JP2010073893A5 - - Google Patents

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Publication number
JP2010073893A5
JP2010073893A5 JP2008239751A JP2008239751A JP2010073893A5 JP 2010073893 A5 JP2010073893 A5 JP 2010073893A5 JP 2008239751 A JP2008239751 A JP 2008239751A JP 2008239751 A JP2008239751 A JP 2008239751A JP 2010073893 A5 JP2010073893 A5 JP 2010073893A5
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semiconductor
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JP2008239751A
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Japanese (ja)
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JP2010073893A (ja
JP5207896B2 (ja
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JP2008239751A 2008-09-18 2008-09-18 半導体装置及びその製造方法 Active JP5207896B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008239751A JP5207896B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008239751A JP5207896B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2010073893A JP2010073893A (ja) 2010-04-02
JP2010073893A5 true JP2010073893A5 (fr) 2011-08-18
JP5207896B2 JP5207896B2 (ja) 2013-06-12

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Family Applications (1)

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JP2008239751A Active JP5207896B2 (ja) 2008-09-18 2008-09-18 半導体装置及びその製造方法

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JP (1) JP5207896B2 (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5100715B2 (ja) * 2009-07-13 2012-12-19 株式会社東芝 半導体装置及び半導体装置の製造方法
KR101131447B1 (ko) * 2010-10-05 2012-03-29 앰코 테크놀로지 코리아 주식회사 반도체 패키지 제조 방법
KR101297015B1 (ko) * 2011-11-03 2013-08-14 주식회사 네패스 리드프레임을 이용한 팬-아웃 반도체 패키지 제조방법, 이에 의한 반도체 패키지 및 패키지 온 패키지
JP5924110B2 (ja) * 2012-05-11 2016-05-25 株式会社ソシオネクスト 半導体装置、半導体装置モジュールおよび半導体装置の製造方法
KR101999114B1 (ko) * 2013-06-03 2019-07-11 에스케이하이닉스 주식회사 반도체 패키지
US10074628B2 (en) 2013-10-04 2018-09-11 Mediatek Inc. System-in-package and fabrication method thereof
US10103128B2 (en) 2013-10-04 2018-10-16 Mediatek Inc. Semiconductor package incorporating redistribution layer interposer
KR101809521B1 (ko) * 2015-09-04 2017-12-18 주식회사 네패스 반도체 패키지 및 그 제조방법
KR101819558B1 (ko) * 2015-09-04 2018-01-18 주식회사 네패스 반도체 패키지 및 그 제조방법
EP3151275A3 (fr) * 2015-09-11 2017-04-19 MediaTek Inc. Système en boîtier et son procédé de fabrication
KR101944007B1 (ko) * 2015-12-16 2019-01-31 주식회사 네패스 반도체 패키지 및 그 제조방법
JP7096741B2 (ja) 2018-09-11 2022-07-06 株式会社東芝 半導体装置の製造方法
JP2023082375A (ja) * 2021-12-02 2023-06-14 ソニーセミコンダクタソリューションズ株式会社 半導体装置及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000294722A (ja) * 1999-04-01 2000-10-20 Nec Corp 積層化チップ半導体装置
JP3649064B2 (ja) * 1999-11-10 2005-05-18 松下電器産業株式会社 半導体装置の製造方法
JP4321758B2 (ja) * 2003-11-26 2009-08-26 カシオ計算機株式会社 半導体装置
JP5378643B2 (ja) * 2006-09-29 2013-12-25 ピーエスフォー ルクスコ エスエイアールエル 半導体装置及びその製造方法
JP2008187203A (ja) * 2008-04-25 2008-08-14 Sanyo Electric Co Ltd 半導体装置の製造方法

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