JP2010043357A5 - - Google Patents

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Publication number
JP2010043357A5
JP2010043357A5 JP2009199943A JP2009199943A JP2010043357A5 JP 2010043357 A5 JP2010043357 A5 JP 2010043357A5 JP 2009199943 A JP2009199943 A JP 2009199943A JP 2009199943 A JP2009199943 A JP 2009199943A JP 2010043357 A5 JP2010043357 A5 JP 2010043357A5
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JP
Japan
Prior art keywords
gas
chamber
negatively charged
reducing gas
magnetic coil
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JP2009199943A
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English (en)
Japanese (ja)
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JP5596319B2 (ja
JP2010043357A (ja
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Priority claimed from US10/425,426 external-priority patent/US7079370B2/en
Priority claimed from US10/819,227 external-priority patent/US7217121B2/en
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Publication of JP2010043357A publication Critical patent/JP2010043357A/ja
Publication of JP2010043357A5 publication Critical patent/JP2010043357A5/ja
Application granted granted Critical
Publication of JP5596319B2 publication Critical patent/JP5596319B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2009199943A 2003-04-28 2009-08-31 電子付着及び遠隔イオン発生を伴うフラックスレス技術によって表面酸化物を除去するための装置及び方法 Expired - Fee Related JP5596319B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/425,426 US7079370B2 (en) 2003-04-28 2003-04-28 Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US10/425426 2003-04-28
US10/819227 2004-04-07
US10/819,227 US7217121B2 (en) 2000-06-26 2004-04-07 Method and apparatus for improved process control in combustion applications

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004134263A Division JP4846987B2 (ja) 2003-04-28 2004-04-28 電子付着及び遠隔イオン発生を伴うフラックスレス技術によって表面酸化物を除去するための装置及び方法

Publications (3)

Publication Number Publication Date
JP2010043357A JP2010043357A (ja) 2010-02-25
JP2010043357A5 true JP2010043357A5 (https=) 2011-10-06
JP5596319B2 JP5596319B2 (ja) 2014-09-24

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JP2009199943A Expired - Fee Related JP5596319B2 (ja) 2003-04-28 2009-08-31 電子付着及び遠隔イオン発生を伴うフラックスレス技術によって表面酸化物を除去するための装置及び方法

Country Status (5)

