JP2010087713A - Piezoelectric oscillator - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a piezoelectric oscillator which can improve productivity and operability by making it easy to inspect a piezoelectric vibration element even after assembly, and is adaptive to size reduction. <P>SOLUTION: The piezoelectric oscillator includes: a substrate part; a container body which has a first recessed space formed by providing a first frame part on one principal surface of the substrate part and has a second recessed space formed by providing a second frame part on the other principal surface of the substrate part; a piezoelectric vibration element mounted on a pair of two piezoelectric vibration element mounting pads provided in the first recessed space; an integrated circuit element mounted on an integrated circuit element mounting pad provided in the second recessed space; and a wiring board for airtightly sealing the fist recessed space, wherein a pair of two piezoelectric vibration element-measuring pads is provided on the principal surface of the wiring board on a side opposite to the principal surface facing the first recessed space side of the wiring board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a piezoelectric oscillator used in an electronic device or the like.

FIG. 15 is a cross-sectional view showing a conventional piezoelectric oscillator. FIG. 16A is a perspective plan view showing one main surface of a substrate portion of a container body constituting the conventional piezoelectric oscillator, and FIG. 16B is a substrate of the container body constituting the conventional piezoelectric oscillator. FIG. 16C is a perspective plan view showing the other main surface of the substrate portion of the container body constituting the conventional piezoelectric oscillator.
As shown in FIGS. 15 to 16, a conventional piezoelectric oscillator 700 mainly includes a container body 701, a piezoelectric vibration element 707, an integrated circuit element 708, and a lid body 709 as an example.
The container body 701 includes a substrate portion 701a and two frame portions 701b and 701c.
The container body 701 has a frame portion 701b provided on one main surface of the substrate portion 701a to form a first recessed space 702, and a frame portion 701c provided on the other main surface of the substrate portion 701a. The recessed space 704 is formed.
A pair of piezoelectric vibration element mounting pads 703a and 703b are provided on one main surface of the substrate portion 701a exposed in the first recess space 702.
An integrated circuit element mounting pad 705 is provided on the other main surface of the substrate portion 701 a exposed in the second recess space 704.
Further, the substrate portion 701a has a laminated structure, and as shown in FIG. 16B, the first wiring pattern 712a and the first wiring pattern 712a are formed on the inner layer that is transmitted through one main surface of the substrate portion 701a. Two wiring patterns 712b and the like are provided.
On the piezoelectric vibration element mounting pads 703a and 703b, a piezoelectric vibration element 707 having a pair of excitation electrodes electrically connected via a conductive adhesive 706 on the front and back main surfaces is mounted. The top surface of the frame portion 701b of the container body 701 surrounding the piezoelectric vibration element 707 is covered with and joined to a metal lid body 709. Thereby, the first recessed space 702 is hermetically sealed.
Further, the integrated circuit element 708 is electrically and mechanically bonded to the integrated circuit element mounting pad 705 via a conductive bonding material such as solder. This state is called loading.

Further, as shown in FIGS. 16A to 16C, the other main surface of the substrate portion 701a exposed in the second recess space 704 has two pairs of piezoelectric vibration element measurement pads 710a. , 710b.
The one piezoelectric vibration element mounting pad 703a is connected to one piezoelectric vibration element measurement pad 710a via a via conductor 711 and a first wiring pattern 712a provided in the inner layer of the substrate portion 701a of the container body 701. ing.
The other piezoelectric vibration element mounting pad 703b is connected to the other piezoelectric vibration element measurement pad 710b via a via conductor 711 and a second wiring pattern 712b provided in the inner layer of the substrate portion 701a of the container body 701. A connected structure is known (for example, see Patent Document 1).

  In addition, after the assembly of the conventional piezoelectric oscillator 700 is completed, the measurement contact pins are brought into contact with the piezoelectric vibration element measurement pads 710a and 710b, so that the oscillation frequency and crystal impedance characteristics of the piezoelectric vibration element 707 can be measured. Measure with an electrical property measuring instrument. Thereby, the characteristic inspection as the piezoelectric oscillator 700 is performed, and the quality of the piezoelectric oscillator 700 is determined.

Japanese Patent No. 3406845

  With the downsizing of the conventional piezoelectric oscillator 700, it is necessary to reduce the surface area of the piezoelectric vibration element measurement pads 710a and 710b formed on the bottom surface of the second recessed space 704 of the container body 701. However, since the surface areas of the piezoelectric vibration element measurement pads 710a and 710b are reduced, it has become difficult to bring the measurement contact pins of the electrical characteristic measuring device into contact with the piezoelectric vibration element measurement pads 710a and 710b. Therefore, there has been a problem that workability and efficiency of characteristic inspection due to poor contact are remarkably lowered.

  The present invention has been made in view of the above problems, and the object thereof is to improve the productivity and workability by easily performing the characteristic inspection of the piezoelectric vibration element even after assembly. Another object of the present invention is to provide a piezoelectric oscillator that can cope with downsizing.

  In the piezoelectric oscillator of the present invention, a first frame portion is provided on one main surface of the substrate portion and the substrate portion to form a first recessed space, and a second recess surface is formed on the other main surface of the substrate portion. A container body provided with a frame portion to form a second recess space, and two pairs of piezoelectric vibration element mounting pads provided on one main surface of the substrate portion exposed in the first recess space; A piezoelectric vibration element mounted and provided with an excitation electrode; an integrated circuit element mounted on an integrated circuit element mounting pad provided on the other main surface of the substrate portion exposed in the second recess space; A wiring board for hermetically sealing the first recess space, and two main piezoelectric vibration element measuring pads on the main surface opposite to the main surface facing the first recess space side of the wiring substrate. Is provided.

