JP2010103342A5 - - Google Patents

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Publication number
JP2010103342A5
JP2010103342A5 JP2008274159A JP2008274159A JP2010103342A5 JP 2010103342 A5 JP2010103342 A5 JP 2010103342A5 JP 2008274159 A JP2008274159 A JP 2008274159A JP 2008274159 A JP2008274159 A JP 2008274159A JP 2010103342 A5 JP2010103342 A5 JP 2010103342A5
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JP
Japan
Prior art keywords
heat
shield case
electronic component
dissipation structure
component according
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JP2008274159A
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Japanese (ja)
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JP5698894B2 (en
JP2010103342A (en
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Priority to JP2008274159A priority Critical patent/JP5698894B2/en
Priority claimed from JP2008274159A external-priority patent/JP5698894B2/en
Publication of JP2010103342A publication Critical patent/JP2010103342A/en
Publication of JP2010103342A5 publication Critical patent/JP2010103342A5/ja
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Publication of JP5698894B2 publication Critical patent/JP5698894B2/en
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Claims (6)

複数の電子部品を搭載した回路基板、この回路基板上に搭載された発熱部品を含む一部の電子部品を覆って該電子部品を電磁シールドするシールドケース、このシールドケース内に設けられ、上記発熱部品と当接することで該発熱部品の発生する熱を上記シールドケースへ伝達する伝達部、上記回路基板及びシールドケースを収納する筐体、この筐体を構成する一つの内面に一方の面の略全域が密着するとともに、他方の面の一部が上記シールドケースの１つの外面の略全域に密着した熱拡散板を備えたことを特徴とする電子部品の放熱構造。 A circuit board having a plurality of electronic components mounted thereon, a shield case for electromagnetically shielding the electronic components by covering a part of the electronic components including the heat generating components mounted on the circuit boards, and the heat generation provided in the shield case transmitting portion for transmitting the heat generation of the heat generating component to by parts abutting to the shield case, a housing for accommodating the circuit board and the shield case, substantially on one side to one of the inner surfaces constituting the housing with whole comes into close contact, the heat radiation structure of an electronic component part of the other surface is characterized by comprising a heat diffusion plate in close contact with substantially the entire area of one of the outer surface of the shield case. 発熱部品と伝達部との間には伝熱シートが介在されていることを特徴とする請求項１に記載の電子部品の放熱構造。The heat dissipation structure for an electronic component according to claim 1, wherein a heat transfer sheet is interposed between the heat generating component and the transmission portion. 回路基板とシールドケースとの間に該シールドケースを筐体内面に向けて押圧する弾性部材が配されていることを特徴とする請求項１または請求項２のいずれか１項に記載の電子部品の放熱構造。The electronic component according to claim 1, wherein an elastic member that presses the shield case toward the inner surface of the housing is disposed between the circuit board and the shield case. Heat dissipation structure. 熱拡散板及びシールドケースは一体に形成されていることを特徴とする請求項１乃至３のいずれか１項に記載の電子部品の放熱構造。The heat dissipation structure for an electronic component according to any one of claims 1 to 3, wherein the heat diffusion plate and the shield case are integrally formed. 熱拡散板は筐体の内面にインサート成型されていることを特徴とする請求項１乃至３のいずれか１項に記載の電子部品の放熱構造。4. The heat dissipation structure for an electronic component according to claim 1, wherein the heat diffusion plate is insert-molded on an inner surface of the housing. 5. シールドケースと熱拡散板との間には伝熱シートが介在されていることを特徴とする請求項１乃至３または請求項５のいずれか１項に記載の電子部品の放熱構造。6. The heat dissipation structure for an electronic component according to claim 1, wherein a heat transfer sheet is interposed between the shield case and the heat diffusion plate.
JP2008274159A 2008-10-24 2008-10-24 Heat dissipation structure for electronic components Active JP5698894B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008274159A JP5698894B2 (en) 2008-10-24 2008-10-24 Heat dissipation structure for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008274159A JP5698894B2 (en) 2008-10-24 2008-10-24 Heat dissipation structure for electronic components

Publications (3)

Publication Number Publication Date
JP2010103342A JP2010103342A (en) 2010-05-06
JP2010103342A5 true JP2010103342A5 (en) 2011-02-10
JP5698894B2 JP5698894B2 (en) 2015-04-08

Family

ID=42293725

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008274159A Active JP5698894B2 (en) 2008-10-24 2008-10-24 Heat dissipation structure for electronic components

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JP (1) JP5698894B2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5565608B2 (en) * 2009-09-25 2014-08-06 株式会社オートネットワーク技術研究所 Circuit unit
JP2016127341A (en) * 2014-12-26 2016-07-11 富士通株式会社 Radio equipment
WO2016163135A1 (en) * 2015-04-08 2016-10-13 三菱電機株式会社 Electronic module and electronic device
US9781819B2 (en) * 2015-07-31 2017-10-03 Laird Technologies, Inc. Multifunctional components for electronic devices and related methods of providing thermal management and board level shielding
JP2017212379A (en) * 2016-05-26 2017-11-30 株式会社ジェイテクト Semiconductor device
CN106231883A (en) * 2016-07-28 2016-12-14 广东欧珀移动通信有限公司 Pcb board assembly and there is its mobile terminal
JP6958438B2 (en) 2018-03-08 2021-11-02 株式会社デンソー Heat dissipation device for electronic components
JP7326138B2 (en) * 2019-12-06 2023-08-15 サクサ株式会社 Heat dissipation structure in electronic equipment
WO2024039395A1 (en) * 2022-08-16 2024-02-22 Google Llc Wireless network device operable in the 6 ghz band
CN116406156B (en) * 2023-06-09 2023-08-18 中国科学院微小卫星创新研究院 Electromagnetic shielding and heat dissipation integrated satellite-borne electronic system and assembly method thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5748455A (en) * 1996-04-23 1998-05-05 Ericsson, Inc. Electromagnetic shield for a radiotelephone
JPH1041678A (en) * 1996-07-25 1998-02-13 Hitachi Ltd Optical receiver
US6195267B1 (en) * 1999-06-23 2001-02-27 Ericsson Inc. Gel structure for combined EMI shielding and thermal control of microelectronic assemblies
JP2004207661A (en) * 2002-12-26 2004-07-22 Sony Corp Heat radiation member and electronic apparatus therewith
KR100652621B1 (en) * 2003-11-21 2006-12-06 엘지전자 주식회사 Apparatus preventing discharging heat for portable terminal
JP4525460B2 (en) * 2005-05-12 2010-08-18 富士通株式会社 Mobile device
JP2008277432A (en) * 2007-04-26 2008-11-13 Kaneka Corp Heat dissipation structure

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