Country Link
US (4) US7079370B2 (https=)
EP (1) EP2308629A1 (https=)
JP (1) JP5596319B2 (https=)
AT (3) ATE428528T1 (https=)
DE (3) DE602004020539D1 (https=)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7387738B2 (en) * 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US8361340B2 (en) * 2003-04-28 2013-01-29 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
US7897029B2 (en) * 2008-03-04 2011-03-01 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment
TWI256945B (en) * 2003-05-30 2006-06-21 Hon Hai Prec Ind Co Ltd A method of making mode
US20050008550A1 (en) * 2003-07-09 2005-01-13 Yixiang Duan Low-power atmospheric pressure mini-plasma and array for surface and material treatment
US20050241671A1 (en) * 2004-04-29 2005-11-03 Dong Chun C Method for removing a substance from a substrate using electron attachment
FR2897503B1 (fr) * 2006-02-16 2014-06-06 Valeo Sys Controle Moteur Sas Procede de fabrication d'un module electronique par fixation sequentielle des composants et ligne de production correspondante
US20070193026A1 (en) * 2006-02-23 2007-08-23 Chun Christine Dong Electron attachment assisted formation of electrical conductors
US20070243713A1 (en) * 2006-04-12 2007-10-18 Lam Research Corporation Apparatus and method for generating activated hydrogen for plasma stripping
JP5036290B2 (ja) * 2006-12-12 2012-09-26 東京エレクトロン株式会社 基板処理装置および基板搬送方法、ならびにコンピュータプログラム
US7582265B2 (en) * 2007-06-28 2009-09-01 Plasma Waste Recycling, Inc. Gas conduit for plasma gasification reactors
US7833897B2 (en) * 2007-07-17 2010-11-16 International Business Machines Corporation Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surface
US7947604B2 (en) * 2008-01-25 2011-05-24 Chartered Semiconductor Manufacturing, Ltd. Method for corrosion prevention during planarization
US8567658B2 (en) * 2009-07-20 2013-10-29 Ontos Equipment Systems, Inc. Method of plasma preparation of metallic contacts to enhance mechanical and electrical integrity of subsequent interconnect bonds
US8454850B2 (en) * 2009-09-02 2013-06-04 Air Products And Chemicals, Inc. Method for the removal of surface oxides by electron attachment
FR2964112B1 (fr) * 2010-08-31 2013-07-19 Commissariat Energie Atomique Traitement avant collage d'une surface mixte cu-oxyde, par un plasma contenant de l'azote et de l'hydrogene
SG188998A1 (en) * 2010-09-15 2013-05-31 Praxair Technology Inc Method for extending lifetime of an ion source
US9006975B2 (en) * 2011-02-09 2015-04-14 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
US9053894B2 (en) * 2011-02-09 2015-06-09 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique involving electron attachment