  Further, a plurality of first connection electrodes are provided on the main surface of the first frame portion of the container body, and the first connection electrodes are provided on the main surface facing the first recessed space side of the wiring board. A plurality of second connection electrodes provided so as to face each other are provided, and the first connection electrode and the second connection electrode are electrically connected at a connection portion made of a conductive connection material, The frame part and the wiring board are joined in a ring shape with a sealing member provided inside or outside of the connection part along the first frame part.

  The main surface of the wiring board on which the piezoelectric vibration element measuring pad is provided is provided with a lid bonding wiring pattern, and the lid is bonded to the lid bonding wiring pattern. It is.

  The wiring board is provided with a third frame portion to form a third recess space, and a piezoelectric vibration element measurement pad is provided in the third recess space. is there.

  Further, the piezoelectric vibration element measuring pad exposed in the third recess space is covered with an insulating resin.

  The main surface of the third frame portion is provided with a lid bonding wiring pattern, and the lid is bonded to the lid bonding wiring pattern.

  According to the piezoelectric oscillator of the present invention, two pairs of piezoelectric vibration element measurement pads are provided on one main surface of the wiring board that hermetically seals the first recess space, so that the electric vibration of the piezoelectric vibration element can be reduced. When measuring the mechanical characteristics, it is possible to form two pairs of piezoelectric vibration element measuring pads having a size that can reliably contact the contact pins of the electrical characteristic measuring instrument. Therefore, it is possible to improve workability, inspection efficiency, and productivity of the characteristic inspection of the piezoelectric oscillator.

  Further, since it is not necessary to form two pairs of piezoelectric vibration element measurement pads on the bottom surface in the second recess space of the container body, the piezoelectric oscillator can be further downsized.

In addition, since the lid is bonded to the lid bonding wiring pattern, it is protected from fluctuations in the oscillation frequency of the piezoelectric oscillator caused by dirt or foreign matter adhering to the two pairs of piezoelectric vibration element measurement pads. can do.
Further, it is possible to protect against a short circuit between one adjacent piezoelectric vibration element measurement pad and the other piezoelectric vibration element measurement pad due to dust or foreign matter adhering to the piezoelectric vibration element measurement pad.
In addition, by connecting this second lid to a ground terminal which is one of the external connection electrode terminals of the container body, the external noise is well shielded and a stable oscillation frequency is output. It becomes possible to make it.

Since the piezoelectric vibration element measurement pad in the third recess space is covered with an insulating resin, dust or foreign matter adheres to the piezoelectric vibration element measurement pad, so that the oscillation of the piezoelectric oscillator is performed. It can protect against frequency fluctuations.
In addition, it is possible to protect against a short circuit between one adjacent piezoelectric vibration element measurement pad and the other piezoelectric vibration element measurement pad due to dust or foreign matter adhering to the piezoelectric vibration element measurement pad.

  Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. A case where quartz is used for the piezoelectric vibration element will be described.

(First embodiment)
FIG. 1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. FIG. 2 is a cross-sectional view taken along the line AA of FIG. FIG. 3 is an external perspective view seen from the other main surface of the wiring board constituting the piezoelectric oscillator according to the first embodiment of the present invention. FIG. 4A is a plan view showing one main surface of the container body constituting the piezoelectric oscillator according to the first embodiment of the present invention, and FIG. 4B is the first embodiment of the present invention. FIG. 4C is a perspective plan view showing the inner layer surface of the substrate portion of the container body constituting the piezoelectric oscillator according to the embodiment, and FIG. 4C is the other side of the container body constituting the piezoelectric oscillator according to the first embodiment of the present invention. It is a top view which shows the main surface. In addition, the illustrated dimensions are partially exaggerated.

   As shown in FIGS. 1 and 2, the piezoelectric oscillator 100 according to the embodiment of the present invention mainly includes a container body 110, a piezoelectric vibration element 120, a wiring board 130, and an integrated circuit element 140. In the piezoelectric oscillator 100, a piezoelectric vibration element 120 is mounted in a first recess space 111 formed in the container body 110, and an integrated circuit element 140 is mounted in a second recess space 114. . The first recess space 111 is hermetically sealed by the wiring board 130.

As shown in FIGS. 1 and 2, the piezoelectric vibration element 120 is formed by adhering an excitation electrode 122 to a crystal element plate 121, and an alternating voltage from the outside passes through the excitation electrode 122. When applied to 121, excitation occurs in a predetermined vibration mode and frequency.
The quartz base plate 121 is a substantially flat plate shape that is cut from an artificial crystalline lens at a predetermined cut angle and is subjected to outer shape processing, and has a planar shape of, for example, a quadrangle.
The excitation electrode 122 is formed by depositing and forming a metal in a predetermined pattern on both the front and back main surfaces of the crystal base plate 121.
Such a piezoelectric vibration element 120 includes a lead electrode extending from the excitation electrode 122 attached to both main surfaces of the piezoelectric vibration element 120 and a piezoelectric vibration element mounting pad 113a formed on the inner bottom surface of the first recess space 111, 113b is electrically and mechanically connected to the first recessed space 111 through the conductive adhesive 150. At this time, an end side which is a free end opposite to the side on which the extraction electrode is provided is defined as a tip end portion 123 of the piezoelectric vibration element 120.

