A JP2008295481A JP2008295481A JP2010120245A JP 2010120245 A JP2010120245 A JP 2010120245A JP 2008295481 A JP2008295481 A JP 2008295481A JP 2008295481 A JP2008295481 A JP 2008295481A JP 2010120245 A JP2010120245 A JP 2010120245A
- Authority
- JP
- Japan
- Prior art keywords
- resin molded
- exposed end
- metal plate
- end portion
- bus bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 66
- 239000011347 resin Substances 0.000 title claims abstract description 66
- 239000002184 metal Substances 0.000 title claims abstract description 44
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 235000012054 meals Nutrition 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 25
- 230000005540 biological transmission Effects 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 238000003780 insertion Methods 0.000 description 5
- 230000000149 penetrating effect Effects 0.000 description 4
- 238000005192 partition Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0082—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units specially adapted for transmission control units, e.g. gearbox controllers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
- F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
- F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0969—Apertured conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10401—Eyelets, i.e. rings inserted into a hole through a circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10742—Details of leads
- H05K2201/1075—Shape details
- H05K2201/1084—Notched leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Control Of Transmission Device (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Connector Housings Or Holding Contact Members (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Connection Of Plates (AREA)
Abstract
【解決手段】本発明のセンサユニット10は、金属プレート20と、金属プレート20と一体に成形された樹脂成形部30と、樹脂成形部30から露出した露出端部52を有し、樹脂成形部30の内部に配設されたバスバー50と、露出端部52の先端側に設けられ、金属プレート20上に配設された油温センサ41とリベット止めされる接続部52Aとを備え、露出端部52の両側部は、樹脂成形部30と部分的に接触している構成としたところに特徴を有する。
【選択図】図6
Description
接続部の両側部は、全て樹脂成形部と接触している構成としてもよい。
このような構成によると、接続部の両側部と樹脂成形部との摩擦抵抗が大きくなるため、リベット止めを行う際に、接続部が動くことを規制できる。
本発明の実施形態1を図1ないし図10の図面を参照しながら説明する。本実施形態におけるセンサユニット(本発明の「金属プレート付き樹脂成形品」に相当する。)10は、自動車のトランスミッション中に装着され、ミッションオイルに接触可能な状態で使用される。センサユニット10は、図1に示すように、金属プレート20と、この金属プレート20と一体に成形された樹脂成形部30と、電子部品とを備えて構成されている。なお、電子部品は、図2に示すように、油温センサ41、油圧スイッチ42等を備えて構成されている。
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
(1)本実施形態では露出端部52の根元側から先端側に至る範囲における一方の側部を樹脂成形部30と一体に成形しているものの、本発明によると、前記範囲において間欠的に樹脂成形部30と連結させてもよい。
11…コネクタ部
12…張り出し部
20…金属プレート
30…樹脂成形部
41…油温センサ(電子部品)
50…バスバー
52…露出端部
52A…接続部
60…リベット
Claims (3)
- 金属プレートと、
前記金属プレートと一体に成形された樹脂成形部と、
前記樹脂成形部から露出した露出端部を有し、前記樹脂成形部の内部に配設されたバスバーと、
前記露出端部の先端側に設けられ、前記金属プレート上に配設された電子部品とリベット止めされる接続部とを備え、
前記露出端部の両側部は、前記樹脂成形部と部分的に接触していることを特徴とする金属プレート付き樹脂成形品。 - 前記接続部の両側部は、全て前記樹脂成形部と接触している請求項1に記載の金属プレート付き樹脂成形品。
- 前記バスバーにおける前記露出端部と異なる端部を収容し、前記樹脂成形部の外周縁から突出するコネクタ部と、
前記コネクタ部と隣り合う位置でかつ前記露出端部と対応する位置に、前記樹脂成形部の外周縁から前記コネクタ部の突出方向に張り出して形成された張り出し部とを備え、
前記露出端部は、前記張り出し部が形成されたことにより前記張り出し部の張り出し方向に拡張して形成された請求項1または請求項2に記載の金属プレート付き樹脂成形品。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008295481A JP5229561B2 (ja) | 2008-11-19 | 2008-11-19 | 金属プレート付き樹脂成形品 |