JP5679333B2 (ja) * 2011-08-29 2015-03-04 住友電装株式会社 プリント基板積層体およびその製造方法
JP2013093370A (ja) * 2011-10-24 2013-05-16 Hitachi High-Tech Instruments Co Ltd ダイボンダ装置、及びダイボンド方法
US9018861B2 (en) 2011-12-29 2015-04-28 Elwha Llc Performance optimization of a field emission device
US9349562B2 (en) 2011-12-29 2016-05-24 Elwha Llc Field emission device with AC output
US8928228B2 (en) 2011-12-29 2015-01-06 Elwha Llc Embodiments of a field emission device
US8692226B2 (en) 2011-12-29 2014-04-08 Elwha Llc Materials and configurations of a field emission device
US8575842B2 (en) 2011-12-29 2013-11-05 Elwha Llc Field emission device
US9171690B2 (en) 2011-12-29 2015-10-27 Elwha Llc Variable field emission device
US8810161B2 (en) 2011-12-29 2014-08-19 Elwha Llc Addressable array of field emission devices
US9646798B2 (en) 2011-12-29 2017-05-09 Elwha Llc Electronic device graphene grid
US8970113B2 (en) 2011-12-29 2015-03-03 Elwha Llc Time-varying field emission device
US8810131B2 (en) 2011-12-29 2014-08-19 Elwha Llc Field emission device with AC output
US8946992B2 (en) 2011-12-29 2015-02-03 Elwha Llc Anode with suppressor grid
WO2013101937A1 (en) * 2011-12-29 2013-07-04 Elwha Llc Electronic device graphene grid
JP2013143542A (ja) * 2012-01-12 2013-07-22 Tokyo Electron Ltd 半導体デバイス製造システム及び半導体デバイス製造方法
CN102744481A (zh) * 2012-07-31 2012-10-24 郑州机械研究所 一种提高钎缝强度的钎焊方法及其钎焊炉
CN104520099A (zh) 2012-08-16 2015-04-15 英派尔科技开发有限公司 动力传输
US9659735B2 (en) 2012-09-12 2017-05-23 Elwha Llc Applications of graphene grids in vacuum electronics
US9659734B2 (en) 2012-09-12 2017-05-23 Elwha Llc Electronic device multi-layer graphene grid
CN104425289B (zh) * 2013-09-11 2017-12-15 先进科技新加坡有限公司 利用激发的混合气体的晶粒安装装置和方法
US10438804B2 (en) 2014-11-12 2019-10-08 Ontos Equipment Systems Simultaneous hydrophilization of photoresist and metal surface preparation: methods, systems, and products
CN105903724B (zh) * 2016-06-22 2017-11-21 西北大学 微小空间内表面放电清洗方法和装置
MX387378B (es) * 2016-11-22 2025-03-18 Senju Metal Industry Co Metodo de soldadura.
JP2018168417A (ja) * 2017-03-29 2018-11-01 三菱マテリアル株式会社 円筒型スパッタリングターゲットの製造方法、及び、円筒型スパッタリングターゲット
US20190366460A1 (en) * 2018-06-01 2019-12-05 Progress Y&Y Corp. Soldering apparatus and solder nozzle module thereof
CN109518203B (zh) * 2018-12-13 2020-10-30 江苏美霖铜业有限公司 一种有色金属表面处理装置
CN111282887B (zh) * 2020-02-27 2021-09-24 杭州御兴科技有限公司 一种绝缘子表面污秽激光湿式清洗装置及清洗方法
CN112752422B (zh) * 2020-11-20 2022-04-01 上海望友信息科技有限公司 一种通孔回流焊器件钢网开口方法及计算机可读存储介质
JP2022100984A (ja) * 2020-12-24 2022-07-06 パナソニックＩｐマネジメント株式会社 生成物の除去方法及びフラックスの除去方法及び生成物の除去装置
US12512431B2 (en) 2023-02-17 2025-12-30 Air Products And Chemicals, Inc. Apparatus and method for wafer oxide removal and reflow treatment

