JP2010098286A - 印刷回路基板及びその製造方法 - Google Patents
印刷回路基板及びその製造方法 Download PDFInfo
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- JP2010098286A JP2010098286A JP2009100013A JP2009100013A JP2010098286A JP 2010098286 A JP2010098286 A JP 2010098286A JP 2009100013 A JP2009100013 A JP 2009100013A JP 2009100013 A JP2009100013 A JP 2009100013A JP 2010098286 A JP2010098286 A JP 2010098286A
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
【解決手段】接着層20の上面に電子素子30を付着する工程と、電子素子30が埋め込まれるように、電子素子30の上側及び接着層20の下側に絶縁体41,43をそれぞれ積層する工程と、絶縁体41に回路パターン45及びビア46を形成する工程と、を含むことを特徴とする印刷回路基板及びその製造方法。
【選択図】図7
Description
12 回路パターン
14 ビア
16 キャビティ
20 接着層
21 離型紙
22 位置合わせマーク
30,30a,30b 電子素子
32,32a,32b 電極
41,43 絶縁体
42,44 ベース基板
45 回路パターン
46,46a,46b,47 ビア
Claims (13)
- 接着層の上面に電子素子を付着する工程と、
前記電子素子が埋め込まれるように、前記電子素子の上側及び前記接着層の下側に絶縁体をそれぞれ積層する工程と、
前記絶縁体に回路パターン及びビアを形成する工程と、
を含む印刷回路基板の製造方法。 - 前記絶縁体を積層する工程が、前記電子素子の上側及び前記接着層の下側に対して同時に行われることを特徴とする請求項1に記載の印刷回路基板の製造方法。
- 前記電子素子を付着する工程の前に、
前記接着層の上面に、キャビティが形成されたコア基板を積層する工程をさらに含み、
前記電子素子は、前記キャビティから露出されている前記接着層に付着されることを特徴とする請求項1または2に記載の印刷回路基板の製造方法。 - 前記電子素子が複数であり、
前記複数の電子素子のうちの一部は電極が上面を向くように配置され、残りは電極が下面を向くように配置されることを特徴とする請求項1から3の何れか一項に記載の印刷回路基板の製造方法。 - 前記複数の電子素子のうちの前記一部は前記接着層の上面に付着され、前記残りは前記接着層の下面に付着されることを特徴とする請求項4に記載の印刷回路基板の製造方法。
- 前記接着層には、前記電子素子を位置合わせするための位置合わせマークが形成されることを特徴とする請求項1から5の何れか一項に記載の印刷回路基板の製造方法。
- 前記位置合わせマークが、前記接着層を貫通する孔であることを特徴とする請求項6に記載の印刷回路基板の製造方法。
- 接着層と、
前記接着層に付着された電子素子と、
前記電子素子が埋め込まれるように、前記接着層の上面及び下面に積層された基板部と、
前記基板部に形成された回路パターン及びビアと、
を含む印刷回路基板。 - 前記基板部は、
前記電子素子が内蔵されるようにキャビティが形成され、前記接着層の上面に積層されたコア基板と、
前記コア基板の上面及び前記接着層の下面に積層された絶縁体と、
を含むことを特徴とする請求項8に記載の印刷回路基板。 - 前記電子素子が複数であり、
前記複数の電子素子のうちの一部は電極が上面を向くように配置され、残りは電極が下面を向くように配置されることを特徴とする請求項8または9に記載の印刷回路基板。 - 前記複数の電子素子のうちの前記一部は前記接着層の上面に付着され、前記残りは前記接着層の下面に付着されることを特徴とする請求項10に記載の印刷回路基板。
- 前記接着層には、前記電子素子を位置合わせするための位置合わせマークが形成されることを特徴とする請求項8から11の何れか一項に記載の印刷回路基板。
- 前記位置合わせマークは、前記接着層を貫通する孔であることを特徴とする請求項12に記載の印刷回路基板。
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KR1020080102508A KR100999531B1 (ko) | 2008-10-20 | 2008-10-20 | 인쇄회로기판 및 그 제조방법 |
KR10-2008-0102508 | 2008-10-20 |
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JP2015035560A (ja) * | 2013-08-09 | 2015-02-19 | 新光電気工業株式会社 | 配線基板の製造方法 |
WO2019198241A1 (ja) * | 2018-04-13 | 2019-10-17 | 株式会社メイコー | 部品内蔵基板の製造方法及び部品内蔵基板 |
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KR101283821B1 (ko) * | 2011-05-03 | 2013-07-08 | 엘지이노텍 주식회사 | 인쇄회로기판의 제조 방법 |
KR101237668B1 (ko) | 2011-08-10 | 2013-02-26 | 삼성전기주식회사 | 반도체 패키지 기판 |
US20130256007A1 (en) * | 2012-03-28 | 2013-10-03 | Ibiden Co., Ltd. | Wiring board with built-in electronic component and method for manufacturing the same |
CN104219883B (zh) * | 2013-05-29 | 2017-08-11 | 碁鼎科技秦皇岛有限公司 | 具有内埋元件的电路板及其制作方法 |
DE102014118462A1 (de) * | 2014-12-11 | 2016-06-16 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Semiflexible Leiterplatte mit eingebetteter Komponente |
KR20160084143A (ko) * | 2015-01-05 | 2016-07-13 | 삼성전기주식회사 | 전자소자 내장기판 및 그 제조 방법 |
US9806063B2 (en) | 2015-04-29 | 2017-10-31 | Qualcomm Incorporated | Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability |
TWI777741B (zh) * | 2021-08-23 | 2022-09-11 | 欣興電子股份有限公司 | 內埋元件基板及其製作方法 |
KR20230047812A (ko) * | 2021-10-01 | 2023-04-10 | 삼성전기주식회사 | 전자부품 내장기판 |
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KR20100043461A (ko) | 2010-04-29 |
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