As shown in FIGS. 1 and 2, the integrated circuit element 140 is provided with an oscillation circuit or the like for generating an oscillation output from the piezoelectric vibration element 120 on the circuit formation surface, and an output signal generated by the oscillation circuit. Is output to the outside of the piezoelectric oscillator 100 via the external connection electrode terminal 119, and is used as a reference signal such as a clock signal, for example.
In addition, in the integrated circuit element 140, in order to compensate the fluctuation of the oscillation frequency of the oscillation circuit due to the temperature change by applying a control voltage according to the ambient temperature to the variable capacitance element, the temperature is controlled by the cubic function generation circuit and the storage element unit. A compensation circuit unit is provided, and a temperature sensor is connected to the cubic function generation circuit.
This temperature sensor is configured to output a temperature data signal (voltage value) generated based on the detected temperature and a voltage value applied to the temperature sensor to a cubic function generation circuit.
The integrated circuit element 140 is mounted on an integrated circuit element mounting pad 115 formed on the substrate portion 110a exposed in the second recessed space 114 of the container body 110 via a conductive bonding material such as solder.

As shown in FIGS. 1 to 3, the container body 110 is mainly composed of a substrate part 110 a, a first frame part 110 b, and a second frame part 110 c.
In the container body 110, a first frame portion 110b is provided on one main surface of the substrate portion 110a, and a first recessed space 111 is formed. In addition, a second frame portion 110 c is provided on the other main surface of the container body 110, and a second recessed space 114 is formed.
The substrate part 110a, the first frame part 110b and the second frame part 110c constituting the container body 110 are formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics. The substrate unit 110a has a structure in which ceramic materials are stacked.

A plurality of first connection electrodes 116 a and 116 b are provided on the first frame portion 110 b of the container body 110.
An annular sealing conductor pattern 112 is provided on the inner side of the first connection electrodes 116a and 116b of the first frame portion 110b.
A pair of piezoelectric vibration element mounting pads 113a and 113b are provided on one main surface of the substrate portion 110a exposed in the first recess space 111.
Wiring patterns 117a, 117b and the like are provided in the inner layer of the substrate part 110a.
A plurality of integrated circuit element mounting pads 115 are provided on the other main surface of the substrate portion 110a exposed in the second recess space 114.

As shown in FIGS. 4A to 4C, one piezoelectric vibration element mounting pad 113a is connected to a wiring pattern 117a formed in the inner layer of the substrate 110a of the container body 110 by a via conductor 118a. Has been.
The wiring pattern 117a is connected to the first connection electrode 116a by a via conductor 118c. As a result, the one piezoelectric vibration element mounting pad 113a is connected to the first connection electrode 116a.
The other piezoelectric vibration element mounting pad 113b is connected to a wiring pattern 117b provided in an inner layer of the substrate portion 110a of the container body 110 by a via conductor 118a.
The wiring pattern 117b is connected to the first connection electrode 116b by a via conductor 118b. As a result, the other piezoelectric vibration element mounting pad 113b is connected to the first connection electrode 116b.
External connection electrode terminals 119 are provided at the four corners of the main surface of the second frame portion 110c that is parallel to the main surface of the substrate body 110a on which the integrated circuit element mounting pad 115 is provided.
The integrated circuit element mounting pad 115 and the external connection electrode terminal 119 include a wiring pattern (not shown) having a portion formed in the substrate portion 110a in the second recessed space 114 of the container body 110 and a second frame. They are connected by via conductors (not shown) formed inside the portion 110c.

As shown in FIGS. 3 and 4, the wiring board 130 is formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics.
Two pairs of piezoelectric vibration element measuring pads 131a and 131b are provided on the main surface of the wiring board 130 opposite to the main surface facing the first recessed space 111 side.
A plurality of second connection electrodes 132a and 132b provided to face the first connection electrodes 116a and 116b are provided on the main surface of the wiring board 130 facing the first recessed space 111 side. ing.
The second connection electrodes 132a and 132b are electrically and mechanically connected to the first connection electrodes 116a and 116b through a connection portion 160 made of a conductive bonding material.
In addition, a sealing member wiring pattern 133 is formed on the main surface of the wiring board 130 facing the first concave space 111 side at a location facing the sealing conductor pattern 112. A sealing member 134 is deposited on the sealing member wiring pattern 133.
In such a wiring board 130, the first recessed space 111 is hermetically sealed with nitrogen gas or vacuum. Specifically, the wiring board 130 is mounted in a form that covers the first recessed space 111 of the container body 110 on which the piezoelectric vibration element 120 is mounted in a predetermined atmosphere, and the sealing member 134 is heated and melted. The wiring board 130 and the container body 110 are joined to be hermetically sealed.

The two pairs of piezoelectric vibration element measuring pads 131a and 131b are provided on the main surface of the wiring board 131 opposite to the main surface facing the first recessed space 111 side.
The piezoelectric vibration element measurement pads 131a and 131b are used for measuring characteristics such as an oscillation frequency and crystal impedance of the piezoelectric vibration element 120 mounted in the first concave space 111 of the container body 110.

