JP2010083951A5 - - Google Patents

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Publication number
JP2010083951A5
JP2010083951A5 JP2008252953A JP2008252953A JP2010083951A5 JP 2010083951 A5 JP2010083951 A5 JP 2010083951A5 JP 2008252953 A JP2008252953 A JP 2008252953A JP 2008252953 A JP2008252953 A JP 2008252953A JP 2010083951 A5 JP2010083951 A5 JP 2010083951A5
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JP
Japan
Prior art keywords
phr
polyimide resin
agent
resin composition
photosensitive
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Application number
JP2008252953A
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English (en)
Japanese (ja)
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JP2010083951A (ja
JP5343494B2 (ja
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Publication date
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Priority claimed from JP2008252953A external-priority patent/JP5343494B2/ja
Priority to JP2008252953A priority Critical patent/JP5343494B2/ja
Priority to PCT/JP2009/063885 priority patent/WO2010038543A1/ja
Priority to CN2009801377695A priority patent/CN102165370B/zh
Priority to HK11112010.8A priority patent/HK1157880B/xx
Priority to TW98127563A priority patent/TWI394777B/zh
Publication of JP2010083951A publication Critical patent/JP2010083951A/ja
Publication of JP2010083951A5 publication Critical patent/JP2010083951A5/ja
Publication of JP5343494B2 publication Critical patent/JP5343494B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2008252953A 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物 Active JP5343494B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2008252953A JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物
PCT/JP2009/063885 WO2010038543A1 (ja) 2008-09-30 2009-08-05 感光性シロキサンポリイミド樹脂組成物
CN2009801377695A CN102165370B (zh) 2008-09-30 2009-08-05 感光性硅氧烷聚酰亚胺树脂组合物
HK11112010.8A HK1157880B (en) 2008-09-30 2009-08-05 Photosensitive siloxane polyimide resin composition
TW98127563A TWI394777B (zh) 2008-09-30 2009-08-17 Photosensitive siloxane polyimide resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008252953A JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物

Publications (3)

Publication Number Publication Date
JP2010083951A JP2010083951A (ja) 2010-04-15
JP2010083951A5 true JP2010083951A5 (https=) 2010-05-27
JP5343494B2 JP5343494B2 (ja) 2013-11-13

Family

ID=42073320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008252953A Active JP5343494B2 (ja) 2008-09-30 2008-09-30 感光性シロキサンポリイミド樹脂組成物

Country Status (4)

