JP2010103342A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2010103342A5 JP2010103342A5 JP2008274159A JP2008274159A JP2010103342A5 JP 2010103342 A5 JP2010103342 A5 JP 2010103342A5 JP 2008274159 A JP2008274159 A JP 2008274159A JP 2008274159 A JP2008274159 A JP 2008274159A JP 2010103342 A5 JP2010103342 A5 JP 2010103342A5
- Authority
- JP
- Japan
- Prior art keywords
- heat
- shield case
- electronic component
- dissipation structure
- component according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims 5
- 238000009792 diffusion process Methods 0.000 claims 4
- 230000020169 heat generation Effects 0.000 claims 2
- 230000005540 biological transmission Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008274159A JP5698894B2 (ja) | 2008-10-24 | 2008-10-24 | 電子部品の放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008274159A JP5698894B2 (ja) | 2008-10-24 | 2008-10-24 | 電子部品の放熱構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010103342A JP2010103342A (ja) | 2010-05-06 |
| JP2010103342A5 true JP2010103342A5 (enrdf_load_stackoverflow) | 2011-02-10 |
| JP5698894B2 JP5698894B2 (ja) | 2015-04-08 |
Family
ID=42293725
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008274159A Active JP5698894B2 (ja) | 2008-10-24 | 2008-10-24 | 電子部品の放熱構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5698894B2 (enrdf_load_stackoverflow) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5565608B2 (ja) * | 2009-09-25 | 2014-08-06 | 株式会社オートネットワーク技術研究所 | 回路ユニット |
| JP2016127341A (ja) * | 2014-12-26 | 2016-07-11 | 富士通株式会社 | 無線装置 |
| WO2016163135A1 (ja) * | 2015-04-08 | 2016-10-13 | 三菱電機株式会社 | 電子モジュール及び電子装置 |
| US9781819B2 (en) * | 2015-07-31 | 2017-10-03 | Laird Technologies, Inc. | Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding |
| JP2017212379A (ja) * | 2016-05-26 | 2017-11-30 | 株式会社ジェイテクト | 半導体装置 |
| CN106231883A (zh) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | Pcb板组件及具有其的移动终端 |
| JP6958438B2 (ja) | 2018-03-08 | 2021-11-02 | 株式会社デンソー | 電子部品用放熱装置 |
| JP7326138B2 (ja) * | 2019-12-06 | 2023-08-15 | サクサ株式会社 | 電子機器における放熱構造 |
| KR20250022850A (ko) * | 2022-08-16 | 2025-02-17 | 구글 엘엘씨 | 6 ghz 대역에서 동작가능한 무선 네트워크 디바이스 |
| CN116406156B (zh) * | 2023-06-09 | 2023-08-18 | 中国科学院微小卫星创新研究院 | 电磁屏蔽与散热一体化的星载电子系统及其装配方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5748455A (en) * | 1996-04-23 | 1998-05-05 | Ericsson, Inc. | Electromagnetic shield for a radiotelephone |
| JPH1041678A (ja) * | 1996-07-25 | 1998-02-13 | Hitachi Ltd | 光受信器 |
| US6195267B1 (en) * | 1999-06-23 | 2001-02-27 | Ericsson Inc. | Gel structure for combined EMI shielding and thermal control of microelectronic assemblies |
| JP2004207661A (ja) * | 2002-12-26 | 2004-07-22 | Sony Corp | 放熱部材および放熱部材を有する電子機器 |
| KR100652621B1 (ko) * | 2003-11-21 | 2006-12-06 | 엘지전자 주식회사 | 휴대용 단말기의 방열장치 |
| JP4525460B2 (ja) * | 2005-05-12 | 2010-08-18 | 富士通株式会社 | モバイル機器 |
| JP2008277432A (ja) * | 2007-04-26 | 2008-11-13 | Kaneka Corp | 放熱構造体 |
-
2008
- 2008-10-24 JP JP2008274159A patent/JP5698894B2/ja active Active