M355236 八、新型說明： 【新型所屬之技術領域】 本創作係有關於-種用以吸附、固定待加工物之真空吸附平台裝置，特別 是有關於用來吸附、m定半導體基板或半導體元件的真空吸附裝置之承載台結 構。 【先前技術】 按，目刖透過真空吸附之加工方法已廣泛地應用在各種產業、領域的成品 ·.製把過私中’其可靠與成熟的技術特性亦能運用在高科技的半導體領域中。前 述所提之真空制方法，—般均錢過—真空吸喊置，將—待加讀置放於 一承載平台上，利用待加工物和承载平台之間酸間加以減壓，藉由和大氣壓 力之間的壓力差麟加J1物按壓在承載平台上，而使待加讀固定在承載平台 上’即可進行後續的加工步驟。 s知的真空吸附裝置結構如第丨圖所示，其包括有—上基板，其係架設M355236 VIII. New description: [New technical field] This creation is about a vacuum adsorption platform device for adsorbing and fixing objects to be processed, especially for adsorbing and fixing semiconductor substrates or semiconductor components. The structure of the load platform of the vacuum adsorption device. [Prior Art] According to the method of vacuum adsorption, it has been widely used in various industries and fields of finished products. The technology is reliable and mature. Its reliable and mature technical characteristics can also be applied in the high-tech semiconductor field. . The vacuum method mentioned above, the average money is over-vacuum-sucking, and the - to be read and placed on a carrying platform, using the acid between the workpiece and the carrying platform to decompress, by means of The pressure difference between the atmospheric pressures and the pressing of the J1 object on the carrying platform, so that the reading is to be fixed on the carrying platform can be followed by subsequent processing steps. The structure of the vacuum adsorption device is as shown in the figure, which includes an upper substrate, which is erected
於-固定框11上，而上基板1G下林設有—下基板12，其巾上基板1D與下基 板12中間形成有-通道13 ’此外上_ 1Q設有複數個吸孔⑻能連通此通道 13。因此’當-真錄氣裝置（圖未示）連接至通道如並開始抽氣時即能透 過吸孔101之吸附使置放於上基板Π)表面上之待加工物（圖未示）固定之，以 利檢測或其他加XX狀進n經查此則狀紅⑽裝置乃存在如下 缺失：-、由於上、下基板中存料隙而非貼合，因此當抽真空時恐因壓力的 變化而使上紐略為扭曲變形，献當上練之姆為錄材料，其被吸孔 吸著之部份會產生凹陷之情形，如此-來對於要求精密加卫的製程或產品而 言’此種上基板變形的問題將伴隨待加工物與承載台_吸附力、支撐性減損 M355236 2 物產生偏移、滑動’導致製程的精密度將低而產生誤差，進而影響 待加工物之檢測或其他加工工. 〈進仃，二、若以雷射切割自動加工而言，此 :土板的厚度會造成雷射光束的干涉而影響射人角度與路徑，造成加工的困擾 與麻煩，實屬不便。 /此’有胁習知真空抽氣裝Μ其結構設計所衍生缺失之問題 ，本創作 .的提出—真空吸附裝置之承•結構，用以改善前述習知麟之缺點。 【新型内容】 • 本創作之目的在提供—種真空吸_置之承載台結構，其藉由第-透明基 斤又置之吸孔、連通槽與第二透明基板的貼合，使真空吸附裝置不留空隙， 大幅提升承載台的支揮與密合度’解決真空吸附裝置之真空吸附承載台與待加 工物間吸著壓力不均之缺失，箱提高待加工_加球與準確度。 本創作之另-目的在提供—種真空_裝置之承载台結構其係由二片透 明基板貼合而成，可廣泛地適用於不同的加工方製程或方式能降低加工過程 因承載台厚度而影響加工品質的困擾，可確保檢測或加工工作之品質。 • 本創作為了達成上述之目的及功效，其所採行之技術手段包括-第-透明 .基板，絲-透喊板設有概吸孔，—第二翻基板，第三透贿板與第一 .透輸板相互貼合，収至少-連賴，射此連通射料求設置於第一透 明基板或第二透明基板之表面上且對絲一吸孔之位置，使連通槽能連通每— 吸孔。 目 底下藉由具施娜合賴_式詳加_， 的、技術内容、特點及其所達成之功效。 【實施方式】 6 M355236 由於本創作一種真空吸附裝置之承載台結構係由二片透明基板貼合而成， 因此為能清楚說明、呈現本創作的具體結構，請先一併參閱第3至第4圖之本 創作基板之立體圖與剖視圖。本創作一種真空吸附裝置之承載台結構包括有_ 第一透明基板20 ’此第一透明基板20可為石英、玻璃或壓克力等透明之堅硬板 材，第一透明基板20設有複數吸孔201 ’而第一透明基板20之一表面上且對應 每一吸孔201之位置亦設有至少一連通槽202，用以連通每一吸孔201。在此實 施方式中，第一透明基板20與第二透明基板22係以圓形為說明例，而吸孔2〇1On the fixed frame 11, the upper substrate 1G is provided with a lower substrate 12, and a channel 13 is formed between the upper substrate 1D and the lower substrate 12, and a plurality of suction holes (8) are connected to the upper substrate 1 Channel 13. Therefore, when the true gas recording device (not shown) is connected to the channel and starts to pump, the object to be processed (not shown) can be fixed on the surface of the upper substrate by the adsorption of the suction hole 101. Therefore, in order to facilitate the detection or other addition of XX, the red (10) device has the following defects: -, due to the storage gap in the upper and lower substrates instead of the fit, so when the vacuum