The second connection electrodes 132a and 132b are provided along the short side of the main surface of the wiring board 130 facing the first recessed space 111 side.
The second connection electrodes 132a and 132b are connected to the piezoelectric vibration element measurement pads 131a and 131b via via conductors 135a and 135b provided in the wiring board 130.
The one second connection electrode 132a is electrically and mechanically connected to the one first connection electrode 116a through a connection portion 160 made of a conductive bonding material. As a result, the one piezoelectric vibration element mounting pad 113a is connected to the one piezoelectric vibration element measurement pad 131a.
The other second connection electrode 132b is electrically and mechanically connected to the other first connection electrode 116b via a connection portion 160 made of a conductive bonding material. As a result, the other piezoelectric vibration element mounting pad 113b is connected to the other piezoelectric vibration element measurement pad 131b.

The wiring pattern 133 for the sealing member is provided in a ring shape on the main surface facing the first concave space 111 side of the wiring board 130 and inside the second connection electrodes 132a and 132b.
Further, the sealing member wiring pattern 133 is provided with a sealing member 134.

  The sealing member 134 is made of, for example, a gold tin (Au—Sn) brazing material. The thickness of the gold tin (Au—Sn) layer is 10 μm to 40 μm. For example, the component ratio is 80% gold and 20% tin.

  The conductive adhesive 150 contains conductive powder as a conductive filler in a binder such as silicone resin. As the conductive powder, aluminum (Al), molybdenum (Mo), tungsten (W ), Platinum (Pt), palladium (Pd), silver (Ag), titanium (Ti), nickel (Ni), nickel iron (NiFe), or a combination thereof is used. .

  The connecting portion 160 is formed of, for example, a conductive bonding material made of solder, gold-tin (Au—Sn) brazing material, or the like.

  When the container body 110 is made of alumina ceramics, a sealing conductor pattern 112, a piezoelectric vibration element, and the like are formed on the surface of a ceramic green sheet obtained by adding and mixing a suitable organic solvent to a predetermined ceramic material powder. Conventionally known screens include a conductive paste to be a mounting pad 113, an external connection electrode terminal 119, and the like, and a conductive paste to be a via conductor in a through-hole previously punched by punching a ceramic green sheet. It is manufactured by applying by printing, laminating a plurality of these and press-molding them, followed by firing at a high temperature.

According to the piezoelectric oscillator according to the first embodiment of the present invention, the main surface opposite to the main surface facing the first recess space 111 side of the wiring substrate 130 hermetically sealing the first recess space 11 is provided. By providing the two pairs of piezoelectric vibration element measurement pads 131a and 131b, 2 of a size that can reliably contact the contact pins of the electric characteristic measuring instrument when measuring the electric characteristics of the piezoelectric vibration element 120. A pair of piezoelectric vibration element measurement pads 131a and 131b can be formed. Therefore, the workability, inspection efficiency, and productivity of the characteristic inspection of the piezoelectric oscillator 100 can be improved.
Further, since it is not necessary to form two pairs of piezoelectric vibration element measurement pads on the inner bottom surface of the second recess space 114 of the container body 110, the piezoelectric oscillator 100 can be further downsized.

(Second Embodiment)
The piezoelectric oscillator according to the second embodiment of the present invention is a sealing member in which the first frame portion and the wiring board are provided outside the connection portion along the first frame portion. It differs from the first embodiment in that it is joined in an annular shape.
FIG. 5 is an exploded perspective view showing a piezoelectric oscillator according to the second embodiment of the present invention. 6 is a cross-sectional view taken along line BB in FIG. FIG. 7 is an external perspective view seen from the other main surface of the wiring board constituting the piezoelectric oscillator according to the second embodiment of the present invention. FIG. 8A is a plan view showing one main surface of the container body constituting the piezoelectric oscillator according to the second embodiment of the present invention, and FIG. 8B is the second embodiment of the present invention. FIG. 8C is a perspective plan view showing the inner layer surface of the substrate portion of the container body constituting the piezoelectric oscillator according to the embodiment, and FIG. 8C is the other side of the container body constituting the piezoelectric oscillator according to the second embodiment of the present invention. It is a top view which shows the main surface. In addition, the illustrated dimensions are partially exaggerated.

As shown in FIGS. 5-7, the container body 210 is mainly comprised by the board | substrate part 210a, the 1st frame part 210b, and the 2nd frame part 210c.
In the container body 210, a first frame portion 210b is provided on one main surface of the substrate portion 210a to form a first recessed space 211. In addition, a second frame portion 210 c is provided on the other main surface of the container body 210 to form a second recessed space 214.
The substrate part 210a, the first frame part 210b, and the second frame part 210c constituting the container body 210 are formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics. The substrate portion 210a has a structure in which ceramic materials are stacked.

A plurality of first connection electrodes 216 a and 216 b are provided on the main surface of the first frame portion 210 b of the container body 210.
Further, an annular sealing conductor pattern 212 is provided on the main surface of the first frame portion 210b outside the first connection electrodes 216a and 216b. That is, the sealing conductor pattern 212 is provided along the edge of the first frame portion 210b.
Two pairs of piezoelectric vibration element mounting pads 213a and 213b are provided on one main surface of the substrate portion 210a exposed in the first recess space 211.
In the container body 210, a second recessed space 214 is formed by the other main surface of the substrate portion 210a and the second frame portion 210c.
Wiring patterns 217a, 217b, etc. are provided in the inner layer of the substrate part 210a.
A plurality of integrated circuit element mounting pads 215 are provided on the other main surface of the substrate portion 210 a exposed in the second recess space 214.

