JP2010052090A - 研磨装置および研磨方法 - Google Patents

研磨装置および研磨方法 Download PDF

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Publication number
JP2010052090A
JP2010052090A JP2008219233A JP2008219233A JP2010052090A JP 2010052090 A JP2010052090 A JP 2010052090A JP 2008219233 A JP2008219233 A JP 2008219233A JP 2008219233 A JP2008219233 A JP 2008219233A JP 2010052090 A JP2010052090 A JP 2010052090A
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Japan
Prior art keywords
polishing
slurry
surface plate
water
polishing apparatus
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Withdrawn
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JP2008219233A
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Japanese (ja)
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JP2010052090A5 (enExample
Inventor
Hiroaki Yuki
広昭 結城
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Miyazaki Epson Corp
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Epson Toyocom Corp
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Priority to JP2008219233A priority Critical patent/JP2010052090A/ja
Publication of JP2010052090A publication Critical patent/JP2010052090A/ja
Publication of JP2010052090A5 publication Critical patent/JP2010052090A5/ja
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
JP2008219233A 2008-08-28 2008-08-28 研磨装置および研磨方法 Withdrawn JP2010052090A (ja)

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JP2008219233A JP2010052090A (ja) 2008-08-28 2008-08-28 研磨装置および研磨方法

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JP2008219233A JP2010052090A (ja) 2008-08-28 2008-08-28 研磨装置および研磨方法

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JP2010052090A true JP2010052090A (ja) 2010-03-11
JP2010052090A5 JP2010052090A5 (enExample) 2011-07-28

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101596598B1 (ko) * 2014-11-10 2016-02-22 주식회사 엘지실트론 웨이퍼 연마장치
JP2016064478A (ja) * 2014-09-25 2016-04-28 株式会社Sumco ワークの研磨装置およびワークの製造方法
WO2021140737A1 (ja) * 2020-01-09 2021-07-15 信越半導体株式会社 ラッピング装置の洗浄装置
KR20210111095A (ko) 2020-03-02 2021-09-10 에스케이실트론 주식회사 웨이퍼 랩핑 장치
TWI758100B (zh) * 2020-12-23 2022-03-11 大陸商上海新昇半導體科技有限公司 具有自清洗功能的雙面拋光設備及拋光方法
WO2025226359A1 (en) * 2024-04-25 2025-10-30 Applied Materials, Inc. A nozzle assembly for a fluid recovery system

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016064478A (ja) * 2014-09-25 2016-04-28 株式会社Sumco ワークの研磨装置およびワークの製造方法
KR101596598B1 (ko) * 2014-11-10 2016-02-22 주식회사 엘지실트론 웨이퍼 연마장치
WO2021140737A1 (ja) * 2020-01-09 2021-07-15 信越半導体株式会社 ラッピング装置の洗浄装置
JP2021109271A (ja) * 2020-01-09 2021-08-02 信越半導体株式会社 ラッピング装置の洗浄装置
CN114786871A (zh) * 2020-01-09 2022-07-22 信越半导体株式会社 研磨装置的清洗装置
KR20220119387A (ko) * 2020-01-09 2022-08-29 신에쯔 한도타이 가부시키가이샤 래핑장치의 세정장치
CN114786871B (zh) * 2020-01-09 2024-03-08 信越半导体株式会社 研磨装置的清洗装置
TWI861293B (zh) * 2020-01-09 2024-11-11 日商信越半導體股份有限公司 研光裝置的清洗裝置
KR102844591B1 (ko) 2020-01-09 2025-08-11 신에쯔 한도타이 가부시키가이샤 래핑장치의 세정장치
KR20210111095A (ko) 2020-03-02 2021-09-10 에스케이실트론 주식회사 웨이퍼 랩핑 장치
TWI758100B (zh) * 2020-12-23 2022-03-11 大陸商上海新昇半導體科技有限公司 具有自清洗功能的雙面拋光設備及拋光方法
WO2025226359A1 (en) * 2024-04-25 2025-10-30 Applied Materials, Inc. A nozzle assembly for a fluid recovery system

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