JP2010087425A - 基板保持部材および接合装置 - Google Patents

基板保持部材および接合装置 Download PDF

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Publication number
JP2010087425A
JP2010087425A JP2008257722A JP2008257722A JP2010087425A JP 2010087425 A JP2010087425 A JP 2010087425A JP 2008257722 A JP2008257722 A JP 2008257722A JP 2008257722 A JP2008257722 A JP 2008257722A JP 2010087425 A JP2010087425 A JP 2010087425A
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Japan
Prior art keywords
substrate
contact surface
pressure
substrate holder
holding member
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Pending
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JP2008257722A
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English (en)
Japanese (ja)
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JP2010087425A5 (enExample
Inventor
Isao Sugaya
功 菅谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
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Nikon Corp
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Priority to JP2008257722A priority Critical patent/JP2010087425A/ja
Publication of JP2010087425A publication Critical patent/JP2010087425A/ja
Publication of JP2010087425A5 publication Critical patent/JP2010087425A5/ja
Pending legal-status Critical Current

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JP2008257722A 2008-10-02 2008-10-02 基板保持部材および接合装置 Pending JP2010087425A (ja)

Priority Applications (1)

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JP2008257722A JP2010087425A (ja) 2008-10-02 2008-10-02 基板保持部材および接合装置

Applications Claiming Priority (1)

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JP2008257722A JP2010087425A (ja) 2008-10-02 2008-10-02 基板保持部材および接合装置

Related Child Applications (1)

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JP2014053022A Division JP6044570B2 (ja) 2014-03-17 2014-03-17 基板保持部材および接合装置

Publications (2)

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JP2010087425A true JP2010087425A (ja) 2010-04-15
JP2010087425A5 JP2010087425A5 (enExample) 2012-05-17

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JP2008257722A Pending JP2010087425A (ja) 2008-10-02 2008-10-02 基板保持部材および接合装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089623A (ja) * 2010-10-18 2012-05-10 Tokyo Electron Ltd 押圧用アダプタ
JP2013102080A (ja) * 2011-11-09 2013-05-23 Disco Abrasive Syst Ltd ウエーハの支持基板およびウエーハの加工方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343327A (ja) * 1986-08-11 1988-02-24 Canon Inc エピスパイククラツシユ装置
JP2007142381A (ja) * 2005-10-17 2007-06-07 Tokyo Electron Ltd 貼り合せ装置
JP2007300033A (ja) * 2006-05-02 2007-11-15 Hitachi Cable Ltd ウェハ接合用ジグ及び発光素子用ウェハの製造方法
JP2008010671A (ja) * 2006-06-29 2008-01-17 Nikon Corp ウェハ接合装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6343327A (ja) * 1986-08-11 1988-02-24 Canon Inc エピスパイククラツシユ装置
JP2007142381A (ja) * 2005-10-17 2007-06-07 Tokyo Electron Ltd 貼り合せ装置
JP2007300033A (ja) * 2006-05-02 2007-11-15 Hitachi Cable Ltd ウェハ接合用ジグ及び発光素子用ウェハの製造方法
JP2008010671A (ja) * 2006-06-29 2008-01-17 Nikon Corp ウェハ接合装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012089623A (ja) * 2010-10-18 2012-05-10 Tokyo Electron Ltd 押圧用アダプタ
JP2013102080A (ja) * 2011-11-09 2013-05-23 Disco Abrasive Syst Ltd ウエーハの支持基板およびウエーハの加工方法

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