As shown in FIGS. 8A to 8C, one piezoelectric vibration element mounting pad 113a is connected to a wiring pattern 217a formed in the inner layer of the substrate portion 210a of the container body 210 by a via conductor 218a. Has been.
The wiring pattern 217a is connected to the first connection electrode 216a by a via conductor 218c. Thereby, the one piezoelectric vibration element mounting pad 213a is connected to the first connection electrode 216a.
The other piezoelectric vibration element mounting pad 213b is connected to a wiring pattern 217b provided in the inner layer of the substrate portion 210a of the container body 210 by a via conductor 218a.
The wiring pattern 217b is connected to the first connection electrode 216b by a via conductor 218b. Thereby, the other piezoelectric vibration element mounting pad 213b is connected to the first connection electrode 216b.
External connection electrode terminals 219 are provided at the four corners of the main surface of the second frame portion 210c which is parallel to the main surface on which the integrated circuit element mounting pads 215 of the substrate 210a of the container body 210 are provided.
The integrated circuit element mounting pad 215 and the external connection electrode terminal 219 include a wiring pattern (not shown) having a portion formed in the substrate portion 210a in the second recessed space 214 of the container body 210 and a second frame. They are connected by via conductors (not shown) formed inside the portion 210c.

As shown in FIGS. 7 and 8, the wiring board 230 is formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics.
Two pairs of piezoelectric vibration element measurement pads 231a and 231b are provided on the main surface of the wiring board 230 opposite to the main surface facing the first recessed space 211 side.
A plurality of second connection electrodes 232a and 232b provided to face the first connection electrodes 216a and 216b are provided on the main surface of the wiring board 230 facing the first recessed space 211 side. ing.
The second connection electrodes 232a and 232b are electrically and mechanically connected to the first connection electrodes 216a and 216b through a connection portion 260 made of a conductive bonding material.
In addition, a sealing member wiring pattern 233 is formed on the main surface of the wiring substrate 230 facing the first recessed space 211 side at a location facing the sealing conductor pattern 212. A sealing member 234 is deposited on the sealing member wiring pattern 233.
In such a wiring board 230, the first recessed space 211 is hermetically sealed with nitrogen gas, vacuum, or the like. Specifically, the wiring board 230 is mounted in a predetermined atmosphere so as to cover the first recessed space 211 of the container body 210 on which the piezoelectric vibration element 220 is mounted, and the sealing member 234 is heated and melted. The wiring board 230 and the container body 210 are joined to be hermetically sealed.

The two pairs of piezoelectric vibration element measuring pads 231a and 231b are provided on the main surface of the wiring board 231 opposite to the main surface facing the first recessed space 211 side.
The piezoelectric vibration element measurement pads 231a and 231b are used for measuring characteristics such as an oscillation frequency and crystal impedance of the piezoelectric vibration element 220 mounted in the first recess space 211 of the container body 210.

The second connection electrodes 232a and 232b are provided on the main surface of the wiring board 30 facing the first recessed space 211 side.
The second connection electrodes 232a and 232b are connected to the piezoelectric vibration element measurement pads 231a and 231b via via conductors 235a and 235b provided in the wiring board 230.
The one second connection electrode 232a is electrically and mechanically connected to the one first connection electrode 216a through a connection portion 260 made of a conductive bonding material. As a result, the one piezoelectric vibration element mounting pad 213a is connected to the one piezoelectric vibration element measurement pad 231a.
The other second connection electrode 232b is electrically and mechanically connected to the other first connection electrode 216b through a connection portion 260 made of a conductive bonding material. Thus, the other piezoelectric vibration element mounting pad 213b is connected to the other piezoelectric vibration element measurement pad 231b.

  The wiring pattern 233 for the sealing member is provided on the main surface facing the first recessed space 211 side of the wiring board 230 in an annular shape outside the second connection electrodes 232a and 232b. That is, the sealing member wiring pattern 233 is provided in an annular shape along the edge of the main surface of the wiring board 230 facing the first recessed space 211. The sealing member wiring pattern 233 is provided with a sealing member 234.

The piezoelectric oscillator according to the second embodiment of the present invention has the same effects as those of the first embodiment.
Further, since the sealing member 234 can be exposed to the outside from between the first container body 210 and the wiring board 230, the bonding state between the first container body 210 and the wiring board 230 is visually confirmed. can do.
Further, since the joint portion 260 and the first recessed space 211 of the container body 210 are surrounded by the sealing member 234, noise from the outside is well shielded, and the piezoelectric vibration element is stably oscillated. be able to.

(Third embodiment)
In the piezoelectric oscillator according to the third embodiment of the present invention, a lid bonding wiring pattern is provided on one main surface of the wiring board, and the lid is bonded to the lid bonding wiring pattern. This is different from the first embodiment.
FIG. 9 is an exploded perspective view showing a piezoelectric oscillator according to the third embodiment of the present invention. 10 is a cross-sectional view taken along the line CC of FIG.

The wiring board 330 is formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics.
Two pairs of piezoelectric vibration element measuring pads 331a and 331b are provided on the main surface of the wiring board 330 opposite to the main surface facing the first recessed space 311 side.
In addition, lid connecting wiring patterns 336a and 336b are provided on the main surface of the wiring board 330 opposite to the main surface facing the first recessed space 311 side.
The main surface of the wiring board 330 facing the first recessed space 311 is opposed to the first connection electrodes 316a and 316b provided on the main surface of the first frame 310b of the container 310. A plurality of provided second connection electrodes 332a and 332b are provided.
The second connection electrodes 332a and 332b are electrically and mechanically connected to the first connection electrodes 316a and 316b through a connection portion 360 made of a conductive bonding material.