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2874763A (en) * 1956-11-02 1959-02-24 William S Hobbs Unburned fuel detection and burner control
DE1255833B (de) * 1963-08-10 1967-12-07 Siemens Ag Verfahren und Einrichtung zum Aufheizen von Gasen in einem Plasmabrenner
US3628079A (en) * 1969-02-20 1971-12-14 British Railways Board Arc plasma generators
US3742213A (en) * 1971-01-28 1973-06-26 Franklin Gno Corp Apparatus and methods for detecting, separating, concentrating and measuring electronegative trace vapors
US4043742A (en) * 1976-05-17 1977-08-23 Environmental Data Corporation Automatic burner monitor and control for furnaces
DE2913464C3 (de) 1979-04-04 1983-11-10 Deutsche Forschungs- Und Versuchsanstalt Fuer Luft- Und Raumfahrt E.V., 5300 Bonn Gleichstrom-Plasmabrenner
US4379218A (en) 1981-06-30 1983-04-05 International Business Machines Corporation Fluxless ion beam soldering process
US4577461A (en) 1983-06-22 1986-03-25 Cann Gordon L Spacecraft optimized arc rocket
FR2586334B2 (fr) 1983-11-17 1989-02-24 Air Liquide Procede de traitement thermique par une torche a plasma micro-ondes, et torche pour sa mise en oeuvre
US4616137A (en) * 1985-01-04 1986-10-07 The United States Of America As Represented By The United States Department Of Energy Optical emission line monitor with background observation and cancellation
US4626648A (en) 1985-07-03 1986-12-02 Browning James A Hybrid non-transferred-arc plasma torch system and method of operating same
US5017004A (en) * 1988-12-22 1991-05-21 Westinghouse Electric Corp. Multifunction electro-optical system test tool
FR2653633B1 (fr) * 1989-10-19 1991-12-20 Commissariat Energie Atomique Dispositif de traitement chimique assiste par un plasma de diffusion.
GB2242976A (en) * 1990-04-12 1991-10-16 Rank Taylor Hobson Ltd Measuring surface characteristics
FR2674450B1 (fr) 1991-03-26 1994-01-21 Agence Spatiale Europeenne Procede pour deposer un revetement sur un substrat par projection au plasma, et dispositif pour la mise en óoeuvre du procede.
DE69229083T2 (de) * 1991-07-18 1999-11-11 Mitsubishi Jukogyo K.K., Tokio/Tokyo Sputteranlage und Ionenquelle
JP2703432B2 (ja) * 1991-10-08 1998-01-26 シャープ株式会社 ペロブスカイト型酸化物膜のドライエッチング方法
US5345056A (en) * 1991-12-12 1994-09-06 Motorola, Inc. Plasma based soldering by indirect heating
US5313044A (en) * 1992-04-28 1994-05-17 Duke University Method and apparatus for real-time wafer temperature and thin film growth measurement and control in a lamp-heated rapid thermal processor
JPH05337399A (ja) 1992-05-21 1993-12-21 Asea Brown Boveri Ag 摩擦帯電器内で粒子を帯電させる方法および装置
FR2697456B1 (fr) * 1992-10-30 1994-12-23 Air Liquide Procédé et dispositif de fluxage par voie sèche.
US5409543A (en) * 1992-12-22 1995-04-25 Sandia Corporation Dry soldering with hot filament produced atomic hydrogen
US5304297A (en) * 1993-02-26 1994-04-19 Rockwell International Corporation Reducing agent regeneration system
US5770098A (en) * 1993-03-19 1998-06-23 Tokyo Electron Kabushiki Kaisha Etching process
US5735451A (en) * 1993-04-05 1998-04-07 Seiko Epson Corporation Method and apparatus for bonding using brazing material
US6007637A (en) * 1993-06-11 1999-12-28 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process and apparatus for the dry treatment of metal surfaces
JP3312377B2 (ja) 1993-12-09 2002-08-05 セイコーエプソン株式会社 ろう材による接合方法及び装置
FR2713666B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de dépôt à basse température d'un film contenant du silicium sur un substrat métallique.
FR2713528B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de fluxage par voie sèche de surfaces métalliques avant brasage ou étamage.
US6021940A (en) * 1993-12-15 2000-02-08 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method and apparatus for reflow soldering metallic surfaces
FR2713667B1 (fr) * 1993-12-15 1996-01-12 Air Liquide Procédé et dispositif de dépôt à basse température d'un film contenant du silicium sur un substrat non métallique.
FR2714047B1 (fr) * 1993-12-21 1996-03-15 Aerospatiale Procédé de fabrication de matériaux composites à matrice vitreuse ou virtrocéramique renforcée de fibres et dispositifs pour sa mise en Óoeuvre.
US6006763A (en) * 1995-01-11 1999-12-28 Seiko Epson Corporation Surface treatment method
JP3521587B2 (ja) 1995-02-07 2004-04-19 セイコーエプソン株式会社 基板周縁の不要物除去方法及び装置並びにそれを用いた塗布方法
FR2735053B1 (fr) * 1995-06-09 1997-07-25 Air Liquide Procede et dispositif de brasage a la vague integrant une operation de fluxage par voie seche