Country Link
JP (1) JP5343494B2 (https=)
CN (1) CN102165370B (https=)
TW (1) TWI394777B (https=)
WO (1) WO2010038543A1 (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5417364B2 (ja) * 2011-03-08 2014-02-12 富士フイルム株式会社 固体撮像素子用硬化性組成物、並びに、これを用いた感光層、永久パターン、ウエハレベルレンズ、固体撮像素子、及び、パターン形成方法
JP5494725B2 (ja) * 2011-09-21 2014-05-21 Ｊｓｒ株式会社 レンズの形成方法、レンズおよびネガ型感光性組成物
KR101590862B1 (ko) 2011-09-21 2016-02-02 제이에스알 가부시끼가이샤 렌즈의 형성 방법 및 네거티브형 감광성 조성물
CN104066769B (zh) * 2011-11-25 2019-01-15 日产化学工业株式会社 显示器基板用树脂组合物
CN104066768B (zh) * 2011-11-25 2018-03-23 日产化学工业株式会社 显示器基板用树脂组合物
CN104053724B (zh) * 2012-01-20 2018-05-08 旭化成株式会社 树脂组合物、层积体、多层印刷线路板和多层柔性线路板及其制造方法
CN104662475B (zh) * 2012-09-25 2019-03-29 东丽株式会社 正型感光性树脂组合物、含有使用了其的固化膜的半导体器件的制造方法
TW201413387A (zh) * 2012-09-26 2014-04-01 Toray Industries 正型感光性樹脂組成物
JPWO2014148441A1 (ja) * 2013-03-18 2017-02-16 旭化成株式会社 樹脂前駆体及びそれを含有する樹脂組成物、樹脂フィルム及びその製造方法、並びに、積層体及びその製造方法
CN105295792B (zh) * 2015-08-26 2017-12-29 北京化工大学 一种高性能聚酰亚胺交联改性环氧树脂及其制备方法
JPWO2019181386A1 (ja) * 2018-03-22 2021-02-18 富士フイルム株式会社 ろ過装置、精製装置、薬液の製造方法
JP7111031B2 (ja) * 2018-03-23 2022-08-02 信越化学工業株式会社 感光性樹脂組成物、感光性樹脂積層体、及びパターン形成方法
US20210246268A1 (en) * 2018-04-23 2021-08-12 Shin-Etsu Chemical Co., Ltd. Silicon-containing compound
JP7327983B2 (ja) * 2018-05-16 2023-08-16 旭化成株式会社 ポリイミド前駆体樹脂組成物
CN109100917A (zh) * 2018-07-19 2018-12-28 江苏博砚电子科技有限公司 一种彩色感光性树脂组合物及其制备方法
KR102279081B1 (ko) * 2018-08-20 2021-07-19 주식회사 엘지화학 폴리이미드 필름 및 이를 이용하는 플렉서블 디바이스
CN110441989B (zh) * 2019-08-07 2022-08-23 沧州信联化工有限公司 一种光刻胶组合物
CN111830786B (zh) * 2020-07-17 2023-05-23 波米科技有限公司 一种含硅烷偶联剂的感光性树脂组合物
CN118778355B (zh) * 2023-05-17 2025-05-30 深圳先进电子材料国际创新研究院 一种感光性树脂组合物及其应用
JP7397419B1 (ja) 2023-06-02 2023-12-13 Jsr株式会社 感放射線性組成物、硬化膜及びその製造方法、半導体素子並びに表示素子

Family Cites Families (11)

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JP3221756B2 (ja) * 1992-12-28 2001-10-22 新日鐵化学株式会社 プリント基板用耐熱性接着剤フィルム及びその使用方法並びにこれを用いたプリント基板の製造方法
CN1849042A (zh) * 1998-07-08 2006-10-18 伊比登株式会社 印刷电路板及其制造方法
JP4374840B2 (ja) * 2002-08-30 2009-12-02 東レ株式会社 ポジ型感光性樹脂組成物、半導体素子の製造方法および、半導体装置
TWI262041B (en) * 2003-11-14 2006-09-11 Hitachi Chemical Co Ltd Formation method of metal layer on resin layer, printed wiring board, and production method thereof
JP2005173027A (ja) * 2003-12-09 2005-06-30 Kyocera Chemical Corp ポジ型感光性樹脂組成物及びその硬化物
SG160331A1 (en) * 2005-03-25 2010-04-29 Sumitomo Bakelite Co Semiconductor device, resin composition for buffer coating, resin composition for die bonding, and resin composition for encapsulating
JP2008038031A (ja) * 2006-08-07 2008-02-21 Sony Chemical & Information Device Corp ポリイミド組成物、フレキシブル配線板及びフレキシブル配線板の製造方法
US7592119B2 (en) * 2007-02-09 2009-09-22 Sony Corporation Photosensitive polyimide resin composition
JP5242958B2 (ja) * 2007-04-13 2013-07-24 デクセリアルズ株式会社 ポリイミド組成物及びフレキシブル配線板
WO2009025283A1 (ja) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation 新規なポリイミド樹脂及び感光性ポリイミド樹脂組成物
WO2009025319A1 (ja) * 2007-08-22 2009-02-26 Sony Chemical & Information Device Corporation ポリイミド組成物、フレキシブル配線板、及び、フレキシブル配線板の製造方法

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