The lid bonding wiring pattern 336 is provided along the edge on the short side of the main surface opposite to the main surface facing the first recessed space 311 side of the wiring board 330. The lid 370 is fixed to the lid bonding wiring pattern 336 with a laser.
The lid 370 is made of, for example, an Fe—Ni alloy (42 alloy), an Fe—Ni—Co alloy (Kovar), or the like.
As the laser, for example, a carbon dioxide laser, a YAG laser, a YVO ₄ laser, a semiconductor laser, an excimer laser, or the like is used. For example, in the case of a YVO ₄ laser, the third harmonic of the laser having a wavelength of, for example, 300 to 400 nm is used.

According to the piezoelectric oscillator according to the third embodiment of the present invention, a lid bonding wiring pattern 336 is provided on one main surface of the wiring board 330, and the lid bonding wiring pattern 336 has a lid 370. Can be protected from fluctuations in the oscillation frequency of the piezoelectric oscillator caused by dirt or foreign matter adhering to the two pairs of piezoelectric vibration element measurement pads 331a and 331b.
Further, it is possible to protect against a short circuit between one adjacent piezoelectric vibration element measurement pad 331a and the other piezoelectric vibration element measurement pad 331b due to dust or foreign matter adhering to the piezoelectric vibration element measurement pads 331a and 331b. it can.
Further, by connecting the lid 370 to a ground terminal which is one of the external connection electrode terminals 319 of the container 310, noise from the outside is well shielded and a stable oscillation frequency is output. It becomes possible to make it.

(Fourth embodiment)
In the piezoelectric oscillator according to the fourth embodiment of the present invention, the third recess space is provided on one main surface of the wiring substrate by the wiring substrate and the third frame portion, and is exposed in the third recess space. The second embodiment is different from the first embodiment in that the two pairs of piezoelectric vibration element measurement pads are provided on one main surface of the wiring board.
FIG. 11 is an exploded perspective view showing a piezoelectric oscillator according to the fourth embodiment of the present invention. 12 is a cross-sectional view taken along the line DD of FIG.

As shown in FIGS. 11 and 12, a third frame portion 437 is provided on the main surface of the wiring board 430 opposite to the main surface facing the first recessed space 411 side, and the third recessed space 438 is provided. Is formed.
The wiring board 430 and the third frame portion 437 are formed by laminating a plurality of ceramic materials such as alumina ceramics and glass-ceramics.
Two pairs of piezoelectric vibration element measurement pads 431a and 431b are provided on the main surface opposite to the main surface facing the first recess space 411 side of the wiring board 430 exposed in the third recess space 438. It has been.
A plurality of second connection electrodes 432a and 432b provided to face the first connection electrodes 416a and 416b are provided on the main surface of the wiring board 430 facing the first recessed space 411. ing.
The second connection electrodes 432a and 432b are electrically and mechanically connected to the first connection electrodes 416a and 416b through a connection portion 460 made of a conductive bonding material.
In addition, a sealing member wiring pattern 433 is formed on the main surface of the wiring board 430 facing the first recessed space 411 side at a location facing the sealing conductor pattern 412. In addition, a sealing member 434 is attached to the sealing member wiring pattern 433.

The two pairs of piezoelectric vibration element measurement pads 431 a and 431 b are provided in the third recess space 438. The piezoelectric vibration element measurement pads 431a and 431b are provided so as to be located on the inner side of the third frame portion 437 in plan view.
The piezoelectric vibration element measurement pads 431a and 431b are used for measuring characteristics such as the oscillation frequency and crystal impedance of the piezoelectric vibration element 420 mounted in the first recessed space 411 of the container body 410.

The second connection electrodes 432a and 432b are provided along the short side of the main surface facing the first recessed space 411 side of the wiring board 430.
The second connection electrodes 432a and 432b are connected to the piezoelectric vibration element measurement pads 431a and 431b via via conductors 435a and 435b provided in the wiring board 430.
The one second connection electrode 432a is electrically and mechanically connected to the one first connection electrode 416a through a connection portion 460 made of a conductive bonding material. As a result, the one piezoelectric vibration element mounting pad 413a is connected to the one piezoelectric vibration element measurement pad 431a.
The other second connection electrode 432b is electrically and mechanically connected to the other first connection electrode 416b through a connection portion 460 made of a conductive bonding material. Thus, the other piezoelectric vibration element mounting pad 413b is connected to the other piezoelectric vibration element measurement pad 431b.

  The sealing member wiring pattern 433 is annularly provided on the main surface of the wiring board 430 facing the first recessed space 411 and inside the second connection electrodes 432a and 432b. Further, the sealing member wiring pattern 433 is provided with a sealing member 434.

  The piezoelectric oscillator according to the fourth embodiment of the present invention has the same effects as those of the first embodiment of the present invention.

(Fifth embodiment)
In the piezoelectric oscillator according to the fifth embodiment of the present invention, two pairs of piezoelectric vibration element measurement pads provided on one main surface of the wiring board exposed in the third recessed space are made of an insulating resin. The fourth embodiment is different from the fourth embodiment in that it is covered by the above.
FIG. 13 is a cross-sectional view showing a piezoelectric oscillator according to a fifth embodiment of the present invention.