is drawn, the pressure is due to pressure The change makes the upper Newton a distorted deformation. It is a material for the recording, and the part sucked by the suction hole will cause a depression. So - for the process or product that requires precision protection The problem of the deformation of the substrate will be accompanied by the offset between the workpiece and the loading platform _ adsorption force, the support loss M355236 2 , and the slip will cause the precision of the process to be low, which will affect the detection of the workpiece or other Processing workers. <Into the 仃, Second, if the laser cutting automatic processing, this: the thickness of the soil plate will cause the interference of the laser beam and affect the angle and path of the shooting, causing processing troubles and troubles, it is inconvenient . This problem arises from the lack of structural design of the vacuum pumping device. This proposal proposes a structure for the vacuum adsorption device to improve the shortcomings of the aforementioned Xizhilin. [New content] • The purpose of this creation is to provide a vacuum suction-type carrier structure, which is vacuum-adsorbed by the suction of the first transparent base and the connection of the communication groove and the second transparent substrate. The device does not leave a gap, and greatly increases the support and the degree of tightness of the carrying platform. The solution to the lack of uniformity of the suction pressure between the vacuum adsorption bearing platform of the vacuum adsorption device and the object to be processed, the box improves the processing and the accuracy. Another object of the present invention is to provide a vacuum _ device carrier structure which is formed by laminating two transparent substrates, and can be widely applied to different processing processes or methods to reduce the thickness of the processing process due to the thickness of the carrier. Affects the quality of the processing to ensure the quality of the inspection or processing work. • In order to achieve the above purposes and functions, the technical means adopted by the creation include - the first - transparent substrate, the silk - transparent board with a suction hole, the second substrate, the third transparent plate and the first 1. The transmissive plates are attached to each other, and the at least one connection is received, and the communication target is placed on the surface of the first transparent substrate or the second transparent substrate and the position of the suction hole of the wire is made so that the communication groove can communicate with each other. — Suction hole. Under the circumstance, with the technical content, characteristics and the effects achieved by Shi Nahe Lai. [Embodiment] 6 M355236 Since the structure of the carrying platform of a vacuum adsorption device is made up of two transparent substrates, in order to clearly illustrate and present the specific structure of the creation, please refer to the third to the first 4 is a perspective view and a cross-sectional view of the original creation substrate. The carrier structure of the vacuum adsorption device comprises a first transparent substrate 20 ′. The first transparent substrate 20 can be a transparent hard plate such as quartz, glass or acrylic, and the first transparent substrate 20 is provided with a plurality of transparent holes. And at least one communication groove 202 is disposed on a surface of one of the first transparent substrates 20 and corresponding to each of the suction holes 201 for communicating each of the suction holes 201. In this embodiment, the first transparent substrate 20 and the second transparent substrate 22 are illustrated by a circular shape, and the suction holes 2〇1
