JP2010067888A5 - - Google Patents
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- Publication number
- JP2010067888A5 JP2010067888A5 JP2008234622A JP2008234622A JP2010067888A5 JP 2010067888 A5 JP2010067888 A5 JP 2010067888A5 JP 2008234622 A JP2008234622 A JP 2008234622A JP 2008234622 A JP2008234622 A JP 2008234622A JP 2010067888 A5 JP2010067888 A5 JP 2010067888A5
- Authority
- JP
- Japan
- Prior art keywords
- metal layer
- layer
- pad
- forming
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims 24
- 229910052751 metal Inorganic materials 0.000 claims 24
- 239000000758 substrate Substances 0.000 claims 7
- 230000002093 peripheral effect Effects 0.000 claims 5
- 238000005530 etching Methods 0.000 claims 4
- 239000004020 conductor Substances 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 238000010030 laminating Methods 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008234622A JP2010067888A (ja) | 2008-09-12 | 2008-09-12 | 配線基板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008234622A JP2010067888A (ja) | 2008-09-12 | 2008-09-12 | 配線基板及びその製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012193205A Division JP5315447B2 (ja) | 2012-09-03 | 2012-09-03 | 配線基板及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010067888A JP2010067888A (ja) | 2010-03-25 |
| JP2010067888A5 true JP2010067888A5 (enExample) | 2011-09-15 |
Family
ID=42193198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008234622A Pending JP2010067888A (ja) | 2008-09-12 | 2008-09-12 | 配線基板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2010067888A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120077054A1 (en) * | 2010-09-25 | 2012-03-29 | Tao Wu | Electrolytic gold or gold palladium surface finish application in coreless substrate processing |
| JP5906264B2 (ja) * | 2014-02-12 | 2016-04-20 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
| JP2017168510A (ja) * | 2016-03-14 | 2017-09-21 | Ｓｈマテリアル株式会社 | 半導体素子搭載用基板、半導体装置、半導体素子搭載用基板の製造方法、及び半導体装置の製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004153141A (ja) * | 2002-10-31 | 2004-05-27 | Ngk Spark Plug Co Ltd | セラミック配線基板、それを用いた部品実装済み配線基板、及びそれらの製造方法 |
-
2008
- 2008-09-12 JP JP2008234622A patent/JP2010067888A/ja active Pending
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