A third frame portion 537 is provided on the main surface of the wiring substrate 530 opposite to the main surface facing the first concave space 511 side to form a third concave space 538.
Two pairs of piezoelectric vibration element measurement pads 531a and 531b are provided on the main surface opposite to the main surface facing the first recess space 511 side of the wiring board 530 exposed in the third recess space 438. It has been.
Two pairs of piezoelectric vibration element measurement pads 531 a and 531 b provided in the third recess space 538 are covered with an insulating resin 580.
The insulating resin 580 is often made of epoxy, polyimide, or the like, and is made of a thermoplastic resin having a characteristic of flowing when softened or melted by heating.

According to the piezoelectric oscillator of the fifth embodiment of the present invention, the two pairs of piezoelectric vibration element measurement pads 531a and 531b exposed in the third recessed space 538 are covered and protected by the insulating resin 580. Therefore, it is possible to protect against fluctuations in the oscillation frequency of the piezoelectric oscillator 500 due to the influence of dust, foreign matter and the like.
Further, it is possible to protect against a short circuit between one adjacent piezoelectric vibration element measurement pad 531a and the other piezoelectric vibration element measurement pad 531b due to dust or foreign matter adhering to the piezoelectric vibration element measurement pads 531a and 531b. it can.

(Sixth embodiment)
In the piezoelectric oscillator according to the sixth embodiment of the present invention, the main surface of the third frame portion is provided with a lid bonding wiring pattern, and the lid is bonded to the lid bonding wiring pattern. This is different from the third embodiment.
FIG. 14 is a cross-sectional view showing a piezoelectric oscillator according to the sixth embodiment of the present invention.

A third frame portion 637 is provided on one main surface of the wiring board 630 to form a third recessed space 638.
A pair of two piezoelectric vibration element measurement pads 631a and 631b are provided on the main surface opposite to the main surface facing the first recess space 611 side of the wiring board 630 exposed in the third recess space 638. It has been.
On the main surface of the third frame portion 638, a lid bonding wiring pattern 636 is provided. The lid 670 is fixed to the lid bonding wiring pattern 636 with a laser.

According to the piezoelectric oscillator according to the sixth embodiment of the present invention, the lid bonding wiring pattern 636 is provided on one main surface of the third frame portion 637, and the lid bonding wiring pattern 636 is provided on the lid bonding wiring pattern 636. By joining the lid 670, it is possible to protect against fluctuations in the oscillation frequency of the piezoelectric oscillator caused by dust or foreign matter adhering to the two pairs of piezoelectric vibration element measurement pads 631a and 631b.
Further, it is possible to protect against a short circuit between one adjacent piezoelectric vibration element measurement pad 631a and the other piezoelectric vibration element measurement pad 631b due to dust or foreign matter adhering to the piezoelectric vibration element measurement pads 631a and 631b. it can.
Further, by connecting the lid 670 to a ground terminal which is one of the external connection electrode terminals 619 of the container body 610, noise from the outside is well shielded and a stable oscillation frequency is output. It becomes possible to make it.

In addition, this invention is not limited to the said embodiment, A various change, improvement, etc. are possible in the range which does not deviate from the summary of this invention.
For example, in the above-described embodiment, the case where quartz is used as the piezoelectric material constituting the piezoelectric vibration element has been described. However, as other piezoelectric materials, lithium niobate, lithium tantalate, or piezoelectric ceramics is used as the piezoelectric material. The piezoelectric vibration element may be used.
For example, the piezoelectric vibration connected to the second connection electrode via the via conductor after measuring the electrical characteristics such as crystal impedance and oscillation frequency of the piezoelectric vibration element by bringing the probe into contact with the piezoelectric vibration element measurement pad. You may make it cut | disconnect the location of the element measurement pad.

1 is an exploded perspective view showing a piezoelectric oscillator according to a first embodiment of the present invention. It is AA sectional drawing of FIG. It is the external appearance perspective view seen from the other main surface of the wiring board which comprises the piezoelectric oscillator which concerns on the 1st Embodiment of this invention. (A) is a transparent top view which shows one main surface of the container body which comprises the piezoelectric oscillator which concerns on the 1st Embodiment of this invention, (b) concerns on the 1st Embodiment of this invention. It is a see-through | perspective top view which shows the inner layer surface of the board | substrate part of the container body which comprises a piezoelectric oscillator, (c) shows the other main surface of the container body which comprises the piezoelectric oscillator which concerns on the 1st Embodiment of this invention. It is a perspective plan view. It is a disassembled perspective view which shows the piezoelectric oscillator which concerns on the 2nd Embodiment of this invention. It is BB sectional drawing of FIG. It is the external appearance perspective view seen from the other main surface of the wiring board which comprises the piezoelectric oscillator which concerns on the 2nd Embodiment of this invention. (A) is a perspective top view which shows one main surface of the container body which comprises the piezoelectric oscillator which concerns on the 2nd Embodiment of this invention, (b) concerns on the 2nd Embodiment of this invention. It is a see-through | perspective top view which shows the inner layer surface of the board | substrate part of the container body which comprises a piezoelectric oscillator, (c) shows the other main surface of the container body which comprises the piezoelectric oscillator which concerns on the 2nd Embodiment of this invention. It is a perspective plan view. It is a disassembled perspective view which shows the piezoelectric oscillator which concerns on the 3rd Embodiment of this invention. It is CC sectional drawing of FIG. It is a disassembled perspective view which shows the piezoelectric oscillator which concerns on the 4th Embodiment of this invention. It is DD sectional drawing of FIG. It is a step view showing a piezoelectric oscillator according to a fifth embodiment of the present invention. It is a step view showing a piezoelectric oscillator according to a sixth embodiment of the present invention. It is sectional drawing which shows the conventional piezoelectric oscillator. (A) is a see-through | perspective top view which shows one main surface of the board | substrate part of the container body which comprises the conventional piezoelectric oscillator, (b) is the inner-layer surface of the board | substrate part of the container body which comprises the conventional piezoelectric oscillator. FIG. 7C is a perspective plan view showing the other main surface of the substrate portion of the container body constituting the conventional piezoelectric oscillator.