與連通槽202亦採對應之圓形環繞式設置，藉此形成内外二圈之連通槽，因此， W 本實施例外圈之連通槽202與内圈之連通槽203,係透過連通槽204來接連使内 外二圈之連通槽203與連通槽203能相互連通，且同時對應並連通每一吸孔 201 ; —第二透明基板22，此第二透明基板22如同第一透明基板20同樣可為石 英、玻璃或壓克力等透明之堅硬板材。 接續，請參閱第5圖用以說明本創作之實施流程：如圖所示，本創作一種 真空吸附裝置之承載台結構係將第一透明基板2〇與第二透明基板22相互緊密 籲貼合於一起，此時第一透明基板2〇與第二透明基板22之間僅存有連通槽2〇2、 203與204之空隙’故此第二透明基板22能提供第一透明基板2〇強力的支撐性 與密合度，用以確保後續的抽氣過程中第一透明基板2〇不致因壓力的變化導致 支撐不足而變形。而此連通槽202、203與204係透過一連通管體（圖位置）之 連接’再與一真空抽氣裝置（圖未示）接連；最後，於第一透明基板2〇之一表 面置放一待加工物24 ’在此所述之待加工物24可為半導體基板或半導體元件等 等。而當前述真空抽氣裝置開始作用時，其所產生於連通槽2〇2、2〇3與2〇4内 的氣流麼力會藉由吸孔201之吸附而使待加工物24固定於第一透明基板上， M355236 即可進行後續的加工或檢測事項。 由於第-透明基板20與第二透明基板22間已無雄之產生，因此第一透 明基板20或吸孔201不會因為壓力不均產生變形而使置於第一透明基板2〇上 之待加工物24因吸力不足而產生偏移滑動的情形發生，同時更能確保待加工物 24穩固地被吸附在第-透明基板20上方，以維持待加工物24後續之檢測或加 工工作之品質。 此外，請再接續糊第6 B，本創作在前述的實施方式外，亦可配合操作 •.者或製造者或待加工物之不同需求而做彈性的設計，如可將連通槽2〇2、2〇3與 204設置於第二透明基板22之表面上且對絲一吸孔2〇1之位置，此種設計型 態同樣亦能連通此些吸孔201而達到與前述實施方式相同的目的；再者，第一 透明基板20、吸孔2〇1與連通槽202、203與亦可採方形設計，即如第4圖 所示，用以對應不同尺寸之待加工物；是以，本創作之結構可彈性地依使用者 考量作不同的設計，以提高加工的便利性。 综合以上所述’本創作確實能夠提供真空吸附之加工作業之精密度與可靠 #性’確實為-相當優異之創思’爰依法提出申請新型專利；惟上述說^内容， 僅為本創狀健實施繼明，凡依本_之技術手段所延伸之變化，皆應落 入本創作之專利申請範圍，特此說明。 【圖式簡單說明】 第1圖為習知真空吸附裝置平面示意圖。 第2圖為本創作之第一透明基板結構立體示意圖。 第3圖為本創作之第一透明基板結構立體與仰視圖。 第4圖為本創作之剖視示意圖。 M355236 第5圖為本創作組裝之剖視示意圖。 第6圖為本創作之第二實施例剖視示意圖。 第7圖為本創作之第一透明基板結構示意圖。 【主要元件符號說明】 10 上基板 11 固定框 12 下基板 13 通道 101 吸孔 20 第一透明基板 201 吸孔 202 連通槽 203 連通槽 204 連通槽 22 第二透明基板 24 待加工物·The communication groove 202 is also provided in a circular wraparound manner, thereby forming a communication groove of the inner and outer two turns. Therefore, the communication groove 202 of the communication ring 202 and the inner ring of the present embodiment are connected through the communication groove 204. The communication groove 203 and the communication groove 203 of the inner and outer two circles can communicate with each other, and at the same time correspond to and communicate with each of the suction holes 201; the second transparent substrate 22, the second transparent substrate 22 can also be quartz like the first transparent substrate 20 Transparent hard plates such as glass or acrylic. For the continuation, please refer to FIG. 5 for explaining the implementation process of the present creation. As shown in the figure, the carrier structure of the vacuum adsorption device creates a close contact between the first transparent substrate 2 and the second transparent substrate 22. At the same time, there is only a gap between the first transparent substrate 2 〇 and the second transparent substrate 22 between the communication grooves 2 〇 2, 203 and 204. Therefore, the second transparent substrate 22 can provide the first transparent substrate 2 The supportability and the degree of tightness are used to ensure that the first transparent substrate 2 in the subsequent pumping process is not deformed due to insufficient pressure due to a change in pressure. The communication grooves 202, 203, and 204 are connected to a vacuum pumping device (not shown) through a connection