JP2010050337A5 - - Google Patents
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- Publication number
- JP2010050337A5 JP2010050337A5 JP2008214163A JP2008214163A JP2010050337A5 JP 2010050337 A5 JP2010050337 A5 JP 2010050337A5 JP 2008214163 A JP2008214163 A JP 2008214163A JP 2008214163 A JP2008214163 A JP 2008214163A JP 2010050337 A5 JP2010050337 A5 JP 2010050337A5
- Authority
- JP
- Japan
- Prior art keywords
- component
- imaging unit
- imaging
- surface mounter
- size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003384 imaging method Methods 0.000 claims 27
- 239000000758 substrate Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008214163A JP4829941B2 (ja) | 2008-08-22 | 2008-08-22 | 表面実装機 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008214163A JP4829941B2 (ja) | 2008-08-22 | 2008-08-22 | 表面実装機 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010050337A JP2010050337A (ja) | 2010-03-04 |
| JP2010050337A5 true JP2010050337A5 (enExample) | 2011-05-19 |
| JP4829941B2 JP4829941B2 (ja) | 2011-12-07 |
Family
ID=42067179
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008214163A Active JP4829941B2 (ja) | 2008-08-22 | 2008-08-22 | 表面実装機 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4829941B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103863874B (zh) * | 2012-12-17 | 2017-11-28 | 韩华泰科株式会社 | 带送进器 |
| CN107432117B (zh) * | 2015-03-23 | 2019-12-03 | 株式会社富士 | 安装装置及安装方法 |
| WO2018052956A1 (en) | 2016-09-13 | 2018-03-22 | Universal Instruments Corporation | Feeder system, pick and place machine, and method |
| JP7232980B2 (ja) * | 2019-01-07 | 2023-03-06 | パナソニックIpマネジメント株式会社 | テープフィーダおよび部品実装装置 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307598A (ja) * | 1994-05-11 | 1995-11-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置及び電子部品実装方法 |
| JP3647146B2 (ja) * | 1996-06-20 | 2005-05-11 | 松下電器産業株式会社 | 電子部品実装装置および電子部品実装方法 |
| JP2002176290A (ja) * | 2000-12-08 | 2002-06-21 | Matsushita Electric Ind Co Ltd | 部品供給装置、部品供給方法、並びに部品実装装置 |
| JP4886989B2 (ja) * | 2005-01-20 | 2012-02-29 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
| JP4744241B2 (ja) * | 2005-08-31 | 2011-08-10 | 株式会社日立ハイテクインスツルメンツ | 電子部品装着装置 |
-
2008
- 2008-08-22 JP JP2008214163A patent/JP4829941B2/ja active Active
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