Explanation of symbols

110, 210, 310, 410, 510, 610 ... container body 110a, 210a, 310a, 410a, 510a, 610a ... substrate portion 110b, 210b, 310b, 410b, 510b, 610b ... first frame Part 110c, 210c, 310c, 410c, 510c, 610b ... second frame part 111, 211, 311, 411, 511, 611 ... first recess space 112, 212, 312, 412, 512, 612 ... Conducting conductive patterns 113a, 113b, 213a, 213b, 313a, 313b, 413a, 413b, 513a, 513b, 613a, 613b ... Piezoelectric vibration element mounting pads 114, 214, 314, 414, 514, 614 ... Second recess space 115, 215, 315, 415, 51 , 615 ... Integrated circuit element mounting pads 116a, 116b, 216a, 216b, 316a, 316b, 416a, 416b, 516a, 516b, 616a, 616b ... first connection electrodes 117a, 117b, 217a, 217b, 317a 317b, 417a, 417b, 517a, 517b, 617a, 617b ... Wiring patterns 118a, 118b, 118c, 218a, 218b, 218c, 318b, 418b, 518b, 618a, 618b ... via conductors 119, 219, 319 419, 519, 619 ... External connection electrode terminals 120, 220, 320, 420 ... Piezoelectric vibration elements 121, 221, 321, 421 ... Quartz element plates 122, 222, 322, 422 ... Excitation electrodes 123, 223, 32 423 ... tip portion 130, 230, 330, 430, 530, 630 ... wiring board 131a, 131b, 231a, 231b, 331a, 331b, 431a, 431b, 531a, 531b, 631a, 631b ... piezoelectric Vibration element measurement pads 132a, 132b, 232a, 232b, 332a, 332b, 432a, 432b, 532a, 532b, 632a, 632b ... second connection electrodes 133, 233, 333, 433, 533, 633 ... Wiring pattern for sealing member 134, 234, 334, 434, 534, 634...
Sealing member 135a, 135b, 235a, 235b, 335a, 335b, 435a, 435b, 535a, 535b, 635a, 635b ... via conductors 236,636 ... lid bonding wiring patterns 437, 537, 637 ... Third frame portion 438, 538, 638 ... third recessed space 140, 240, 340, 440, 540, 640 ... integrated circuit element 150, 250, 350, 450, 550, 650 ... Conductive adhesive 160, 260, 360, 460, 560, 660 ... connection part 370, 670 ... lid 580 ... insulating resin 100, 200, 300, 400, 500, 600 ... piezoelectric Oscillator

Claims (6)

A first frame portion is provided on one main surface of the substrate portion and the substrate portion to form a first recessed space, and a second frame portion is provided on the other main surface of the substrate portion. A container body in which a second recessed space is formed;
A piezoelectric vibration element mounted on two pairs of piezoelectric vibration element mounting pads provided on one main surface of the substrate portion exposed in the first recess space and provided with an excitation electrode;
An integrated circuit element mounted on an integrated circuit element mounting pad provided on the other main surface of the substrate portion exposed in the second recess space;
A wiring board for hermetically sealing the first recessed space,
2. A piezoelectric oscillator comprising a pair of piezoelectric vibration element measuring pads provided on a main surface opposite to a main surface facing the first concave space side of the wiring board. A plurality of first connection electrodes are provided on the main surface of the first frame portion of the container body,
A plurality of second connection electrodes provided to face the first connection electrode are provided on a main surface facing the first concave space side of the wiring board,
The first connection electrode and the second connection electrode are electrically connected at a connection portion made of a conductive connection material,
The first frame portion and the wiring board are joined in a ring shape with a sealing member provided inside or outside the connection portion along the first frame portion. The piezoelectric oscillator according to claim 1.   The main surface of the wiring board on which the piezoelectric vibration element measurement pad is provided is provided with a lid bonding wiring pattern, and the lid is bonded to the lid bonding wiring pattern. The piezoelectric oscillator according to claim 2.   3. The wiring board according to claim 1, wherein a third frame portion is provided on the wiring board to form a third recess space, and the piezoelectric vibration element measurement pad is provided in the third recess space. 2. The piezoelectric oscillator according to 2.   5. The piezoelectric oscillator according to claim 4, wherein the piezoelectric vibration element measuring pad exposed in the third recess space is covered with an insulating resin.   The piezoelectric oscillator according to claim 4, wherein a lid bonding wiring pattern is provided on a main surface of the third frame portion, and the lid is bonded to the lid bonding wiring pattern.

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