JP2010050288A5 - - Google Patents

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Publication number
JP2010050288A5
JP2010050288A5 JP2008213409A JP2008213409A JP2010050288A5 JP 2010050288 A5 JP2010050288 A5 JP 2010050288A5 JP 2008213409 A JP2008213409 A JP 2008213409A JP 2008213409 A JP2008213409 A JP 2008213409A JP 2010050288 A5 JP2010050288 A5 JP 2010050288A5
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JP
Japan
Prior art keywords
resin
semiconductor device
radiating plate
relay electrode
heat radiating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008213409A
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English (en)
Japanese (ja)
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JP2010050288A (ja
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Application filed filed Critical
Priority to JP2008213409A priority Critical patent/JP2010050288A/ja
Priority claimed from JP2008213409A external-priority patent/JP2010050288A/ja
Publication of JP2010050288A publication Critical patent/JP2010050288A/ja
Publication of JP2010050288A5 publication Critical patent/JP2010050288A5/ja
Withdrawn legal-status Critical Current

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JP2008213409A 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法 Withdrawn JP2010050288A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008213409A JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008213409A JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JP2010050288A JP2010050288A (ja) 2010-03-04
JP2010050288A5 true JP2010050288A5 (enrdf_load_stackoverflow) 2011-08-04

Family

ID=42067137

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008213409A Withdrawn JP2010050288A (ja) 2008-08-22 2008-08-22 樹脂封止型半導体装置およびその製造方法

Country Status (1)

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JP (1) JP2010050288A (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106298723A (zh) * 2015-05-13 2017-01-04 无锡华润安盛科技有限公司 一种双岛引线框框架
JP6642719B2 (ja) * 2016-08-10 2020-02-12 三菱電機株式会社 半導体装置
JP7325384B2 (ja) * 2020-07-22 2023-08-14 三菱電機株式会社 半導体装置の製造方法
CN115346948B (zh) * 2022-10-14 2023-04-07 吉光半导体(绍兴)有限公司 一种半桥模块

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