JP2010073908A5 - - Google Patents

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Publication number
JP2010073908A5
JP2010073908A5 JP2008240194A JP2008240194A JP2010073908A5 JP 2010073908 A5 JP2010073908 A5 JP 2010073908A5 JP 2008240194 A JP2008240194 A JP 2008240194A JP 2008240194 A JP2008240194 A JP 2008240194A JP 2010073908 A5 JP2010073908 A5 JP 2010073908A5
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JP
Japan
Prior art keywords
layer
connected member
compound
semiconductor device
metallized
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008240194A
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English (en)
Japanese (ja)
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JP2010073908A (ja
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Publication date
Application filed filed Critical
Priority to JP2008240194A priority Critical patent/JP2010073908A/ja
Priority claimed from JP2008240194A external-priority patent/JP2010073908A/ja
Publication of JP2010073908A publication Critical patent/JP2010073908A/ja
Publication of JP2010073908A5 publication Critical patent/JP2010073908A5/ja
Pending legal-status Critical Current

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JP2008240194A 2008-09-19 2008-09-19 半導体装置およびその製造方法 Pending JP2010073908A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008240194A JP2010073908A (ja) 2008-09-19 2008-09-19 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008240194A JP2010073908A (ja) 2008-09-19 2008-09-19 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2010073908A JP2010073908A (ja) 2010-04-02
JP2010073908A5 true JP2010073908A5 (cg-RX-API-DMAC10.html) 2011-05-06

Family

ID=42205422

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008240194A Pending JP2010073908A (ja) 2008-09-19 2008-09-19 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP2010073908A (cg-RX-API-DMAC10.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5533223B2 (ja) * 2010-05-12 2014-06-25 日立金属株式会社 接合材料およびその製造方法、半導体装置およびその製造方法
JP5601275B2 (ja) 2010-08-31 2014-10-08 日立金属株式会社 接合材料、その製造方法、および接合構造の製造方法
JP5578326B2 (ja) * 2011-03-29 2014-08-27 日立金属株式会社 リード部品及びその製造方法、並びに半導体パッケージ
JP5927567B2 (ja) * 2012-05-21 2016-06-01 パナソニックＩｐマネジメント株式会社 半導体素子の接合構造体と製造方法
JP6354954B2 (ja) * 2015-05-15 2018-07-11 トヨタ自動車株式会社 半導体装置の製造方法及び半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4390799B2 (ja) * 2006-11-21 2009-12-24 株式会社日立製作所 接続材料、接続材料の製造方法、および半導体装置

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