JP2010056128A5 - - Google Patents

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Publication number
JP2010056128A5
JP2010056128A5 JP2008216547A JP2008216547A JP2010056128A5 JP 2010056128 A5 JP2010056128 A5 JP 2010056128A5 JP 2008216547 A JP2008216547 A JP 2008216547A JP 2008216547 A JP2008216547 A JP 2008216547A JP 2010056128 A5 JP2010056128 A5 JP 2010056128A5
Authority
JP
Japan
Prior art keywords
wiring board
flexible wiring
manufacturing
board according
axis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2008216547A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010056128A (ja
JP5243892B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2008216547A external-priority patent/JP5243892B2/ja
Priority to JP2008216547A priority Critical patent/JP5243892B2/ja
Priority to US13/001,946 priority patent/US9060432B2/en
Priority to EP09773390.1A priority patent/EP2306794B1/en
Priority to CN2009801250016A priority patent/CN102077698B/zh
Priority to KR1020117001735A priority patent/KR101580822B1/ko
Priority to PCT/JP2009/061644 priority patent/WO2010001812A1/ja
Priority to EP14157869.0A priority patent/EP2747527A1/en
Priority to TW98122077A priority patent/TWI471067B/zh
Publication of JP2010056128A publication Critical patent/JP2010056128A/ja
Publication of JP2010056128A5 publication Critical patent/JP2010056128A5/ja
Publication of JP5243892B2 publication Critical patent/JP5243892B2/ja
Application granted granted Critical
Priority to US14/282,922 priority patent/US20140254114A1/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2008216547A 2008-06-30 2008-08-26 可撓性配線基板の製造方法。 Expired - Fee Related JP5243892B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2008216547A JP5243892B2 (ja) 2008-08-26 2008-08-26 可撓性配線基板の製造方法。
PCT/JP2009/061644 WO2010001812A1 (ja) 2008-06-30 2009-06-25 可撓性回路基板及びその製造方法並びに可撓性回路基板の屈曲部構造
EP14157869.0A EP2747527A1 (en) 2008-06-30 2009-06-25 Flexible circuit board and bend structure and device comprising the flexible circuit board
EP09773390.1A EP2306794B1 (en) 2008-06-30 2009-06-25 Method for producing flexible circuit board
CN2009801250016A CN102077698B (zh) 2008-06-30 2009-06-25 挠性电路基板及其制造方法以及挠性电路基板的弯曲部结构
KR1020117001735A KR101580822B1 (ko) 2008-06-30 2009-06-25 가요성 회로기판 및 그 제조방법 그리고 가요성 회로기판의 굴곡부 구조
US13/001,946 US9060432B2 (en) 2008-06-30 2009-06-25 Flexible circuit board and method for producing same and bend structure of flexible circuit board
TW98122077A TWI471067B (zh) 2008-06-30 2009-06-30 Flexible circuit substrate and method of manufacturing the same, and flexural structure of flexible circuit board and electronic device
US14/282,922 US20140254114A1 (en) 2008-06-30 2014-05-20 Flexible circuit board and method for producing same and bend structure of flexible circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008216547A JP5243892B2 (ja) 2008-08-26 2008-08-26 可撓性配線基板の製造方法。

Publications (3)

Publication Number Publication Date
JP2010056128A JP2010056128A (ja) 2010-03-11
JP2010056128A5 true JP2010056128A5 (https=) 2012-07-19
JP5243892B2 JP5243892B2 (ja) 2013-07-24

Family

ID=42071766

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008216547A Expired - Fee Related JP5243892B2 (ja) 2008-06-30 2008-08-26 可撓性配線基板の製造方法。

Country Status (1)

Country Link
JP (1) JP5243892B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101690491B1 (ko) * 2009-12-25 2016-12-28 신닛테츠 수미킨 가가쿠 가부시키가이샤 가요성 회로기판 및 가요성 회로기판의 굴곡부 구조
JP5329491B2 (ja) * 2010-08-13 2013-10-30 Ｊｘ日鉱日石金属株式会社 フレキシブルプリント配線板用銅箔及びその製造方法
JP7284612B2 (ja) * 2019-03-28 2023-05-31 Ｊｘ金属株式会社 金属製圧延シート、及び金属製品の製造方法
JP6887459B2 (ja) * 2019-03-28 2021-06-16 Ｊｘ金属株式会社 金属製品及びその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003193211A (ja) * 2001-12-27 2003-07-09 Nippon Mining & Metals Co Ltd 銅張積層板用圧延銅箔
JP2005005413A (ja) * 2003-06-11 2005-01-06 Ibiden Co Ltd フレキシブル−リジッド配線基板
JP2008038170A (ja) * 2006-08-03 2008-02-21 Sumitomo Kinzoku Kozan Shindo Kk 圧延銅箔
JP4215093B2 (ja) * 2006-10-26 2009-01-28 日立電線株式会社 圧延銅箔およびその製造方法

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