DE200910051016 DE102009051016A1 (de) | 2008-11-19 | 2009-10-28 | Eine Einheit aus harzgeformten Artikel, der mit einer Metallplatte versehen ist, und Verfahren zum Bilden desselben |
US12/617,016 US8309865B2 (en) | 2008-11-19 | 2009-11-12 | Resin-molded article fit with a metal plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008295481A JP5229561B2 (ja) | 2008-11-19 | 2008-11-19 | 金属プレート付き樹脂成形品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010120245A true JP2010120245A (ja) | 2010-06-03 |
JP5229561B2 JP5229561B2 (ja) | 2013-07-03 |
Family
ID=42105423
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008295481A Active JP5229561B2 (ja) | 2008-11-19 | 2008-11-19 | 金属プレート付き樹脂成形品 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8309865B2 (ja) |
JP (1) | JP5229561B2 (ja) |
DE (1) | DE102009051016A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012210412A1 (de) | 2011-06-22 | 2013-01-03 | Sumitomo Wiring Systems, Ltd. | Sensorvorrichtung mit o-ring |
JP2013171614A (ja) * | 2012-02-17 | 2013-09-02 | Denso Corp | 油圧スイッチモジュール |
US11841251B2 (en) * | 2018-03-06 | 2023-12-12 | Ezmems Ltd. | Direct implementation of sensors in tubes |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6652195B2 (ja) * | 2016-08-22 | 2020-02-19 | 株式会社オートネットワーク技術研究所 | 導電部材、回路構成体、及び、導電部材の製造方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008001225A (ja) * | 2006-06-22 | 2008-01-10 | Sumitomo Wiring Syst Ltd | 金属プレート付き樹脂成形品 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003348731A (ja) * | 2002-05-22 | 2003-12-05 | Yazaki Corp | ブスバ配線板及びブスバ配線板の組立方法 |
US7520759B2 (en) * | 2006-06-28 | 2009-04-21 | Eaton Corporation | Modular bus assembly for a loadcenter |
US7759577B1 (en) * | 2007-07-31 | 2010-07-20 | Amazon Technologies, Inc. | Bus bar system |
US7952026B2 (en) * | 2009-06-22 | 2011-05-31 | Jim Ramsey | Angled stabs for a busway plug in unit |
-
2008
- 2008-11-19 JP JP2008295481A patent/JP5229561B2/ja active Active
-
2009
- 2009-10-28 DE DE200910051016 patent/DE102009051016A1/de not_active Ceased
- 2009-11-12 US US12/617,016 patent/US8309865B2/en active Active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008001225A (ja) * | 2006-06-22 | 2008-01-10 | Sumitomo Wiring Syst Ltd | 金属プレート付き樹脂成形品 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102012210412A1 (de) | 2011-06-22 | 2013-01-03 | Sumitomo Wiring Systems, Ltd. | Sensorvorrichtung mit o-ring |
US8826753B2 (en) | 2011-06-22 | 2014-09-09 | Sumitomo Wiring Systems, Ltd. | Sensor apparatus with O-ring |
DE102012210412B4 (de) | 2011-06-22 | 2018-05-30 | Sumitomo Wiring Systems, Ltd. | Sensorvorrichtung mit o-ring |
JP2013171614A (ja) * | 2012-02-17 | 2013-09-02 | Denso Corp | 油圧スイッチモジュール |
US11841251B2 (en) * | 2018-03-06 | 2023-12-12 | Ezmems Ltd. | Direct implementation of sensors in tubes |
Also Published As
Publication number | Publication date |
---|---|
US8309865B2 (en) | 2012-11-13 |
DE102009051016A1 (de) | 2010-05-20 |
US20100124665A1 (en) | 2010-05-20 |
JP5229561B2 (ja) | 2013-07-03 |
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