of a connecting pipe body (picture position); finally, placed on one surface of the first transparent substrate 2 A workpiece 24 to be processed 24 described herein may be a semiconductor substrate or a semiconductor component or the like. When the vacuum pumping device starts to function, the airflow generated in the communication grooves 2〇2, 2〇3, and 2〇4 forces the workpiece 24 to be fixed by the adsorption of the suction hole 201. On a transparent substrate, the M355236 can be used for subsequent processing or inspection. Since there is no male between the first transparent substrate 20 and the second transparent substrate 22, the first transparent substrate 20 or the suction hole 201 is not placed on the first transparent substrate 2 due to deformation due to pressure unevenness. The workpiece 24 is offset and slipped due to insufficient suction, and at the same time, it is more ensured that the workpiece 24 is firmly adsorbed above the first transparent substrate 20 to maintain the quality of the subsequent inspection or processing work of the workpiece 24. In addition, please continue to paste 6B. In addition to the above-mentioned embodiments, this creation can also be flexibly designed according to the different needs of the operator or the manufacturer or the workpiece to be processed, such as the connection groove 2〇2 2, 3 and 204 are disposed on the surface of the second transparent substrate 22 and are opposite to the position of the wire suction hole 2〇1, and the design pattern can also communicate with the suction holes 201 to achieve the same as the foregoing embodiment. The first transparent substrate 20, the suction hole 2〇1 and the communication grooves 202, 203 and the square groove design, that is, as shown in FIG. 4, are used to correspond to different sizes of objects to be processed; The structure of the creation can be flexibly designed according to the user's consideration to improve the convenience of processing. Based on the above, 'this creation can indeed provide the precision and reliability of the vacuum adsorption processing operation. The 'sexuality' is indeed - quite excellent, the creation of the 'scientific application of new patents; but the above said ^ content, only the creation Jian Jian Ji Ming, the changes that extend according to the technical means of this _ should fall within the scope of the patent application of this creation, hereby explain. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic plan view of a conventional vacuum adsorption device. Figure 2 is a perspective view showing the structure of the first transparent substrate of the present invention. Figure 3 is a perspective view of the first transparent substrate structure of the creation. Figure 4 is a schematic cross-sectional view of the creation. M355236 Figure 5 is a schematic cross-sectional view of the creative assembly. Figure 6 is a schematic cross-sectional view showing a second embodiment of the creation. Figure 7 is a schematic view showing the structure of the first transparent substrate of the creation. [Main component symbol description] 10 Upper substrate 11 Fixed frame 12 Lower substrate 13 Channel 101 Suction hole 20 First transparent substrate 201 Suction hole 202 Communication groove 203 Communication groove 204 Communication groove 22 Second transparent substrate 24 Items to be processed·