US20030223528A1 (en) * 1995-06-16 2003-12-04 George Miley Electrostatic accelerated-recirculating-ion fusion neutron/proton source
DE19532412C2 (de) * 1995-09-01 1999-09-30 Agrodyn Hochspannungstechnik G Vorrichtung zur Oberflächen-Vorbehandlung von Werkstücken
US5928527A (en) * 1996-04-15 1999-07-27 The Boeing Company Surface modification using an atmospheric pressure glow discharge plasma source
CH692446A5 (de) * 1996-04-15 2002-06-28 Esec Sa Verfahren zur Herstellung von Werkstücken und von Teilen hierfür
US5941448A (en) * 1996-06-07 1999-08-24 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Method for dry fluxing of metallic surfaces, before soldering or tinning, using an atmosphere which includes water vapor
US5693241A (en) * 1996-06-18 1997-12-02 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Atmospheric pressure method and apparatus for removal of organic matter with atomic and ionic oxygen
FR2750622B1 (fr) 1996-07-02 1998-09-25 Air Liquide Procede de traitement de surface par voie seche et dispositif pour la mise en oeuvre d'un tel procede
FR2750620B1 (fr) * 1996-07-02 1998-09-25 Air Liquide Dispositif d'excitation de gaz
JPH1031493A (ja) 1996-07-15 1998-02-03 Canon Inc 音楽再生システム及び音楽記録再生システム
DE19643865C2 (de) * 1996-10-30 1999-04-08 Schott Glas Plasmaunterstütztes chemisches Abscheidungsverfahren (CVD) mit entfernter Anregung eines Anregungsgases (Remote-Plasma-CVD-Verfahren) zur Beschichtung oder zur Behandlung großflächiger Substrate und Vorrichtung zur Durchführung desselben
US6122042A (en) * 1997-02-07 2000-09-19 Wunderman; Irwin Devices and methods for optically identifying characteristics of material objects
JP3772936B2 (ja) 1997-05-20 2006-05-10 セイコーエプソン株式会社 表面処理方法
US6181411B1 (en) * 1997-08-14 2001-01-30 R. Brooks Associates, Inc. Apparatus for inspecting difficult to access objects
US6194036B1 (en) * 1997-10-20 2001-02-27 The Regents Of The University Of California Deposition of coatings using an atmospheric pressure plasma jet
US6037241A (en) * 1998-02-19 2000-03-14 First Solar, Llc Apparatus and method for depositing a semiconductor material
US6174500B1 (en) * 1998-06-02 2001-01-16 Mitsubishi Denki Kabushiki Kaisha Negative ion generating apparatus
US6077388A (en) * 1998-07-10 2000-06-20 Ball Semiconductor, Inc. System and method for plasma etch on a spherical shaped device
SE516336C2 (sv) 1999-04-28 2001-12-17 Hana Barankova Apparat för plasmabehandling av ytor
US6193135B1 (en) * 1999-09-13 2001-02-27 Lucent Technologies Inc. System for providing back-lighting of components during fluxless soldering
US6196446B1 (en) * 1999-09-13 2001-03-06 Lucent Technologies Inc. Automated fluxless soldering using inert gas
DE19963904C2 (de) 1999-12-31 2001-12-06 Gtv Ges Fuer Thermischen Versc Plasmabrenner und Verfahren zur Erzeugung eines Plasmastrahls
US6573991B1 (en) * 2000-04-26 2003-06-03 Martin Paul Debreczeny Self-compensating radiation sensor with wide dynamic range
JP2002001253A (ja) 2000-06-27 2002-01-08 Matsushita Electric Works Ltd プラズマ洗浄装置及びプラズマ洗浄方法並びに半田付けシステム及び半田付け方法
US6440864B1 (en) * 2000-06-30 2002-08-27 Applied Materials Inc. Substrate cleaning process
TW570856B (en) * 2001-01-18 2004-01-11 Fujitsu Ltd Solder jointing system, solder jointing method, semiconductor device manufacturing method, and semiconductor device manufacturing system
US6664740B2 (en) * 2001-02-01 2003-12-16 The Regents Of The University Of California Formation of a field reversed configuration for magnetic and electrostatic confinement of plasma
JP3970840B2 (ja) 2001-05-15 2007-09-05 株式会社荏原製作所 半導体製造方法及び装置
JP4009087B2 (ja) 2001-07-06 2007-11-14 アプライド マテリアルズ インコーポレイテッド 半導体製造装置における磁気発生装置、半導体製造装置および磁場強度制御方法
US20030029837A1 (en) * 2001-08-10 2003-02-13 Applied Materials, Inc. Dielectric etch plasma chamber utilizing a magnetic filter to optimize plasma characteristics
US6776330B2 (en) 2001-09-10 2004-08-17 Air Products And Chemicals, Inc. Hydrogen fluxless soldering by electron attachment
US7079370B2 (en) * 2003-04-28 2006-07-18 Air Products And Chemicals, Inc. Apparatus and method for removal of surface oxides via fluxless technique electron attachment and remote ion generation
US7387738B2 (en) * 2003-04-28 2008-06-17 Air Products And Chemicals, Inc. Removal of surface oxides by electron attachment for wafer bumping applications

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